DRAFT DEVELOPMENT DOCUMENT

                for the
  ELECTRICAL AND  ELECTRONIC COMPONENTS
         POINT SOURCE CATEGORY
           Douglas M. Costle
             Administrator
            Eckardt C.  Beck
        Assistant Administrator
    for Water and Waste Management
            Steven Schatzow
    Deputy Assistant Administrator
   for Water Planning and Standards
          Robert B. Schaffer
Director, Effluent Guidelines Division
          G. Edward Stigall
  Chief,  Inorganic Chemicals Branch
           Richard J. Kinch
        Senior Project Officer

            Frank H. Hund
           Project Officer
            October ,  1980
     Effluent  Guidelines  Division
 Office  of  Water  and  Waste Management
 U.S.  Environmental Protection Agency
       Washington, D. C.  20460

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                     TABLE OF CONTENTS
SECTION                       TITLE

  I       CONCLUSIONS AND SUMMARY

  II      RECOMMENDATIONS

  III     INTRODUCTION

  IV      SUBCATEGORIZATION

  V       DRY PRODUCTS SUBCATEGORY
               Switchgear and Fuses
               Resistance Heaters
               Ferrite Electronic Parts
      	      Motors and Generators
               Fuel Cells
               Alternators
               Insulated Wire and Cuble,
                 Non-Ferrous

  VI      CARBON AND GRAPHITE PRODUCTS
               Products   i
               Size of Industry
               Manufacturing Processes
               Materials
               Water Usage
               Production Normalizing Parameters
               Waste Characterization and
                 Treatment-In-Place
               Potential Polluant Parameters
               Applicable Treatment Technologies
               Benefit Analysis

  VII      DIELECTRIC MATERIALS  SUBCATEGORY
               Products
               Size of Industry
               Manufacturing Processes
               Materials
               Water Usage
               Production Normalizing Parameters
               Waste Characterization and
                 Treatment-In-Place
               Potential Pollutant Parameters
               Applicable Treatment Technologies
               Benefit Analysis
 III-l

 IV-1

 V-l
 V-l
 V-2
 V-4
 V-6
 V-8
 V-10
 V-l 2
VI-1
VI-2
VI-4
VI-6
VI-9
VI-11
VI-13

VI-36
VI-43
VI-48
VII-1
VII-5
VII-6
VII-11
VII-16
VII-19
VII-22

VII-42
VII-42
VII-63

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                     TABLE OF CONTENTS
                        (Continued ]f
SECTION
  VIII
  IX
  X
                    TITLE

ELECTRIC LAMP SUBCATEGORY
     Products
     Size of the Industry
     Manufacturing Processes
     Materials
     Water Usage
     Production Normalizing Parameters
     Waste Characterization and
       Treatment-In-Place
     Potential Pollutant Parameters
     Applicable Treatment Technologies
     Benefit Analysis

ELECTRON TUBE SUBCATEGORY
     Products
     Size of the Industry
     Manufacturing Processes
     Materials
     Water Usage
     Production Normalizing Parameters
     Waste Characterization and
       Treatment-In-Place
     Potential Pollutant Parameters
     Applicable Treatment Technologies
     Benefit Analysis

SEMICONDUCTOR SUBCATEGORY
     Products
     Size of the Industry
     Manufacturing Processes
     Materials
     Water Usage
     Production Normalizing Parameters
     Waste Characterization and
       Treatment-In-Place
     Potential Pollutant Parameters
     Applicable Treatment Technologies
     Benefit Analysis
                                                       PAGE
                                                       VIII-1
                                                       VIII-3
                                                       VIII-5
                                                       VIII-16
                                                       VIII-19
                                                       VIII-20
                                                       VIII-24

                                                       VIII-59
                                                       VIII-67
                                                       VIII-77
                                                       IX-1
                                                       IX-6
                                                       IX-7
                                                       IX-13
                                                       IX-15
                                                       IX-15
                                                       IX-18

                                                       IX-68
                                                       IX-77
                                                       IX-93
                                                       X-l
                                                       X-2
                                                       X-3
                                                       X-9
                                                       X-13
                                                       X-l 5
                                                       X-16

                                                       X-87
                                                       X-88
                                                       X-97
                                 11

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                     TABLE OF CONTENTS
                        (Continued)
SECTION                       TITLE                    PAGE

  XI      CAPACITOR SUBCATEGORY
               Products                                XI-1
               Size of the Industry                    XI-3
               Manufacturing Processes                 XI-3
               Materials                               XI-17
               Water Usage                             XI-18
               Production Normalizing Parameters       XI-18
               Waste Characterization and              XI-22
                 Treatment-In-Place
               Potential Pollutant Parameters          XI-46
               Applicable Treatment Technologies       XI-47
               Benefit Analysis                        XI-67

XII       CONTROL AND TREATMENT TECHNOLOGY
               Introduction                            XII-1
               Transfer of Performance                 XII-3
               Individual Treatment Technologies       XII-68
               In-Process Treatment Techniques         XII-128

  XIII    COST OF WASTEWATER CONTROL AND TREATMENT
               Introduction                            XIII-1
               Cost Estimation Methodology             XIII-1
               Cost Estimates for Individual           XIII-15
                 Treatment Technologies
               Energy and Non-Water Quality Aspects    XIII-56

  XIV     ACKNOWLEDGEMENTS                             XIV-1

  XV      REFERENCES                                   XV-1

  XVI     GLOSSARY                                     XVI-1
                                iii

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      SECTION I
TO BE PREPARED BY EPA
       1-1

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                            SECTION III

                           INTRODUCTION
GUIDELINE DEVELOPMENT SUMMARY

The Electrical and Electronic Components (E&EC) Category is des-
cribed in terras of the Standard Industrial Classifications
(SIC's) as defined in Table 3-1.  This document encompasses the
following E&EC product areas:

          Carbon and Graphite                        .
          Switchgear and Fuses
          Resistance Heaters
          Incandescent Lamps
          Fluorescent Lamps
          Electron Tubes
          Cathode and TV Tubes
          Insulators - Mica
          Insulators - Plastic and Laminates
     .    Capacitors
          Semiconductors (Simple)
          Semiconductors (Complex)
          Electric and Electronic Components
          Wet Transformers

Effluent guidelines for the E&EC Category were developed from
data obtained from previous EPA studies, literature searches,
and plant surveys and evaluations.  Initially, all existing
information from EPA records and available literature was re-
viewed to determine the production processes performed, raw
materials utilized, wastewater treatment practices, water uses
and wastewater characteristics.  In addition to providing a
description of the E&EC Category, this existing information
also identified both the need to acquire additional information
and potential plants to contact for this information.

Approximately 160 plants were contacted by phone and letters to
obtain additional data on the E&EC Category.  Thirty-nine of
these plants were visited for an on-site study of their manu-
facturing processes, water use and wastewater treatment.  In
addition, wastewater samples were collected at twenty-four of
the visited plants.  Sampling was utilized to determine the
source and quantity of pollutants in the raw process wastewater
and Jbreated effluent from a cross-section of plants in the E&EC
Category.

Utilizing both existing data and sampling data collected during
this study, the wastewater characteristics of the E&EC Category
were assessed to determine possible uniformity from plant to
plant and thus the applicability of one set of discharge stan-
dards.  Since the discharge characteristics of all plants in the
                                  III-l

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                             TABLE  3-1

                          E&EC CATEGORY
SIC   3612 - Power, Distribution, and Specialty Transformers
SIC   3613 - Switchgear and Switchboard Apparatus
SIC   3621 - Motors and Generators
SIC   3622 - Industrial Controls
SIC   3623 - Welding Apparatus, Electric
SIC   3624 - Carbon and Graphite Products
SIC   3629 - Electrical Industrial Apparatus, Not Elsewhere
            Classified
SIC   3631 - Household Cooking Equipment
SIC   3632 - Household Refrigerators and Home and Farm Freezers
SIC   3633 - Household Laundry Equipment
SIC   3634 - Electric Housewares and Fans
SIC   3635 - Household Vacuum Cleaners
SIC   3639 - Household Appliances, Not Elsewhere Classified
SIC   3641 - Electric Lamps
SIC   3643 - Current-Carrying Wiring Devices
SIC   3644 - Noncurrent-Carrying Wiring Devices
SIC   3645 - Residential Electric Lighting Fixtures
SIC   3646 - Commercial, Industrial, and Institutional Electric
            Lighting Fixtures
SIC   3647 - Vehicular Lighting Equipment
SIC   3648 - Lighting Equipment, Not Elsewhere Classified
SIC   3651 - Radio and Television Receiving Sets, Except
            Communication Types
SIC   3652 - Phonograph Records and Pre-recorded Magnetic Tape
SIC   3661 - Telephone and Telegraph Apparatus
SIC   3662 - Radio and Television Transmitting, Signaling, and
            Detection Equipment and Apparatus
            Radio and Television Receiving Type Electron Tubes,
            Except Cathode Ray
SIC   3672 - Cathode Ray Television Picture Tubes
SIC   3673 - Transmitting, Industrial, and Special Purpose
            Electron Tubes
SIC   3674 - Semiconductors and Related Devices
SIC   3675 - Electronic Capacitors
SIC   3676 - Resistors, for Electronic Applications
SIC   3677 - Electronic Coils, Transformer and Other Inductors
SIC   3678 - Connectors, for Electronic Applications
SIC   3679 - Electronic Components, Not Elsewhere Classified
SIC   3693 - Radiographic X-Ray, Fluoroscopic X-Ray, Therapeutic
            X-Ray, and Other X-Ray Apparatus and Tubes; Electro-
            medical and Electrotherapeutic Apparatus
SIC   3694 - Electrical Equipment for Internal Combustion Engines
SIC   3699 - Electrical Machinery, Equipment, and Supplies, Not
            Elsewhere Classified
SIC  3671 -
                                 III-2

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data base were not uniform, it was necessary to establish sub-
categories for which the wastewater characteristics of each
subcategory were uniform.  The initial subcategorization of the
E&EC Category was made by product type as follows:

          Transformers
          Switchgear and Fuses
          Carbon and Graphite
          Resistance Heaters
          Electric Lamps
          Insulators
          Electron Tubes
          Semiconductors
          Capacitors      .

The manufacturing processes associated with some products in the
above areas do not generate wastewaters.  In addition, the manu-
facturing processes of some products are already covered by
existing regulations (for example metal finishing).  Therefore,
the initial approach to subcategorization was modified to a
combined product/manufacturing process basis.  This modified
approach encompasses only those products and manufacturing
processes unique to the E&EC Category where wastewater is
generated.  This modification resulted in the establishment of
the following subcategories for which,effluent limitations are
required:

          Dielectric Materials
          Carbon and Graphite Products
          Electric Lamps
          Picture Tubes
          Semiconductors
          Capacitors

Further subdivision of the subcategories may be required to
account for variations in wastewater characteristics requiring
treatment resulting from different basis materials, production
processes, product types and their attendant wastewater
characteristics.

Once the subcategorization approach was established, all of the
data collected were analyzed to determine wastewater generation
and raw waste characteristics for each subcategory.  In addition,
the full range of control and treatment technologies existing
within the E&EC Category was identified.  This technology
review was accomplished by considering the pollutants to be
treated and the chemical, physical and biological characteristics
of these pollutants.  Special attention v/as paid to in-process
technology such as the recovery and reuse of process solutions,
the recycle or reuse of process water and the curtailment of
water use.
                                III-3

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 The  information  as  outlined  above was  then  evaluated in order to
 determine  applicable  treatment  technology for each  subcategory.
 In evaluating  these technologies, various factors were con-
 sidered.   These  included  demonstrated  performance,  the total
 cost of application of  the technology  in relation to the pollu-
 tant reduction benefits to be achieved, the age of  equipment
 and  facilities involved,  the processes employed, the engineering
 aspects of the application of various  types of control tech-
 niques, process  changes,  and non-water quality environmental
 impact  (including energy  requirements).

 Sources of Industry Data

 Data on the E&EC Category were  gathered from literature
 studies, contacts with  EPA regional offices, previous industry
 studies by the EPA, plant surveys and  evaluations,  and inquiries
 to waste treatment  equipment manufacturers.  These  data sources
 are  discussed  below.

 Literature Study -  Published literature in  the form of books,
 reports, papers, periodicals, promotional materials, Dun and
 Bradstreet surveys  and  Department of Commerce Statistics was
 examined;  the  most  informative  sources are  listed in Section
 XIII.  The researched material  included product descriptions
 and  uses,  manufacturing processes utilized,  raw materials con-
 sumed, waste treatment  technology and  the overall characteristics
 of plants  in the E&EC Category  concerning number of plants,
 employment levels and production.

 EPA  Regional Office Contacts -  All 10  EPA regional  offices were
 telephoned for assistance in identifying E&EC plants in their
 respective regions.

 EPA  Studies -  A  previous  preliminary and unpublished EPA study
 of the E&EC Category was  reviewed.  This information included
 sampling data  from  nine plants, visit  trip  reports  from 21
 plants, and data from phone  surveys of 81 E&EC plants.  Visit
 trip  report and  survey  data  included information on products
 manufactured,  manufacturing  processes  performed, water use, and
 wastewater treatment for  each plant.   A summary of  these visits
 and phone  contacts  is presented in Table 3-2 for each E&EC
 product area.  The  only stream  data available from  these previous
 EPA  studies came from sampling  visits  to nine plants.

 Plant Survey and Evaluation  - Three types of data collection were
 used to supplement  available information pertaining to facilities
 in the E&EC Category.   First, approximately 160 plants were
 contacted  by phone  and/or letter to obtain  basic information re-
 garding products, manufacturing processes performed, wastewater
 generation and waste treatment.  Second, based upon this in-
 formation, 39 plants were visited to view their operations and
 discuss their products, manufacturing  processes, water use and
wastewater treatment.   Finally, 24 plants were selected for
                                III-4

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sampling visits to determine the pollutant characteristics of their
wastewater.  Table 3-3 summarizes these plant contacts for each
E&EC product area.

The sampling program at each plant consisted of up to three days
of sampling.  Prior to any sampling visit all available dataf such
as layouts and diagrams of the selected plant's production processes
and waste treatment facilities, were reviewed.  In most cases, a
visit to the plant to be sampled was made prior to thev actual
sampling visit to finalize the sampling approach.  Representative
sample points were then selected.  Finally, before conducting a:
visit, a detailed sampling plan showing the selected sample points
and all pertinent sample data to be obtained was generated and
reviewed.

For all sampling, flow proportioned composite samples or the equi-
valent (for batch discharge) were taken over the daily time period
the plant was in operation.  Sample points typically included a
total raw waste sample, a final treated effluent sample, and a
sample of a particular process step that was of interest.  For
example, a typical semiconductor sampling visit included samples
of the final effluent, total raw waste, and wet air scrubber
discharge streams.

All of the samples collected were kept on ice throughout each day
of sampling.  At the end of the sampling day, the composite
samples were divided into several bottles and preserved according
to EPA protocol.

All samples were subjected to three levels of analysis depending
on the stability of the parameters to be analyzed.  On-site
analysis, performed by the sampler at the facility, determined
flow rate, pH, and temperature.  Five liters of water from each
sample point for each sampling day were delivered to a laboratory
in the vicinity of the subject plant and analyzed for total
cyanide, fluoride, total organic carbon, biological oxygen demand,
oil and grease, phenols, and total suspended solids.  This analysis
was performed by these local laboratories within 24 hours after
each sample was collected. Because of the sensitive nature of
the cyanide and phenols analysis procedures, a quality assurance
questionnaire was completed by all laboratories performing this
analysis.
                                 III-5

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                               TABLE  3-2
               SUMMARY OF PREVIOUS EPA E & EC CATEGORY
                               CONTACTS
Product Area
Phone Contact
Resistance Heaters            -
Switchgear & Puses            10
Transformers                   5
Insulators                    15
Electron Tubes                14
Carbon & Graphite Products    13
Semiconductors                10
Capacitors                     5
Electric Lamps                 9
Totals                        	
                              81
Plant Visit Data  Sample Data
                          1
                          1
                          3
                          1
                          5
                          5
                          5

                         IT
                      1
                      3
                      2
                      2
                              III-6

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                               TABLE 3-3
                   PLANT SURVEY & EVALOATION SUMMARY
Product Area
Transformers
Switchgear
and Fuses
Carbon and
Graphite
Resistance
Heaters
Electric Lamps
Insulators
Electron Tubes
Semiconductors
Capacitors
Totals
Phone Contact
     25
     14

      5

      2

     23
     18
     12
     41
     23

    163
Plant Visit Data
      4
Sample Data
      1
      6
      1
      5
     10
      8

     3?
      4
      1
      2
      9
      4

     I?
                                 III-7

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 The remainder of the composite samples collected each day were
 analyzed by an IFB organics laboratory and an IPS metals  laboratory,
 These two laboratories were selected by the Sample Control Center
 prior to the plant visit,   ail organic samples were shipped on  ice
 to the organics laboratory daily,  and all  metals samples  were
 shipped at the end of the  sampling visit.   Analyses performed
 at the IPS laboratories were in accordance with EPA protocol.

 Waste Treatment Equipment  Manufacturers -  Various manufacturers
 of waste treatment equipment were  contacted by phone or visited
 to obtain cost and performance data on specific technologies.
 Information collected was  based both on manufacturer's research
 and on in-situ operation at plants that were not E&EC manufacturers
 but had similar wastewater characteristics of primarily heavy
 metals wastes.

 UTILIZATION OF INDUSTRY DATA

 Data collected from the previously described sources are  used
 throughout this report in  the development  of a base for limitations
 and standards  for  each E&EC subcategory.   Previous EPA studies,
 the literature,  and plant  visits provided  the information used  to
 describe  the E&EC  Category in terms of its products as presented
 later in  this  section.   This same  information also provided the
 basis for the  subcategorization approach discussed in Section IV.
 Raw wastewater characteristics and effluent data presented for
 each subcategory in Section VI through XI  were obtained from
 previous  EPA sampling  data as well  as  sampling conducted .during
 this study.  Based  on  these sampling data,  pollutant parameters
 requiring control  in each  subcategory  were selected and are
 presented in Sections  VI through XI  for each subcategory.
 Applicable  treatment technologies  for  control  of these pollutants
 are  also  presented  in  Section XII.   The applicability of  each
 technology  is  supported by its use  in  the  E&EC Category as  well as
 data from treatment manufacturers  or its use in other industries
 with similar wastes.   The  cost and performance of treatment
 (both individual technologies and  systems)  are also presented in
 Section XIII for each  subcategory.  These  costs  are based
 primarily on data from equipment manufacturers.   Specific  systems
 for  each  subcategory are detailed  in the individual  subcategory
presentations  (Sections VI  through XI).  Actual  performance  based
on sampling  data and performance of observed treatment based
on data from many industrial  areas with similar  wastes and
treatment are also presented.
                                 XII-8

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                         SECTION IV

                 INDUSTRY SUBCATEGORIZATION
INTRODUCTION

The purpose of industry subcategorization is to establish group-
ings within the Electrical and Electronic Components  (E&EC)
Point Source Category such that each group has a uniform set of
effluent limitations.  Subcategorization should be based on raw
waste characteristics and the factors that affect the raw waste
characteristics of a plant.  Thus, if the raw wastewater
characteristics for plants within a group are similar, a uniform
effluent will result for a given wastewater treatment system for
that group.  Such a group is designated as a subcategory.  This
section presents the subcategories and discusses the  factors
considered as a basis for E&EC subcategorization.

Due to the breadth of the E&EC Category and the wide variety of
products manufcictured, subcategorization of the electrical and
electronic components is approached in three stages:

     1.  Identify the various product areas encompassed
         by the E&EC Category.  (Reference Table 3-1)

     2.  Identify those products using no wet processes
         in their manufacture and those products using
         wet processes that are covered by existing or
         projected regulations governing other point
         source categories.

     3.  Identify those products using wet processes that
         are unique to the manufacture of E&EC products
         and are not covered by existing or proposed
         regulations.  This latter group of products will
         be further investigated to establish a final set
         of subcategories, each of which has a uniform
         set of wastewater characteristics.

Several products may be excluded from this study because there is
no wastewater generated in their manufacture or the wastewater
produced is covered by other point source categories.  Table 4-1
presents the products that will be excluded from this document
because their manufacture is dry.  Products covered under other point
source categories are discussed in more detail in Section V of this
document and are also listed in Table 4-1.

Deleting those products whose manufacture does not utilize
manufacturing process water unique to E&EC manufacturing
results in the establishment of the following subcategories:
                              1V-1

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                        TABLE 4-1
                      E&EC PRODUCTS
     USING DRY PROCESSES OR NON-UNIQUE WET PROCESSES
Products whose manufacture uses only dry processes
 Product
 Capacitors; non metal case, paper, film or
   metallized film dielectric
 Incandescent lamps
   Reflector lamps
   Metal vapor lamps using glass envelopes
   Photoflash lamps
 Insulators, epoxy and phenolic

Products using wet processes addressed by other
Point Source Categories
 Transformer (dry)
 Switchgear
 Carbon and graphite brushplates
 Resistance heaters stove/oven burner units
 Small electric appliance
      Rigid, encased heaters
      Flexible heaters
      Bare wire heaters
 Electric comfort heaters
                         IV-2

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                            TABLE 4-1 Con't
                             E&EC PRODUCTS
           USING DRY PROCESS OR NON-UNIQUE WET PROCESSES

      Product

2.   Con't

      Other flexible heaters strips, bands, cables  ,

      Paper film or metallized film dielectric

      Household cooking equipment

      Electric motors and generators

      Industrial controls

      Welding apparatus

      Household refrigerators and freezers

      Household laundry equipment

      Electric housewares and fans

      Household vacuum cleaners

      Current carrying wiring devices

      Non-current carrying wiring devices            "._  i
                                                  ' •-  ' )
      Residential commercial, industrial, and institutional
        electric lighting fixtures

      Vehicular lighting equipment

      Phonograph records and prerecorded magnetic tape

      Telephone and telegraph apparatus

      x-ray tubes and equipment

      Electrical equipment for internal combustion engines

      Electrical equipment, machinery, and supplies not else-
        where classified
                               IV-3

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        Carbon and Graphite Products
        Dielectric Materials
        Electric Lamps
        Electron Tubes
        Semiconductors
        Capacitors

SUBCATEGORIZATION DEVELOPMENT

A study of the E&EC Category indicates that more than one subcategory
is required because of the variety of wastewater characteristics
generated by the manufacture of the different product types.  The
remainder of this section describes the subcategorization of E&EC
products to establish groupings such that each group has a uniform
set of wastewater characteristics.

After considering the nature of the E&EC products, the follow-
ing subcategorization bases were considered plausible:
     1.
     2.
     3.
     4.
     5.
     6.

Products
Products
Manufacturing Processes
Raw or Process Materials Used
Size of Plant
Age of Plant
Geographic Location
A review of each of these factors reveals that product type is
the principal factor affecting the wastewater characteristics of
plants within the E&EC Category.  Product type determines both
the raw and process material requirements and the number and type
of manufacturing processes used.  Groups of products using the same
wet processes produce wastewater with similar characteristics.  The
different products vary widely in wet manufacturing processes
used, and this results in major differences in the wastewater
characteristics associated with each product.  The major source
of wastewater results from clean-up and rinsing activities
associated with each of these manufacturing processes.  A product
subcategorization results in the following nine subcategories:
1.   Transformers
               Two types are manufactured, wet (filled
               with dielectric fluid) and dry.

               Both types use standard metal working
               and metal finishing processes covered
               by the Metal Finishing Category.

               Wet processes unique to the product are
               detergent dielectric fluid clean up and
               management of residual PCB fluids.
                             IV-4

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     Switchgear &
     Fuses
     Carbon &
     Graphite
4.   Resistance
     Heaters
5.   Electric Lamps -
All types use processes included in the
metal finishing and plastics processing
categories«

All wet processes used in the manu-
facture of switchgear and fuses are
addressed by the Metal Finishing
Category.

Products range from contacts and motor
brushes weighing ounces to metallurgical
electrodes weighing several tons.

Wet processes unique to the product are
extrusion and impregnation quenches used
at some plants manufacturing large
products.  Some plants also use contact
water in carbon machining and wet air
scrubber processes.

Three types of resistance heaters are
made; rigid encased elements used for
electric stoves and ovens, bare wire
heaters used in toasters and hair
dryers, and insulated flexible heater
wire that is incorporated into blankets
and heating pads.

All wet processes used in the manu-
facture of resistance heaters are in-
cluded in the Metal Finishing Category.

Five major product types are manufac-
tured:  incandescents, flash bulbs,
fluorescents, glow lamps, and lamp
parts.

Incandescent and flash bulb manufacture
use dry processes only.

Fluorescent lamp manufacture uses a wet
glass washing process.  In addition, a
few plants use a wet process to apply
phosphors.

Neon glow lamps use a lead cleaning pro-
cess using an acid cleaner and its sub-
sequent water rinses which are covered
by the Metal Finishing Category.  Some
quartz envelope vapor lamps receive a
final cleaning using an acid process.
                               IV-5

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6.
Dielectric
Materials
7.   Electron Tubes -
8.   Semiconductors -
                         Manufacture of lamp bases uses wet,
                         processes addressed by the Metal Finish-
                         ing Category.

                         Filament manufacture uses
                         a unique wet process to dissolve the
                         mandrels on which filaments are wound.
Three types of non-glass and non-
ceramic insulators are used:  mica,
epoxy, and phenolic.

Epoxy and phenolic insulators use no
wet processes.

Mica insulation manufacture is analogous
to paper making and uses a wet process
unique to the product.

Four basic types of electron tubes are
produced:  TV and cathode ray picture
tubes, receiving tubes, power tubes,
and light sensing tubes.

Receiving, power, and light sensing
tube manufacture uses' wet processes al-
ready addressed by the Metal Finishing
Category.

TV and cathode ray picture tube manu-
facture use the same metal finishing
processes as receiving, power, and light
sensing tubes in addition to wet pro-
cesses associated with glass etching,
photolithography, and phosphor
deposition.

The industry manufactures many different
types of devices used in electronic
circuitry.

Product types are based on several dif-
ferent material technologies.

Manufacture involves similar processes
for all products.  Many wet processes
are used such as wafer cutting and lap-
ping, fume scrubbing associated with
layer generation and doping, deposition
of conducting layers by evaporation,
application and removal of photolitho-
graphic masks, removal of layers by acid
etching, and preparation and use of
deionized water for rinsing.
                                 IV-6

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9.   Capacitors     -    Approximately a dozen type of capa-
                         citors are manufactured to cover a wide
                         range of sizes,^operating voltages,
                         and environments associated with
                         electric motors, electric power
                         handling, fluorescent lighting and
                         electronic equipment.

                    -    The different types require different
                         materials and processes.

                    -    Some types use all dry manufacturing
                         processes.  These are non-metal case
                         types using paper, film, or metallized
                         dielectrics.

                    -    Metal case versions of the above types
                         may use wet processes in the case
                         manufacture.  These processes are ad-
                         dressed by the Metal Finishing Category.

                    -    The remaining types use wet processes
                         unique to the product during the
                         manufacture of the electrodes and/or
                         dielectric and during encapsulation.

As can be seen from the above, product subcategorization does
not adequately address differences in raw wastes produced by
some processes within the same subcategory.  For example, in
the capacitor industry ceramic capacitors are manufactured  .
utilizing the same manufacturing processes as other capacitor
types except for the use of a ball milling operation.  This
operation produces wastes that differ from wastes produced by
other capacitor manufacturing.  These wastes also require
different treatment technologies for pollutant removal-.  For this
reason, two different wastewater treatment systems are required
to treat wastewaters from ceramic ball milling and from capacitor
manufacturing processes excluding ball milling.

Manufacturing Processes

Subcategorization by manufacturing process could adequately de-
fine waste characteristics for the E&EC Category.  However,
this subcategorization would be overly complex in determining
the waste loads and effluent limitations due to the number of
processes that exist in this category.  In addition, subcate-
gorization on the basis of manufacturing process is not uniquely
suited to define waste characteristics since many operations
generate the same waste constituents.

Subcategorization by both product type and by manufacturing
process is necessary in some instances in the E&EC Category.
                               IV-7

-------
This subcategorization basis will account for differences in
raw wastes produced by the subcategory without being overly complex,
This product/manufacturing process subcategorization results in
the following subcategories:

     1.   Transformers - The only wet processes that is unique
                         to E&EC are the clean-up and management
                         of residual dielectric fluid.  These
                         processes will be considered in the
                         dielectric materials subcategory.
2.


3.


4.


5.


6.
          Switchgear and Fuses - (no further subcategorization
                                 is necessary)

          Carbon and Graphite - quenching processes
                                machining processes
          Resistance Heaters - (no further subcategorization
                               is necessary)

          Electric Lamps - filament manufacturing
                           fluorescent lamp manufacturing
          Dielectric
          Materials
                       The only wet process that is unique to
                       E&EC is the manufacture of mica paper
                       dielectric.  Mica paper dielectric
                       manufacture will be included in the
                       dielectric materials subcategory.

     7.   Electron Tubes - electron tube manufacturing
                           aperture mask manufacturing

     8.   Semiconductors - (no further subcategorization is necessary)

     9.   Capacitors - ball milling operations
                       capacitor manufacture (excluding ball milling)
                       (Production of some types of capacitors in-
                       cludes the use of dielectric fluid.  This
                       dielectric fluid use will be included in the
                       dielectric materials subcategory).

Raw or Process Materials Used

There is a wide variation in basis materials, process materials,
and process chemicals used within this industry, and all waste-
water constituents are a direct result of this material usage.
Therefore, they are intrinsically accounted for since the selec-
ted product subcategories are directly related to the physical
and chemical properties of the raw materials used (e.g., basis
materials/ solvents, process chemicals).

Size of Facility

The nature of the manufacturing processes for the E&EC Category
is the same in all facilities regardless of their size.  Size
alone is an insufficient categorization criterion since the
waste characteristics of a plant depend on the raw materials and
the manufacturing processes employed.
                                IV-8

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 Age  of Facility

 The  relative  age  of plants  is  important but  is  not  a  suitable
 basis  for  categorizing  the  industry because  it  does not  consider
 those  items which affect  the effluent  wastewater discharged.   The
 age  of a plant  has no bearing  on  the resulting  wastewater  charac-
 teristics  or  the  required waste treatment.   Therefore, plant age
 is an  inappropriate basis on which  to  categorize.

 Geographic Location

 There  is not  a  basis for subcategorization by geograohic location
 alone.  Manufacturing processes are  not affected by the physical
 location of the facility, except  for availability of  usable
 process water.  The price of water may affect the amount of
 modification  to procedures  employed  in each  plant.  However,
 procedural changes  can affect  the volume of  pollutants discharged
 but  not the characteristics of the constituents.  The waste
 treatment  components described in Section XII can be  utilized  in
 any  geographical  area.  In  the event of a limitation  in the
 availability  of land space  for constructing  a waste treatment
 facility,  the in-process controls and  rinse  water conservation
 techniques described in Section XII  can be adopted  to minimize
 the  land space  required for the end-of-process  treatment
 facility.  Often, a compact package  unit can easily handle end-
of-process waste  if good in-process  techniques  are utilized to
conserve raw materials and water.

SUMMARY OF SUBCATEGORIZATION

The subcategorization of the E&EC industry is summarized as
follows:
     1.
Subcategorizing raw waste characteristics by product
type for unique water using processes not covered
under other point source categories produces tfie fol-
lowing subcategories:                        j

          Carbon and Graphite Products      <
          Dielectric Materials
          Electric Lamps
          Electron Tubes
          Semiconductors
          Capacitors
                              IV-9

-------
     2.   Further subcategorization by manufacturing process pro-
          duces the following subdivisions within the subcategories;

                    Carbon and Graphite Products
                         Quenching operations
                         Machining, grinding, scrubbing operations
               .    Dielectric Materials
                         Dielectric fluid use
                         Mica paper dielectric manufacture
               .    Electric Lamps
                         Fluorescent lamp manufacture
                         Filament manufacture
                    Electron Tubes
                         Electron tube manufacture
                         Aperture mask manufacture
               .    Semiconductors
                         (no further breakdown is required)
                    Capacitors
                         Capacitor manufacturing operations
                           excluding ball milling
                         Ceramic ball milling operations

Some manufacturing processes used in the manufacture of E&EC
products are covered under existing or proposed regulations
while other processes used in the manufacture of the same
products are unique to this industry.  The discussion of all of
these processes is found in the appropriate product subcategory
sections which follow.
                              IV-10

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                          SECTION  V

                   DRY  PRODUCTS  SOBCATEGORY
INTRODUCTION
The dry products  subcategory  includes  those  electrical  and
electronic  components  that do not  require  manufacturing process
water unique  to the  E  &  EC industry.   Rather,  any  process waste-
water results  from manufacturing operations  in the Metal Finishing
Category.   Electronic  products considered  in this  dry products
subcategory are:

          Switchgear and Fuses
          Resistance Heaters
          Ferrite Electronic  Parts
          Motor and Generators
          Fuel Cells
          Alternators
          Insulated Wire and  Cable, Non-ferrous

Sources of  information for this subcategory  include phone surveys
of plants in the various product areas and literature reviews.

This section includes discussion of the various products, size
of the industry, manufacturing processes and materials  used, and
process water usage.  A table  is presented for each product area
which summarizes the manufacturing processes and basis  materials
used.

SWITCHGEAR  AND FUSES

Products

The switchgear industry manufactures products  used  to control
electrical  flow and to protect equipment from  electrical power
surges and  short circuits.  The major switchgear products are:

          Electrical power distributors, controls,  and
          metering panel assemblies.

          Circuit breakers - Circuit breakers /are  automatic
          load sensitive switches used to protect  equipment
          from short circuits  and power surges by  dis-
          connecting the equipment from the power  source.
          Circuit breakers may be of the arq quenching
          (air or gas)  or oil  filled quenching types.

          Relays - Control relays (low voltage), power  relays
          (high voltage), and  magnetically abtuated  switches.
                                V-l

-------
           Switches - Manual current controlling devices.

           Puses - Electronic current controlling devices.
           Unlike circuit breakers, they may be used only once.

 Size of Industry

 Switchgear manufacture is classified under SIC 3613.  It is
 estimated that approximately 84,000 production workers are employed
 in the manufacture of switchgear and that between 572 and 678 manu-
 facturing firms are engaged in this business.  The mean
 employment level is estimated to be 135 production employees per
 plant.  Employment levels in the plants contacted range from 35
 to 2,500 production employees.

 Manufacturing Processes and Materials

 Table 5-1 is a listing of switchgear products and typical manu-
 facturing processes.  This information was gathered from actual
 plant visits and phone surveys of 24 switchgear manufacturers.
[ No wet manufacturing processes unique to the manufacture of
I switchgear have been identified.  The manufacture of oil-filled
' circuit breakers does not involve wet processing.  The use of
I this circuit breakerioil, a petroleum based, naphthenic dielectric
ji fluid, is covered in'the dielectric fluids Section VI of this
; report.

 Process Water Usage

 All switchgear manufacturing processes involving  the use or dis-
 charge of process water are metal finishing processes.  These
 processes and associated water and wastewater are therefore covered
 by the Metal Finishing Category Development Document and will not
 be discussed further in this report.

 RESISTANCE HEATERS   !

 Products

 Resistance heaters convert electrical energy  into usable heat
 energy,
The major resistance heater products are:

 Rigid, metal encased heater elements which are
 used in stoves, ovens, and small appliances.

 Bare wire heaters which are used in toasters
 and space heaters and utilize a wire or
 ribbon to 'convert the electrical energy to heat.
                                 V-2

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                               TABLE 5-1
    PROCESSES AND MATERIALS USED  IN SWITCHGE^R AND FUSE MANUFACTURE
PRODUCT

Circuit Breakers



Buss Bars


Fuses



Switches
Regulators
(Voltage, Power)
Assemblies
Enclosures
METAL, FINISHING PROCESSES

Chemical Milling, Stamping,
Milling, Molding, Assembly
Chemical Milling, Assembly,
Stamping, Molding, Grinding

Chemical Milling, Electroplat-
ing, Assembly, Milling,
Molding, Soldering, Machining

Conversion Coating, Plating,
Chemical Milling, Milling,
Stamping, Machining, Grinding,
Assembly

Chemical Milling, Electroplat-
ing, Grinding, Welding,
Soldering, Machining,
Polishing, Assembly

Chemical Milling, Electroplat-
ing, Conversion Coating,
Grinding, Welding, Soldering,
Solvent Degreasing, Machining,
Painting, Polishing

Chemical Milling, Electroplat-
ing, Conversion Coating,
Welding, Soldering, Solvent
Degreasing, Machining,
Assembly, Polishing, Grinding
BASIS MATERIALS

Plastic, Steel, Cooper,
Brass, Aluminum,
Nickel, Zinc

Copper, Aluminum, Brass
Copper, Brass, Plastic,
Steel
Steel, Copper, Brass,
Zinc      '
Copper, Brass, Steel,
Plastic
Aluminum, Steel, Zinc,
Plastic, Fiberglass
Steel, Aluminum,
Plastic
                                    V-3

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          Flexible insulated wire heaters which are used
          in electrical heating cables, electric heating
          pads, and electric blankets.
                                      s-     '   '   '
Size of Industry

Resistance heater manufacture consists of portions of SIC 3631,
Household Cooking Equipment and SIC 3634, Electric Housewares
and Pans.  It is estimated that approximately 11,000 production
workers are employed in the manufacture of resistance heaters
and that between 154 and 160 plants are engaged in this business.
The mean employment level is estimated to be 71 production employees
per plant.  However, review of plant listings indicates that in the
majority of plants, the manufacture of resistance heaters is an
integral part of the manufacture of another finished product.  Re-
latively few plants manufacture resistance heaters as their final
product.

Manufacturing Processes and Materials

Table 5-2 is a listing of resistance heater products and typical
manufacturing processes.  This information has been gathered from
phone surveys of 10 plants.  No manufacturing processes unique to
the manufacture of resistance heaters have been identified.

Process Water Usage

All resistance heater manufacturing processes involving the use or
discharge of process water are metal finishing processes.  These
processes and associated water and wastewater are therefore
covered by the Metal Finishing Category Development Document and
will not be discussed further in this report.

FERRITE ELECTRONIC PARTS

Products

The ferrite electronic parts subcategory includes electronic
products utilizing metallic oxides.  The metallic oxides have
ferromagnetic properties that offer high resistance, making cur-
rent losses extremely low at high frequencies.  Ferrite electronic
products include:

     .    Magnetic recording tape
          Magnetic tape transport heads
     .    Electronic and aircraft instruments
          Microwave connectors and components
     .    Electronic digital equipment
                               V-4

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                               TABLE 5-2
    PROCESSES AND MATERIALS USED IN RESISTANCE HEATER MANUFACTURE
PRODUCT

Rigid
Heater
Elements
Bare Wire
 Heaters

Flexible Insulated
Wire Heaters
METAL FINISHING PROCESS

    Plating, Chemical Milling,
    Welding, Rolling, Molding,
    Swaging, Machining
    Plating, Soldering,
    Welding

    Plating, Descaling,
    Machining, Molding, Welding
BASIS MATERIALS
     Steel, Nickel, Copper,
     Plastic, Insulating
     Material, Ceramic
     Material

     Steel, Nickel, Copper,
     Insulating Material

     Copper, Steel, Nickel,
     Rubber, Plastic,
     Insulating Material
                                  V-5

-------
Size of Industry

Perrite electronic parts manufacture is classified under SIC 3679,
It is estimated that 10,000 production workers are employed in
ferrite electronics parts manufacturing.  Between 35 and 40
manufacturing firms are engaged in this business.  The mean
employment level is estimated to be 270 production employees
per plant.

Manufacturing Processes and Materials

Table 5-3 is a listing of ferrite products and typical manu-
facturing processes.  The information presented was gathered
from the literature and a phone survey of 10 facilities.
Process Water Usage

Ferrite manufacturing processes and associated water usage
and wastewater generation are covered  in the Metal Finishing
Category Development Document and will not be discussed  further
in this report.

MOTOR AND GENERATORS

Products

The motor manufacturing industry produces devices that convert
electric energy into mechanical energy.  The generator manufactur-
ing industry produces devices which convert an input mechanical
energy into electrical energy.  The major motor  and generator
products are:

          Electric motors and generators
          Motors and generators
          Variable speed drives and gear motors
     .    Fractional horsepower motors
          Hermetic motor parts
     .    Appliance motors
     ,    Special purpose electric motors

Size of Industry

Motor and generator manufacture is classified under SIC  3621.  It
is estimated that 75,100 production workers are  employed in  the
                               V-6

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                            TABLE 5-3
               PROCESSES AND MATERIALS USED IN
            FERRITE ELECTRONIC PARTS MANUFACTURE
PRODUCT

Magnetic Recording
 Tape

Magnetic Tape
 Transport Heads
Electric and Air-
 craft Instruments
 Electronic Digital
 Equipment, Microwave
 Connectors and Com-
 ponents
  PROCESSES

Shearing, Slitting,
Assembling

Metal Producing,
Welding, Fabrication,
Machining

Forming, Shearing,
Slitting, Fabrica-
tion, Machining
   BASIS MATERIAL

Aluminum, Magnesium,
Castings, Stampings

Bronze, Brass,
Aluminum Extrusions,
Epoxies-quartz

Aluminum Reels, Iron
Rods & Bars, Tubing,
Extrusions
                                   V-7

-------
manufacture of motors and generators.  The 1977 Census of
Manufactures lists 448 manufacturers of motors and genera1
tors.  The mean employment level is estimated 'to be 170 pro-
duction employees per plant.

Manufacturing Processes and Materials

Table 5-4 is a listing of motor and generator products and typi-
cal manufacturing processes.  The information was gathered
from phone surveys of 11 motor and/or generator manufacturers
and from a literature investigation.

Process Water Usage

All motor and generator manufacturing processes involving the
use or discharge of process wastewater are metal finishing pro-
cesses.  These processes and associated water usage and waste-
water generation are covered by the Metal Finishing Category
Development Document and will not be discussed further in this
report.

FUEL CELLS

Products

The fuel cell industry manufactures products that are electro-
chemical generators in which the chemical energy from a reaction
of air (oxygen) and a conventional fuel is converted directly
into electricity.

The major fuel cell industry products, basically in research and
development stages, are:

          Fuel cells for military applications (Low power
          equipment, < 10 kW)

          Fuel cells for power supply for vehicles
          (Medium power sources, 10 to 150 kW)

          Fuel cells used as high power sources,
          > 150 kW for:

          - railway traction, including shunting engines
          - naval propulsion
          - power stations, basic and emergency
          - space applications
                             V-8

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                            TABLE  5-4
PROCESSES AND MATERIALS  USED  IN  MOTOR  AND  GENERATOR MANUFACTURE
PRODUCT
Appliance Motors
Special Purpose
Electric Motors,
Electric Motors,
Fractional Horse-
power Motors, Her-
metic Motor Parts
Motors and
Generators,
Variable Speed
Drivers and Gear
Motors
          PROCESSES

Casting, Forging, Stamp-
ing, Blanking, Drawing,
Shearing, Slitting,
Welding, Heat Treating,
Surface Fnishing,
Assembly, Machining

Casting, Stamping,
Blanking, Drawing, Shear-
ing, Slitting, Forming,
Welding, Machining, Heat
Treating, Assembly

Die Casting, Stamping,
Blanking, Drawing,
Shearing, Welding,
Machining, Heat Treat-
ing, Surface Finishing,
Assembly

Casting, Stamping,
Blanking, Drawing,
Shearing, Slitting,
Machining, Assembly
   BASIS MATERIALS

Carbon Steel Alloys
and Tool Steel,
Copper Wire, Aluminum,
Iron Sheets
Carbon Steel Sheets,
Rods, Bars, Strips,
Coils, Stainless Steel
Rods and Bars, Copper
Wire

Aluminum Casting Sheets,
Iron Castings, Steel
Plates, Slabs, Rods,
Bars, Carbon Steel Rods,
Bars, Strips, and Coil
Carbon Steel Sheets,
Rods and Bars
                                 V-9

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          Low temperature - low pressure fuel cells with
          carbon electrodes

Size of Industry

The fuel cell industry is classified under SIC 3674 (Solid State
Fuel Cells) and SIC 3629 (Electrochemical Generators).  It is
estimated that 1000 to 5000 production workers are employed
in the manufacture of fuel cells under SIC 3629.  The number
of employees under SIC 3674 is unavailable.  Between 5 and 10
manufacturing firms are engaged in the production of fuel cells.
The mean employment level is estimated to be 500 production
employees per plant.

Manufacturing Processes and Materials

Table 5-5 is a listing of fuel cell products and typical manu-
facturing processes.  The information presented was gathered from
phone surveys of 3 fuel cell manufacturers and from a literature
survey.

Process Water Usage

All fuel cell manufacturing processes involving the use or dis-
charge of process wastes are metal finishing processes.  These
processes and associated water usage and wastewater genera-
tion are covered by the Metal Finishing Category Development
Document and will not be discussed further in this report.

ALTERNATORS

Products

The alternator industry manufactures products that convert
mechanical energy into electrical energy in  the form of an
alternating current.

The major alternator products are:

          Electric equipment for internal combustion engines
          Automobile electrical parts
          Flywheel alternators, solid state  voltage regulators,
          overvoltage controls

Size of Industry

Alternator manufacture is classified under SIC  3694.  It is
estimated that 8750 production workers are employed in the manu-
facture of alternator products.  Between 65  and 75 manufacturers
are engaged in this business.  The mean employment level is
estimated to be 125 production employees per plant.
                              V-10

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                            TABLE 5-5
   PROCESSES AND MATERIALS USED  IN FUEL CELL MANUFACTURES
PRODUCT

Low Temperature -
Low Pressure Fuel
Cells with Carbon
Electrode
Fuel Cells Used
as High Power
Sources for Mili-
tary Applications,
as Power Supply for
Vehicles
     PROCESSES

Extrusion, Gas-baking,
Heat treating, Testing,
Assembly, Molding,
Catalyzation with Heavy
Metals Salts, Sintering
Machining, Heat Treating,
Sintering, Molding,
Carbonizing, Testing,
Assembly
   BASIS MATERIALS

Base Carbo-n, Binders
Metal (oxide) Cata-
lysts, Wax or Paraffin
Compounds, Chlorapla-
tinic Acid, Teflon,
Polyethylene, Nickel,
Plastics

Graphite, Resins,
Plastic, Teflon,
Electronic Components,
Cutting Fluids
                                 v-n

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Manufacturing Processes and Materials

Table 5-6 is a listing of alternator products and typical
manufacturing processes.  The information presented was gathered
from a literature survey and phone survey of 7 alternator
manufacturers.

Process Water Usage

All alternator manufacturing processes involving the use or dis-
charge of process waters are metal finishing processes.  These
processes and associated water usage and wastewater genera-
tion are covered by the Metal Finishing Category Development
Document and will not be discussed further in this report.

INSULATED WIRE AND CABLE, NON-FERROUS

The insulated wire and cable industry manufactures products where
a conductor is covered with a non-conductive material to eliminate
shock hazard.  The major insulated wire and cable industry pro-
ducts are:

          Insulated non-ferrous wire
          Drawn and tinned copper wire
          Auto wiring systems
          Magnetic wire
          Bulk cable appliances
          Marine cable appliances
          Marine wiring
          Camouflage netting
          Fine insulated wire

Size of Industry

The insulated wire and cable industry is classified under SIC 3357,
Estimates of the number of employees and the number of firms
manufacturing insulated wire and cable are not available.

Manufacturing Processes and Materials

Table 5-7 is a listing of insulated wire and cable products and
typical manufacturing processes.  The information presented was
gathered from a literature survey and phone survey of 8
insulated wire and cable manufacturers.
                           V-12

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                            TABLE 5-6
   PROCESSES AND MATERIALS USED  IN ALTERNATOR MANUFACTURE
PRODUCT

Electric Equipment
for Internal Com-
bustion Engines
Auto Electrical
Parts
Flywheel Alterna-
tors, Solid State
Voltage Regulators,
Overvoltage Controls
   PROCESSES

Stamping, Blanking,
Drawing, Welding,
Fabricating, Machining,
Heat Treating, Surface
Finishing, Assembly
Stamping, Blanking,
Drawing, Fabrication,
Assembly

Casting, Stamping,
Blanking, Drawing,
Welding, Fabrication,
Machining, Heat Treat-
ing, Surface Finishing,
Assembly
    BASIS MATERIALS

Carbon Steel Sheets,
Rods, Bars, Tubing
and Pipe,  Stainless
Steel, Brass-Bronze,
Aluminum, Iron Rods,
Zinc Ingots, Mica
Paper

Steel Sheet, Copper
Wire, Brass Rods
and Sheets

Carbon Steel Rods,
Bars, Strips, and
Coils; Aluminum
Ingots, Pigs, Bullets,
Strips and Coils;
Zinc Ingots
                               V-13

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                            TABLE 5-7
         PROCESSES AND MATERIALS USED IN INSULATING
                 WIRE AND CABLE MANUFACTURE
PRODUCT

Drawing & Insulat-
ing of Non-Ferrous
Wire, Camoflage Net-
ting, and Fine insu-
lated Wire

Drawing and Tinning
Copper Wire and
Insulated Male
Cable

Auto Wiring Systems,
Magnet Wire, Marine
Wiring and Insulated
Bulk Cable
Appliances
   PROCESSES
                                                  BASIS MATERIALS
Drawing, Spot Welding    Copper Wire
Drawing, Stranding,
Heat Treating
Die Casting, Stamping
Blanking, Drawing,
Shearing, Slitting,
Forming, Welding, Heat
Treating, Assembly
Carbon, Stainless
Steel, Steel, Copper
Carbon Steel, Brass-
Bronze Strips, Coils,
Stainless Steel-Wire,
Copper-Rods and Bars,
Aluminum Wire
                                   V-14

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Process Water Usage

All insulated wipe and cable manufacturing processes  involving
the use or discharge of process waters are metal  finishing
process.  These processes and associated water  usage  and  waste-
ewater generation are covered by the Metal Finishing  Category
Development Document and will not be discussed  further  in this
report.
                                V-15

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                             SECTION VI
               CARBON AND GRAPHITE SUBCATEORY
INTRODUCTION

This discussion of the Carbon and Graphite subcategory consists of
the following major sections:

     Products
     Size of Industry
     Manufacturing Processes
     Materials
     Water Usage
     Production Normalizing Parameters
     Waste Characterization and Treatment in Place
     Potential Pollutant Parameters
     Applicable Treatment Technologies
     Benefit Analysis

Data contained in this section were obtained from several sources.
Engineering visits were made to 6 plants within the subcategory.  Of
these 6 plantst wastewater samples were collected from four of these
facilities.  A total of 16 Carbon and Graphite plants were contacted
by telephone in this survey.  A literature survey was also conducted
to ascertain differences between types of Carbon and Graphite products,
process chemicals used, and typical manufacturing processes.

PRODUCTS

Elemental carbon in its amorphous and anisotropic crystalline forms
exhibits unique electrical, thermal, physical, and nuclear proper-
ties.  Manufacturing techniques permit control of these properties
over very wide ranges.  Thus, both carbon (the amorphous form) and
graphite (the anisotropic crystalline form) are used, in hundreds
of products manufactured for use by many industries.  Most carbon
and graphite produdts are electrical conductors of one form or
another; hence, the manufacture of most carbon and graphite pro-
ducts is included within the E&EC Category.

The major carbon and graphite product areas are carbon electrodes
for aluminum smelting and graphite furnace electrodes for electric
steel production.  Carbon electrodes for aluminum smelting are made
primarily by the aluminum industry for consumption within that
-industry.  Their manufacture is covered by existing regulations for
the aluminum industry.
                                VI-1

-------
 Graphite  furnace electrodes  for electric steel production  are  made
 by the  carbon and graphite products  industry.   In addition to
 graphite  furnace electrodes, th*is  study of the Carbon and  Graphite
 subcategory also includes  the following products:

      .     Graphite molds and crucibles  for metallurgical
           applications.

           Graphite anodes  for electrolytic cells  used for  produc-
           tion of  materials such, as  caustic soda, chlorine,
           potash, and  sodium chlorate

           Carbon and graphite for  structural,  refractory,  nuclear,
           and other non-electrical applications

      .     Carbon and graphite brushes,  brush stock contacts  and
           other products for electrical applications  (Brushes  are
           used to make continuous  electrical contact  between ro-
           tating and stationary members of electrical machines)

           Carbon and graphite specialties  such as jigs and fixtures,
           battery carbons, seals and rings, and rods  for electric
           arc lighting,  welding, and metal cutting

 Carbon  and graphite products are contained in  SIC 3624.  The major
 subclassifications of  SIC  3624 are electrodes  for electric furnace
 and electrolytic cell  use  and carbon and graphite products (except
 electrodes).   Carbon and graphite  products include brushes,  elec-
 trodes  and other carbon  and  graphite products  (electrical, mechan-
 ical, aerospace,  nuclear,  metallurgical and refractory).

 SIZE OF INDUSTRY

 The size of  the  Carbon and Graphite  subcategory is presented in the
 following  paragraphs in  terms  of number of plants,  number  of produc-
 tion employees,  and production rate.  Each of  these figures  represent
 an estimate  based  upon data  collected from visited facilities, tele-
 phone surveys,  and  literature  surveys.

 It is estimated  that approximately 70 plants are  engaged in  the manu-
 facture of  carbon  and  graphite products.   These estimates  are  based
 upon the 1977  Dun and  Bradstreet listing of companies  engaged  in
 business in  SIC  3624.  Known non-manufacturing firms  (distributors)
 and known  manufacturers  of non-carbon and  graphite products  (brush-
plates)  were  removed  from the listing.  From  this  modified  lis-
 ting, 70 plants  are estimated  to be  engaged in the manufacture of
 carbon and graphite products.
                                Vl-2

-------
The Department of Commerce 1977 Census of Manufactures (Preliminary
Statistics) was also reviewed.  After removal of plants believed to
be engaged in the manufacture of non-carbon and graphite products
(brushplates), 70 plants were estimated to be engaged in the manu-
facture of carbon and graphite products.

The Department of Commerce 1972 Census of Manufactures was also
compared to the above sources.  70 plants were estimated to be
engaged in the manufacture of carbon and graphite products.

Number of Employees

It is estimated that between 8,300 and 9,000 production employees
are engaged in the manufacture of carbon and graphite products.
These estimates are based on the Department of Commerce 1972 Census
of Manufactures which lists 8,600 production employees engaged in
the manufacture of carbon and graphite products and on the Depart-
ment of Commerce 1977 Census of Manufactures Preliminary Statistics
which lists 9,000 production employees.  Employees believed to be
engaged in the manufacture of non-carbon and graphite products
(brushplates) were subtracted from the total number of production
employees listed in the SI-C.  The resulting estimate based on the
1977 census is that approximately 8,300 employees are engaged in
the manufacture of carbon and graphite products.

Typical plants either surveyed by telephone or visited have numbers
of production employees ranging from 30 to 800.  The majority of
plants employ between 60 and 350 production employees.  Only six
plants employ more than 300 production employees*

Production Rate

Total production of carbon and graphite products is not available.
However, the following partial information is presented from the
Department of Commerce 1977 Census of Manufactures  (Preliminary
Statistics) to profile the industry:
Electrodes for electric
and electrolytic cell use

     Carbon

     Graphite

All other carbon and
graphite products

Other products not
elsewhere classified
                                    Millions of Kg.
                                    Per Year (1977)
782.76 (355.8)

832.48 (378.4)


    N/A


    N/A
                     % Total Annual
                     Dollar Value (1977)
12%

42


44
                               VI-3

-------
A  typical medium  sized  plant,  employing  260  production  workers  and
360  total people,  produces  15,800  metric tons/year  of large  carbon
and  graphite  electrodes.  A typical  large plant,  employing 650  to-
tal  employees, produces 68,000 metric  tons/year of  graphite.

MANUFACTURING PROCESSES

Due  to  its high triple  point,  3750 _+ 50°C and  125 + 15  atm,  carbon
cannot  be melted  and  cast to form  finished products.  At  ambient
pressure carbon does  not melt; it  sublimes (at 3370 4- 25°C).  Thus
the  manufacturing  process for  carbon and graphite products is one
of aggregating small  particles together,  followed by heat treating
to develop the desired  microstructure  and physical  properties.

Carbon  products,  called "baked carbon" in the  industry, require
baking  at approximately 1000°C.  Graphite products  also known as
"synthetic graphite", "graphitized products",  or  "electrographite",
require one or more additional heat  treating cycles at  high  tempera-
tures to develop  the  anisotropic crystalline structure  that  is
unique  to graphite.   This process  is called  "graphitizing".

The  flow of materials and the  major  unit operations in  the produc-
tion of baked carbon  and electrographite are presented  schematically
in Figure 6-1.  This  schematic most  closely  defines the process for
producing carbon or graphite of large  dimensions  for molds,  struc-
tural,  and furnace electrode applications.   Many  of the steps out-
lined are also followed in  producing different grades of  material
for  special applications, such as  anodes and motor  brushes.

The process starts with weighing the required  quantities  of
calcined carbon filler,  binders and  additives; combining  them as
a batch in a  heated mixer;  and then  forming  the resulting "green"
mixture by compression  molding or  by extrusion.   In some  plants
green carbon  forms are  quenched in large water-filled tanks  to
harden  the material for subsequent handling.   Following inspection
and  testing for defects, acceptable  green bodies  are readied for
baking.

Green bodies  are carefully  packed  in materials such as  sand,
coke granules, or  charcoal.  Packing supports  the green body (which
softens during the early stages of baking),  distributes heat more
uniformly, absorbs excess tar  or pitch binder, and  protects  the
green bodies  from oxidation.   Baking takes place  within a gas or
oil fired furnace, reaching a  peak temperature of approximately
1000°C.  The process  continues for several weeks.   When the
furnace has cooled down to  approximately 400°C, the resulting
baked carbon bodies are unpacked,  stripped of  packing material,
and cleaned.
                               VI-4

-------
                                       Raw  Materials
Process  Materials
   Extrusion Aids
       Water
       Packing
                                                   Extrusion
                                                  Or Molding
       	•—- Denotes Wastewater Flow Path
                                FIGURE 6-1
               PRODUCTION OF CARBON AND GRAPHITE SUBCATEGORY
                                  VI-5

-------
 Baked carbon is one of the most difficult refractory materials to
 machine.   It is hard, brittle and very abrasive,  owing to small
 carbide inclusions formed from impurities during  the baking
 process.   Hence, manufacturing to final shape and finish is
 performed  by grinding with'diamond wheels.  Cooling and dust
 control are achieved either by air pickup with bag-house filtering
 or by wet  grinding using contact cooling water.

 For graphite production the baked carbon is  placed in an electric
 furnace.   The baked carbon is packed  with metallurgical coke,
 graphite or charcoal to facilitate current flow at the
 start of heating.  As the temperature rises, the  baked carbon
 itself becomes the resistor material.  Peak  temperature is
 controlled to 2700 + 500°C,  the precise value having an important
 effect on  the physical and electrical properties  of the final
 product.   Duration of the graphitizing process is approximately
 two weeks.  After unpacking, finished graphite is allowed to air
 cool to room temperature.  The density of electrographite can  be
 increased  by impregnating the graphite with  such  materials as
 coal tar pitch or petroleum oil, either prior to  or subsequent to
 initial graphitizing, and then recycling through  the graphitizing
 furnace.   Impregnation generally occurs in a pressure or vacuum
 autoclave.  In some plants the impregnated material is quenched in
 water-filled tanks to facilitate subsequent  handling.

 The resulting graphite is soft and nonabrasive.  It can be machined
 with conventional wood working or metal working tools.  Machining
 lubricants are unnecessary and undesirable,  because the porosity
 of  the graphite may cause absorption  of the  lubricants which would
 alter the  electrical characteristics  of the  piece.

 MATERIALS

 Materials  required to manufacture carbon and graphite products
 may be classified as raw materials and process materials.   Raw
 materials,  which generally become part of the product, may be
 subdivided  into fillers,  binders,  additives,  and  impregnants.
 Process materials  such as  packing materials,  contact water,  and
 extrusion  aids  do not generally enter the product,  but they are
 necessary  to  perform certain  operations.


 Filler Materials

 Several different  raw carbon  filler materials are  used depending
on  the product  to  be  manufactured.  These filler materials  are:


      .     Petroleum  Coke  - A  byproduct  of petroleum cracking,
          petroleum  coke  is a  refining  residue  from which  most
                              VI-6

-------
Binders
          of the volatiles have been driven off.  Formation of
          crystallites during coking promotes subsequent graphi-
          tizing.  Petrole-im coke still contains approximately
          5 to 15% volatile organics.  These must be driven off
          by calcining prior to mixing with the other raw materials.

          Anthracite Coal - Anthracite coal is used for baked
          carbon products only, not for graphitized products.
          Ash content must be reduced from 12% to approximately
          6%r which is generally achieved by washing or other
          benefincation processes, including electric calcining.

          Wood Charcoal - Used for specialty carbon products and
          brushes, wood charcoal imparts desirable high electrical
          contact resistance to carbon compositions.  Wood charcoal
          does not graphitize.

          Carbon Black - A product of incomplete petroleum
          combustion, carbon black is used in a wide variety of
          carbon and graphite products, especially brushes.

          Natural Graphite - Used to increase the density and
          conductivity of carbon and graphite formulations, natural
          graphite is used as a filler in brushes and other
          products.  Natural abrasives, which are always present,
          are useful in controlling the self-cleaning action of
          brushes.

          Pitch Coke - The result of coking coal tar pitch, pitch
          coke is higher in ash content and is more abrasive than
          petroleum coke.  Its use is limited to specialty carbon
          and graphite products.
Binder materials are^used to cement the aggregated filler material
particles together during the "green" stage.  Binder materials are
required to bond with carbon during the baking process to con-
tribute to the uniformity of the microstructure of the finished
product.  Binder materials include:

          Coal Tar Pitch - A byproduct of coal tar distillation
          and the production of metallurgical coke, coal tar
          pitch is the primary binder used in the manufacture of
          carbon and graphite products.

          Phenol Formaldehyde - This and other related thermo-
          setting plastics are used in applications where
          extra durability is required.
                                VT-7

-------
 Additives

 Additives  are  used  to  alter  the  electrical  and  physical  properties
 of  the  product.   They  are  non-carbonaceous  and  include:

      .     Sulfur  -  Sulfur  is sometimes  used to  dehydrogenate  the
           binder  to promote  coking  of the binder.

           Iron Oxide - Iron  oxide is used to limit  volumetric
           expansion during graphitizing to  help avoid  structural
           defects.

           Metals  -  Silver  or copper powders are used to  increase
           electrical conductivity of certain brush  and electrical
           contact formulations.

 Impregnants

 Impregnants are sometimes  applied to graphite products prior  to final
 graphitizing to increase density and reduce porosity.  Impregnants
 include:

           Coal Tar  Pitch - Coal  tar pitch is the most common
           impregnant used.   Impregnant  grades of pitch are  less
           viscous and  have lower melting points than binder pitches,
           but  they  are  derived from the same sources.

      .     Oils -  Petroleum oil is also  used as  an impregnant  because
           of its  low viscosity,  low melting point,  and absence of
           solid particles.   Other oils  are  used in  some  plants to
           control the  off  gassing of volatiles  into the  atmosphere
           during  this process.

Process Materials

Packing materials,  extrusion  lubricants, contact water,  and scrubber
water comprise the  process materials used in  the manufacture  of carbon
and graphite products.

           Packing Materials— "Green" body packing materials
           consist of sand, charcoal, and granulated coke.  They
           are used  singly or  in  combination to  support the green
           body during baking, to protect the  body from oxidation,
           and to distribute the  furnace heat  uniformly.

           Graphitizing  furnace packing materials consist of
           graphite, metallurgical coke, and  charcoal.  They are
           used to protect against oxidation  and to  conduct  furnace
          current during initiation of heat-up.
                               71-8

-------
          Extrusion Lubricants - Small quantities of materials
          such as petroleum oil may be added to the green mixture
          to facilitate extrusion.

          Contact Water - Contact water is used in some plants
          to quench the hot green carbon after extrusion.
          Contact water may also be used to quench hot baked
          carbon following its impregnation with graphitizing
          materials.

          Contact water may also be used in conjunction with the
          final machining and finishing of baked carbon products.
          The water is used for flushing chips and for cooling
          the diamond grinding wheels.

          Scrubber Water - One visited facility re~processes the
          baking oven packing sand by air scrubbing the carbon
          from the sand.  The carbon-laden air is subsequently
        .  scrubbed of carbon particulates with a wet air scrubber.

WATER USAGE

Prom the 1972 Census of Manufactures, gross water usage is estimated
to be 102.2 million liters per day (27 million gallons per day) for
the carbon and graphite products industry.  Based on plants visited,
approximately 58% is recycled and 42%, or 42.8 million liters per
day (11.3 million gallons/day), is discharged.  Process water is
approximately 18% of the gross water usage, or 18.5 million liters
per day (4.9 million gallons/day).  (The remaining 82% includes sanitary.
use, boiler blowdown, etc.)  Process water use appears to be unevenly
divided over the 70 plants estimated to be involved in carbon and
graphite production.  Many smaller plants, employing up to approxi-
mately 150 total employees, report no use of contact cooling water
at all.  Five visited medium and large plants reported contact
water in amounts ranging between approximately 302,000 and 2,650,000
liters per day (80,000 to 700,000 gallons per day).  This contact
water use includes the use of wet air scrubber water at one visited
facility.

Wastewater

Of the 42.8 million liters/day (11.3 million gallons/day) discharged,
it is estimated that approximately 14.4 million liters/day (3.8 mil-
lion gallons/day) are treated, and the balance is discharged untreated,
Treatment is not consistent in the carbon and graphite products indus-
try.  Observations regarding treatment from six visited plants are
summarized in Table 6-1.
                                 VX-9

-------
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PRODUCTION NORMALIZING PARAMETERS

Production normalizing parameters are used to relate the pollutant
mass discharge to the production level of a plant.  Regulations expres-
sed in terms of this productiqn normalizing parameter are multiplied
by the value of this parameter at each plant to determine the allowable
pollutant mass that can be discharged.  Meaningful production
normalizing parameters that have been considered for Carbon and
Graphite industry include:

          Size, complexity and other product attributes that
          affect the amount of pollution generated during
          manufacture of a unit.

          Manufacturing processes, but differences in pro-
          cesses for the same product result in differing
          amounts of pollution.

          Production records, but lack of applicable data
          may impede determination of production rates in
          terms of desired normalizing parameters.

Several other broad strategies that have been developed to determine
normalizing parameter are as followsj


          The process approach - In this approach, the production
          normalizing parameter is a direct measure of the produc-
          tion rate for each wastewater producing manufacturing
          operation.  These parameters may be expressed as sq.m.
          processed per hour, kg of product processed per hour,
          etc.  This approach requires knowledge of all the wet
          processes used by a plant because the allowable pollu-
          tant discharge rates for each process are added to
          determine the allowable pollutant discharge rate for
          the plant.  Regulations based on the production norma-
          lizing parameter are multiplied by the value of the
          parameter for each process to determine allowable dis-
          charge rates from each wastewater producing process.

          Concentration limit/flow guidance - This strategy
          limits effluent concentration.  It can be applied
          to an entire plant or to individual processes.  To
          avoid compliance by dilution, concentration limits
          are accompanied by flow guidelines.  The flow guide-
          lines, in turn, are expressed in terms of the produc-
          tion normalizing parameter to relate flow discharge
          to the production rate at the plant.

There are four wet processes used in the carbon and graphite sub-
category.  They were introduced earlier in this section, but will
be expanded here to develop production normalizing parameters.  The
four wet processes are:
                                Vl-11

-------
 Extrusion  Quenching  -  Some  plants, making  large
 electrodes for metals  smelting,  extrude  the mixed
 raw materials for  the  electrode  in paste or "green"
 carbon  form.  The  hot  green carbon is  cooled  by  im-
 mersion in large,  open water tanks to  cool and harden
 them, so that they can be handled in the subsequent
 baking  steps.  These baking steps transform the  "green"
 carbon  to  a hard form, called "baked"  carbon.

 Pollutants are leached from the  surface  of the
 green carbon during  extrusion quenching.  Hence,
 an applicable production normalizing factor for  this
 process would be" surface area of the extruded pieces.

 Impregnation Quenching - Baked carbon  is con-
 verted  to  graphite by  subsequent heating.  Electrical
 and physical properties of  the graphite  can be altered
 by impregnating the  baked carbon with  additional
 graphitizing materials.

 Impregnation occurs  within  a vacuum or pressure
 autoclave,  which is  flooded with impregnant and  then
 emptied once each  impregnation cycle.  Impregnant  is
 absorbed into the  graphite  as a  function of the  sur-
 face area.  Some plants impregnate prior to the  first
 graphitizing cycle,  which is followed  by quenching the
 warm, impregnated, baked carbon  in large,  open water
 tanks to facilitate  subsequent handling.

 As with extrusion  quenching, pollutants  are leached
 from the. surface of  the impregnated graphite  during
 subsequent  quenching.  An applicable production  norma-
 lizing  parameter for impregnation quenching is surface
 area.   Therefore,  effluents from extrusion and impreg-
 nation  quench will be  considered together  in  the
 development of production normalizing  parameters.

 Machining  and Grinding - Baked carbon  is a hard, abrasive
 material that is best  machined using diamond grinding
 wheels^  Water is  used as a machining  lubricant  and
 coolant  as well as for dust control.   Machining  opera-
 tions range from smoothing  or finishing  operations on
 large electrodes in  which less than 1% of  the rough
 electrode  is removed to complex  machined shapes  in which
 the majority of the  rough stock  is machined away.  How-
 ever, complete recycling of machining  process water has
 been achieved in this  industry,  which  results in zero
 discharge.  Zero discharge  is  recommended  for machining
 and grinding processes, and this eliminates the  need for
 defining a production  normalizing parameter for  the
machining process.
                      VI-12

-------
          Scrubbing - Air scrubbers have not been reported to be
          -Ln wide use in the carbon and, graphite industry.  They
          have been observed at only one plant, 15606, where they
          are used in a sand recycling process.  The sand, used
          to pack the baking furnace, is stripped of excess carbon
          by an air blast which is subsequently cleaned with- a
          wet air scrubber.  Scrubbing washes the pollutant laden
          air stream with a flow of water.  Analysis of raw waste-
          water shows that raw scrubber wastewater is similar to
          raw machining process wastewater and therefore will be
          considered along with machining and grinding.  Zero
          discharge is recommended for scrubbing processes, and
          this eliminates the need for defining a production
          normalizing parameter for the scrubber process.

The carbon and graphite industry can therefore be considered to have
two types of process wastewaters.  Quench waters used for extrusion
and impregnation are similar in pollutant constituents and concentra-
tions.  Machining (or grinding) and wet air scrubbing of carbon
and graphite products represents the second type of effluent.
While quench waters tend to contain oils, machined wastes and sand
scrubbing contain suspended solids.

WASTE CHARACTERIZATION AND TREATMENT IN PLACE

This section presents the sources of waste in the Carbon and Graphite
subcategory and the analytical results of samples of this wastewater.
The in-place waste treatment systems are also discussed and effluent
sample data from these systems for the four sampled Carbon and Graphite
plants is presented.

Sources of Wastewater

The following four wet processes are used by the carbon and graphite
industry:

          Post-extrusion quench
          Post-impregnation quench
          Machining
      .    Scrubbing                    •

These wet processes are not universally used by the industry.
Table 6-2 summarizes the use of wet processes at plants contacted
during this study.  A review of this table indicates that:

          Zero or moderate discharge versions of all four wet
          processes presently exist and are in use by the in-
          dustry.

          Manufacturers of large products generally use wet
          processes, although no one plant has been found to
          use all four wet processes.
                                Vl-13

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           Large  products,  such  as  electrodes  and  anodes,  are
           made  in  medium to  large  plants.

           Small  plants  make  small  products, such  as  electric
           motor  brushes and  s^al rings,  and generally  use no
           wet processes.

 Post-Extrusion Quench

 At  four visited  plants, this process  is  associated only with  large
 products  such as electrodes  or  anodes.   These products range  from
 3 to 5 meters long,  40  to  72 cm (16 to 28 inches)  in diameter,
 and,weigh several  metric tons.  Quenching typically  occurs in large
 open, concrete tanks that  are filled  with contact  cooling water.
 Observed  tank capacities range  from 42,000 liters  to 110,000  liters
 (11,000 to 29,000  gallons).   Large products may require several hours
 in  the tank to cool  down.  Extrusion  aids may be  used  in  the  batch
 formulations of  the  product.  In one  plant, extrusion  aids form an
 oil film  on the  surface of the  cooling water.  This  oil film  was
 removed by skimming  and contractor hauled.

 The post-extrusion quench  process  uses a straight-through water flow,
 with no recirculation or cooling.  Flows of 62,000,  364,000,  662,000,
 and 1,744,000 liters/day (16,400,  96,000, 175,000, and 461,000 GPD)
 have been observed at visited plants.

 Zero discharge extrusion quench was not  observed.  All four visited
 plants discharge extrusion quench  water.  By  contrast, four other
 plants surveyed  that make  small, molded  products do  not use
 quenching at all.  These products  are allowed  to air cool with no
 water usage.

 Post-Impregnation  Quench - This process, observed at three visited
 plants, is  associated with large graphite products such as electro-
 des and occurs only  if  impregnation precedes  initial graphitizing.
 The quench  typically occurs  in  large open, concrete  tanks that are
 filled with contact cooling  water.  Tanks of  165,000 liters
 (11,500 gallons) capacity  have been observed.  Some  impregnants
 form an oil film on the surface of the cooling water.  This oil
 film is removed  prior to further processing of the product.

The simplest post-impregnation quench process uses a straight-
 through flow with  no recirculation.  A quench flow rate of 200,000
 liters/day  (53,000 GPD) was  observed at  one plant using this  process.
A zero discharge,  post  impregnation process was observed  at two
other plants.  Incoming water is used to make up evaporation  losses
and maintain bath  temperature at 30-35°C (85-95°F).  No oil film  was
observed.  No recirculating processes or zero-discharge processes
using oil skimming were observed.

When impregnation  of large graphite products occurs  subsequent to
 initial graphitizing, the  impregnated product is allowed  to air
                              Vl-15

-------
cool.  Quenching in water would cause  too rapid a cooling  rate,
and product cracking may result.

Machining - The machining operations that use water are associated
with both large and small products, but some carbon and graphite
product manufacturers also use dry machining.  When water  is  used,
it is used to control dust and to cool the diamond grinding wheels.
In two of four plants visited using wet machining processes,
settling and recycling of the water was observed, resulting in
zero discharge.  Carbon sludge was dewatered and hauled.   Recircu-
lation rates ranged from 11,000 to 18,000 liters/day  (3,000 to
4,800 GPD).

One other plant has an agreement to discharge 73,000  I/day (19,000
GPD) to the local POTW without any pretreatment.  The carbon  solids
in the water are useful to the POTW as a flocculant.  Other plants
surveyed use dry machining processes,  employing vacuum pick-up and
bag house filtering of carbon dust.

Scrubbers - One visited plant recycles the baking oven packing sand
by stripping the carbon dust from the  sand with air.  The  air stream
is subsequently cleaned in a scrubber, which discharges 64,000
liters/day (17,000 GPD) of water.  No  other scrubber  processes have
been observed.

Wastewater Analysis Data

Raw waste characteristics from the four wet processes were obtained
by sampling a total of eight waste streams in four carbon  and graphite
plants.  The samples were analyzed for the pollutants listed  in
Table 6-3, which contains the 129 toxic pollutants and 26  non-toxic
pollutants.

Table 6-4 presents sampling analysis data for detected parameters
in raw process wastewaters and Table 6-6 for treated  effluents for
those plants sampled within the 'carbon and graphite subcategory.
Pollutant parameters are grouped according to toxic organics,
toxic metals, non-toxic metals, and other pollutants.  Total
pollutant concentrations are presented as well as mass loadings
of those pollutant parameters.  Mass loadings were derived by
multiplying concentration by the flow  rate and the hours per  day
that a particular process is operated.  Some entries  were  left
blank for one of the following reasons:  the parameter was not
detected; the concentration used for the kg/day calculation is less
that the lower quantifiable limits or  not quantifiable.  The  kg/day
is not included in, totals for calcium, magnesium, and sodium. The
kg/day is not applicable to pH.  Totals do not include values
preceded by "less , than."

Table 6-4 lists the raw waste streams  sampled for the carbon  and
graphite subcategory.  The following considerations were made in
presenting the data:

     .    Trace Levels - Pollutants detected at levels too
          low to measure are reported  at less than  (<) the
          minimum threshold of- measurement for the test
          method used.
                              VI-16

-------
                              TABLE 6-3
                    POLLUTANT PARAMETERS ANALYZED
TOXIC   ORGANICS

001  Acenaphthene
002  Acrolein
003  Acrylonitrile
004  Benzene
005  Benzidine
006  Carbon tetrachloride
       (tetrachloromethane)
007  Chlorobenzene
008  1,2,4-trichlorobenzene
009  Hexachlorbenzene
010  1,2-dichlorethane
011  1,1,1-trichloroethene
012  Hexachloroethane
013  1,1-dichloroethane
014  1,1,2,2-tetrachloroethane
015  1,1,2,2-tetrachloroethane
016  Chloroethane
017  Bis(chloromethyl)ether
018  Bis(2-chloroethyl)ether
019  2-chloroethyl vinyl ether (mixed)
020  2-chloronaphthalene
021  2,4,6-trichlorophenol
022  Parachlorometa cresol
023  Chlorof orm(trichloromethane)
024  2-chlorophenol
025  1,2-dichlorobenzene
026  1,3-dichlorobenzene
027  1,4-dichlorobenzene
028  3,3-dichlorobenzidine
029  1,1-dichloroethylene
030  1,2-trans-dichloroethylene
031  2,4-dichlorophenol
032  1,2-dichloropropane
033  1,2-dichloropropylene
      (1,3-dichloropropene)
034  2,4-dimethylphenol
035  2,4-dinitrotoluene
036  2,6-dinitrotoluene
037  1,2-diphenylhydra
038  Ethylbenzene
039  Pluoranthene
040  4-chlorophenyl phynyl ether
041  4-bromophenyl phenyl ether
042  Bis(2-chloroisopropyl)ether
043  Bis(2-chloroethoxy) methane
044  Methyle'ne chloride
      (dichloromethane)
045  Methyl Chloride (chloromethane)
046  Methyl bromide (bromoethene)
047  Bromoform (tribromomethane)
048  Dichlorobromomethane
049  Trichlorofluoroethane
050  Dichlorodifluoromethane
051  Chlorodibromomethane
052  Hexachlorobutadiene
053  Hexachlorocyclopentadiene
054  Isophorone
055  Naphthalene
056  Nitrobenzene
057  2-nitrophenol
058  4-nitrophenol
059  2,4-dinitrophenol
0 60  4,6-dinitro-o-cresol
061  N-nitrpsodimethylamine
062  N-nitrosodipheynylamine
063  N-nitrosodi-n-propylamine
064  Pentachlorophenol
065  Phenol
066  Bis(2-ethylhexyl) phthalate
067  Butyl benzyl phthalate
068  Di-tt-butyl phthalate
069  Di-n-ocityl phthalate
070  Diethyl phthalate
071  Dimethyl phthalate
072  1,2-benzanthracene
      (benzo(a)anthracene)
073  Benzo(a)pyrene (3,4-benzopyrene)
0 74  3,4-benzofluoranthene
      (benzo(b)fluoranthene)
075  11,124aenzofluoranthene
      (benzo{k)fluoranthene)
076  Chrysene
077  Acenaphthylene
078  Anthracene
079  1,12-benzoperylene
      (benzo(ghi)perylene)
080  Fluorene
081" Phenanthrene
082  1,2,5,6-dibenzanthracene
      ,(dibenzo (a, h) anthracene)
                                     Vl-17

-------
                       TABLE 6-3 (Continued)
                   POLLUTANT PARAMETERS ANALYZED
TOXIC   ORGANICS

083  Indeno (1,2,3-CD) Pyrene
     (2,3-o-phenylene pyrene)
084  Pyrene
085  Tetrachloroethylene
086  Toluene
087  Trichloroethylene
088  Vinyl chloride (Chlorethylene)
089  Aldrin
090  Dieldrin
091  Chlordane (technical mixture
     and metabolites)
092  4,4'-DDE
093  4,4'-DDE (p,p'-DDX)
094  4,4'-ODD (p,p'-TDE)
095  Alpha-endosulfan
096  Beta-endosulfan
097  Endosulfan sulfate
098  Endrin
099  Endrin aldehyde
100  Heptachlor
101  Heptachlor epoxide (BHC-Hexa-
     chlorocyclohexane)
102  Alpha-BHC
103  Beta-BHC
104  Gamma-BBC (Lindane)
105  Delta-BHC (PCG-polychlorinated
     biphenyls)
106  PCB-1242 (Arochlor 1242)
107  PCB-1254 (Arochlor 1254)
108  PCB-1221 (Arochlor 1221)
109  PCB-1232 (Arochlor 1232)
110  PCB-1248 (Arochlor 1248)
111  PCB-1260 (Arochlor 1260)
112  PCB-1016 (Arochlor 1016)
113  Toxaphene
129  2,3,7,8-tetrachlorodibenzo-p-
     dioxin (TCDD)

Xylenes
Alkyl epoxides
TOXIC METALS

114  Antimony
117  Beryllium
118  Cadmium
119  Chromium
120  Copper
121  Cyanide
122  Lead
123  Mercury
124  Nickel
125  Selenium
126  Silver
127  Thallium
128  Zinc

TON-TOXIC METALS

     Calcium
     Magnesium
     Aluminum
     Manganese
     Vanadium
     Boron
     Barium
     Molybdenum
     Tin
     Yttrium
     Cobalt
     Iron
     Titanium

OTHER POLLUTANTS

     Oil and Grease
     Total Organic Carbon
     Biochemical Oxygen Demand
     Total Suspended Solids
     Phenols
     Fluoride
     pH
                                      VI-18

-------
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          Incoming Water Analysis - In some instances samples
          were taken of incoming plant water.  Pollutants were
          found -in some of these incoming streams at essential-
          ly the same levels as in the output streams, indi-
          cating that the incoming water is the source of the
          pollutant.  These pollutant levels were not subtracted
          from the total pollutant level of the affected streams.
          The presence of pollution in the incoming streams is
          noted in the data.

          Pollutant Loads - Pollutant loads were calculated for
          measurable pollutants by multiplying concentration by
          flow and daily flow durations.  This procedure gives
          calculated pollutant loads in kg/day for each pollu-
          tant for each stream sampled.

          Sample Blanks - Blank samples of organic-free distilled
          water were placed adjacent to sampling points to detect
          airborne contamination of water samples.  These sample
          blank data are not subtracted from the analysis results,
          but, rather, are shown as a  (B) next to the pollutant
          found in both the sample and the blank.  The tables show
          figures for total toxic organics, total toxic and
          non-toxic metals, and other pollutants.

Summary of Raw Waste Stream Data

Table 6-5 summarizes pollutant concentration data for the sampled
raw waste streams for the Carbon and Graphite Subcategory.  Mini-
mum, maximum, mean, and flow weighted mean concentrations have been
determined' for sampled raw waste streams.  The flow weighted mean
concentration was calculated by dividing the total mass rates  (mg/
day) by the total flow rate (liters/day) for all sampled data  for
each parameter.  The flow weighted mean concentration of total raw
waste (includes machining, grinding, scrubber wastes, and quenches)
is also presented in Table 6-5.

Pollutant parameters listed in Table 6-5 were selected based upon
their occurrence and concentration in  the  sampled streams.  Those
parameters not detected or at  trace levels in the sampled streams
were excluded from  this table.

Treatment In-Place

Table 6-1 summarized treatment  in place  for  the  carbon and  graphite
industry.  Wastewater  treatment was observed  in  six  of the  carbon
and graphite plants visited, and consists  of  the following:

          Oil separation  prior  to discharging quench water.

          Settling  carbon solids out of  water  used  for
          machining coolants prior to  reuse.
                              VI-24

-------
                                         TABLE 6-5
                              CARBON AND GRAPHITE SUBCATEGORY
                   MACHINING, GRINDING & SCRUBBER RAW WASTE STREAM DATA
     Parameter
                                             Flow Weighted
  Minimum        Maximum         Mean            Mean
Concentration  Concentration  Concentration  Concentration
                   (mg/1)         (mg/1)
TOXIC ORGANICS

Oil  1,1,1 Trichloroethane
044  Methylene Chloride
065  Phenol
066  Bis(2-ethylhexyl)phthalate
067  Butyl benzyl phthalate
068  Di-n-butyl phthalate

TOXIC METALS

114  Antimony
115  Arsenic
118  Cadmium
119  Chromium
120  Copper
121  Cyanide
122  Lead
123  Mercury
124  Nickel
125  Selenium
128  Zinc

NON-TOXIC METALS

     Aluminum
     Manganese
     Vanadium
     Boron
     Barium
     Molybdenum
     Tin
     Yttrium
     Cobalt
     Iron
     Titanium
     Magnesium
 0.068,(B)*
<0.01
<0.01
<0.01
<0.01
 0.007
 0.001
 0.001
<0.003
<0.005
<0.01
<0.01
<0.005
<0.005
<0.01
 0.003
 0.061
 0.23
 0.006
 0.023
 0.041
 0.085
 0.020
 0.013
<0.004
 0.013
 0.573
 0.047
 1.21
 0.068(B)
 0.049
 0.039
 0.410
 0.019
<0.01
 0.005
<0.01
 0.019
 0.054
 5.3
 0.065
 1.7
 0.002
 0.146
 0.08
 0.237
 2.18
 0.071
 0.121
 0..424
 0.878
 0.445
 0.208
 0.007
 0.051
 6.689
 0.338
 8.296
0.068
0.023
0.025
0.11
0.013
0.01
0.003
0.004
0.008
0.028
1.67
0.03
0.483
0.001
0.062
0.025
0.125
0.942
0.05
0.075
0.193
0.48
0.167
0.085
0.005
0.038
3.285
0.145
3.79
0.068
0.0160
0.034
0.153
0.0115
0.01
0.0178
0.006
0.01
0.045
1.219
0.026
0.264
0.0025
0.046
0.015
0.178
1.783
0.061
0.105
0.347
0.524
0.358
0.171
0.005
0.049
5.5
0.273
2.07
                                              VI-25

-------
                                  TABLE 6-5 (Con't)
                             CARBON AND GRAPHITE SUBCATEGORY
                   MACHINING, GRINDING & SCRUBBER RAW WASTE STREAM DATA
     Earameter
OTHER POIZOTANTS

     Total Suspended Solids
     Tbtal Organic Carbon
     Biochemical Oxygen Demand
     Oil and Grease
     Hienols
                                             Flow Weighted
  Minimum        Maximum         Mean            Mean
Concentration  Concentration  Concentration  Concentration
   (rag/1)         (mg/1)         (mg/1)         (mg/1)
 53
 116
 0.0
 7.0
 0.014
2988.
7222.
25
70.4
0.122
1329.
2050.3
10.13
26.73
0.04
612.
353
9.2
11.3
0.066
* Based on one stream, one day (concentration found in blanks)
                                              VI-26

-------
                                  TABLE 6-5  (Con't)
                             CARBON AND GRAPHITE SUBCATEGORY
                   EXTRUSION AND IMPREGNATION QUENCHING RAW KfcSTE STREAMS
     Parameter
                                             Flow Weighted
  Minimum        Maximum         Mean            Mean
Concentration  Concentration  Concentration  Concentration
   (mg/1)         (mg/1)         (mg/1)         (mg/1)
TOXIC ORGANICS

004  Benzene                       <0.01           0.011
039  Pluoranthene                  <0.01           0.013
044  Methylene chloride            <0.01           0.062
066  Bis(2-«thylhexyl)phthalate    <0.01           2.1
072  1,2-Benzanthracene            <0.01           0.019
073  Benzo pyrene                  <0.01           0.013
075  11,12 Benzoanthracene         <0.01           0.011
076  Chrysene                      <0.01           0.011
078  Anthracene                    <0.01           0.013

TOXIC METALS

119  Chromium                      <0.01          <0.015
120  Copper                        <0.01           0.027
122  Lead                          <0.005          0.045
123  Mercury                        0.0007        <0.001
124  Nickel                        <0.01           0.114
125  Selenium                       0.002         <0.01
128  Zinc                           0.023          0.11

NON-TOXIC METALS

     Aluminum                       0.217          0.279
     Manganese                      0.003          0.017
     Vanadium                      <0.01           0.061
     Boron                          0.018          0.116
     Barium                         0.023          0.042
     Molybdenum                     0.005         <0.035
     Yttrium                       <0.004          0.005
     Cobalt                         0.003         <0.05
     Iron                           0.003          0.653
     Titanium                      <0.002          0.003
     Magnesium                      1.37           8.069
                              0.01
                              0.011
                              0.034
                              0.533
                              0.013
                              0.012
                              0.01
                              0.01
                              0.011
                              0.013
                              0.016
                              0.038
                              0.0012
                              0.038
                              0.005
                              0.05
                              0.242
                              0.011
                              0.016
                              0.055
                              0.035
                              0.025
                               0.0043
                              0.034
                              0.424
                              0.002
                              3.62
0.01
0.01
0.014
0.047
0.010
0.01
0.01
0.01
0.01
0.013
0.023
0.037
0.001
0.107
0.003
0.029
0.239
0.0038
0.03
0.062
0.018
0.008
0.003
0.01
0.104
0.002
4.23
                                             VI-27

-------
                                  TABLE 6-5 (Con't)
                             CARBON AND GRAPHITE SUBOVTEGORY
                   EXTRUSION AND IMPREGNATION QUENCHING RAW WASTE STREAMS
     Parameter
OTHER POLLUTANTS

     Total Suspended Solids
     Total Organic Carbon
     Biochemical Oxygen Demand
     Oil & Grease
     Phenols
                                             Flow Weighted
  Minimum        Maximum         Mean            Mean
Concentration  Concentration  Concentration  Concentration
   (mg/1)         (mg/1)         (mg/1)         (mg/1)
 1.0
<1.0
 2.0
 3.5
<0.005
19.0
4.1
19.0
44.0
0.022
6.90
2.28
7.67
18.80
0.015
2.79
2.53
5.69
7.93
0.016
                                           VI-28

-------
                      TABLE 6-5 (Con't)
             CARBON AND GRAPHITE-TOTAL RAW WASTE
        (MACHINING, GRINDING,  SCRUBER EFFLUENT,  AND
             EXTRUSION AND IMPREGNATION QUENCHES)
     Parameter
TOXIC ORGANICS

004  Benzene
Oil  1,1,1-trichloroethene
039  Fluoranthene
044  Methylene chloride
065  Phenol
066  Bis(2-ethylhexyl)phthalate
067  Butyl benzyl phthalate
068  Di-n-butyl phthalate
072  1,2-benzanthracene
073  Benzo(a)pyrene
075  11,12-benzofluoranthene
076  Chrysene
078  Anthracene
079  1,12-benzoperylene

TOTAL- TOXIC ORGANICS

TOXIC ORGANICS

119  Chromium
120  Copper
122  Lead
124  Nickel
128  Zinc

OTHER POLLUTANTS          ,

     Total Suspended Solids
     Total Organic Carbon
     Oil & Grease
     Biochemical Oxygen Demand
  Flow Weighted
Mean Concentration
       (mg/1)
       0.01
       0.01
       0.01
       0.021
       0.013
       0.052
       0.01
       0.01
       0.01
       0.012
       0.01
       0.01
       0.01
       0.01

       0.197
       0.015
       0.08
       0.045
       0.104
       0.036
       31.8
       19.25
       8.09
       5.86
                              VI-29

-------
 Oil Separation : - Oil separation was observed at one visited plant.
At  this plant, the effluents from the extrusion quench and the
impregnation quench each flow through oil separators prior to
discharge.

The extrusion quench oil separation treatment was installed primarily
to  handle oil leakage from the extrusion machinery and to contain
leakage from any major hydraulic system failure that might occur.

Process wastewater at the rate of 27,600 1/hr (7,292 gal/hr) enters
the tank at the bottom.  Oil droplets impinge on plates placed
perpendicular to the flow direction causing the oil droplets to coa-
lesce and rise to the surface.  The water leaves the tank at the
bottom of the opposite end of the tank.  The oil that collects at the
top of the tank is periodically skimmed off and stored for future
use or reclaim.

The impregnation oil separation treatment is similar to the extrusion
oil separation treatment.  The only significant difference is that
the impregnation quench flow is smaller at 8,357 1/hr (2,208 gal/hr).
The impregnant oil rises to the top of the tank from which it is
skimmed periodically.  Skimmed oil is stored for future use or
reclaim.

Settling - Settling of carbon particles generated from machining
and wet air scrubbing processes was observed at five visited
plants.  In three of these plants, carbon particles are picked up
in  a water stream and sent to a settling tank.  The supernatant is
recycled back to the machining process.  The carbon particles are
pumped from the bottom of the settling tank as sludge and contrac-
tor removed.

There are differences between the plants in the implementation of
the settling treatment.  In Plant 36173 a water flow of 757. 1/hr
(200 gal/hr) carries carbon particles to a circular clarifier that
is  equipped with a conical bottom.  Carbon sludge, drawn from the
clarifier, is pumped to a tank which is emptied periodically by
contract hauling.  The effluent water is recycled back to the
machining processes for reuse.  In Plant 30047 a water flow of 712
1/hr (188 gal/hr) carries carbon particles to a 15,140 liter (4,000
gal) lamella separator.  An anionic polymer is added to the water
before it enters the lamella separator.  The polymer acts as a floc-
culant, aiding the settling of carbon particles.  The carbon parti-
cles are drawn off the bottom of the lamella separator as sludge,
which is dewatered in a vibrating screen dewaterer.  The water from
the dewatered sludge is returned to a 16,300 liter (4,310 gal) sump
located upstream of the lamella separator, which collects the wet
machining wastes.  Plant 36175 treats process wastewater in two
parallel clarifiers prior to discharging the treated effluent.
The clarifiers are regularly pumped out to maintain a low level of
carbon sludge.  The treated effluent is then discharged directly
to  a stream at a rate of 22710 liters per hour (6000 gallons/hr).
                                 VI-30

-------
Plant 15606 uses a wet air scrubber to remove carbon particles  from
baking operations.  The scrubber water is discharged to a settling
pond where settling of carbon particles occurs.  The wastewater flow
rate from this process is approximately 15897 liters/hr (4200
gallons/hr).

Treated Waste Analysis

Table 6-6 presents the sampling analysis results of treated effluents
from the quenching processes and two machining processes.  Table 6-6
is based on the same considerations used in constructing Table  6-4
in reporting trace levels, incoming water analysis, and pollutant
loads.  As with Table 6-4 the samples presented in Table 6-6 were
analyzed for the pollutants listed in Table 6-3.          '

Actual Performance of Observed Treatment Systems

Use of raw wastewater data from Table 6-4 and treated wastewater
data from Table 6-6 permits assessment of the performance of
the following three observed treatment systems:

          Extrusion oil separation prior to discharge
     .    Impregnation oil separation prior to discharge
     .    Wet machining settling and recirculation

Extrusion Oil Separation - The performance of the extrusion oil
separator at plant 36173 is presented in Table 6-7.  Its oil and
grease removal effectiveness is fairly low.  The low removal rate
is consistent with its primary purpose of containing, a major
hydraulic fluid spill should it occur rather than of removing small
amounts of oil adhering to the product.  The concentration of metals
and organics is essentially unchanged through th\e separator.  The
apparent increases in concentration of some pollutants shown in
Table 6-7 are attributed to sampling variations and are not considered
significant in light of the very low concentratio^i levels involved.

Impregnation Oil Separation - The performance of the impregnation oil
separator at plant 36173 is presented in Table 6-8.\  Oil and grease
is reduced from 44 to 6 mg/1 which is consistent with its primary
purpose of removing process impregnant from the discharge stream.  As
with Table 6-7, increases in concentration of some pollutants such
as zinc are attributed to sampling variations.        \

Machining Settling - The performance of the machining clarifier at
plant 36173 is presented in Table 6-9.  The clarifier removes 99%
of the TSSf
-------
Plant  10 No.
Stream Description

Ftou (1/ltr)
Duration (hrs)
Sample ID No.

TOXIC  ORCANICS
   1  Acenaphtheni!
   4  Benzene
   7  Chlorobonzene
  11  1,1,1-Trichloroethane
  23  Chloroform
  24  2-Chlorophcnol
  37  l|2-Diphenylhydrazine
  J8  Ethylbenzcne
  39  Fluoranthene
  bit  Hethylene Chloride
  67  Bromoforra
  48  Dichlorobromomethane
  51  Chlorodibromomethane
  S3  Naphthalene
  57  2-Nitrophenol
  62  N-Nitrosodiphenylamine
  65  Phenol
  66    Bis(2-ethylhexyl)
        phthalate)
  67  Butyl benzyl phthalate
  68  Di-n-butyl phthalate
  69  Di-n-octyl phthalate
  70  Diethylphthalatc
  71  Dinethylphthalate
  72  Benzanthracene
  73  3,4-Bcnzopyrene
  75  11,12-Benzofluoranthene
  76  Chrysene
  73  Anthracene
  79  1,12-Bcnzoperylene
  SO  Fluorene
  83  Ideno(l,2,3-cd)pyrene
  86  Pyrene
  85  Tetrachloroethylene
  86  Toluene
  87  Trichloroethylene
  96  6,6-DDE(p,p-TDE)
100  Heptachlor
102  Alpha-BHC
106  G-imia-BHC
Total Toxic Organics

TOXIC ffiTALS

116  Antimony
115  Arsenic
117  Beryllium
118  Cadmium
119  Chromium
120  Copper
121  Cyanide
122  Lead
123  Mercury
126  (ticket
125  Seleniun
126  Silver
127  Thallium
128  Zinc
Total Toxic Metals

OTHER POLLUTANTS   •

     TSS
     TOC
     BOD
     Oil & Grease
     Phenols
                                      TABLE 6-6
                CARBON & GRAPHITE TREATED EFFLUENT CHARACTERISTICS

Concentration Mass Load    Concentration Mass Load        Concenlration Mass Load
mg/liter      kg/day       mg/liter     kg/day            nig/liter     kg/day
         36173                      36173                          36173
Extrusion Quench Effluent  Impregnation Quench Effluent   Machining Effluent
<0.010
<0.010

<0.010
<0.010
 0.090
<0.010

<0.010
<0.010
<0.010
<0.010

<0.010
<0.010
<0.010
<0.010
<0.010
<0.010
<0.010
<0.010
<0.010
<0.010
<0.010

<0.010
<0.010
 0.090
 0.001
 0.001
<0.001
<0.005
<0.015
<0.013
 0.030
<0.050
<0.001
<0.013
 0.0181
<0.001
<0.001
 0.135
 0.185
 6.0
 2
 2.0
11.0
 0.020
         27,600
         26
         3273
               0.060
               0.060
0.00066
0.00066
0.020
0.012
0.089
0.122
4.00
1.325
1.325
7.29
0.013
                     8357
                     24
                     3274
                           <0.010
                           <0.010
            <0.010

            <0.010
            <0.010
             0.023
            <0.010

            <0.010

            <0.010

            <0.010
            <0.010

            <0.010
            <0.010
             0.010
            <0.010
            <0.010

            <0.010
            <0.010
            <0.010
            <0.010
            <0.010

            <0.010
            <0.010
                            0.033
<0.001
 0.001
<0.001
<0.005
<0.015
<0.013
<0.010
<0.050
<0.001
<0.013
 0.0021
<0.001
<0.001
 0.041
 0.044
 5.0
 4
 7.0
 6
 0.014
  VI-32
                                         0.005
              0.002
                                         0.007
                          0.0002
                          0.0004
0.0082
0.0088
1.00
0.802
1.40
1.20
0.003
                                                           0.059
 0.001
<0.001
<0.001
<0.005
 0.043
 0.158
<0.01
 0.435
<0.001
<0.013
 0.013
 0.001
<0.001
 0.027
0.682
24.0
 2.0
 6.0
19.0
 0.010
                                        757
                                        24
                                        3272
                                                          <0.010
                               <0.010


                                0.059        0.001
                               <0.010

                               <0.010
                                                          <0.010
                                                          <0.010
                               <0.010
                               <0.010
                               <0.010

                               <0.010
                               <0.010
                               <0.010
                                                                        0.001
                                                                        0.00002
                                                         0.0008
                                                         0.-003
                                                         0.008
                                                         0.0002
                                                         0.00002
0.0005
0.0125
0.436
0.036
0.109
0.345
0.0002

-------
                         TABLE 6-7
       EXTRUSION QUENCH OIL SEPARATION PERFORMANCE
Plant ID  36173
SAMPLE ID NO.
  3270

Raw Waste
  mg/1
   3273

Treated Waste
   mg/1
044  Methylene Chloride     .062*
072  1,2-Benzanthracene     0.011
073  3,4-Benzopyrene        0.013
075  11,12-Benzo            .011
     fluoranthene
076  Chrysene               .011

Total Toxic Organics        0.108

125  Selenium               0.002
128  Zinc                   0.023

Total Toxic Metals          0.025

     TSS                    5
     TOC                    1
  -   BOD                    2
     Oil & Grease           14
     Phenols                .022
                 .09
                <.010
                <.010
                <.010

                <.010

                 0.09

                 0.018*
                 0.135

                 0.153

                 6
                 2
                 2
                 11
                 .020
* Interferences present
                        VI-33

-------
                         TABLE 6-8
       IMPREGNATION QUENCH OIL SEPARATION PERFORMANCE
SAMPLE ID NO.
  3271

Raw Waste
  mg/1
   3274

Treated Waste
   mg/1
044  Methylene Chloride      .030*
072  1,2-Benzanthracene      .019

Total Toxic Organics         0.049

115  Arsenic                 .001
125  Selenium                .006*
128  Zinc                    .034

Total Toxic Metals           0.041

     TSS                     19
     TOG                   <1
     BOD                     19
     Oil & Grease            44
     Phenols                 .019
                 .023
                 .010

                 0.033

                 .001
                 .002*
                 .041

                 0.044

                 5
                 4
                 7
                 6
                 .014
   Interferences present
                           VI-34

-------
                              TABLE 6-9
               MACHINING SETTLING WATER CHARACTERISTICS
SAMPLE I.D. NO.
004  Methylene Chloride
067  Butyl Benzyl Phthalate

Total Toxic Organics
114
115
119
120
122
123
124
125
128
Antimony
Arsenic
Chromium
Copper
Lead
Mercury
Nickel
Selenium
Zinc
Total Toxic Metals

     TSS
     TOC
     BOD
     Oil & Grease
     Phenols
      3269

Grinding Effluent
      mg/1

      .049*
      .019

      0.068

      .003
      0.001
      0.054
      5.3
      1.7
      .002
      0.02
      .080*
      0.061

      7.22

      2,988
      188
      25
      20
      .014
     3272

Clarifier Effluent
     mg/1

     .059
    <.010

     0.059

     .001
    <0.001
     0.043
     .158
     .435
    <.001
    <0.013
     .013
     .027

     0.682

     24
     2
     6
     19
     .010
*  Interferences Present
                               Vl-35

-------
POTENTIAL  POLLUTANT  PARAMETERS

This  section  assesses  the  raw wastewater  characteristics  of  the
carbon  and graphite  industry and  identifies  the  significant  pol-
lutants.   The wastewater analysis  of  8  raw waste streams  sampled
at  6  plants were  shown in  Table 6-5.

The requirement for  control of a particular  pollutant depends  upon
consideration of  its presence at harmful  levels  and  the existence
of practical  technology for removing  the  pollutant.   The  process
raw waste  pollutant  parameters listed in  Table 6-5 were reviewed
in  light of these considerations.  As a result of this review,
the following pollutants have been selected  from machining,  grin-
ding  and scrubber raw  waste data as significant  pollutants re-
quiring control:
          120  Copper

          122  Lead

          128  Zinc
               Total Suspended
                 Solids
Total Organic Carbon

Oil and Grease

Iron

Aluminum
Table 6-10 lists pollutants other  than  the potential pollutant
parameters presented above that were analyzed  in machining,  grinding
and scrubber effluent raw waste streams sampled within  the carbon
and graphite subcategory.  Each pollutant is listed in  the appropriate
group as being not detected, detected at trace levels,  or at levels
too low to be effectively treated.

Review of quenching raw waste streams shows the following pollutant
as significant and requiring control:

          Oil and Grease

Table 6-11 lists pollutants other  than  the potential pollutant
parameter listed above that were analyzed in extrusion  and
impregnation quench raw waste streams sampled within the carbon
and graphite subcategory.  Each pollutant is listed in  the appro-
priate group as being not detected, detected at trace levels,
or levels too low to be effectively treated.
                             Vl-36

-------
                                   TABLE 6-10
                        CARBON AND GRAPHITE SUBCATEGORY
            POLLUTANT PARAMETERS NOT DETECTED IN RAW WASTE STREAMS
                       MACHINING, GRINDING, AND SCRUBBER
TOXIC   ORGANICS

002  Acrolein
003  Acrylonitrile
005  Benzidine
006  Carbon tetrachloride
     (tetrachloromethane)
007  Chlorobenzene
008  1,2,4-trichlorobenzene
009  Hexachlorobenzene
010  1,2-dichloroethane
012  Hexachloroethane
013  1,1-dichloroethane
014  1,1,2-trichloroethane
015  1,1,2,2-tetrachloroethane
016  Chloroethane
017  Bis (dhilorornethyl) ether
018  Bis(2-chloroethyl)ether
019  Ether (mixed) 2-chloroethyl vinvyl
020  2-chloronaphthalene
021  2,4,6-trichlorophenol
022  Parachlorometa cresol
025  1,2-dichlorobenzene
026  1,3-dichlorobenzene
027  1,4-dichlorobenzene
028  3,3-dichloroethylene
029  1,1-dichloroethylene
030  1,2-trans-dichloroethylene
031  2,4-dichlorophenol
032  1,2-dichloropropane
033  1,2-dichloropropylene
035  2,4-dinitrotoluene
036  2,6-<3initrotoluene
038  Ethylbenzene
040  4-chlorophenyl phenyl ether
041  4-bromophenyl phenyl ether
042  Bis(2-chloroisopropyl)ether
043  Bis(2-chloroethoxy)
045  Methyl chloride  (chloromethane)
046  Methyl bromide (bromomethane)
047  Brcmoform
049  Trichlorofluoromethane
050  Dichlorodifluoromethane
051  Chlorodibromethane
052  Hexachlorobutadiene
053  Ffexachlorocyclopentadiene
054  Isophorone
056  Nitrobenzene
058  4-nitrophenol
059  2,4-dinitrophenol
061  N-nitrosodimethylamine
063  N-nitrosodi-n-propylamine
064  Pentachlorophenol
072  Benzanthracene
074  3,4-benzofluoranthene
     (benzo(b)fluoranthene)
076  Chrysene
077  Acenaphthylene
079  1,12-benzoperylene
082  1,2,5,6-dibenzanthracene
083  Ideno pyrene
085  Tetrachloroethylene
088  Vinyl chloride (chloroethylene)
089  Aldrin
090  Dieldrin
091  Chlordane
092  4,4-DDT
093  4,4-DDE (pfp'-DDX)
095  Alpha-endosulfan
096  Beta-endosulfan
097  Endosulfan sulfate
098  Endrin
099  Endrin aldehyde
101  Heptachlor epoxide
     (BHC-hexachlorocyclohexane)
103  Beta-BHC
104  Gamma-BHC
105  Delta-BHC (PCB-^)olychlorinated
     biphenyls)
106  PCB-1242 (Arochlor 1242)
107  PCB-1254 (Arochlor 1254)
108  PCB-1221 (Arochlor 1221)
109  PCB-1232 (Arochlor 1232)
110  PCB-1248 (Arochlor 1248)
111  PCB-1260 (Arochlor 1260)
112  PCB-1016 (Arochlor 1016)
113  Toxaphene
129  2,3,1,8-tetrachlorodibenzo-p-
     dioxin (TCDD)
                                   VI-37

-------
                             TABLE 6-10  (Cbntinued)
                       POLLUTANTS  DETECTED AT TRACE LEVELS
                       MACHINING, GRINDING, AND SCRUBBER
                               RAW WASTE STREAMS
TOXIC OSGANICS

001  Acenaphthene
004  Benzene
023  Chloroform
024  2-chlorophenol
034  2,4-dimethylphenol
037  1,2-diphenylhydrazine
039  Pluoranthene
048  Dichlorobromethane
055  Naphthalene
057  2-nitrophenol
062  N-nitrosodiphenylamine
068  Di-n-butyl phthalate
069  Di-n-octyl phthalate
070  Diethyl phthalate
071  Dimethyl phthalate
073  Benzo(z)pyrene
075  11,12-benzofluoranthene
078  Anthracene
080  Pluorene
081  Phenanthrene
084  Pyrene
086  Toluene
087  Trichloroethylene
094  4,4-DDE
100  Beptachlor
102  Alpha-BRC
104  Gamma-BHC
TOXIC METALS

117  Beryllium
126  Silver
127  Thallium
127  Thallium
                                   VI-38

-------
                                  TABLE 6-10 (Continued)
                POIiUTANTS DETECTED AT LEVELS TOO LOW TO REQUIRE TREATMENT*
                        MACHINING, GRINDING, AND SCRUBBER EFFLUENT
Parameter

Toxic   organics

Oil  1,1,1-Trichloroethane
044  Methylene Chloride
065  Phenol
066  Bis(2-ethylhexyl)Phthalate
067  Butyl Benzyl Phthalate
068  Di-n-butyl Phthalate

Toxic Metals

114  Antimony
115  Arsenic
118  Cadmium
119  Chromium
121  Cyanide
123  Mercury
125  Selenium

Non-Toxic Metals

     Barium
     Tin
     Yttrium
     Cobalt
     Titanium
     Magnesium

Other Pollutants

     BCD
     Phenols
Mean Concentration rag/1
       0.068
       0.023
       0.025
       0.11
       0.013
       0.01
       0.003
       0.004
       0.008
       0.028
       0.03
       0.001
       0.025
       0.48
       0.085
       0.005
       0.038
       0.145
       3.79
       10.13
       0.04
    Flow Weighted
Mean Concentration rog/1
       0.068
       0.016
       0.034
       0.153
       0.0115
       0.01
       0.0178
       0.006
       0.01
       0.045
       0.026
       0.0025
       0.015
       0.524
       0.171
       0.005
       0.049
       0.273
       2.07
       9.2
       0.066
*These parameters do not require treatment because (1) the raw waste concen-
 tration is less than the daily makimum figure (See Table 6-12), or (2) no
 performance data is available for treatment of these parameters.
                                      VI-3 9

-------
                              TABLE  6-11
                    CARBON AND GRAPHITE SUBCATEGORY
         POLLUTANT PARAMETERS  NOT DETECTED IN RAW WASTE STREAMS
                  EXTRUSION AND  IMPREGNATION QUENCHES
TOXIC ORGANICS

002  Acrolein
003  Acrylonitrile
005  Benzidine
006  Carbon tetrachloride
      (tetrachlorcnte thane)
0 08  1,2,4-trichlorobenzene
009  Hexachlorobenzene
010  1,2-dichloroethane
012  Hexachloroethane
013  1,1-dichloroethane
014  1,1,2-trichloroethane
015  1,1,2,2-tetrachloroethane
016  Chloroethane
017  Bis(chloromethyl) ether
018  Bis(2-chloroethyl)ether
019  Ether (mixed) 2-chloroethyl vinyl
020  '2-chloronaphthalene
021  2,4,6-trichlorophenol
022  Parachlororaeta cresol
025  1,2-dichlorobenzene
026  1,3-dichlorobenzene
027  1,4-dichlorobenzene
028  3,3-dichloroethylene
029  1,1-dichloroethylene
030  1,2-trans-dichloroethylene
031  2,4-dichlorophenol
032  1,2-dichloropropane
033  1,2-dichloropropylene
     (1,3-dichloropropene)
035  2,4-dinitrotoluene
036  2,6-dinitrotoluene
040  4-chlorophenyl phenyl ether
041  4-bronophenyl phenyl ether
042  Bis(2-chloroisopropyl) ether
043  Bis(2-chloroethoxy) Methane
045  Methyl chloride (chloromethane)
046  Methyl bromide (bromomethane)
049  Trichlorofluoromethane
050  Dichlorodifluoromethne
052  Hexachlorobutadiene
053  Hexachlorocyclopentadiene
054  Isophorone
056  Nitrobenzene
057  2-nitrophenol
058  4-nitrophenol
059  2,4-dinitrophenol
060  4,6-dinitro-o-cresol
061  N-nitrosodimethylamine
063  N-nitrosodi-n-propylamine
064  Pentachlorophenol
069  Di-n-octyl phthalate
074  3,4-Benzofluoranthene
     (benzo(b)fluoranthene)
077  Acenaphthylene
085  Tetrachloroethylene
088  Vinyl Chloride (chloroethylene)
089  Aldrin
090  Dieldrin
091  Chlordane
092  4,4-DDT
Q93  4,4HDDE (p,p-DDX)
096  Beta-endosulfan
097  Endosulfan sulfate
098  Endrin
099  Endrin aldehyde
101  Heptachlor epoxide
     (BHCHtiexachlorocyclohexane)
103  Beta-BHC
105  Delta-BHC (PCB-polychlorinated
     biphenyls)
106  PC3-1242 (Arochlor 1242)
107  PCB-1254 (Arochlor 1254)
108  PCB-1221 (Arochlor 1221)
109  PCB-1232 (Arochlor 1232)
110  PCB-1248 (Arochlor 1248)
111  PCB-1260 (Arochlor 1260)
112  PCB-1016 (Arochlor 1016)
113  Toxaphene
129  2,3,7,8-tetrachlorodibenzo-p-
     dioxin (TCDD)
                                    VI-40

-------
                             TABLE 6-11 (Continued)
                        CARBON-'AND GRAPHITE SUBCATEQORY
                  POLLUTANT PARAMETERS DETECTED AT LOW LEVELS
              EXTRUSION AND IMPREGNATION QOENCH-RAW WASTE STREAMS
Toxic Organics

001  Acenaphthene
004  Benzene
007  Chlorofoenzene
Oil  1,1,1-Trichlorethane
023  Chloroform
024  2-chlorophenol
034  2,4-dimethyl phenol
037  1,2-diphenylhydrazine
038  Ethylbenzene
047  Bronoform
048  Dichlorobronethane
051  Chlorodibromomethane
055  Naphthalene
062  N-nitrosodiphenylamine
065  Phenol
067  Butyl Benzyl Phthalate
068  Di-n-butyl phthalate
070  Diethyl phthalate
071  Dimethyl phthalate
079  1,12-benzopenylene
080  Fluorene
081  Phenanthrene
082  Dibenzo anthracene
083  Ideno pyrene
084  Pyrene
086  Ibluene
087  Trichloroethylene
094  4^4-DDE
095  2-endosulfan
100  Heptachlor
102  Alpha-BHC
104  Ganroa-BHC

Toxic Metals

114  Antimony
115  Arsenic
117  Beryllium
118  Cadmium
121  Cyanide
126  Silver

Non-Toxic Metals

     Tin
                                   VI-41

-------
                                  TABLE 6-11 (Continued)
                POLLUTANTS DETECTED AT LEVELS TOO LOW TO REQUIRE TREATMENT
                           EXTRUSION AND IMPREQilATION QUENCHES
Parameter

Toxic Organics

004  Benzene
039  Fluoranthene
044  Methylene Chloride
066  Bis(2-ethylhexyl)Ehthalate
072  Benzanthracene
073  3,4-Benzopyrene
075  11,12-Benzofluoranthene
076  Chrysene
078  Anthracene

Toxic Metals

119  Chromium
123  Mercury
125  Selenium

Non-Toxic Metals

     Aluminum
     Manganese
     Vanadium
     Boron
     Barium
     Molybdenum
     Yttrium
     Cobalt
     Iron
     Titanium
     Magnesium

Other Pollutants

     BOD
     Ehenols
Mean Concentration mg/1
       0.01
       0.011
       0.034
       0.533
       0.013
       0.012
       0.01
       0.01
       0.011
       0.013
       0.0012
       0.005
       0.242
       0.011
       0.016
       0.055
       0.035
       0.025
       0.0043
       0.034
       0.424
       0.002
       3.62
       7.67
       0.015
    Plow Weighted
Mean Concentration mg/1
       0.01
       0.01
       0.014
       0.047
       0.01
       0.01
       0.01
       0.01
       0.01
       0.013
       0.001
       0.003
       0.239
       0.0038
       0.03
       0.062
       0.018
       0.008
       0.003
       0.01
       0.104
       0.002
       4.23
       5.69
       0.016
* These parameters do not require treatment because (1) the raw waste concen-
  tration is less than the daily maximum figure (See Table 6-12), or (2) no
  performance data is available for treatment of these parameters.
                                      VI-42

-------
APPLICABLE TREATMENT TECHNOLOGIES

These paragraphs  contain  a discussion  of  alternative  treatment
schemes  for  reducing the  pollutant  levels discharged  from  the four
wet processes associated  with  the manufacture  of  carbon  and  graphite
products.  All  treatment  alternatives  presented use standard/ proven
treatment technologies which are discussed in  detail  in  Section  XII.

Recommended  Treatment Systems

Two levels of treatment are presented  for each water  discharging
process  used in carbon and graphite product manufacture.   The Level
1 treatment  consists of end-of-pipe schemes to reduce pollutant
loads prior  to discharge.  Level 2  treatment permits  total recircu-
lation of process water.

Identical treatment is recommended  for both extrusion and  impreg-
nation quench streams.  Two levels of  treatment have  been  recom-
mended.  The Level 1 treatment schematic  is presented in Figure
6-2 and  consists  of skimming and contract hauling of  sludge.  Pro-
visions  for  settleable solids  removal  is  also  included.  The
quench stream Level 2 recycle  treatment schematic is  presented in
Figure 6-3 and consists of a clarifier for settling with oil
skimming.  Recycle presents the likelihood of  increased  oil  and
solids concentrations requiring removal to prevent pollutant build-
up.  Polymer addition is  recommend  for improved solids removal
for applications where high TSS is of  concern.

For machining, grinding and scrubber effluent  waste'waters, two
levels of treatment have  been  recommended.   The Level 1  treatment
schematic is presented in Figure 6-4 and  consists of  a clarifier
with solids  and oil removal.   The Level 2 system  schematic is pre-
sented in Figure 6-5 and  is identical  to  Level 1  but  includes re-
cycling.  Recycle in this application  requires polymer addition
to prevent excessive TSS  build-up in the  returned coolant.   Level
2 without oil skimming has been observed  in industry.  Oil skim-
ming is  recommended for those  applications where  increased con-
centrations  of oil and grease  in the returned  coolant could  become
absorbed by  the machined  carbon and affect product quality or ease
of handling.

Performance  of Recommended Treatment Systems

Level 1 has  been observed for  extrusion and impregnation quenches
within the industry and sampling has verified  separator  effective-
ness in  reducing oil and  grease discharge levels".  (Tables
6-7 and  6-8).  Level 2 treatment for extrusion and impregnation
quenches achieves zero discharge of pollutants.
                              Vi-43

-------
      011 Separator
           I
      SolIds Removal
                          011
Discharge
         FIGURE  6-2
LEVEL 1  EXTRUSION AND IMPREGNATION QUENCH
TREATMENT SYSTEM FOR CARBON AND GRAPHITE
             SUBCATEGORY
             VI-44

-------
                              Recycle
   Polymer.
  Addition
                    Clarifier
                    T
               Solids Removal
Haul  Oil
                FIGURE  6-3

LEVEL 2 EXTRUSION AND IMPREGNATION QUENCH
TREATMENT SYSTEM FOR CARBON AND GRAPHITE
            SUBCATEGORY
              VI-45

-------
                      Recycle
Polympf _...
Addition
»
Clarifier


               f
•Haul Oil
         Solids  Removal
               FIGURE  6-4

LEVEL 2 MACHINING, GRINDING, AND SCRUBBER EFFLUENT
      TREATMENT SYSTEM FOR CARBON AND GRAPHITE
                   SUBCATEGORY
                    VI-46

-------
    Polymer
   Addition"
                      Clarifier
                      I
   •Discharge
•Haul Oil
               Solids Removal
                 FIGURE   6-5


LEVEL 1  MACHINING, GRINDING, AND SCRUBBER EFFLUENT

     TREATMENT SYSTEM FOR CARBON AND GRAPHITE

                    SUBCATEGORY
                   VI-47

-------
Level 1 treatment of machining, grinding, and scrubber effluent
has been observed in industry without oil skimming and sampling
has verified that a clarifier without polymer addition can main-
tain a TSS level of less than 24 mg/1 (Table 6-9).

Level 2 treatment of extrusion and impregnation quench streams has
not been observed in industry, but discussion with industry repre-
sentatives has indicated that recycle would not affect product
quality.  The only reservation expressed by industry was that the
recycled water may require cooling to prevent a build-up of heat
in the quench tank.  A typical quench tank operates at 30-35°C
(85-95°F) and uses make-up water of 15-20°C (60-70°F).

Performance figures are based upon data from treatment component
performance observed in other industries.  This performance data
is applicable to the Carbon and Graphite industry.  Section XII
describes the treatment components and systems and the typical
performance levels achievable by each component and system.
System performance is presented in Table 6-12 for Level 1 systems,
Level 2 is total recycle.

Estimated Cost of Recommended Treatment Systems

The procedures and process assumptions for determining estimated
costs for the recommended treatment system components are discussed
in Section XII and Section XIII of this report.  Tables 6-13 to
6-24 present estimated costs for each of the recommended treatment
systems previously discussed.

Costs have been estimated for two types of waste (1) machining,
grinding and scrubber wastewater and (2) quench wastewaters, for
both the Level 1 and Level 2 treatment systems.  Three different
flow rates were used for each waste type to present the variation
in system costs resulting from changes in system flow rates.  The
three flow rates for each waste stream are characteristic of a
small, medium, and large wastewater discharge within the Carbon
and Graphite industry for both types of waste streams.

BENEFIT ANALYSIS

This section presents an analysis of the industry-wide benefit
estimated to result from applying the two levels of treatment
previously discussed in this section to the total process waste-
water generated by the Carbon and Graphite subcategory.  This
analysis estimates the total amount of pollutants that would not
be discharged to the environment if the two levels of treatment
were applied on a subcategory-wide basis.  An analysis of the
benefit versus estimated subcategory-wide cost for each of the
treatment levels will also be provided.
                                Vl-48

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-------
Industry-wide Costs

By multiplying the cost of each level of treatment at various flow
rates by the number of plants in each flow regime in the  industry,
a subcategory-wide cost figure is estimated  (Table 6-25).  This
figure represents the total cost of each treatment level  for the
entire Carbon and Graphite subcategory.  This calculation does not
make any allowance for waste treatment that  is currently  in-place at
Carbon and Graphite facilities.

Industry-wide Cost and Benefit

Table 6-26 presents the estimate of total cost to the Carbon and
Graphite subcategory to reduce pollutant discharge.  This table also
presents the benefit of reduced pollutant discharge for the Carbon
and Graphite subcategory resulting from the  application of the two
levels of recommended treatment.  Benefit was calculated  by multi-
plying the estimated number of gallons discharged by the  subcate-
gory times the performance attainable by each of the recommended
treatment systems as shown in Table 6-12.  Values are presented for
each of the selected subcategory pollutant parameters.

The column "Raw Waste" shows the total amount of pollutants that would
be discharged to the environment if no treatment was employed by any
facility in the industry.  The columns under.Levels 1 and 2 show
the amount of pollutants that would be discharged if each level of
treatment were applied to the total wastewater estimated  to be dis-
charged by the carbon and graphite subcategory.

The total amount of wastewater .discharged from each level of treat-
ment is also presented in this table to indicate the amount of pro-
cess wastewater to be recycled by each of the levels of treatment.
Process wastewater recycle is a major step toward water conservation
and reduction in pollutant discharge.
                                  VI-63

-------
                          TABLE  6-25
               Carbon and  Graphite  Subcategory
                 Industry-wide  Cost Analysis
             Extrusion and Impregnation  Quenches
Investment*
Annual Costs
     Capital Costs
     Depreciation
     Operation  & Maint.
     Energy and Power

Total Annual Cost
 LEVEL 1
2429578.1

 204851.45
 485915.61
 390493.48
      0.0

1081260.6
 LEVEL 2
9380265.4

 790892.7
1876052.9
 658505.4
  57495.1

3382944.8
           Machining, Grinding, and Scrubber Effluent
Investment*
Annual Costs
     Capital Costs
     Depreciation
     Operation & Maint.
     Energy and Power

Total Annual Cost
 LEVEL 1
3369762.5

 284123.42
 673952.5
 303572.15
   2224.586

1263872.8
 LEVEL 2
3549162.5

 299247.0
 709832.5
 474862.7
   4824.56

1488766.8
* Based on 26 plants estimated to discharge process wastewater
  from these processes.
                                 VI-64

-------
                             TABLE 6-26
                  Cartoon and Graphite Subcategory
              Didustry-wide Cost and Benefit Analysis
             Machining, Grinding, and Scrubber Effluent
Parameter
Plow (Million liters/year)
120  Copper
122  Lead
128  Zinc
     Ibtal Suspended
       Solids
     total Organic
        Carbon
     Oil and Grease
     Iron
     Aluminum
Annual Cost
                Extrusion and Impregnation Quenches
Plow (Million liters/year)      5980          5980
     Oil and Grease             47421.4       NC
Raw Waste
kg/year
304.2
370.82
66.62
54.15
186200.0

107534.7
3437.5
1673.1
542.4

Level 1
kg/year
304.2
247.6
15.21
54.15
5414.8

NA*
3346.2
242.5
.NA
1081260.6
Level 2
304.2

%
1
I
q
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3382944
            5980
            Recycle-Zero Discharge
Annual Cost
1263872.8   1488766.8
NC - No Change In Concentration Due To Treatment
*NA - Not Available
                                     VI-65

-------

-------
                        SECTION VII
              DIELECTRIC MATERIALS SUBCATEGORY
INTRODUCTION

This discussion of the dielectric materials subcategory consists of
the following major sections:

     Products
     Size of Industry
     Manufacturing Processes
     Materials
     Water Usage
     Production Normalizing Parameters
     Waste Characterization and Treatment in Place
     Potential Pollutant Parameters
     Applicable Treatment Technologies
     Benefit Analysis


Data contained in this section were obtained from several sources.
Engineering visits were made to six plants within the  industry.
Wastewater samples were collected from 3 facilities.   A total of
63 dielectric materials manufacturing plants were contacted  in
this survey by telephone.  These plants include manufacturers
that use dielectric materials in wet capacitors and  transformers.
A literature survey was also conducted to ascertain  differences
between types of dielectric materials, process chemicals used, and
typical manufacturing processes.

PRODUCTS

This product subcategory consists of both dielectric-containing de-
vices such as oil filled transformers and capacitors in addition
to the miscellaneous dielectric products themselves  (except  por-
celain and glass) such as mica paper (used in fixed  capacitors),
phenolics, laminates, fiberglass, polyesters, and rubbers.   There
are three major wastewater producing products in the dielectric
subcategory:  oil filled transformers, oil filled capacitors, and
mica paper dielectric.  Only those processes unique  to the E&EC
category will be discussed, other processes are considered in
other development documents, particularly, the Metal Finishing
Subcategory.

Oil Filled Transformers for Power, Distribution, and Special
Applications

Transformers can be classified into two groups, namely oil filled
("wet") transformers and non-oil filled  ("dry") transformers.  Most
                               VII-1

-------
 of  the  larger transformers  such  as  power and-distribution  transfor-
 mers  are  oil  filled.   Small high-voltage transformers  such as  auto-
 motive  ignition  coils  are wet while virtually all  of the smaller
 low-voltage transformers are dry.

 Electric  power is  transmitted by increasing  the  voltage at the
 generator, transmitting  it  to distant  locations  via high voltage
 transmission  lines, and  then reducing  the voltage  successively at
 substations,  at  primary  feed substations, and at distribution  points
 to  the  consumption level.   Thus, the transmission  and  distribution
 of  electric power  requires  a substantial number  of transformers, al-
 most  all  of which  are  oil filled.   Power and distribution  transformers
 account for a sizable  part  of the transformer industry (63% of the
 total dollar  value of  transformer sales).

 Small low voltage  transformers are  used  as fluorescent lamp bal-
 lasts (accounting  for  10% of the total dollar value of transformer
 sales).   Other common  uses  of low voltage transformers include
 signalling and doorbell  transformers,  machine tool controls,
 general industrial and commercial uses,  power regulation,  and
 instrument transformers.

 Production of the  different classes of transformers is summarized
 below in  terms of  percent of total  annual dollar value.  This  in- •
 formation was obtained from the  1977 Department  of Commerce Census
 of  Manufactures  (Preliminary Statistics).

                                         % Total  Annual
                                          Dollar  Value
Power and distribution
  transformers

Fluorescent lamp ballasts

Specialty transformers  (except
  fluorescent lamp ballasts)

Power regulators, other trans-
  formers , parts

(Other not specified by type)
 63.0%

 10.0%


 16.4%


  8.0%

  2.6%

100.0%
The total annual value of transformer shipments for 1977 is estimated
to be $2,084,000,000.

Oil Filled Capacitors

Oil filled capacitors can be separated into two categories by size:
larger sized capacitors generally used for power factor correction
and smaller sized capacitors used for electric motor control and
in fluorescent lamps.
                              VII-2

-------
 Production  of  the  different  classes  of  transformers  is  summarized
 below in  terms of  percent  of total annual  dollar  value.   This  in-
 formation was  obtained  from  the  1977 Department of Commerce  Census
 of  Manufactures (Preliminary Statistics).
 Shunt  and  series power  capacitors,
   units  and  equipment,  1/2  KVA  and
   above, and accessories  for ,power
   factor correction  and other low-
   frequency  a,c. applications.

 A.C. capacitors, except electro-
   lytic; general purpose, for
   motors,  controls,  etc.; capaci-
   tors for fluorescent  lamp
   ballast; and other capacitors.

 Capacitors for industrial use
   except for electronic appli-
   cations.
% Total Annual
 Dollar Value

     41.6%
     57.7%
      0.7%
                                             100.0%

The total annual value of transformer shipments  is estimated  to be
$154,900,000 for 1977.

Mica Paper Dielectric

Mica paper is a dielectric material used in  the  manufacture of fixed
capacitors.  Fixed capacitors are layered structures of conductive and
dielectric (insulating) surfaces.  The layering  of fixed capacitors
is either in the form of rigid plates or in  the  form of thin  sheets
of flexible material which are rolled.  Fixed capacitor types are
distinguished from each other by type of conducting material, dielec-
tric material, and encapsulating material.   Mica paper is one of the
dielectrics used in fixed capacitors and is  included in this  section
because of the large quantities of process water required in  its pro-
duction.  No other mica applications have been addressed in this docu-
ment .

Miscellaneous Dielectrics

Miscellaneous dielectrics are summarized in  Table 7-1.  Table 7-1 al-
so presents a summary of the manufacturing processes used in  the pro-
duction of miscellaneous dielectrics, process water used, and waste-
water treatment.  This listing is based on telephone contacts with
32 plants.  Most electrical insulators are manufactured of phenolic,
                             VII-3

-------
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laminates, fiberglass, polyesters, or molded dense rubber.  Insula-
ting parts manufactured of rubber and various plastics are made by
molding, cutting, stamping, extruding, punching and various machine
forming operations.  An undetermined amount of water is used
in quenching, spray contact cooling or wet machining.  These
products and manufacturing processes are covered under existing
or proposed documents.  Therefore, miscellaneous dielectrics
will not be discussed further in the E&EC category.

SIZE OF INDUSTRY

The size of the dielectric materials industry is presented in the
following paragraphs in terms of number of plants, number of produc-
tion employees, and production rate.  Each of these values represents
is estimated based upon data collected from visited facilities, tele-
phone surveys and literature surveys«

Number of Plants

Transformers -• It is estimated that 280 plants are engaged in the
manufacture of both wet and dry transformers.  This estimate is
based on the following three sources of information:

          1977 Dun and Bradstreet listing of companies engaged
          in business within the SIC 3612 category.  Known non-
          manufacturers (distributors) were removed from the
          listing.  Prom this modified listing, 350 plants are
          estimated to be engaged in the manufacture of trans-
          formers .

          Department of Commerce 1977 Census of Manufactures
          (Preliminary Statistics).  A total of 280 plants were
          estimated to be engaged in the manufacture of trans-
          formers .

          Department of Commerce 1972 Census of Manufactures.
          A total of 210 plants were estimated to be engaged
          in the manufacture of transformers.

Oil Filled Capacitors - It is estimated that 30 to 50 plants are
engaged xn the manufacture of oil filled capacitors.  This estimate
is based on the following two sources:

          Department of Commerce 1977 Census of Manufactures
          (Preliminary Statistics).  A total of 30 to 50
          plants were estimated to be engaged in the manufac-
          ture of oil filled capacitors. *

          Department of Commerce 1972 Census of Manufactures.
          A total of 36 to 60 plants were estimated to be en-
          gaged in the manufacture of oil filled capacitors.
                               VII-5

-------
Mica Paper  Dielectric  -  It  is estimated  that  12  to  18 plants are en-
gaged  in  the manufacture of mica paper.  This estimate  is based on a
telephone survey of manufacturers producing mica paper.

Number of Employees

Transformers -  It  is estimated  that between 32,700  and  46,600
production  employees are engaged in the  manufacture of  both wet
and dry transformers.  These estimates are based on the  follow-
ing sources:

     .    Department of Commerce 1977 Census  of  Manufactures
          (Preliminary Statistics).  A total  of  32,700 produc-
          tion  workers were estimated to be engaged in  the man-
          ufacture of  transformers.

     .    Department of Commerce 1972 Census  of  Manufactures
          lists 46,620 production workers engaged in the manu-
          facture of transformers.

Twenty-nine transformer plants  were visited or surveyed by telephone.
Each plant employs between  35 and 4,000  production  employees.  The
majority  of plants contacted have between 140 and 300 production em-
ployees .

Oil Filled Capacitors  - It  is estimated  that  between 2,200 and 4,800
production employees are engaged in the  manufacture of oil filled
capacitors.  These estimates are based on the following sources:

          Department of Commerce 1977 Census  of  Manufactures
          (Preliminary Statistics).  A range  of  2,200 to 3,800
          production workers were estimated to be engaged in
          the manufacture of oil filled  capacitors.

          Department of Commerce 1972 Census  of  Manufactures.
          A range of 2,800  to 4,800 production workers were
          estimated to be engaged in the manufacture of oil
          filled capacitors. •

Eight oil filled capacitor  plants were visited or surveyed by tele-
phone.  Each plant employs  between 30 and 350 production workers.

Mica Paper Dielectric  - It  is estimated  that  between 250 and 450 pro-
duction employees are  engaged in the manufacture of mica paper dielec-
tric.  Typical plants  surveyed  employ between 20 and 40 production
workers.  These estimates are based on a telephone  survey of manufac-
turers producing mica  paper.

MANUFACTURING PROCESSES

The manufacturing processes for dielectric materials are described in
the following paragraphs.   The  use of dielectric fluids in wet trans-
                               VII-6

-------
formers and capacitors, and the manufacture of mica paper dielectric
are discussed in terms of typical production processes for each of  '
these products.                >        ,                              ,

Wet Transformers

Power transformers are the largest transformers made and are used at
power generating stations to increase voltages to high levels for
transmission (e.g. 765,000 volts).  A typical process flow diagram
for wet power transformer manufacture is given in Figure 7-1.

The main operations in manufacturing a power transformer are common
to all transformer manufacture.  They are the manufacture of a steel
core, the winding of coils, and the assembly of the coil/core on some
kind of frame or support.  A significant difference between "dry" and
"wet" transformer manufacture  is the need for a container or tank
to contain the dielectric fluid in the case of "wet" transformers.
In addition, the larger wet transformers have radiators attached to
air-cool the dielectric fluid.  Oil filled transformers must be free
of moisture, because any water diminishes the effectiveness of the
dielectric and can lead to a short circuit failure.

Coil-winding starts with the manufacture of a cylindrical pressboard
or phenolic plastic form, which is saturated with transformer oil.
Copper wire, wound with 12-18 wraps of paper insulation, is wound
around the coil form.  A series of paper and paperboard or phenolic
plastic spacers is.added to the form during winding to separate the
coils.  Upon completion of winding all coils on a form, the windings
are compressed axially in a press to the required size.  The wound
coil is then heated and vacuum dried to remove residual moisture.
Flooding the coil with oil impregnates the coil.  Finally the coil
is compressed a second time.

In the four wet transformer plants visited, transformer oil is care-
fully handled to prevent its escape into the environment.  Vacuum
impregnation processes use chamber flooding to introduce the oil
into the coil assembly.  The process takes several days, and ade-
quate time is allowed to let free oil drip off the coils and hand-
ling equipment while still inside the chamber, s Minimal evidence of
oil spillage was observed anywhere in the manufacturing plants.
Solid absorbents were used for collecting the small quantities of
spilled oil.

Core fabrication starts by cutting thin strips of silicon steel to
size.  These strips of steel are stacked to form the core.  Coils
are then placed over legs of the core.  The top yoke is placed,on
the top of the assembly.  Kraft paper and/or phenolic spacers are
added to the assembly as an insulator, the complete assembly is dried
in a chamber, and transformer oil is added manually to saturate the
assembly.
                                  VII-7

-------
          Hake Coil
                              Hake Core
                                                  Make Tank
                     Assenbly
Cut Grain
Oriented Silicon
Steel


Assemble core
. By Stacking
Steel Leaves
Core
iy
)ver

Processes with uastewater
discharges are unknown
                          FIGURE 7-1

                 OIL FILLED TRANSFORMER MANUFACTURE

                               VII-8

-------
Tank fabrication  starts  by  shot  blasting carbon steel plates.  The
plates are  cut  to size by shearing  or burning with a torch.  Smaller
steel parts are deburred in a  water solution and rinsed in a rust
inhibiting  solution.  The tank is welded using submerged arc
welding.  Radiators,  bought from an outside supplier, are
welded to some  tanks  and bolted  to  others.   The tank is deter-
gent washed and rinsed.  An epoxy primer is applied and then baked on.
The tank is then  coated  with an  alkyd finish coat.  Core and
tank fabricating  and  welding process operations are discussed
further under the Metal  Finishing Category.

Pans, a control unit  and, in some cases, radiators are attached in
pre-assembly.  The coil-core assembly is placed into the tank, con-
nections are made and bushings are  attached to the unit in final
assembly.  The unit is evacuated to remove  any water vapor and then
filled with oil.   The completed  transformer is then tested.

Oil Filled Capacitors

Large oil filled  capacitor  containers are produced manually and
are made of steel or  aluminum.   Large oil filled capacitors are often
used in corrosive environments,  and their containers are often pro-
tected by phosphate or chromate  surface  treatment and subsequent paint-
ing.  Container preparation for  large oil filled capacitors can dis-
charge cleaning and coating wastes.  Special ceramic insulators are
used to separate  the  cover  from  the terminals.

Small oil filled  capacitor  containers of aluminum or steel are
fabricated on a dry automatic  impact extruder.  The containers for
small oil filled  capacitors are  usually  unfinished.  Hence, there is
no wastewater discharge  associated  with  their fabrication.  Figure
7-2 depicts a typical production process.  In addition, small oil
filled capacitors utilize a number  of automatic operations to pro-
vide insulated terminals that  connect to the interior wiring.  These
operations usually do not have a wastewater discharge.

The electrical leads  of  the winding are  manually soldered to the
terminal connections  on  the cover of all capacitors.  The covers are
welded to the capacitor  container to form a sealed capacitor.  There
is a fill hole in the cover that is left open for subsequent oil fil-
ling operations.   The soldering  and welding operations do not usually
result in a wastewater discharge.

The conditioning  process for small  oil filled capacitors takes place
after the sealed  capacitors are  loaded into a filling chamber.  The
sealed capacitors are conditioned prior  to  filling by baking at
moderate temperatures under heavy vacuum for several hours.  While
still under vacuum, the  chamber  is  flooded  with dielectric fluid.
The dielectric enters the fill holes until  the capacitors are com-
pletely filled.   The  chamber is  then allowed to drain and the small
oil filled capacitors are removed.   After removal, the fill holes are
                               VII-9

-------
                         CONTAINER
                       MANUFACTURE
                         SURFACE

                        TREATMENT
                            I
                         EXTERIOR
                         PAINTING
                       PHOSPHATE
                          OR
                       CHROMATE
                       (covered under MFC)
                         DIELECTRIC
                           OIL
                         FILLING
                          DETERGENT

                           WASH
                            I
                          WATER
                          RJNSE
                            1
                          SOLDER
                          LEADS
                       CONDITIONING
                            1
                        ELECTRICAL
                        EVALUATION
                           SHIP
                                                  	*• Denotes
                                                       Wastewater
                                                       Flow Paths
. -
'-if**
         FIGURE 7-2

OIL-FILLED CAPACITOR MANUFACTURE
                           VII-10

-------
 soldered  closed.   Large oil filled capacitors are filled individually
 with  a  hose.   A special one way valve prevents the dielectric fluid
 from  escaping.   These  operations are dry and do not result in "a waste-
 water discharge.

 Oil filled  capacitors  are  usually cleaned with solvent after filling
 with  dielectric fluid.   The solvent is recovered, distilled, reused.
 One facility  cleans  the exterior of the small oil filled capacitors
 with  a  water  wash  which results in a wastewater discharge (this
 cleaning  process has been  eliminated and a solvent cleaning step
 has been  instituted  since  the  time of the plant visit).  Large
 capacitor manufacture  did  not  result in a wastewater discharge at
 any of  the  visited facilities.

 Mica  Paper  Dielectric

 Mica  paper  manufacturing requires significant quantities of process
 water.  This  water is  used for  carrying mica in a slurry.  Figure 7-3
 depicts a typical  production process.

 Mica  is heated  in  a  kiln and then placed in a grinder where water
 is added.   The  resulting slurry is passed to a double screen sepa-
 rator where undersized  and oversized particles are separated.  The
 screened  slurry flows  to a mixing pit and then to a vortex cleaner.
 The properly  sized slurry  is used in a paper-making machine where
 excess water  is drained or evaporated.  The resulting cast sheet of
 mica  paper  is fed  on a  continuous roller to a radiant drying oven,
 where it  is cured.   From there,  the mica paper is wound onto rolls,
 inspected and shipped.

 Mica  particles  too fine for use are discharged in process wastewater.
 All process wastewater  is  treated by settling.

 MATERIALS

 Materials used  in  the dielectric materials subcategory are discussed
 in the following paragraphs.  Materials are listed in terms of their
 use in wet  transformers, oil-filled capacitors,  and mica paper dielectric,

Wet Transformers

 Materials used  in  the manufacture of oil filled  transformers are:

          Silicon  Steel  -  This  magnetic steel is wound or
          stacked  in sheets to  form the magnetic iron core.

          Copper Wire - Used to wind the primary and secondary
          coils,,of most transformers.

          Aluminum Wire  -  Used  to wind the coils of some trans-
          formers.
                               VII-11

-------
                                                       u

VII-12

-------
 Carbon Steel - Used for manufacturing transformer
 tanks or casings and for making radiators used in
 larger transformers.

 Insulating Paper and Paperboard - Used to insulate
 the coil wire and serve as spacers between windings.
 Paper board is used to form the inner cylinder of
 larger concentric coils or as a flat platform for
 flat interleaved type coils.   Kraft paper, the most
 extensively used insulating paper, is made from wood
 fiber;^manila paper from Manila hemp; kraftboard from
 wood fiber; and pressboard from wood and cotton.

 Laminated Phenolic Resin - Used for forming the inner
 cylinder of some coils and used as insulating spacer
 material.

 Hardwood (maple) - Used as insulated support in some
 power transformers.

 Ceramic  Bushings - Used for external connections to
 the primary and secondary transformer windings.

 Varnishes,  Lacquers,  and Shellacs  - Used to coat windings
 and for  insulation of dry transformers to seal them from
 moisture.

 Enamel Coating - Used to coat some core steel before
 forming  the core.

 Paints  (Epoxys,  Alkyd coatings,  PVC coatings, Polyurethane
 paints,  etc)  - Used  to coat transformer cans or tanks.

 Nitrogen Gas  - Large  transformers  are filled with nitrogen
 gas  after the  unit  is tested  and drained of oil.   The trans-
 former is shipped  with N, under  a  slight positive pressure
 to  prevent  leakage of air and moisture  into the transformer,

 Light  Petroleum  Distillate  (similar to  kerosene) — Used  as
 vapor  to heat  coil-core  assemblies  to drive out moisture
 prior  to flooding with transformer  oil.

 Transformer Oils - Used  to  impregnate insulation  and
 spacers of  coil-core  assemblies of  large,  "wet"  trans-
 formers.

 Dielectric  Fluid - Most  oil filled  transformers  contain
 a highly refined petroleum oil similar  to  low viscosity
 lubricating oil.  Some  transformers  are  filled  with  a
gaseous dielectric fluid, e.g. perfluoroethane.
                         VII-13

-------
These dielectric fluids are basically organic liquids, such  as  lubri-
cating oil, used as an electrical dielectric  (or  insulator)  and  serve
as heat transfer media for cooling electrical components.  In the
E&EC category, dielectric fluids are used  in  larger  transformers,  and
oil filled capacitors.  In transformers, the  quantity of  fluid  re-
quired varies from about 35 liters to 105,000 liters.

Previously, polychlorinated biphenyl  (PCB) was  used  as the dielectric
fluid in practically all fluid  filled capacitors  and transformers.
The manufacture of PCB dielectric fluid  ended in  1978.  The  PCB  rule
prohibits PCB manufacture after July 1,  1979.   Problems related  to
PCB use as a dielectric fluid are discussed  in  Appendix >A of this
report.

Substituting other dielectric fluids for PCB  is required  by  law.
There are several fire resistant fluids  which are proposed as sub-
stitutes for PCB.  Table 7-2 presents a  summary of PCB substitute
dielectric fluids currently used or proposed  for  use in oil  filled
capacitors and oil filled transformers.  Di-n-octyl  phthalate is
widely used in fluid filled capacitors.  Silicone oils are probably
the most popular PCB substitute for transformer oils.

Oil Filled Capacitors

Materials required in  the manufacture of oil  filled  capacitors  are
similar to those of the transformers  listed  above.  These materials
are:

          Insulating Paper
          Polypropylene Sheet
          Aluminum Sheet
          Steel Casing
          Dielectric Fluids

Oil filled capacitors  utilize  the  same  dielectric fluids  as  trans-
formers with  capacities ranging from  a  few milliters to  as  many as
25 liters.  Capacitor  assembly  and  manufacturing  is  another  subcate-
gory.

Mica Paper Dielectric

Mica paper in its simplest  form is  pure mica, but for  some  applica-
tions, a lamination of  plastic  on  both  sides of the  mica  sheet  may be
required.  These  are  the  only  process  material  requirements  for the
production of mica paper.
                                 VII-14

-------







































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WATER USAGE

Host manufacturers of oil filled transformers and capacitors have
eliminated the use of water from their production steps.  Some of
them have accomplished this by employing solvent cleaners.  Other
manufacturers require water for the cleaning of transformer and
capacitor casings prior to painting and coating.  Cleaning, pain-
ting, and coating are processes included within the Metal Fini-
shing Category Document.  Some manufacturers perform  a  cleaning
operation on transformers and capacitors after filling  with dielec-
tric fluids.  These manufacturing processes will be discussed in
this section.

The production of mica paper dielectric is totally dependent on pro-
cess water.  Unlike oil filled transformers or capacitors, water
is used in large quantities throughout each step of production.

Transformers

From the 1972 Census of Manufactures, gross water usage is estimated
to be 198.8 million liters per day  (52 million gallons  per day) for
wet and dry transformer manufacture.  Approximately 63% of gross
water usage is recycled.  Only 3% of gross water used,  6.06 million
liters per day (1.6 million gallons per .day) is process water.
From plant contacts and visits, it was observed that  most of the
manufacturing process water used is for non-contact cooling water.
From these same sources, it was found that all process  water was
used in metal cleaning processes prior to coating.

From the 1972 Census of Manufactures, the amount of water discharged
which includes both process and non-process water is  estimated at
33% of gross water usage or 64.7 million liters per day (17.1 mil-
lion gallons per day).  Nine percent or 64.7 million  liters per day
(1.5 million gallons per day) of this discharged water  is estimated
to be treated.  As shown in Table 7-3, most process water used is
simply discharged without treatment.

All of the visited plants made use of process water only in metal
cleaning operations and conversion  coating  (see Table 7-3).  The
plants surveyed by phone indicated  that their transformer manu-
facturing either required no process water or required  use of
process water only in conjunction with metal coating  or electro-
plating operations.

Oil Filled Capacitors

Some water usage was observed in oil filled capacitor manufacturing.
Table 7-4 summarizes the survey results and shows that  two of  the
eight plants contacted use a detergent wash upon completion of the
capacitor fill step.  The single plant visited discharges 432,000
liters per day (114134 GPD) from this detergent wash  process and
phosphatizing.
                                    VII-16

-------
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                     VII-17

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 The remaining manufacturers  contacted  do  not  use  process  water
 by either using  solvent  degreasing  when cleaning  is  required or by
 employing manufacturig techniques that avoid  the  need  for cleaning
 after filling.   The visited  capacitor  facilities  that  used a water
 wash after filling operations  are now  using a solvent  cleaning step
 and are not discharging  process wastewater unique to E&EC manufac-
 turing.

 Mica Paper Dielectric

 Water usage was  observed  in  all mica paper dielectric  manufacturing.
 Table 7-5 summarizes the  water usage,  which ranges from 3,506,000
 liters/day (926285.2 GPD) to 31,400 liters/day  (8295.9 GPD).   The
 water is necessary first  to  saturate,  separate, and  break down the
 raw mica into flakes and  then :to carry the refined mica through its
^deposition onto  the web of the paper machine.

 PRODUCTION NORMALIZING PARAMETERS

 Production normalizing parameters are  used to relate the  pollutant
 mass discharge to the production level of a plant.   Regulations ex-
 pressed in terms of this  production normalizing parameter are  multi-
 plied, by the value of this parameter at each plant to  determine the
 allowable pollutant mass  that can be discharged.  Meaningful pro-
 duction normalizing parameters for dielectric materials subcategory
 that have been considered are:

           Size,  complexity and other product attributes that affect
           the amount of pollution generated during manufacture
           of a unit.

           Manufacturing processes,  but differences in  processes
           for the same product result  in differing amounts of
           pollution.

           Production records, but lack of applicable data  may
           impede determination of production rates in  terms of
           desired normalizing parameters.

 Several  other broad strategies which have been developed  to deter-
 mine  normalizing parameters.   They are as follows:

           The process  approach •- In this  approach, the production
           normalizing  parameter is  a direct measure of the produc-
           tion rate for each  wastewater producing manufacturing
           operation.   These parameters may be  expressed as sq.m.
           processed per hour, kg of  product processed per hour, etc.
           This approach requires knowledge of  all the wet pro-
           cesses used  by  a plant because  the  allowable pollutant
           discharge rates for each  process are added to determine
           the  allowable pollutant discharge rate for the plant.
           Regulations  based on the  production  normalizing parame-
           ter  are multiplied  by the  value  of  the parameter for
           each process  to determine  allowable  discharge rates  from
           each wastewater producing  process.
                               VIi-19

-------
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           Concentration limit/flow guidance - This strategy limits
           effluent concentration.   It can be applied to an entire
           plant or to individual processes.  To avoid compliance
           by dilution,  concentration limits must be accompanied by
           flow guidelines.   The flow guidelines, in turn, are ex-
           pressed  in terms  of the  production normalizing parameter
           to relate flow discharge to the production rate at the
           plant.

The  following paragraphs present selected production normalizing
parameters for the dielectric materials subcategory and the rationale
used  in  their selection.

Wet Transformers and Oil Filled Capacitors

The manufacturing  processes used in the production of wet transformers
and oil  filled capacitors are similar in regard to dielectric fluid
cleanup.   In both  wet transformers and oil filled capacitors a waste-
water discharge results from cleaning the unit after filling.  Pol-
lutants  entering the waste  stream  are generated partly as a direct
result of  the washing and rinsing  of the exterior of the product to
remove excess dielectric fluid.

Much of  the  pollutant discharge is not directly related to production.
At one visited facility, for example, the treatment system is used
to remove  residual PCB  fluid from  contaminated plant grounds.  This
type of  discharge  can best  be regulated by determining an allowable
pollutant  discharge concentration.  Therefore, use of a production
related  normalizing parameter is not appropriate, and effluent
limitations  should be expressed in terms of concentration only.

Mica Paper Dielectric

Based upon the nature of the mica  paper manufacturing industry,  the
mass of  mica processed  has  been selected as the production normali-
zing parameter.  This selection is based upon the fact that the
principal  factor affecting  wastewater characteristics is the amount
of mica  produced.

The processes  used in mica  paper dielectric manufacturing requires
the use  of mica and  water only.  As  the mica is processed in-
to its final  form,  wastewater containing the inert mica is produced.
This wastewater production  occurs  only when the manufacturing proces-
ses are  operating.   Since several  different thicknesses of mica  paper
are produced,  the  area  of the paper  may not be indicative of the amount
of wastewater  generated.  This leaves the weight or mass of mica paper
produced as  the most applicable production normalizing parameter.
These data are  easily obtainable because they are collected by man-
ufacturers as  a means of controlling productivity of the plant.
                                     VII-21

-------
WASTE CHARACTERIZATION AND TREATMENT IN PLACE

This section will present the  sources of wastewater  in  the  dielectric
materials subcategory, sampling  results of  this wastewater,  and  treat-
ment currently in place at these  facilities.  Wastewater  produced
by mica paper manufacturing will  be discussed separately  because
of waste characteristics and treatment technology.

Process Descriptions and Water Use

Wet Transformers - Two types of  transformers are  manufactured:   wet
(filled with dielectric fluid) and dry.  Both types  of  transformers
use standard metal finishing processes.  Wet transformers use  wet
processes unique to this subcategory of the E&EC  category for
clean-up of dielectric fluid spills and management of residual
PCB fluid spills.

Oil Filled Capacitors - Oil filled capacitors require process  water
that is specific to the E&EC industry.  This process water is  used
in the clean-up of dielectric  fluid that spills or overflows when
the capacitor is filled and water used for  case wash.

There are two distinct sizes of  capacitors  that are  filled with  di-
electric fluid, and the technique of filling the  two categories  of
capacitors differs.  Larger capacitors are  filled individually through
a hose connection, and smaller capacitors are batch  filled in  racks
within a chamber, which is evacuated and then flooded with dielectric
fluid.  A small amount of spillage occurs when  disconnecting the fill
hose from the larger capacitors.   The  spilled dielectric  is generally
washed away with a solvent which is reclaimed.  This procedure does
not result in any wastewater discharge.

The racks of smaller capacitors  coming  from the  flooded chambers
are washed either by an organic  solvent which can be recycled  or by
a detergent wash and rinse.  At  Plant  ID  30082  the  detergent wash
may be recycled, but the rinses  are discharged.   This discharge
carries dielectric fluid  into  the environment.  However,  the
plant is now using a solvent washer  for  cleaning  these capaci-
tors with no discharge to waste  treatment.

Mica Paper Dielectric  - The manufacture  of  mica paper dielectric re-
quires inert mica and  water as process  materials.  The mica is ground
into fine particles and mixed  with water  into  a slurry.  This  slurry
is then cast into a sheet on  a moving  belt  and  the water is drained
and evaporated.  The mica sheet  is then  rolled  and prepared for ship-
ment.  The wastewater  generated  by this  process comes from the drain-
age on the moving belt and  from  the  slurry  which  is discarded.
                                  VTI-22

-------
 Since particle size of mica flakes is important in producing mica
 paper that is both flexible and durable, the manufacturing process
 rejects those particles too small and discharges them with
 process wastewater.  The above represent the only process
 wastewater specific to mica paper dielectric production.

 Wastewater Analysis Data

 Process wastewater and effluent discharges from dielectric materials
 manufacturing were sampled at three facilities.  Samples were analyzed
 for  parameters identified on the list of 129 toxic pollutants,
 non-toxic  metals,  and other pollutants presented in Table 7-6.

 Tables  7-7 through 7-12 present sampling analysis data for detected
 parameters in raw  process wastewaters and treated effluents for
 those plants  sampled within the dielectric materials subcategory.
 Pollutant  parameters are grouped according to toxic organics,
 toxic metals,  non-toxic metals,  and other pollutants.   Total
 pollutant  concentrations are presented as well as mass loadings
 of those pollutant parameters.   Mass loadings were derived by
 multiplying concentration by the flow rate and the hours per
 day  that a particular process is operated.   Some entries were
 left  blank for one of the following reasons:   the parameter was
 not detected?  the  concentration used for the  kg/day calculation is
 less  than  the  lower quantifiable limits  or not quantifiable.   The
 kg/day  is  not  included in totals for calcium,  magnesium, and
 sodium.  The  kg/day is not applicable to pH.   Totals do not include
 values  preceded by "less than".

 Only  a  limited  amount of stream analysis data  is available.   Toxic
 organics,  toxic metals and non-toxic  metals were detected at
 measurable levels  as  well  as  at  levels below  the limit of quanti-
 tative  measurement.   Other parameters are all  reported in measurable
quantities.  The following conventions were  followed in presenting
 the data:                                                         ^

          Trace Levels - Pollutants  detected  at levels too low to
          measure  are  reported  as  less than  (<)  the  minimum limit
          of measurement for  the  test method used.

          Pollutant Loads  - Pollutant loads are calculated for
          measureable  pollutants  by multiplying concentration
          by flow  and  daily flow  durations.  This procedure  gives
          calculated pollutant loads  in  kg/day  by pollutant  for
          each stream  sampled. ,
                                VI1-23

-------
                                              TABLE 7-6
                                   POLLUIANT PARAMETERS ANALYZED
TOXIC ORGANICS

 1.  Acenaphthene                               46.
 2.  Acrolein                                   47.
 3.  Acrylonitrile                              48.
 4.  Benzene                                    49.
 5.  Benzidine                                  50.
 6.  Carbon Tetrachloride(Tetrachloromethane)   51.
 7.  Chlorobenzene                              52.
 8.  1,2,4-Trichlorobenzene                     53.
 9.  Hexachlorbenzene                           54.
10.  1,2-Dichlorethane                          55.
11.  1,1,1-Tridiloroethene                      56.
12.  Hexachloroethane                           57.
13.  1,1-Dichloroethane                         58.
14.  1,1,2-Trichlroethane                       59.
15.  1,1,2,2-Tetrachloroethane                  60.
16.  Chloroethane                               61.
17.  Bis(Oiloranethyl}Ether                     62.
18.  Bis(2-Chloroethyl)Ether                    63.
19.  2-Chloroethyl Vinyl Ether(Mixed)           64.
20.  2-Chloronaphthalene                        65.
21.  2,4,6-Trichlorophenol                      66.
22.  Parachloroneta Cresol                      67.
23.  Chlorofonn(Trichloromethane)               68.
24.  2-Chlorophenol                             69.
25.  1,2-Dichlorobenzene                        70.
26.  1,3-Oichlorobenzene                        71.
27.  1,4-Dichlorobenzene                        72.
28.  3,3'-Dichlorobenzidine                     73.
29.  lA-Dichlocoethylene                       74.
30.  1,2-Trans-Dichloroethylene                 75.
31.  2.4-Dichlorophenol                         76.
32.  1,2-Dichloropropane                        77.
33.  l,2^icMorcpropylene(l,3-^ichloropropene) 78.
34.  2,4HDimethylphenol                         79.
35.  2,4-Dinitrotoluene                         80.
36.  2,6-Dinitrotoluene                         81.
37.  1,2-Diphenylhydrazine                      82.
38.  Ethylbenzene                               83.
39.  Fluoranthene                               84.
40.  4-ChlorophenylPhynyl Ether                 85.
41.  4-BroK^>henylPhenyl Ether                  86.
42.  Bis(2-Chloroisoprcpyl)Ether                87.
43.  Bis(2-Chloroethoxy)Methane                 88.
44.  Methylene Chloride(Dichloromethane)        89.
45.  Methyl Chloride (Chloromethane)             90.
Methylbromide (Bromomethane)
Bromoform (Tribromonethane)
Dichlorobromone thane
Trichlorofluoromethane
Dichlorcdifluoromethane
Chlorodibromome thane
Hexachlorobutadiene
Hexachlorocyclopentadiene
Isophorone
Naphthalene
Nitrobenzene
2, 4-Dinitrophenol
4, 6-Dinitro-o-cresol
N-Nitrosodimethylamine
N-^itrosodiphenylaraine
N-Nitrosodi-N-Propylamine
Pentachlorophenol
Phenol
Bis ( 2-Ethylhexyl ) Phthalate
Butyl Benzyl Phthalate
Di-N-Butyl Phthalate
Di-N-Octyl Phthalate
Diethyl Phthalate
Dimethyl Phthalate
1 , 2-Benzanthracene (Benzo (A) Anthracene )
Benzo ( A)Pyrene ( 3 , 4-Benzo-Pyrene )
3 , 4-Benzof luoranthene ( Benzo ( B ) Fluoranthene )
11 , 12-Benzof luoranthene ( Benzo ( K ) Fluoranthene )
Chrysene
Acenaphthylene
Anthracene
1 , 12-Benzoperylene ( Benzo ( (KI ) -Perylene )
Fluorene
Phenanthrene
1,2, 5, 6-Dibenzathracene(Dibenzo(A,H)Anthracene)
Indeno (1,2, 3-CC ) Pyrene ( 2 , 3-o-PhenylenePyrene )
Pyrene
Tetrachloroethylene
Toluene
Trichloroethylene
Vinyl Chloride (Chloroethylene)
Aldrin
Dieldrin
                                                      VII-24

-------
                                              TABLE 7-6  Con't
  91.  Chlordane(TechnicalMixtureandMetabolites) 112.
  92.  4,4'-DOT                                  113.
  93.  4,4I-DDE(P,P'-DDX)                        TOXIC
  94.  4,4'-DDD(P1FP'-TDE)                        114.
  95.  Alpha-Endosulfan                          115.
  96.  Beta-Endosulfan                           117.
  97.  Endosulfan Sulfate                        118.
  98.  Endrin                                    119.
  99.  Endrin Aldehyde                           120.
 100.  Heptachlor                                121.
 101.  HeptachlorEpoxide(BHC-Hexachlorocyclo-    122.
         hexane)                                  123.
 102.  Alpha-BHC                                  124.
 103.  Beta-BHC                                  125.
 104.  Gamma-BHC(LIndane)                        126.
 105.  Delta-BHC(PCB-Polychlorinated Biphenyls)  127.
 106.  PCB-1242(Arochlor 1242)                    128.
 107.  PCB-1254(Arochlor 1254)
 108.  PCB-1221(Arochlor 1221)
 109.  PCB-1332(Arochlor 1232)
 110.  PCB-1248(Arochlor 1248)
 111.  PCB-1260(Arochlor 1260)
 129.   2,3,7,8-Tetrachlorcdibenzo-P-Dioxin (TCDD)
PCB-1016(Arochlor 1016)
Toxaphene
METALS
Antimony
Arsenic
Beryllium
Cadmium
Chromium
Copper
Cyanide
Lead
Mercury
Nickel
Selenium
Silver
Thallium
Zinc
NON-TOXIC METALS

Calcium
Magnesium
Aluminum
Manganese
/Vanadium
Boron
Barium
Molybdenum
Tin
Yttrium
Gobalt
Iron
Titanium

OTHER POLLUTANTS

Oil & Grease
Total Organic Carbon
Biological Oxygen Demand
Total Suspended solids
Phenols
Fluoride
Xylenes
Alkyl Epoxides
                                                        VII-25

-------
                                                TABLE 7-7
                                   OIL FILLED TRANSFORMER PROCESS WATER
                                          (PLANT I.D. NO. 19563)   -
Strean I.D. No.


Flow Rate (Liters/Hr)
Duration (Hrs/Day)
Sample Number

     TOXIC ORGANICS

 11  1,1,1-Trichloroethane
 22  Parachloroaeta Cresol
 23  Chloroform (Trichloromethane)
 24  2-Chlorophenol
 39  Fluoranthene
 44  Methylene Chloride (Dichloromethane)
 55  Naphthalene
 65  Phenol
 66  Bis(2-ethylhexyl)Phthalate
 67  Butyl Benzyl Phthalate
 68  Di-N-Butyl Phthalate
 70  Diethyl Phthalate
 78  Anthracene/Phenanthrene
 80  Fluorene
 84  Pyrene
 86  Toluene
107  PCB-1254 (Atochlor 1254)
Total Toxic Organics

     TOXIC METALS

114  Antimony
115  Arsenic
117  Berylliuffl
118  Cadmium
119  ChroBiua
120  Copper
122  Lead
123  Mercury
124  Nickel
125  Seleniuo
126  Silver
127  Thallium
128  Zinc
Total Toxic Metals

     NON-TOXIC METALS

     Calcium*
     Aluminua
     Vanadium
     Barium
     Tin
     Cobalt
     Titanium
     Magnesium*
     Manganese
     Boron
     Molybdenum
     Yttrium
     Iron
     Sodium*
Total Non-Toxic Metals

     OTHER POLLUTANTS

     pH
121  Cyanide
     Oil & Grease
     Total Organic Carbon
     Biochemical Oxygen Demand
     Total Suspended Solids
     Phenols
     Fluoride

     I-(Interference Present)
tng/1
400
Skinner No. 1
Effluent
152977
24
3947
0.048
0.800
<0.010
0.660
0.01
<0.010
<0.010
<0.010
<0.010
<0.010
<0.010
0.014
1.532
<0.005
<0.005
<0.005
0.005
<0.01
0.01
<0.04
<0.001
<0.04
<0.004
<0.005
<0.025
0.169
0.274
6.330*
0.825
0.031
0.018
0.016
0.003
0.003
1.852*
0.039
0.035
0.008
0.002
0.242
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1.22
6.0
0
0
12
I
9
0.08
0.12
kg/day
400



24

0.176
2.931

2.418
0.037






0.051
5.613



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0.366






0.619
1.004
23.2
3.023
0.114
0.066
0.059
0.011
0.011
6.786
0.143
0.129
0.0293
0.007
0.887
32.23
4.743



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32.978
0.293
0.439
as/I
401
Skimmer No.
Effluent
89894
24
3948
 0.062
<0.010
 0.570
<0.010
<0.010
 1.200
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-------
                                          TABLE 7-12
                      MICA PAPER MANUFACTURING RAW AND TREATED WASTEWATER
                                       PLANT ID #43055
Streaa Identification

Flow Rate, Liters/Hr.
Duration, Hrs/Day

     TOXIC ORGANICS

 04  Benzene
 07  Chlorobenzene
 11  1,1,1-trichloroethane
 23  Chloroform
 38  Ethylbenzene
 44  -Methylene Chloride
 66  Bis(2-ethylhexyl)Phthalate
 67  Butyl Benzyl Phthalate
 68  Di-n-butyl phthalate
 85  Tetrachloroethylene
 86  Toluene
 87  Trichloroethylene
Total Toxic Organics

     TOXIC METALS

114  Antimony
115  Arsenic
117  Beryllium
118  Cadmium
119  Chromium
120  Copper
122  Lead
123  Mercury
124  Nickel
125  Selenium
126  Silver
127. Thallium
128  Zinc
Total Toxic Metals

     NON-TOXIC METALS

     Aluminum
     Barium
     Boron
     Calcium*
     Cobalt
     Iron
     Magnesium*
     Manganese
     Molybdenum
     Sodium*
     Tin
     Titanium
     Vanadium
     Yttrium
Total Non-Toxic Metals

     OTHER POLLUTANTS

     PH
     Temperature, C
121  Cyanide, Total
     Oil & Grease
     Total Organic Carbon
     Biochemical Oxygen DeraanJ
     Total Suspended Solids
     Phenols
mjs/1
   03653
Raw Waste
   146037
24
<0.010
<0.010
 0.180
<0.010
<0.01
 0.029
<0.010
<0.010
<0.010
<0.010
<0.010
<0.010
 0.209
<0.005
<0.003
<0.001
 0.001
 0.004
 0.011
 0.013
<0.001
 0.023
<0.003
<0.003
<0.025
 0.017
 0.055
 0.260
 0.013
 0.052
 9.693*
<0.001
 0.107
 3.270*
 0.004
 0.002
 1.613*
 0.027
 0.002
 0.028
<0.001
 0.495
kg/day



24





 .63088


 .10164
mg/1           kg/
    03654
Treated Waste
    146037
24             24
 .73252
 0.0035
 0.014
 0.038
 0.046

 0.081
 0.060
 0.192
 0.911
 0.046
 0.182
 0.368

 0.014
 0.007

 0.095
 0.007
 0.098

 1.728
7.0
13
0
0.4
1.9
2.0
103
0.008



1.402
6.659
7.0
361.0
0.028
         NOT

       ANALYZED
<0.005
<0.003
<0.001
 0.001
 0.004
 0.010
 0.016
<0.001
 0.039
<0.003
<0.003
<0.025
 0.016
 0.086
 0.110
 0.009
 0.044
 9.639*
<0.001
 0.039
 3.257*
 0.002
 0.001
 1.521*
 0.034
 0.001
 0.024
 0.003
 0.2653
                               6.9
                              13
                                0
                               1.0
                               1.7
                               1.2
                               7.2
                               0.006
0.0035
0.014
0.035
0.056
                               0.137
0.056
0.302
0.386
0.032
0.154
0.137

0.007
0.0035

0.119
0.0035
0.084
0.011
0.937
                               3.505
                               5.958
                               4.206
                              25.235
                               0.021
                          *Not Included in Totals
                                                            VII-32

-------
          Sample Blanks - Blank samples  of organic-free  distilled
          water were placed adjacent  to  sampling  points  to  detect
          airborne contamination of water samples.    These  sample
          blank data are not subtracted  from  the  analysis results,
          but, rather, are shown as a (B) next  to the pollutant
          found in both the sample and the blank.  The tables  show
          figures for total toxic organics, total toxic  and
          non-toxic metals, and other pollutants.

Oil Filled Transformers - Four oil filled transformer plants were
visited, one of which was sampled.  Table 7-7 presents the  analyses
of the effluent streams from oil/water separators.   Raw  wastewater
samples were not collected at this facility.

Oil Filled Capacitors - Tables 7-8 through 7-11 present  data from a
plant manufacturing oil filled capacitors and utilizing  water  to clean
the outside of the capacitors subsequent to filling  with dielectric
fluid.  The plant was sampled on two  separate occasions. On one
occasion, four sample points were taken  - the wastewater lagoon ef-
fluent (total plant composite raw process waste),  the multimedia
filter effluent, the carbon filter effluent and the  final waste
treatment effluent (following the second carbon filter and  diato-
maceous earth filter).  Tables 7-8 through 7-10 trace the progres-
sion of concentration changes through the waste treatment system
components for three days of operation and sampling.

Table 7-11 presents data from the same plant  sampled at  an  earlier
date and includes additional sample points (supply water, deter-
gent wash of filled capacitors, and rinse following  detergent  wash).
This table also traces the progression of concentration  changes
through the waste treatment system components.  The  data are
given for two days of operation.

Mica Paper Dielectric - Table 7-12 presents data  from a  plant  pro-
ducing mica paper.  The data were taken  before  and after two settling
ponds in series used to settle out mica  flakes  in the plant effluent.
The samples were collected over a 24  hour period.

Summary of Raw Wastewater Stream Data

Table 7-13 summarizes pollutant concentration data for the  process
wastewater streams sampled in the dielectric  materials subcategory.
Minimum, maximum, mean, and flow-weighted mean  concentrations
have been determined for the raw waste streams  sampled.  The flow
weighted mean concentration was calculated by dividing the  total mass
rates (mg/day) by the total flow (liters/day) for all appropriate
sampled data for each parameter.  Trace  level concentrations were
not used in these calculations.  Table 7-13 also  summarized mean
pollutant concentration data for mica paper dielectric manufactur-
ing.  Only one stream at Plant ID 43055  was sampled.

Pollutant parameters listed in Table  7-13 were  selected  based  upon
their occurrence and concentration in the sampled streams.  Those
parameters not detected in the sampled streams  were  excluded from
this table.  The information presented in Table 7-13 is  based  on
                              VII-33

-------
                                            TABLE 7-13
                                 DIELECTRIC MATERIALS SUBCATEGORY
                         SUMMARY OF  DIELECTRIC  RAW WASTE  STREAM DATA*
                                (EXCLUDES MICA PAPER MANUFACTURING)

                                  Minimum        Maximum        Mean           Flow  Weighted
                                  Concentration  Concentration  Concentration   Mean  Concentration
                                  (mg/1)         (mg/1)          (mg/1)         (mg/1)
TOXIC ORGANICS
  6  Carbon tetrachloride
  8   1,2,3-trichlorobenzene
 11  1,1,1-trichloroethane
 29  1,1 dichloroethylene
 30  1,2 trans-dichloroethylene
 44  Methylene chloride
 66  Bis(2-ethylhexyl)phthalate
 68  Di-n-butyl phthalate
 70  Diethyl phthalate
 86  Toluene
 87  Trichlorothylene
107  PCB-1254

TOXIC METALS

118  Cadmium
119  Chromium
120  Copper
122  Lead
124  Nickel
126  Silver
128  Zinc

OTHER POLLUTANTS

121  Cyanide
     Oil & Grease
     Total Organic Carbon
     Total Suspended Solids
     Biological Oxygen Demand
     Phenols
 0
0.02
0.045
0.02
0.01
1.2
  2
0.06
3.22
0.02
0.01
0.017
ND**
 0.0023
<0.01
 0.03
 0.025
<0.025
<0.01
 0.415
0.54
0.2,
0.28
0.03
3.8
0.48
0.06
3.22
0.02
0.015
0.20
ND
               0.585
               0.041
               1.7
               1.45
               0.05
               0.02
               0.555
0.28
0.123
0.12
0.02
2.5
0.34
0.06
3.22
0.02
0.013
0.109
ND
               0.21
               0.02
               0.617
               0.548
               0.033
               0.013
               0.5
<0.004
8.2
50.
16.
12.
0.12
0.079
780,000.
8140.
9900.
2810.
0.18
0.041
156053.
2747 .
3373.
983.
0.14
2.
0.
0.
0.273
0.049
0.037
0.02
 .45
 .339
 .06
3.22
0.02
0.015
0.193
ND
               0.03
               0.025
               0.854
               0.119
               0.037
               0.015
               0.261
                                             0.041
                                            17.05
                                            53.36
                                               70
                                               5
                                           21
                                           15
                                                                               0.12
     *Non-Toxic Metals Were Not  Analyzed
     **Not Detected
                                               VII-34

-------
                      TABLE 7-13 CON'T
                  MICA PAPER MANUFACTURING
                SUMMARY OF RAW WASTE DATA
 11  lr1/1 Trichloroethane
 44  Methylene Chloride
118  Cadmium
119  Chromium
120  Copper
122  Lead
124  Nickel
128  Zinc
     Aluminum
     Barium
     Boron
     Iron
     Manganese
     Molybdenum
     Tin
     Titanium
     Vanadium
     Total Organic Carbon
     Total Suspended Solids
     Phenols
     Oil & Grease
Mean  Concentration*

     0.18
     0.029
     0.001
     0.004
     0.011
     0.013
     0.023
     0.017
     0.26
     0.013
     0.052
     0.107
     0.004
     0.002
     0.027
     0.002
     0.028
     1.9
     103
     0.008
     0.4
Flow (liters/day)                  3,504,888

*Only one sample stream, Plant ID 43055  (See Table 7-12)
                                 VII-35

-------
 data in Tables 7-11 (detergent wash stream, detergent wash rinse
 stream, and lagoon influent).  For mica paper manufacturing, Table
 7-12 (raw waste stream) was used.  The concentration data in Table
 7-13 must be used with care, because the detergent wash stream has
 an extremely low average flow rate (it is a batch dump) and the raw
 waste stream has an extremely high flow rate.  Thus, many of the
 maximum concentrations are associated with a very low flow rate, and
 many of the mean concentrations are strongly influenced by this
 same stream.  The flow-weighted mean concentrations are essentially
 equal to the concentrations of the high flow rate (raw waste) stream.

 Treatment In Place

 The following subsections describe treatment in place for wastewater
 from oil filled transformers, oil filled capacitors, and mica paper
 dielectric production.

 PCS Dielectric Fluids  - Plants which used PCS as a dielectric fluid
 are faced with the problem of decontaminating equipment used for im-
 pregnating or filling  the final product.  In some cases, this neces-
 sitates the removal of equipment and piping systems.  As a minimum,
 PCS storage containers, piping, and other equipment has to be drained
 of fluid and flushed with an organic solvent until all but trace
 amounts of PCB are removed.

 PCB's and solvent used for flushing such equipment is the liability
 of the company performing the operation and has to be disposed of
 or stored in an approved manner.  Residual amounts of PCB are not
 readily degraded in the environment.

 The decontamination of plant land area has also been necessary in
 some cases owing to accidental oil spills.  A successful system was
 sampled for removing oils from a land area bordering on a river.
 It is shown schematically in Figure 7-4.  The observed system
 operates in a manner similar to a leaching field working in
 reverse.  Water and oil are collected from an oil contaminant land
 area through pipes buried under the surface.  The oil-water mixture
 goes to a well and is  pumped to an oil-water separator.  The oil is
 analyzed for the concentration level of PCB.  If the concentration
 is over 50 mg/1 but less than 500 mg/1 the oil is stored as a PCB
 contaminated waste oil.  If the concentration exceeds 500 mg/1,  the
 oil  is stored as PCB waste fluid.  If the concentration is less  than
 50 mg/1,  the oil is treated as an ordinary waste oil and is disposed
 of accordingly.
   4
 At present,  there are  no EPA approved incinerators which can be  used
 for PCB disposal.   Two companies, Rollins Environmental Services of
Wilmington,  Delaware and ENSCO of Eldorado,  Arkansas have applied
                                 VII-36

-------
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VII-37

-------
 for  approval.   Rollins has two incinerators which are currently
 under consideration.   One, in Houston,  Texas is presently being
 tested.   The  second plant in Bridgeport,  N.J.  is still involved in
 a  local  legal  conflict preceding the planned "test burn".  Rollins
 estimates that the cost of disposing of PCB will be Ilff to 14jz? per
 kilogram.   The ENSCO  plant in Arkansas  has been put through a test
 burn.  A decision on  approval has not yet been made.

 Oil  Filled  Transformers - Manufacturers within the oil filled trans-
 former industry that  discharge wastewater typically treat their waste
 with one or more of the following operations:

                    Filtration
                    Solids settling in  tank or pond
                    Oil separation
                    Skimming and hauling  or storage of oil

 Figure 7-5  depicts the treatment system observed at Plant ID 19563,
 the  oil  filled transformer plant that was sampled.  This system
 consisted of an oil skimming device only.

 Oil  Filled  Capacitors - Plant 30082 is  one of  the largest oil filled
 capacitor manufacturers in the U.S.  The  pliant uses very few water
 producing operations,  but the discharge from the capacitor manufac-
 ture is  substantial (approximately 187,200 liters per day).  The
 waste  treatment system at this facility,  shown schematically in
 Figure 7-6, was designed to handle oil  and grease, total and dis-
 solved solids  and metals,  and sanitary  and run-off wastes.  The
 settling  lagoon is continuously skimmed and the skimmed oil is
 drummed  and contractor removed for disposal.

 The  discharge  from the lagoon is sent to  two mixed media filters
 connected in parallel.   After filtration  these flows combine and pass
 through  carbon absorption and a diatomaceous earth filter.  Each
 of the multimedia filters in the waste  treatment system is back-
washed on a regular basis.   After sludge  thickening, the decant water
 is put back into the  lagoon.   The final treatment system discharge
 rate  is  between 20-27 1pm (80-100 gpm).  For such a large throughput,
only one or two 55 gallon drums of solids are  removed each year.

Mica Paper Dielectric - Plant 43055 is  a  large mica paper dielectric
manufacturing  facility using  nearly 3.785 million liters per day (one
million  gallons  per day)  of process water.  The raw wastewater dis-
charged  from the manufacturing process  has high amounts of suspended
mica which are inert  mineral  particles.  This  facility utilizes three
settling lagoons or ponds  to  allow the  heavy mica particles to settle
out  of suspension.  The retention time  in each of the ponds is approxi-
mately 8-1/2 hours.   During normal operation,  only two of the ponds
are  used  in series  while the  third is allowed  to dry.  After drying
the pond  is dredged,  and the  sludge is  contractor hauled.  The waste
 treatment system for  this  plant is depicted in Figure 7-7.  The
effluent analysis  data for this facility  are presented in Table 7-12.
                                 VII-38

-------
          OIL SKIMMING
                              RAW WASTE  DISCHARGE
                I
                OIL DRUMMED
               (IF  PCB LEVEL IS >5*0 PPM,
                        'OTHERWISE INCINERATED)
           FIGURE  7-5

DIELECTRIC MATERIALS SUBCATEGORY
      OIL-WATER SEPARATOR
         PLANT ID 19563
 RECOMMENDED LEVEL 1 TREATMENT
                VII-39

-------
        Waste  Water
            i
          Lagoon
     (Oil Separation
         And  Skimming)
Multimedia
  Filter
Multimedia
  Filter
                       {  Backwash
                      . I i n ».i—. \m
Backwash
Holding
  Tank
                                                     Decant
        Activated
          Carbon
        Adsorber
                           Sludge
                          Settling
                            Tank
                              I
                                       Sludge (Haul)
        Activated
          Carbon
        Adsorber
                                     Arrows Indicate
                                     Wastewater Discharge
       Oiatomaceous
       Earth Filter
                   Discharge To River
                       FIGURE 7-6
            DIELECTRIC MATERIALS SUBCATEGORY
              WASTEWATER TREATMENT SYSTEM
                     PLANT ID 30082
             RECOMMENDED LEVEL 2 TREATMENT
                          VII-40

-------
   SETTLING
      POND
    SETTLING
      POND
                      SETTLING
                        POND
 DISCHARGE
'TO STREAM
            * Raw Waste To Alternating  Ponds
            FIGURE 7-7

 DIELECTRIC MATERIALS SUBCATEGORY
MICA PAPER DIELECTRIC MANUFACTURE
   WASTEWATER TREATMENT SYSTEM
          PLANT ID 43055
   RECOMMENDED LEVEL 1 ^TREATMENT
                 VII-41

-------
POTENTIAL SELECTED  POLLUTANT  PARAMETERS

Selected pollutants in  the.dielectric  materials  subcategory (exclud-
ing Mica Paper  Manufacture) are:

             6 Carbon tetrachloride
            30 1,2 Trans-dichloroethylene
            44 Methylene Chloride
            68 Di-n-butyl phthalate
            87 Trichloroethylene
          107 PCB - 1254*
          120 Copper
          122 Lead
          128 Zinc
              Total Suspended Solids
              Oil and Grease
              Total Organic Carbon

These parameters were selected based upon  their  occurrence  in  the
process wastewater  and  upon the treatability  of  each  at  the levels
found.  It  should be noted that data on non-toxic  metals was un-
available.

Table 7-14  lists pollutants other than the potential  pollutant
parameters  listed above that  were analyzed in the  raw waste streams
sampled for the dielectric materials subcategory.   Each  pollutant is
listed in the appropriate grouping  as  being not  detected, detected
at trace levels, or detected  at levels too low to  be  effectively
treated prior to discharge.

The selected pollutant  in the mica  paper manufacturing industry is:

       Total Suspended  Solids

Table 7-15  lists pollutants other than the potential  pollu-
tant parameter  listed above that was analyzed in the  raw waste
streams sampled for the mica  paper  manufacturing industry.   Each
pollutant is listed in  the appropriate grouping  as being hot
detected, detected  at trace levels, or detected  at levels too
low to be effectively treated prior to discharge.

APPLICABLE  TREATMENT TECHNOLOGIES

The treatment systems selected for  the dielectric  materials
subcategory are those defined earlier  in this section in Figures
7-5, 7-6, and 7-7.   The systems are designated as  Level  1 or Level
2.  The Level 1 system  shown  in Figure 7-5 consists of oil  skim-
ming and applies to wet transformers and oil-filled capacitor
manufacture.  The Level 2 system shown in Figure 7-6  applies to
the same industry segments but provides improved performance.  It
consists of oil skimming, multimedia filtration, carbon  adsorption,
and diatomaceous earth  filtration.  The Level 1  system shown in
Figure 7-7  applies  to the mica paper dielectric  segment.  It con-
sists of two stages  of  sedimentation.
*PCB-1254, See Appendix A
                                VII-42

-------
The following subsections will present performance  and  cost  data
for these treatment technologies for  the dielectric subcategory.
Treatment systems for oil filled capacitors, oil  filled transformers^
and mica paper dielectric wastewater  are discussed  in these  subsections,

For oil filled capacitors, it is possible  to eliminate  the need  for
process water use by substituting solvent  cleaning  for  detergent
washes and rinses.  A moderately large plant  (Plant, I.D.  No.  19103)
manufacturing capacitors employs solvent cleaning of finished capa-
citors.  The solvent is distilled and reused.  The  still  bottoms  are
contractor hauled and incinerated.

Although the use of solvents in cleaning oil  filled capacitors will
diminish or replace the need for process water,  the solvents used
must be collected and disposed of properly.  Discharge  of solvents
to the environment would be more harmful than  discharge of detergent
washes and rinses.

Substituting other dielectric fluids  for PCB  is  required  by  law.
There are several fire resistant fluids which  are proposed as sub-
stitutes for PCB.  Table 7-2 presented a summary of PCB substitute
dielectric fluids currently used or proposed  for use in oil  filled
capacitors and oil filled transformers.  Di-n-octyl phthalate is
widely used in fluid filled capacitors although  it  is a priority
pollutant.  Silicone oils are probably the most  popular PCB  substi-
tute for dielectric fluids.
                                  VII-43

-------
                                              TABLE 7-14
                                   DIELECTRIC MATERIALS SUBCATEQORY
                                   (EXCLUDES MICA EAPER MANUFACTURING)
                                        POLLUTANT PARAMETERS

                                  NOT DETECTED IN RAW WASTE STREAMS
TOXIC ORGRNICS

 1.  Acenaphthene                               46.
 2.  Acrolein                           •        47.
 3.  Acrylonitrile                              48.
 4.  Benzene                                    49.
 5.  Benzidine                                  50.
 7.  Chlorobenzene                              51.
 8.  1,2,4-Trichlorobenzene                     52.
 9.  Hexachlorbenzene                           53.
10.  1,2-Dichlorethane                          54.
11.  1,1/1-Trichloroethene                      55.
12.  Hexachloroethane                           56.
13.  1,1-Dichloroethane                         57.
14.  1,1,2-tfrichloroethane                      58.
15.  1,1,2,2-Tetrachloroethane                  59.
16.  Chloroethane                               60.
17.  Bis(Oiloromethyl)Ether                     61.
18.  Bis(2-chloroethyl)Ether                    62.
19.  2-Chloroethyl Vinyl Ether(Mixed)           63.
20.  2-Chloronaphthalene                        64.
21.  2,4,6-Trichlorophenol                      65.
22.  Parachlorometa Cresol                      67.
23.  Chloroform(Trichlorcmethane)               68.
24.  2-chlorophenol                             69.
25.  1,2-Dichlorobenzene        .                70.
26.  1,3-Dichlorobenzene                        71.
27.  1,4-Dichlorobenzene                        72.
28.  3/3-Dichlorobenzidine                      73.
31.  2,4-Dichlorophenol                      •   74.
32.  1,2-Dichloropropane                        75.
33.  l,2-Dichloropropylene(l,3HDichloropropene) 76.
34.  2,4HDimethylphenol                         77.
35.  2,4-Dinitrotoluene                         78.
36.  2,6-Dinitrotoluene                         79.
37.  1,2-^iphenylhydrazine                      80.
38.  Ethylbenzene                               81.
39.  Pluoranthene                               82.
40.  4-chlorophenylPhynyl Ether                 83.
41.  4HBromophenylPhenyl Ether                  84.
42,  Bis (2-chloroisopropyl) Ether
43.  Bis (2-chloroethO3cy) Methane
44.  Jfethyl Chloride(Chlororaethane)
Methylbrcmide (Brononethane)
Bromoform  (Tribromomethane)
Dichlorobroroctnethane
Trichlorofluorcmethane
Dichlorodifliioromethane
Chlorodibrxxnorte thane
Hexachlorobutadiene
Hexachlorocyclcpentadiene
Isophorone
Naphthalene
Nitrobenzene
2-Nitrophenol
4-«itrophenol
2,4-Dinitrophenol
4,6-Dinitro-o-cresol
N-*Iitrosodimethylami.ne
KH«itrosodiphenylamine
N-Nitrosodi-*I-Propylamine-
Pentachlorophenol
Phenol
Butyl Benzyl Phthalate
Dins-Butyl Phthalate
Di-N-Octyl Phthalate
Diethyl Phthalate
Dimethyl Phthalate
1,2-Benznathracene (Benzo (A) Anthracene)
Benzo(A)Pyrene (3,4-fienzo-Pyrene)
3,4-Benzofluoranthrene(Benzo(B)Pluoranthene)
11,12-Benzofluoranthene(Benzo(K)Fluoranthene)
Chrysene
Acenaphthylene
Anthracene
1,12-Benzoperylene(Benzo(GHI)-Perylene)
Fluorene
Phenanthrene
1,2,5,6HDibenzathracene(Dibenzo (A,H)Anthracene
Indeno(1,2,3-DC)Pyrene(2,3-o-PhenylenePyrene)
Pyrene
                                               VEI-44

-------
TABLE 7-14 (Continued)
85.  Ttetrachloroethylene                       100.
88.  Vinyl Chloride (Chloroethylene)           101.
89.  Aldrin                                    103.
90.  Dieldrin                                  104.
91.  ailon3ane(TechnicaWixtureandMetabolitEs) 105.
92.  4,4'HDOT                                  106.
93.  4,4'HDDE (P,P'-DDX)                       107.
94.  4f4'-DDD (P,P'-TDE)                       108.
95.  Alpha-Endosulfan                          109.
96.  Beta-Endusulfan                           110.
97.  Endosulfan Sulfate                        111.
98.  Endrin                                    112.
99.  Endrin Aldehyde                           113.
                                               129.

Xylenes
Alkyl Epoxides
             Heptachlor
             Hepthachlor Epoxide(BHC-Hexachlorocyclohexane)
             Beta-*HC
             Gamma-BHC (Lindane)
             Delta-BHC (PCB-Polychlorinated Biphenyls)
             PCB-1242 (Arochlor 1242)
                      (Arochlor 1254)
                      (Arochlor 1221)
                      (Arochlor 1332)
                      (Arochlor 1248)
                      (Arochlor 1260)
                      (Arochlor 1016)
PCB-1254
PCB-1221
PCB-1332
PCB-1248
PCB-1260
PCB-1016
Itoxaphene
2,3,7,8-Tetrachlorodibenzo-P-Dioxin
                                                 (TCDD)
     VII-45

-------
            TABLE 7-14  (Continued)
DETECTED AT TRACE LEVELS  IN RAW WASTE  STREAMS
             114. Antimony
             115. Arsenic
             117. Beryllium
             123. Mercury
             125. Selenium
             127. Thallium
                         VII-46

-------
                                        TABLE 7-14  (Continued)
                         DETECTED AT LEVELS TOO LOW TO REQUIRE TREATMENT*
  8  1,2,3 Trichlorobenzene
 11  1,1,1 Trichloroethane
118  Cadmium
119  Chromium
124  Nickel
126  Silver
121  Cyanide
     Phenols
     Biochemical Ojcygen Demand
Mean Concentration (mg/1)

        0.123
        0.12
        0.21
        0.02
        0.033
        0.013
        0.041
        0.14
        983.
Flow Weighted
Mean Concentraiton (mg/1)

        0.049
        0.037
        0.03
        0.025
        0.037
        0.015
        0.041
        0.12
        15.5
    These parameters do not require treatment because (1) the raw waste concentration
    is less than the daily maximum figure (See Table 7-17) or (2) no performance data is
    available for treatment of these parameters.
                                            VII-47

-------
                                          TABLE 7-15
                               MICA PAPER MATERIALS SUBCATEGQRY
                                     POLLUTANT PARAMETERS

                               NOT DETECTED IN RAW WASTE STREAMS
TOXIC CRGANICS

 1.  Acenaphthene                                 46.
 2.  Acrolein                                     47.
 3.  Acrylonitrile                                48.
 5.  Benzidine                                    49.
 6.  Carbon Tetrachloride (Tetrachloromethane)    50.
 8.  1,2,4-Trichlorobenzene                       51.
 9.  Hexachlorobenzene                            52.
10.  1,2-Dichloroethane                           53.
12.  Hexachloroethane                             54.
13.  1,1-Dichloroethane                           55.
14.  1,1,2-JTrichloroe thane                        56.
15.  1,1,2,2-Tetrachloroethane                    57.
16.  Chloroethane                                 58.
17.  Bis(Chloromethyl)Ether                       59.
18.  Bis(2-Chloroethyl)Ether                      60.
19.  2-Chloroethyl Vinyl Ether  (Mixed)            61.
20.  2-Chloronaphthalene                          62.
21.  2,4,6-^ichlorophenyl                        63.
22.  Parachlorometa Cresol                        64.
24.  2-Chlorophenol                               65.
25.  1,2-Dichlorobenzene                          69.
26.  1,3-Dichlorobenzene                          70.
27.  1,4-Oichlorobenzene                          71.
28.  S/S'-Dichlorofaenzidine                       72.
29.  1,1-Dichloroethylene                         73.
30.  1,1-Trans-Dichloroethylene                   74.
31.  2,4-Dichlorophenol                           75.
32.  1,2-Dichloropropane                          76.
33.  l,2-Dichloropropylene(l,3^)ichlorc3prcpene)   77.
34.  2,4-Dimethylphenol                           78.
35.  2,4-Dinitrotoluene                           79.
36.  2,6-Dinitrotoluene                           80.
37.  1,2-Diphenylhydrazine                        81.
39.  Fluoranthene                                 82.
40.  4-Chlorophenyl Phenyl Ether                  83.
41.  4-Bronophenyl Phenyl Ether                   84.
43.  Bis(2-<3iloroethoxy)Methane                   88.
45.  Methyl Chloride (Chloromethane)              89.
                                                  90.
Methylbronu.de (Bromomethane)
Bromoform (Tribrornomethane)
Dichlorobrononethane
Trichlorofluoromethane
Dichlorodifluoromethane
Chlorodibromomethane
Hexachlorocyclopentadiene
Hexachlorocyclopentadiene
Isophorone
Napthalene
Nitrobenzene
2-Nitrophenol
4-Nitrophenol
2,4-Dinitrophenol
4,6-Dini tro-o-cresol
N-Nitrosodimethylamine
N-Nitrosodiphenylamine
N-Nitrosodi-N-Propylamine
Pentachlorophenol
Phenol
Di-n-octyl Phthalate
Diethyl Phthalate
Dimethyl Phthalate
1,2-Benzanthracene(Benzo(A)Anthracene)
Benzo(AJPyrene(3,4-Benzo-Pyrene)
3,4-Benzofluoranthrene(Benzo(B)Fluoranthene)
11,12-Benzofluoranthene(Benzo(K)Fluoranthene
Chrysene
Acenaphthylene
Anthracene
1,12-Benzoperylene(Benzo(GHI)-Perylene)
Fluorene
Phenanthrene
l,2,5,6-Dibenzathracene(Dibenzo(A,H)Anthrace
Indeno(1,2,3-DC)Pyrene(2,3-o-PhenylenePyrene
Pyrene
Vinyl Chloride (Chloroethylene)
Aldrin
Dieldrin
                                                 VII-48

-------
                                         TABLE 7-15  (Continued)
  91.   Chlordane (Technical Mixture and          103.
        Metabolites)                             104
  92.   4,4'-Dnr                                  io5.
  93.   4,4'-DDB (P,P'-DEK)                        106.
  94.   4,4'-DDD (P,P'yTDE)                        108.
  95.   Alpha-Endosulfan                          109.
  96.   Beta-Endusulfan                            HO.
  97.   Endosulfan Sulfate                         111
  98.   Endrin     .                               112.
  99.   Endrin Aldehyde                            113]
100.   Heptachlor                                129.
101.   Heptachlor Epoxide (BHC-Hexachlorocyclc-
        hexane)
Beta-BHC
Gamma-BBC (Lindane)
Delta-BHC (PCB-Polychlorinated Biphenyls)
PCB-1242 (Arochlor 1242)
PCB-1221 {Arochlor 1221)
PCB-1332 (Arochlor 1332)
PCB-1248 (Arochlor 1248)
PCB-1260 (Arochlor 1260)
PCB-1016 (Arochlor 1016)
Toxaphene
2,3,7,8-Ttetrachlorodibenzo-P-Dioxin (TCDD)
Xylenes
Alkyl Epoxides
                                               VII-49

-------
           TABLE 7-15 (Continued)
DETECTED AT TRACE LEVELS IN PAW WASTE STREAMS
           4.  Benzene
           7.  Chlorobenzene
          23.  Chloroform
          38.  Ethylbenzene
          66.  Bis(2H3thylhexyl)Phthalate
          67.  Butyl Benzyl Phthalate
          68.  Di-n-butyl Phthalate
          85.  Tetrachloroethylene
          86.  Toluene
          87.  Trichloroethylene
         114.  Antimony
         115.  Arsenic
         117.  Beryllium
         123.  Mercury
         125.  Selenium
         126.  Silver
         127.  Thallium
               Cobalt
               Yttrium
                       VII-50

-------
                          TABLE 7-15  (Continued)
             DETECTED AT LEVELS TOO IOW TO REQUIRE TREATMENT*
     Parameter

 11. 1,1,1-^Trichloroethylene
 44. Methylene Chloride
118. Cadmium
119. Chromium
120. Copper
122. Lead
124. Nickel
128. Zinc
     Aluminum
     Barium
     Boron
     Iron
     Manganese
     Molybdenum
     Tin
     Titanium
     Vanadium
     Total Organic Carbon
Mean Concentration (mg/1)**

          0.18
          0.029
          0.001
          0.004
          0.011
          0.013
          0.023
          0.017
          0.26
          0.013
          0.052
          0.107
          0.004
          0.002
          0.027
          0.002
          0.028
          1.9
 * = These parameters do not require treatment because 1) the raw waste
     concentration is less than the daily maximum figure (See Table 7-17. )-, or
     2) no performance data is available for treatment of these parameters.
** =
     Only one sampled stream, Plant ID 43055
                                    Vli-51

-------
Performance of Observed Treatment Systems

The actual performance of Level 1 and Level 2 treatment systems
that have been sampled for the dielectric materials subcategory
is presented in Table 7-16.  Data from individual effluent streams
utilized in the development of this table are presented in Tables
7-9 through 7-13.

Performance of Recommended Treatment Systems

Performance of the recommended treatment systems  is shown in Table
7-17.  These performance figures are based upon data  from treatment
component performance transferred from the metal  finishing industry.
This performance data can be transferred to the dielectric materials
industry because of the similarity of the raw wastes.  Section XII
describes the treatment components and the performance levels
achievable by each component.  A comparison of observed versus
recommended treatment performance is presented in Table 7-18.

Estimated Cost of Recommended Treatment Systems

The determination of estimated costs for recommended  treatment sys-
tem components is discussed in Section XIII of this report.  Tables
7-19 through 7-24 show estimated costs for each of  the recommended
treatment systems for treatment of dielectric fluid materials waste-
waters that were discussed previously.  Table 7-25  shows estimated
costs for a Level 1 treatment system for the treatment of mica
paper dielectric manufacturing.  Flow rate input  for  treatment
costs characterize small, medium, and large facilities in the dielec-
tric materials subcategory.
                               VI1-52

-------
                                     TABLE 7-16
                      PERFORMANCE OF OBSERVED TREATMENT SYSTEMS

                Dielectric Subcategory (Excluding Mica Paper) - mg/1

     Parameter

  6. Carbon Teta
 30. l,2-Trans-<
 44. Methlene Cl
 87. Trichloroel
107. PCB 1254
120. Copper
122. Lead
128. Zinc
     Total Susp«
     Oil and Grease
Level 1*
achloride ND**
ichlorethylene ND
loride 0.93
hylene ND
<0.01
0.1
<0.04
0.104
nded Solids 11.
ase 3.5
ic Carbon 16.5
Level 2**
ND
0.046
0.0113
0.0052
ND
0.01
0.048
0.70
47^ ****
3 g****
g 5****
                          Mica Paper Dielectric Manufacture
     Parameter
     Total Suspended Solids
                                  Level l*****

                                   7.2
 ND**
  ***
*****
Mean of two sampled streams, Plant ID 19563
Not Detected
Flow Weighted Mean Concentration, Final Effluent (Plant ID 30082, Stream 03553,
03557, 03549, and M22-10)
Mean Concentration, Plant ID 30082, Stream M22-10
Plant ID 43055, mean concentration
                                         VII-53

-------
3
            B  2

            ^Hs
             (3 QJ r-l


            fill
            Sf to QJ ^1

            lili

              j
              JJ

              2
            o oo to o\
                           O O ID O
                              m CM
            B 2
            : d)

            l£<
                         Of  •-<
   I (0 U

   1 Is

    U
5
4J
                         |
                  >H ^3 w QJ  CP

                  lilt!
                    i e c i- p

                    i ,5 rH 04  )d
                  o  5
                 (D **|^  fl
                i m C
                ,3s  jj


                ;SI  g
                     (0
                 i8 "H  -H


                 af  2
                 os  §
                             VII-54

-------
                                          TABLE 7-18

                            COMPARISON OF OBSERVED VS. RECOMMENDED
                                       TREATMENT SYSTEMS
               Dielectric Materials Subcategory - Effluent Concentration (rag/1)
                               (Excludes Mica Paper Manufacturing)
Parameter

  6.  Carbon Tetrachloride
 30.  1,2-Trans-dichloroethylene
 44.  Methylene Chloride
 87.  Trichloroethylene
107.  PCB 1254
      Total Toxic Organics
120.  Copper
122.  Lead
128.  Zinc
      Total Suspended Solids
      Oil & Grease
      Total Organic Carbon
                            Observed
                            Level 1*
                            Treatment

                              ND**
                              ND
                             0.93
                              ND
                            <0.01
                             0.93
                             0.1
                            <0.04
                             0.104
                            11.
                             3.5
                            16.5
Recommended
Level 1
Treatment

  NA***
  NA
  NA
  NA
  NA
 0.940
 0.814
 0.005
 0.551
17.8
11.9
  NA
Observed     Recommended
Level 2****  Level 2
Treatment    Treatment
  ND
 0.046
 0.0113
 0.0052
  ND
 0.063
 0.01
 0.048
 0.70
47t *****
 3ag*****
 8]§*****
  NA
  NA
  NA
  NA
  NA
 0.04
 0.368
 0.034
 0.247
12.7
 7.1
  NA
      Total Suspended Solids
                            Mica Paper Manufacturing

                             7.2*****    17.8
    *
 ND**
NA***
 ****

*****
Mean of two sampled streams, Plant ID 19563
Not Detected
Not Available
Flow weighted mean concentration, Plant ID 30082, (Samples # 03553, 03557,
03549, and M22-10)
Single stream value, See Table 7-16.
                                        VII-55

-------
04 CO
O EH
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BENEFIT ANALYSIS

The following is an analysis of the industry-wide benefit esti-
mated to result from applying the levels of treatment previously
discussed in this section to the total process wastewater generated
by the dielectric materials subcategory.  This analysis  estimates
the total amount of pollutants that would not be discharged  to the
environment if each of the levels of treatment were  applied  on a
subcategory-wide basis.  An analysis of the benefit  versus estimated
subcategory-wide cost for each of the treatment levels will  also be
provided.

Industry-wide Costs

By multiplying the investment and annual costs of each level of
treatment at various flow rates by the number of plants  in each  flow
regime in the industry, a subcategory-wide cost figure is estimated
(Table 7-26).  This figure represents the cost of each treatment
level for the entire dielectric materials subcategory.   This calcu-
lation does not make any allowance for waste treatment that  is
currently in-place at dielectric materials facilities.

Industry-wide Cost and Benefit

Table 7-27 presents the estimate of total cost  to the dielectric
materials subcategory to reduce pollutant discharge.  The calcu-
lations of industry-wide cost we're determined by multiplying
the investment and annual costs for each level of treatment  by  the
number of plants discharging wastewater or potentially discharging
wastewater in the case of dielectric fluid use.  This  table  also
presents the benefit of reduced pollutant discharge  for  the  dielec-
tric materials subcategory resulting from the application of the  two
levels of recommended treatment.  Benefit was calculated by  multiply-
ing the estimated number of liters discharged annually by  the sub-
category times the performance attainable by each of the recommended
treatment systems as shown in Table 7-17.  Table 7-16 presents  the
performance attained by observed treatment of mica  paper wastewaters.
Values are presented for each of the selected subcategory pollu-
tant parameters.

The column "Raw Waste" shows the total  amount of pollutants  that
would be discharged annually to the environment  if  no  treatment
was employed by any facility,in the  industry.   The  columns  "Levels
1 and 2 treatment" show the amount of pollutants  that  would  be
discharged if any one of these  two levels of  treatment were  applied
to the total wastewater estimated  to be discharged  by  the  dielectric
materials subcategory.
                                 VEI-63

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INVESTMENT***

Annual Costs

   Capital Costs
   Depreciation
   Operation & Maint.
   Energy and Power

   Total Annual Costs
           TABLE 7-26

DIELECTRIC MATERIALS SUBCATEGORY
       INDUSTRY-WIDE COST

      Dielectric Fluid Use

         Level 1 Treatment

         $10,317,046.
         $   869,885.6
         $ 2,063,409.1
         $ 1,763,425.8
         	0

         $ 4,696,720.0
Level 2 Treatment

$114,700,000
$  9,670,840.9
$ 22,939,586.
$ 18,437,510.0
   1,172,767.7

$ 52,220,704
***COST ESTIMATES BASED UPON AN ESTIMATE OP 70 PLANTS CURRENTLY USING DIELECTRIC FLUID

                         Mica Paper Dielectric Manufacturing
INVESTMENT*

Annual Costs

   Capital Costs
   Depreciation
   Operation & Maint.
   Energy and Power
   Total Annual Cost
         $444,312**
         $ 37,455.5
         $ 88,862.4
         $216,000.0
         $      0
         $342,317.9
*  DOES NOT INCLUDE COST OF IAND OR LINING (IF NEEDED)
** COST ESTIMATE BASED ON 18 PLANTS CURRENTLY MANUFACTURING MICA PAPER DIELECTRICS
                                     VII-64

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                          SECTION VIII

                ELECTRIC LAMP SUBCATEGORY DISCUSSION
INTRODUCTION

This discussion of the electric lamp industry consists of  the
following major sections:

          Products
          Size of the Industry
          Manufacturing Processes
          Materials
          Water Usage
          Production Normalizing Parameter
          Waste Characterization & Treatment In Place
          Potential Pollutant Parameters
          Applicable Treatment Technologies
          Benefit Analysis

Data contained in this section were obtained from  several  sources.
Engineering visits were made to ten plants within  the  subcategory.
Wastewater samples were collected from  five of these ten
facilities.  A total of thirty-seven electric lamp manufacturing
plants were contacted by  telephone.  A  literature  survey was
also conducted to ascertain differences between types  of electric
lamp products, process chemicals used,  and typical manufacturing
processes.

PRODUCTS

The electric lamp subcategory includes  the manufacture of  incan-
descent, fluorescent, and electric discharge  (other than fluores-
cent) lamps, as well as the manufacture of tungsten filaments  for
use in incandescent and fluorescent lamps.  The major  lamp product
areas are described in accordance with  the manner  in which they
produce radiant energy within the visible  light spectrum.   Because
of the diversity in artificial lighting requirements,  lamps use
a variety of raw materials  for specific applications.  Lamps
are used for general lighting and display, photography and
projection, transportation  lighting, photochemical and photo-
biological processes, as  sources of infrared  and  ultraviolet
electromagnetic radiation,  and as circuit  components  in  electronic
circuitry.
                             VIII-1

-------
 There are two basic types of artificial light production:   incandes-
 cence and luminescence.  The four primary lamp manufacturing pro-
 duct areas fall into these two basic types of artificial light pro-
 duction.  These product areas are:  (1) tungsten filament lamps
 (incandescent), (2) electric discharge lamps other than fluores-
 cent lamps (luminescent), (3) fluorescent lamps (luminsecent), and
 (4) filament manufacture (incandescent and luminescent).

 Incandescent tungsten filament lamps operate on the principle of pas-
 sing an electric current through a conductor, resulting in  the pro-
 duction of heat.  Light is emitted if enough electrical energy is
 supplied to raise the temperature above approximately 500°C.

 There are two types of lamps that produce luminescence:  fluores-
 cent and electric discharge other than fluorescent.  Electric
 discharge lamps produce mainly radiant energy.  A gas discharge
 light source is produced by providing a voltage between a cathode
 and an anode.  Electrons emitted from the cathode surface are
 accelerated by the electric field and collide with gas atoms,
 elevating valence electrons to higher energy states.  After a
 period of time,  the electrons drop to lower energy states,  emit-
 ting photons of light.   The wavelength of these photons is determined
 by the difference between levels occupied by the electrons.

 Fluorescent lamps are electric discharge lamps that utilize a low
 pressure mercury arc in argon.   Through this process,  the lowest
 excited  state of mercury efficiently produces short wave ultra-
 violet radiation at 2537 angstroms.   Phosphor materials commonly
 used such as calcium halophosphate and magnesium tungstate  absorb
 the ultraviolet photons iftto their crystalline structure from which
 they are re-emitted as  visible  white light.

 Based on the  manner in  which  they produce radiant  energy within
 the visible  light spectrum,  the primary lamp numufacturing  product
 areas are as  follows:

           Incandescent  lamps  for use as a light, heat,  or
           infrared  radiation  source.

           Fluorescent lamps which are  specific applications  of
           electric  discharge  lamps  for  use  as a  source  of light.

           Electrical discharge  lamps other  than  fluorescent  lamps
           for use as a  light, heat,  infrared,  or ultraviolet
           radiation  source.

      .     Coiled  tungsten filaments  for use  in incandescent  and
           hot cathode fluorescent lamp  manufacture.

The .electric  lamp subcategory involves  products comprising the
entire SIC 3641, Electric Lamps,  and also includes  portions  of
SIC 3699,  Electrical Equipment  and Supplies,  Not Elsewhere Clas-
sified, for plants that only manufacture coiled tungsten fila-
ments.  The major products of the electric lamp subcategory  are
                            VIII-2

-------
as follows:

          Photographic Incandescent Lamps

          - Photoflash
          - Projection
          - Photo-Enlarger
          - Photoflood

          Large Incandescent Lamps

          - General Lighting
          - Reflector
          - Infrared
          - Traffic and Street
          - Decorative

          Miniature Incandescent Lamps

          - Automotive
          - Flashlight
          - Panel

          Electric Discharge Other  than  Fluorescent

          - Photochemical
          - Photo-biological
          - Indicator Glow
          - Circuit Components
          - Sunlamps
          - High  Intensity General  Lighting

          Fluorescent

          - Hot Cathode
          - Cold  Cathode

          Christmas Tree  Lamps

          Coiled  Tungsten Filaments

 SIZE  OF  THE INDUSTRY

 The size of the  industry  is  defined by the number of plants and
 the number of production  employees  for plants engaged in the manu-
 facture  of electric  lamps,  SIC  3641,  and tungsten filaments, SIC 3699

 Number of Plants

 It is estimated  that  there are  between 125 and 168 plants engaged
                              VIII-3

-------
 in the manufacture of electric lamp products in SIC 3641.
 In addition, a number of these plants also manufacture tungsten
 filaments.  To avoid double counting, plants manufacturing both
 lamps and filaments are counted in SIC 3641.  The number of
 plants is based on the following two sources:

           Department of Commerce 1977 Census of Manufactures
           (Preliminary Statistics).  It is estimated from this
           data base that 168 plants are engaged in the manufacture
           of electric lamp products.

           The 1977 Dun and Bradstreet listing of companies
           whose primary products area is in SIC 3641.   After
           removal of known non-manufacturers of electric lamp
           products, 125 plants are estimated to be involved in
           the manufacture of electric lamp products.

 It is estimated that 9 plants are engaged in the manufacture of
 tungsten  filaments as applicable to the electric lamp  subcategory
 and included in SIC 3699.  These estimates are based on the
 following 2  sources:

      .     Department ;of Commerce 1977 Census of Manufactures
           (Preliminary Statistics).  It is estimated from this
           data base that 9 plants are engaged in the manufacture
           of electric lamp components.   Included in this sub-
           classification are the manufacture of lead-in wires,
           supports, electrodes,  and tungsten filaments.

           Under this  current study, a review of both actual
           plant visits and plant telephone contacts has led
           to an estimate of 9 plants involved in the manu-
           facture  of  electric lamp components.   These  com-
           ponents  include;  filaments,  filament supports,  elec-
           trodes,  and  lead-in wires.

Number of  Employees

It  is estimated that  25,300 production  employees are engaged in
the manufacture of  electric lamps  as  described  under SIC  3641.
This  estimate  is based on information  from the  Department of
Commerce 1977  Census of Manufactures  (Preliminary Statistics).

Plants that  have been  visited during  this  study have from 70 to
400 production employees  each.   These plants  could be  described as
medium to  large size facilities.
                             VIII-4

-------
It is estimated that 1917 production employees are engaged in
the manufacture of tungsten filaments as described under SIC
3699.  This estimate is derived from two facilities contacted
during this study employing 125 and 300 production workers re-
spectively.  These plants are medium to large size facilities.
From the estimate of 9 plants engaged in the manufacture of tung-
sten filaments, together with an average of 213 production em-
ployees for those two plants contacted, it is estimated that 1917
employees are engaged in tungsten filament manufacture.

Production Rate

Production information encompassing nearly all types of electric
lamps and electric lamp components is presented in Table 8-1.
This information was obtained from the Department of Commerce
1977 Census of Manufactures (Preliminary Statistics).

MANUFACTURING PROCESSES

There are two common characteristics of all electric light sour-
ces:  finite lamp life and diminishing luminosity with  lamp age.
Manufacture of all lamp types seeks to optimize the.generation
of light, the efficiency of illumination, and the reliability  (or
lamp-life).  The following description of manufacturing processes
for  the electric lamp products area includes both electric lamp and
electric lamp component manufacture.

Discussion of electric lamp manufacturing is based on  the
primary lamp types:  incandescent, electric discharge  other than
fluorescent, and fluorescent.  Electric lamp component  manufacturing
is restricted to filament manufacturing only.  Other electric
lamp components involve electroplating and other processes not  ap-
plicable to this study.  However, a brief discussion is  included
on lamp base manufacture  (part of the Metal Finishing-  Category)
because of its importance as an electric  lamp component.

Incandescent Lamp Manufacture

Most lamp-making operations are performed by highly  automated
machines generally consisting of  a mount  machine, a  seal  and
exhaust machine/ and a finish machine.  Incandescent lamp manu-
facturing  is a dry process requiring"no process water.   A typical
incandescent lamp manufacturing process is described below and
depicted in Figure 8-1.

The  mount  machine assembles a glass  flare, an  exhaust  tube,  lead-
in wires,  and molybdenum  filament supports.  Tjtie  lead-in wires  are
heat pressed into the glass and  the  components  are  mechanically
constructed forming  a stem assembly.  The coiled  filament is
attached to the lead-in wires and support wires where  applicable.
The  filament is then coated with  a getter solution  which is  an
absorption medium for impurities.  When  the  lamp  is eventually
flashed, the getter  solution  is  activated,  absorbing impurities
and  moisture from the atmosphere  of  the  lamp.   This entire
unit becomes a mount assembly.
                            VIII-5

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                          TABLE 8-1


            PRODUCTS AND PRODUCT CLASSES, QUANTITY
           AND VALUE OP SHIPMENTS BY ALL PRODUCERS
                  OF ELECTRIC LAMP PRODUCTS
                                         Millions
                                         of Lamps
                                      Per Year (1977)
                    Value
                 in Millions
              of Dollars (1977)
SIC  3641
       Photographic  Incandescent
        Lamps

       Large  Incandescent Lamps

       Miniature  Incandescent
        Lamps

       Electric Discharge Lamps

           General  Electric Discharge

           Hot Cathode  Fluorescent

           Cold  Cathode Fluorescent

       Christmas  Tree Lamps

       Other  Lamp Products Not
        Elsewhere Classified
SIC 3699
      Electric Lamp Components- -
        Supports, Filaments,
        Electrodes, Lead-in Wires
2198.4



1720.0

1147.1





 181.6

 295.7

 N/A

  N/A

  N/A





  N/A
307.1



585.7

285.9





123.5

324.4

 53.8*

 N/A

 N/A





173.8
N/A * Not Available                                       ;

  * s This value .denotes cold cathode fluorescent and other  lamp
      products not elsewhere classified.  These categories were
      ^combined to avoid disclosure of individual companies.
                             VIII-6

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   Glass Bulb
       *	
Glass Bulb Coat
   Fuse Mount
     To Bulb
 Glass Tube
     i
 Glass Flare
 Manufacture
                                    1
                              Mount Assembly
                                    1
Filament Coat
                                                Lead Wires,  Filament,
                                                 & Filament Support
     Anneal
       I
  Exaust &
        Gas Fill
       I
    Seal Lamp
Solder Lead Wire
    To Base
 Base Attachment
       1
   Age & Test
        f
      Ship
                       FIGURE  8-1
                INCANDESCENT LAMP MANUFACTURE
                          VIII-7

-------
A  glass  bulb is  electrostatically coated with silica and the
bulb  and mount are connected at the exhaust and seal machine.
The glass bulb is lowered over the mount.  The flared rim of
the mount is then sealed to the neck of the bulb with a natural
gas flame.

The bulb assembly is  annealed,  exhausted, filled with an inert
gas,  and sealed  with  a natural  gas flame.  The inert gas is
usually  a combination of argon  and nitrogen,  which reduces tung-
sten  evaporation and  hence "bulb blackening".  In addition, the
gases allow  higher filament temperature and higher efficiencies
without  sacrificing lamp life.

The finishing  machine solders the lead wires  to the metallic base
which is then  attached by a phenolic resin cement or by a mech-
anical crimping  operation.

The finished lamp is  aged and tested by illuminating it with
excess current for a  period of  time to stabilize its electrical
characteristics.   In  addition,  this process activates the getter
material to  absorb atmospheric  impurities within the glass en-
velope.   This  is  the  last.step  in the production process.

Electric Discharge (Other Than  Fluorescent) Lamp Manufacture

The wavelength spectrum of light from an electric discharge lamp
differs  considerably  from that  of an incandescent filament lamp.
Discharge lamps  concentrate radiation at particular wavelengths
which  are not  continuous.   Incandescent filament lamps produce
light over a wide,  continuous spectrum of wavelengths.

Electric discharge lamps emit different colors of light depending
on the kind  of gas used and its applied pressure.  Gases generally
used  include argon, neon,  xenon,  krypton, and vapors of sodium
and mercury.   Pressures applied may vary from a few microns to hun-
dreds of  atmospheres.   Electrode material usage varies according
to lamp  type,  with the most common being nickel,  tungsten,  and iron.

The efficiency of  a cathode may be improved markedly by the use
of an emissive coating.   This coating reduces the breakdown vol-
tage  and  consequently the  ionization time necessary to produce
a discharge  between the electrodes,  which in  turn is required to
make  the  lamp  glow.   Glass encapsulation can  be a simple glass
envelope, an arc  tube supported inside a glass enclosure control-
ling  the  internal  thermal  condition,  or a quartz  tube where high
temperatures and  pressures can  be maintained.
                            VIII 8

-------
Electric discharge lamps consist of a glass  envelope  or  tube  filled
with an inert gas and contain a set of electrodes  between  which
an arc discharge occurs.  In addition to  the gas atmosphere,  a
metallic vapor or halogen gas may be added  to some discharge  lamps.
In general, the manufacture of these lamps  are dry in their process-
ing operations as they apply to the E&EC  Category.  However,  the
manufacture of quartz mercury vapor lamps employs  a wet  process
at the conclusion of the manufacturing sequence.   A low  volume
of process wastewater is produced from a  hydrofluoric acid clean-
ing bath and a subsequent water rinse.  Wastewater produced contains
primarily fluorides and silica.  This wet process  is  performed on
the exterior of the quartz enclosure.  Because mercury is  confined
to within the finished lamp, it is detected  in the wastewater at
a very low concentration.                                       i

The manufacture of a miniature neon glow  discharge lamp  is des-     '
cribed below and depicted in Figure 8-2.  This manufacturing
process is representative of most other electric discharge lamps
(other than fluorescent) with one exception.  Instead of a con-
ventional lamp base, the lead wires extend  beyond  the lamp and
are attached directly to a power source.

Copper-clad steel lead wires are coated with an emissive mixture  of
barium and strontium carbonate.  The lead wires are placed within
a thin glass tube and the glass is heated and pressed around  the
leads.

The glass envelope is annealed at approximately 1000 °C,  removing  any
moisture present in the envelope.  Radio  frequency waves bombard  the
unit, break down the emissive coating, and  leave barium  oxide on  the
electrode surface.
The final operations consist of exhausting  the  glass
filling it with a neon-argon mixture  before tipping
tube.  This is done .by heating the  end  of the  tube,
away, and producing a pointed tip to  the top of the
electroplated lead wires are cleaned  in an  ammonium
hydrochloric acid solution  followed by  water rinsing
process removes the copper  oxide remnant on the lead
sulting from the annealing  operation.   The  lamps are
in an oven, aged, tested, and shipped.
                                                      envelope and
                                                     off the glass
                                                     drawing it
                                                     lamp.   The
                                                     chloride-
                                                        This
                                                      wires re-
                                                      then  dryed
Production of a neon  glow  discharge  lamp is highly automated and
totally dry  in its processing  operations that are part of the
E & EC Category.  Water  usage  is  restricted to electroplated lead
wire cleaning and subsequent water  rinsing which is part of the
Metal Finishing Category and as such will not be discussed further
in the E & EC Category.
                          VIII-9

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                Glass Tube     Copper-Clad Steel
Denotes Water
  Flow Path
                                Ba-Sr-Carbonate
                                    Coating
                                 Glass &
                                     Lead Hire
                                Press Assembly
                                  Bake  1050°C
                                    RF Wave
                                  Bombardment
                                  Air Exhaust
                                  and Gas Pill
Radioactive
  Dopant
Addition
                                 Lamp Cleaning
                                                      Acid Dump
                                Cold ELO Rinse
                               Aerated  H20 Rinse
                               Aerated H_0 Rinse
                              Aerated H20 Rinse
                                   Oven Dry
                                 Age and lest
                                      r
                                     Ship
                                 FIGURE 8-2

                         ELECTRIC DISCHARGE LAMP MANUFACTORE
                                    VIII-10

-------
Other electric discharge  lamps  such  as  quartz  mercury vapor lamps
are manufactured by a  similar process.   However,  annealing pro-
duces an aesthetically undesirable silica  deposit on the surface
of the quartz tube.  This deposit is removed by a strong hydro-
fluoric acid etching process, which  is  followed by a rinsing step.
However, the volume of wastewater is estimated to be very low
from this process.
                                                           \
Fluorescent Lamp Manufacture

These lamps are electric  discharge lamps used  to produce light.
They are usually in a  long tubular form with an internal coating
of phosphor material.   The discharge passing through the gas
atmosphere generates ultraviolet radiation of  approximately 2537
angstroms.  This radiation is used to excite the'phosphor materials
to emit visible light.

Although the manufacturing processes are similar,  there  are two
types of fluorescent lamps based on  differences in cathode design.

These two types are hot cathode and  cold cathode.   The manufacturing
of a hot cathode fluorescent lamp is described below and depicted
in Figure 8-3.  Hot cathode fluorescent lamps, which operate at 115
volts, utilise a coiled coil or triple  coil tungsten filament.   The
cathode usually receives  an electron emissive  coating -of barium,
strontium, and calcium carbonates.   During operation,  the cathode
is preheated by passing electric current through a starting device.
The hot cathode emits  electrons which flow to  the anode  thus passing
through the mercury vapor.  Cold  cathode  fluorescent lamps, which
operate at high voltages,  utilize a  cylindrical electrode which
may or may not be coated  with an emissive  coating material.  The
iron cathode normally  operates  at 150°C which  is "cold"  compared
to the small hot spot  on  a hot  cathode  type lamp,  which  is at about
900°C.  The cold cathode  lamp starts instantly without a starter,
uses low current, is of small diameter,  and usually is greater than
4 feet in length.  These  lamps  normally outlive hot cathode lamps,
because flashing, dimming,  and  the number  of starts do not affect
cold cathode lamp life as they  do hot cathode  lamps.  Because the
cold cathode manufacture  is primarily an electroplating  operation
performed at a plant other than that which manufactures  electric
lamps, its manufacture is not part of this study but is  included
in the Metal Finishing Category.  In both  hot  and cold cathode
fluorescent lamps, there  is an  inherent negative resistance as
in all electric discharge lamps.  For this reason,  ballasts are
used to control and regulate electric current.
                             VIII-11

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                            Glass Tube

*
SnCl4 Coat
                              Phosphor
                             Application
                           Glass Tube Dry
                             Brush Scrub
                                 or
                             Sponge Wipe
                                Bake
                             Glass Tube
                          Assemble & Seal
                           Air Exhaust  &
                              Gas Pill
                           Base Attachment
                            Silicone Coat
                            Age and Test
                                  t
                                Ship
                                                              Fumes
                                                             Glass Tube
Glass Flare
Manufacture
                                                            Mount Assembly
Denotes Water
  Flow Path
                                      FIGURE 8-3
                                FLUORESCENT LAMP MANUFACTURE
                                         VIII-12

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Hot cathode fluorescent  lamp manufacturing  is  a  highly  automated
process.  Glass tubing is  received  and  rinsed  with  deionized  water.
This removes any remnant dust or  silica material from the  surface
of the tubing.  Some of  the glass tubes receive  a tin chloride
coating for energy saving-low wattage lamps, while  others  bypass
this process and proceed directly to phosphor  application.  The
phosphor coating solution  is a combination  of  phosphors, an organ-
ic binder such as xylol, and often  a lacquer.  The  coating  solu-
tions can be water based or solvent based depending on  the  par-
ticular plant operation.   The coating solutions  are gravity fed
through the tubing and subsequently dried.  The  ends of the tubing
are cleaned by a mechanical brush scrub or  sponge wipe.  This
process may or may not require process  water usage.  The glass
tubing is then baked at  approximately 600°C.

Coiled tungsten filaments  receive an emissive  coating.  They  are
then assembled together  with lead wires, an exhaust tube,  a glass
flare, and a starting device to produce a mount  assembly.   The
mount assemblies are heat  pressed to the two ends of the glass
tubing.  The glass tubes are exhausted,  filled with an  inert  gas,
usually argon, and a drop  of mercury is added.   The lead wires
are soldered to the base,  and the base  is attached  to the  tube
ends, usually with a phenolic resin cement.

The finished lamp receives a silicone coating  solution  to  prevent
the lamp' from arcing.  The silicone coating solution may or
may not be discharged depending on  the  particular plant opera-
tion.  The lamp is then  aged and  tested, before  shipment.

Filament Manufacture

The filament is the most important  component of  all incandescent
lamps.  It is also an integral component of hot  cathode fluorescent
lamps.  Tungsten is the  preferred material  for filament usage
because it combines a very high melting point  of 3380°C with  a
relatively slow and consistent rate of  evaporation.  Filament.de-
sign is a balance between  light output  and  filament life..   The
higher the filament temperature,  the more light  is  emitted  and
the shorter the filament life.

Pure tungsten metal is prepared in  powder form,  pressed--into  ingot
bars, strengthened in an electric furnace,  and sintered.  The bars
of tungsten are then swaged and drawn to wire  as small  as  0.00114
centimeters in diameter.   Tungsten  filaments have a tensile strength
several times that of steel.  Tungsten  filament  manufacture is
described below and depicted in Figure  8-4.           -       a

Filament manufacture begins with  inspection of the  tungsten wire. 4
The wire is then wound on  mandrels  of molybdenum, steel, or copper-
clad steel.  Coiled filaments wound on  molybdenum are of the:, high-
est quality.  These filaments are usually used in hot cathode
                            VIII-13

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                                            Tungsten Wire
                                            Filament Coil
                                               Anneal
                                               Re-Coil
                                              Re-Anneal
           T
  Molybdenum Mandrel
     Dissolution
Copper-Clad Steel Mandrel


            t
Steel Mandrel
       HN03-H2S04

      Dissolution
     HCL

 Dissolution
        Rinse
          Rinse
                                                                                      Rinse
    Neutralization
                                          HCL Dissolution
                                            Neutralization
        Rinse
                                                Rinse
                                                Rinse
      Acid Clean
     Neutralization
  Acid  Clean
        Rinse
         Rinse
                                                                                      Rinse
     Alcohol Dip
       Acid Clean
                                                 Dry
         Dry
         Rinse
                                               'Dry
Denotes Water
  Flow Path
                                           FIGURE 8-4


                                    TUNGSTEN FILAMENT MANUFACTURE

                                              VIII-14

-------
fluorescent lamps and  in  automated,  high  speed,  incandescent lamp
manufacturing.  Filaments wound  on  copper-clad  steel  mandrels are
required when  the filament  cannot tolerate  iron poisoning.   These
filaments are  most commonly found in incandescent  lamps.   Fila-
ments for lower quality applications are  wound  on  plain  steel man-
drels and are  usually  used  in  incandescent  lamps as well.

The coiled filaments are  annealed,  re-coiled, re-annealed,  and
sent to mandrel dissolution.   Coiling of  filaments improves effi-
ciency by improving heat  concentration.   In addition,  coiling of
filaments reduces the  linear length requirement compared  to un-
coiled filaments, permitting use of fewer filament supports which
conduct heat from the  filament.

In all cases,  molybdenum  mandrels are dissolved in nitric  acid-
sulfuric acid  solutions and water rinsed. Most  plants  follow this
mandrel dissolution with  a  neutralization in sodium hydroxide.  At
one of the visited plants,  an  ammonia-water solution  was  used in
place of sodium hydroxide.  Neutralization  removes any excess acid
remaining on the coiled filaments and prevents  further etching of
the tungsten.  Another plant eliminated neutralization by  extensive
centrifugal water rinsing.                                  	

The coiled filaments then receive a nitric  acid or nitric  acid-
sulfuric acid  cleaning followed  by  an alcohol dip  in  methanol
or isopropanol.  The same plant  not only  eliminated neutralization
but also eliminated the alcohol  dip by using a  high speed,  centrifugal
drying process.  Prevention of water spotting on the  filaments is
always important.

Steel and copper-clad  steel mandrel  dissolution processes  are very
similar.  Copper-clad  steel mandrels,  however,  receive a prelimin-
ary nitric acid-sulfuric  acid  mandrel dissolution  to  dissolve the
copper plated  material that would otherwise require a  substantial
length of time in a hydrochloric acid solution.  In addition, this
step reduces tungsten  removal  which occurs  with protracted  exposure
to hydrochloric acid.

Both steel and copper-clad  steel mandrels are dissolved  in
hydrochloric acid followed  by  sodium hydroxide  or,  in  one  in-
stance, trisodium phosphate neutralization.  The coils then
generally receive an acid cleaning  in hydrochloric acid  and are
dried centrifugally or under hot lamps.   One plant used  sulfuric
acid-chromic acid cleaning  followed by a  methanol  dip  and  finally
hot lamp drying.  With the  exception of the alcohol dip, water
rinsing follows each of the mandrel  dissolution, neutralization,
and cleaning processes.   The completed coiled filaments  are then
sent to incandescent and  fluorescent lamp manufacturing.
                             VIII-15

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Lamp Base Manufacture

Lamp bases are pressed from sheet metal using a  lubricant oil.
Materials commonly used  include brass, stainless  steel,  aluminum,
and nickel-iron alloys.  The lamp bases then receive a detergent
cleaning to remove the lubricant oil.  The bases  are bright dipped,
dried•, and sent to lamp  manufacturing facilities  to become part of
the final lamp product.  Lamp base manufacture is  covered by  the
Metal Finishing Category.

MATERIALS

Materials used in the manufacture of lamps can be  classified  as
raw materials and process materials.  Raw materials include:
encapsulating materials, light emitting materials, mount materials,
filling gases, glass coatings, and lamp bases.   Process  materials
include mandrels for filament manufacturing and  cleaning solutions
for lamp manufacturing.

Encapsulating Materials

These materials are used to enclose the lamp components  and provide
an environment in which  to create light.

          Lime-Soda Glass - A soft glass used for  the bulbs
          of almost all  incandescent lamps and for general use
          in electric discharge and fluorescent  lamps.

     .    Borosilicate Glass - A hard glass used  for lamps that
          produce high temperatures, such as projection  lamps.
          The low thermal expansion of this glass  makes  it
          suitable for use in lamps that receive  changing
          temperatures as well, such as sealed beam lamps.

     .    Fused Silica - At extreme temperatures  and pressures
          such as 1000°C and 10 atmospheres, fused silica (quartz)
          is the best material for lamp construction because
          of its structural strength.  Arc tubes  of high pres-
          sure mercury and sodium lamps necessitate the  use
          of quartz enclosures.

          Glass Tubes -  Primarily a type of lime-soda glass
          used in fluorescent, miniature, incandescent,  and
          electric discharge lamps.

Light Emitting Materials

These materials vary considerably and are important because the
lamp characteristics are determined by the light  emitting materials.
                            VIII-16

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           Filaments - Used in incandescent and hot cathode
           fluorescent lamps.   Materials include: platinum,
           osmium,  tantalum,  tungsten,  and carbon.  Tungsten
           filaments are the  most commonly used because they
           can  be  operated at  higher temperatures than the
           others,  while still giving long life without ex-
           cessive  blackening  of the bulb or tube.

           Electrodes - Structures that provide a continual supply
           of electrons to the gas atmosphere of electric dis-
           charge  and cold cathode fluorescent lamps.   Tungsten,
           thoriated tungsten, and nickel are used in  electric
           discharge lamps.  Cold cathode fluorescent  lamps
           employ  a cylindrical electrode of iron.

           Emissive Coatings - These materials are usually alka-
           line earth oxides,  such as barium, strontium,  and cal-
           cium carbonates.  Often getters of pure barium or zir-
           conium  are included.  The emissive coatings allow
           cathodes to operate at muchvlower temperatures, thus
           increasing their efficiency.   Getters are used ,to re-
           move atmospheric contaminants within the environment
           of the  encapsulator.  In particular, emissive  coated
           cathodes are very susceptible to contaminants, and
           getter  solutions very often  are used in lamps  with
           emissive coated cathodes.

           Phosphors - These are solid  luminescent materials
           used in  fluorescent lamps and mercury lamps.
           Visible  light is produced by excitation of  the
           phosphor materials  by ultraviolet radiation from
           mercury  vapor.  Phosphor materials most commonly
           used include:  calcium halophosphates,  cadmium  and
           zinc sulfides,  fluorides,  silicates, borates,  tungstates
           and aluminates  of the alkaline earth metals such as
           barium,  strontium,  calcium,  magnesium,  and  beryllium.
           In addition,  activator ions  and organic binders are
           necessary in combination with the phosphor  materials.
           The common activator ions include:  manganese,  tin,
           lead, copper,  and antimony.   A common organic  binder
           is xylol.

Mount Materials

These consist of a stem press containing the lead wires  and
electrodes for* electric gas discharge  lamps and  the lead wires,
filaments, and filament supports in hot cathode  fluorescent and
incandescent lamps.
                             VIII-17

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      .    Lead Oxide Glass  -  Glass  containing approximately
          30% lead oxide  is used  as the  stem press assembly.   This
          glass contains  the  lead wires  and  is used because of
          its high electrical resistivity.

          Lead Wires - These  deliver the electric current to
          the light emitting  source.   A  typical lead wire from
          an incandescent lamp consists  of  the following:  a
          nickel  section  that supports the  filament, a dumet
          (dual-metal) section of a copper-clad,  nickel-iron
          alloy formed in the stem  press and matching the
          thermal expansion of glass,  a  nickel fuse hermetically
          sealed within, the glass,  and finally the copper lead
          which is soldered to the  contacts  of the lamp base.

      .    Filament Support  -  A molybdenum section supporting the
          tungsten filament to the  lead  wires and preventing
          excess vibration, which prolongs  the life of the filament,

      .    Starting Devices  -  These  are control mechanisms neces-
          sary to heat the  cathodes and  provide voltage to start
          a discharge in  hot  cathode fluorescent lamps.  A set of
          metallic electrodes is  commonly used in conjunction with
          a ballast that  limits the current  through the lamp.

Filling Gases

The type of gas and its applied pressure determine the spectral
emission of the radiant energy generated.

      .    Inert Gases - Gases of  argon,  neon, nitrogen, helium,
          krypton, and xenon  are  most  commonly used.  Gases are
          used in incandescent lamps to  suppress tungsten filament
          evaporation.  Gas is used in an electric discharge lamp
          to reduce the starting  voltage necessary to establish
          a discharge.

      .    Metallic Vapors - Many  electric discharge lamps use
          inert gases to  reduce the starting voltage.  These
          trigger the metallic vapors  such  as mercury and sodium
          that actually sustain this arc.

Glass Coatings

These materials enhance the quality of light from a lamp.

      .    Silica and Titania  (titanium dioxide) - Fine particu-
          late coatings are often used in incandescent lamps to
          "frost" the glass.   This  coating  reduces glare and
          increases the diffusion of light.
                            VIII-18

-------
            no        * -.TransParent  coatings  on  the  inside  and
           outside of the lamps  that produce  light  of various  colors

           Reflector Coatings -  Found usually in incandescent  lamps
           such as the parabolic reflector  lamps.   Coatings  of
           aluminum and silver are frequently used.

           Ceramic Coating - Pigments fused into the glass.  These
           provide permanence to the coated material.

           Tin Chloride - Used in low wattage-energy saving  lamps.
           The metallic coating  enhances electrical conductivity.

           Silicone Coat - An external coating to a finished lamp
           which prevents arcing from occurring  in  the presence
           of high humidity.

 Lamp Bases

 These are essential in securing a lamp to a  lighting fixture  and
 as an aid in transferring electric current from a power source
 to the electrodes within the lamp.  Lamp bases are commonly made
 of tin,  brass,  or plastic materials.

           Phenolic Resin Cement - Most lamps employ this
           material to attach the base to the lamp.

           Mechanical  Crimp - Some lamps of extremely high
           temperatures  use this technique to insure that the
           lamp  base  stays  securely fastened to the  lamp.

 Mandrels

 Tungsten  wire is  wound  on  mandrels of  molybdenum, steel, and
 copper-clad  steel.  The  mandrels are then removed by strong
 solutions  of hydrochloric  acid,  nitric  acid,  and sulfuric acid.

 Cleaning Solutions

Ammonium chloride  and hydrochloric acid are used to remove
copper oxide from  the lead wires on  miniature glow  lamps.   Quartz
lamps often have  silica  deposits on  the lamp  surface  from an
annealing  operation.  Hydrofluoric acid is  commonly employed to
remove this aesthetically undesirable material.

WATER USAGE

From the Department of Commerce  1972 Census of Manufactures,
gross water usage  is estimated to  be 13.6 billion liters/day for
the electric lamp products industry  as  described under  SIC 3641.
                        VIII-19

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Process water is approximately 6 percent of the gross or 816
million liters/day.  It is also estimated that 42 percent or 5.7
billion liters/day of the gross water usage is discharged.  No
estimates could be found of water usage within the  tungsten
filament manufacturing industry as described under  SIC  3699.
Observation of process operations at plants manufacturing electric
lamps and tungsten filaments revealed large differences in water
usage rates  from plant to plant.

Of the 5.7 billion liters/day of discharged water  from  electric
lamp manufacturing,  it is estimated that 7 percent  or 400 million
liters/day of the total discharged water is treated.  Treatment
technologies observed' at visited plants manufacturing electric
lamps, SIC 3641, and tungsten filaments, SIC 3699,  are  summarized
in Table 8-2.

PRODUCTION NORMALIZING PARAMETERS

Production normalizing parameters are used  to  relate  the pollu-
tant mass discharge  to the production level of a plant. Regu-
lations expressed  in terms of this production  normalizing parameter
are multiplied by  the value  of  this parameter  at each plant  to
determine the allowable pollutant mass  that can be discharged.
However, the following problems arise in defining  meaningful
production normalizing parameters for electric lamps:

          Size,  complexity and  other product  attributes affect
          the amount of pollution generated during manufacture
          of a unit.

          Differences  in manufacturing  processes  for the same
          product  result  in  differing amounts  of pollution.

          Lack of  applicable production records  may impede
          determination of production rates in terms of de-
          sired  normalizing  parameters.

Several  broad strategies  have been  developed  to  analyze applicable
production normalizing  parameters.   They are  as  follows:

          The process  approach  - In this approach, the pro-
          duction normalizing parameter is a direct measure of
          the production  rate for each  wastewater producing
          manufacturing operation.   These parameters may be
          expressed as  sq.  m. processed per hour,  kg.  of pro-
          duct  processed  per hour,  etc.  This approach requires
          knowledge of all the  wet processes used by a plant
          because the  allowable pollutant discharge rates for
          each  process are added to determine the allowable
          pollutant discharge rate for the plant.   Regulations
          based on the production normalizing parameter are
          multiplied by the value of the parameter for each
          process to determine allowable discharge rates from
           each  wastewater producing process.
                              VIII-20

-------
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-------
          Concentration limit/flow guidance - This strategy
          limits effluent concentration.  It can be applied
          to an entire plant or to individual processes.  To
          avoid compliance by dilution, concentration limits
          are accompanied by flow guidelines.  The flow guide-
          lines, in turn, are expressed in terms of the pro-
          duction normalizing parameter to relate flow dis-
          charge to the production rate at the plant.

The electric lamp subcategory will be subdivided into two areas
for discussion of production normalizing parameters: electric
lamp manufacture and filament manufacture.  Because the manufac-
ture of these products differs considerably, each product has
its own production normalizing parameter.

Electric Lamp Manufacture

Fluorescent lamps and, to a limited  extent, other electric dis-
charge lamps use wet manufacturing processes requiring an ef-
fluent mass discharge limitation.  Potential candidates for pro-
duction normalizing parameters include: surface  area of product
processed, number of lamps processed, and amount of raw materials
consumed.  It has been determined that  surface area of product
processed is more closely associated with pollutant discharge  than
are the other potential parameters.

Area Processed - There is a direct relationship  between the sur-
face area processed and pollutant load  generated.  Wet processes
consisting of glass tube rinse,  tin  chloride coat, phosphor appli-
cation and silicone coat are all directly applied  to  the  glass
tube surface.  Thus, there  is  a  correlation  between  the surface
area processed and the pollutant discharge  from  wet processes.

Fluorescent lamp surface area  is easily calculated knowing  the
number of each glass tube size processed.   Most  fluorescent  lamps
are produced  in standard sizes for which  length  and  diameter  are
known.  The number of  lamps of each  type  produced  is  readily  avail-
able from production records.  Thus  the pollutant  load  generated
can be related directly  to  the total calculated  surface  area  pro-
cessed.

Some electric  discharge  lamps, namely mercury  lamps  with  quartz
envelopes which were manufactured  at one  plant that  was  visited,
use a wet process  that is directly  related  to  surface area pro-
cessed.  Finished  lamps  are given  a  hydrofluoric acid etch to
remove surface silica  deposits on  the lamp.   The entire  lamp is
submerged  in  the  acid  bath.   Lamp  surface area is  a known con-
stant for  each product type.   Knowing the surface  area per lamp
type and  the  production  rate  in  terms of the number of each type
of  lamp produced  yields  total  surface area  processed.
                              VIII-22

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  Number of  Lamps  Processed - This is the most readily available
  Rn?   So-" param*Jer obtainaKBB**rom lamf* manufacturing facilities.
  But,  because  of  the  variety of lamp sizes manufactured! the num-
  ber of lamps  produced cannot stand alone as a production related
  ?S£Jme!:e!:*i However'  in conjuction with the size of each lamp
  SoduoMon pr°C*ssed area is easily obtained and is a meaningful
  production normalizing parameter.
 f!^"5.^ RtW "aterials  Consumed  - All  fluorescent lamp manu-
 facturing planes  contacted  and" isited  use  similar raw materials
 a?di-?f°£:SS ch®mi?als-   Differences in  lamp manufacturing varies
 little from a basic  sequence  of process operations.   The unique
 feature of each plant's  manufacturing processes  is the phosphor
 sofuMon f°Hmulation' tin chloride  coating,  and silicone coating
 solution. Since most plants maintain that these  formulations,
 particularly phosphor coatings, are proprietary,  information
 regarding their composition and consumption is unobtainable
 Hence, raw material and  process chemical usage is  unavailable
 for use as a basis for effluent discharge limitations.

 Filament Manufacture

 Potential candidates for filament manufacturing production nor-
 malizing parameters include:  weight of mandrel dissolved? num-
 ber of filaments processed,  weight  of filaments processed, and
 amount of process chemicals  consumed.  The  weight  of mandrel
 dissolved is  the best production related parameter because of
 its close association with the mass of discharged  pollutants.


 Weight of Mandrel  Dissolved  - Coiled tungsten filaments are wound
 on  particular  types of  mandrels in accordance with their specific
 use in incandescent and  fluorescent lamps.   Filaments for differ-
 ent applications are wound on mandrels  made  of molybdenum, steel
 ??i f™PP?r~Clad "fteel.   Coiled, coiled-coil,  and triple coil tungsten
 filaments  are  all  wound  initially  on primary mandrels that are
 eventually dissolved in  strong acid. After  initial coiling,  fila-
 ments  to  become  coiled-coil  and triple  coil  filaments are re-
 wound  on  secondary mandrels  that do not  accompany the filament to
 iSllJ w?i££1Uti;n;i Inst*ad' these secondary mandrels are mechan-
 ically withdrawn following an  annealing  process.

 There  is a de terminable  length of  primary mandrel per unit lenqth
 Sf^i16*3!.?"198^11 filament-   In addition, each filament type
 dictates the mandrel material  needed, and the diameter of the  man-
 ArS dljta^e? fche  size of coiling.   The  length, diameter,  and  man-
 drel material used  result in a mandrel weight per filament type.
 Since pollution  from filament  manufacture results  directly from
mandrel dissolution, the  weight of  mandrel dissolved  becomes  the
                                parameter for Determining effluent
                              VIII-23

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Number of Filaments Processed - Because filament types vary with
mandrel material and diameter, there is no direct relationship
between number of filaments produced and  the pollutant mass dis-
charged.  The number of coiled filaments  of each type can  be
used, however, in calculating the  total number of mandrels used.
This can be used to calculate the  total weight of mandrel  dis-
solved per number of coiled filaments produced.  However,  the
weight of mandrel material used can be obtained more directly
from purchasing records.

Weight of Filament Processed - This production parameter  is not
applicable becausedifferent coiled filament  types may have a
different number of coiled turns per length of mandrel used.
This results  in filament  weights that are independent of  mandrel
size and weight.  Thus, there can  be varying  filament weights  for
the same size and type  of mandrel  and varying  filament weights  for
the same pollutant mass discharge. Therefore,  there  is  a
characteristic pollutant  discharge relative  to  the  type  and
diameter of mandrel material  that  is not  related  to  the  weight
of filament processed.

Amounts of Process CheriFicals  Consumed  -  Different mandrel materials
require dissolution processes  that employ various types  of acids
at varying concentrations and  consumption rates.   This  results
in a non-uniform  pollutant  discharge  characteristic which
discounts  this parameter  as  a basis for  effluent discharge
limitations.

Summary of Production Normalizing  Parameters^

In  summary,  the  production normalizing.parameters for the elec-
tric  lamp  subcategory are as follows:
      Product

 Fluorescent Lamps

 Quartz envelope
   mercury discharge
   lamps

 Filament Manufac-
   ture
Production Normalizing
	Parameter	

glass tube surface area

envelope surface area
weight of mandrel  dis-
  solved
  Units
 of Mass
Discharge

  mg/sq m

  mg/sq m



  mg/kg
 WASTE CHARACTERIZATION AND TREATMENT  IN  PLACE

 This section presents the sources  of  waste  in  the  electric
 lamp subcategory and sampling  results for this wastewater.   The
 in-place waste  treatment systems are  discussed and treated
 effluent sample data from these systems  presented.
                             VIII-24

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 Process Descriptions and Water Use

 There are eight wet processes used by the electric lamp industry.
 These wet processes are:

    Glass Tube Rinse
    Tin Chloride Scrubber
    Sulfur Dioxide Scrubber
    Glass Tube Brush Scrub or Sponge Wipe
    Silicone Coating
    Quartz Envelope Cleaning and Subsequent Water Rinsing
 .   Mandrel Dissolution,  Filament Neutralization, Acid Cleaning,
    and Subsequent Water  Rinsing
    Lead Wire Cleaning

 Of  these wet processes,  only seven are unique to the electric
 lamp  industry,  because lead wire cleaning is covered in the Metal
 Finishing Category.

 Wastewater producing processes depend upon product type, pro-
 duction rate,  and size of facility,  as well as on the variation
 in  technological  advancement and degree of automation.   The
 electric lamp  manufacturing processes that use water in their
 operations are  described below..

 There  are four  electric  lamp product areas.   Three of the  product
 areas  consist  of  electric lamp types and include:   incandescent,
 electric discharge  other than fluorescent, and fluorescent lamps.
 The fourth product  area  is  tungsten  filament manufacture.   In-
 candescent lamp manufacture is a dry process.   In general,  elec-
 tric discharge  lamp  manufacture  of other than fluorescent  lamps
 also requires  no  process water usage.   However,  there are  a few
 low volume cleaning  operations of quartz envelopes that encapsu-
 late mercury vapor  lamps.   Fluorescent lamp  manufacture utilizes
wet processes which  include:  glass tube  rinse,  tin chloride
scrubber,  sulfur  dioxide scrubber, glass tube  brush scrubbing,
and silicone coating.  Tungsten  filament manufacture  uses  process
water  for  rinsing after  mandrel  dissolution,  filament neutralization,
and acid  cleaning,  in addition to wet  air scrubbing.

Table  8-3  presents product  type,  wastewater  producing processes,
volume of  water used, and number of  production  employees for  those
plants visited within the industry.  Process  descriptions  for
each of  those manufacturing  operations requiring  water  usage  are
presented  in the  following  subsections.

Glass Tube Rinse - This  process  is associated with  fluorescent
lamp manufacturing.  Glass  tubing  in straight  length  and circu-
lar forms  is rinsed  to remove  any  excess  dust or  silica  impuri-
ties from  the surface of  the glass.  These impurities may weaken
the bond of phosphors to  the wall  of the  glass  tube.
                               VIII-25

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The visited plants  use hot deionized water  spray  rinses.  Glass
tubing  is held  in a vertical position  by  a  spring-clip  mechanism
and sent through an automated  spray rinse.  The rinse water  is
sprayed down through  the  tubing  and collected  in  a  holding basin
below.  At Plant 33189, all rinse water is  deionized and  returned
to the  spray rinse  at a flow rate of 36,336 I/day (9,600  gpd).
At Plant 28126  rinse  water is  discharged  to a  storm sewer which
flows to a nearby creek at a flow rate of 3,789 I/day  (1,000  gpd).

Plant 19121 employs a similar  automated hot water spray rinse.
The glass tubing, however, is  held in  a vertical  position by  a
rack assembly from  above  and below.  In the subsequent  phosphor
application process,  phosphor  coating  solution is gravity fed
through the tubing  and collected in a  holding  basin below.
As a result, the lower rack also receives the  water-based phosphor
coating.  This  coating is removed from the  rack when the  rack
returns to the  glass  tube rinsing process.  The rinse water  is
sprayed down through  the  glass tubing, cleaning the glass of
dust and silica and the racks  of phosphor coating material.   The
rinse water flows to  a 2,044 liter (540 gallon) settling  tank,
the phosphors are recovered, and the remaining wastewater flows
to the sanitary sewer at  a rate  of 93,141 I/day (24,608 gpd).
Plant 19121 uses much more water than  the other two plants pre-
viously discussed because a larger volume of rinse  water  is re-
quired to remove and  recover phosphor  materials from the  racks
that contain the glass tubes.

Tin Chloride Wet Scrubber - Energy saving fluorescent lamps re-
ceive a tin chloride  coating prior to  phosphor application and
after glass tube rinsing.  The tin chloride solution is applied
as a spray coating  and is continually  recirculated  through a
holding basin.  At  Plant  19121,  the tin chloride  vapors are ex-
hausted through a wet air scrubber.  Scrubber  water is  sent to
pH adjustment at a  flow rate of  29,069 I/day (7,680 gpd)  before
being discharged to the sanitary sewer.

Plant 33189, using  a  similar coating process,  has very  little
process water discharge.  Wastewater from the  wet air scrubber
is sent to a pH adjustment tank  at a flow rate of 163,512 I/day
(43,200 gpd).   The  pH is  adjusted with sodium  hydroxide to a
level of 10-12, precipitating  tin hydroxide out of  solution.  The
decant is recirculated back to the wet air  scrubber, and  the
settled material is contractor removed weekly.  In  addition,
weekly maintenance  of this system discharges approximately 379
liters  (100 gallons)  or less of  wastewater  to  a municipal treat-
ment system.
                            VIII-27

-------
Sulfur Dioxide Scrubber - Sulfur dioxide is used as a lubricant
in the automated process of glass flare manufacturing.  A glass
flare seals the mount assembly to the inner rim of the glass
tubing.  A small diameter glass tube is heated with a natural
gas flame and lubricated with small quantities of sulfur dioxide
introduced in the gas flame.  The tube is then slowly forced
over a die, forming a funnel-shaped glass flare.  Two visited
plants use such a small amount of sulfur dioxide that no wet
air scrubber is required.

However, a third facility, Plant 19121, uses sulfur dioxide in
quantities necessitating a wet air scrubber.  The sulfur dioxide
fumes are exhausted through the scrubber and the wastewater flows
to a pH adjustment tank before being discharged to a municipal
treatment system.  Approximately 36,336 I/day (9,600 gpd) of
water are used by this facility in the manufacturing of glass
flares.  Because this fume scrubbing process of .glass flare
manufacturing is believed to occur only at this plant, no
effluent discharge limitation is recommended for this process.

Glass Tube Brush Scrub and Sponge Wipe - All plants that were
visited during this study that manufacture fluorescent lamps
employ a highly automated phosphor application process in which
the phosphor materials are prepared as solvent-based or water-
based solutions.  Both types of phosphor coating solutions are
gravity fed through glass tubes held in a vertical position.  As
the coating materials drip off the lower end of the tube, phos-
phors accumulate around the inner and outer rim of the tube.
After the phosphors are dried, but prior to baking, the lower ends
of the glass tubes are brush scrubbed or sponge wiped to remove
the excess phosphor material.  One plant applies a solvent
based phosphor coating and uses a dry mechanical brush scrub.
Because of its solvent base, the dried phosphor is very hard and
can be removed only by an abrasive brush scrub.  As the material
is removed, the hardened pieces fall into a series of pans.  The
removed phosphors are dissolved in a solvent and sent to the
phosphor application area for reuse.

Two plants were visited in which water based phosphor coatings
are applied.  At Plant 19121, the phosphor material is removed
by a dry mechanical brush scrub as a fine dust, which is removed
by a vacuum exhaust dust collector.  The other facility, Plant
33189, utilizes a water based phosphor application and employs
a mechanical sponge wipe accompanied by a water spray rinse.
The rinse dissolves the phosphors, which drop into a settling
tank, below.  The phosphors are recovered by gravitational settling,
and the water is recycled.  This plant has achieved zero discharge.
All water is recirculated at a rate of 1817 I/day  (480 gpd).
                           VIII-28

-------
 Process  operations  for  glass  tube  brush scrubbing or sponge
 wiping are  either dry or  use  a low water rinse flow rate.   At
 the  plant using  a wet process, zero discharge has been achieved
 through  settling and  total  recycle.

 Silicone Coat  -  All fluorescent lamps  receive a final silicone
 coating  prior  to being  aged and tested.   This coating is  applied
 to the outer surface of the finished lamp as  a dip coat or as a
 roll coat.  At two  of the visited  plants the  silicone coating
 solution is never discharged.   Solution is added to make  up
 the  amount  consumed in  the  coating operation.

 Plant 33189 discharges  76 I/month  of silicone coating solution
 from roll coating.  This  is done to clean the coating solution
 trough of any  particulate matter that  may have fallen into the
 solution or been dragged  in by the lamp itself.

 Plant 19121 employs a dip coating  operation in which the  lamp
 travels  along  a  conveyor  and  through the coating solution.   In
 this process the coating  solution  is continually added to  the
 coating  basin  and overflows at a rate  of 242  I/day (64 gpd).

 Quartz Envelope  Lamp Cleaning  - Cleaning of quartz envelope
 mercury  discharge lamps was observed at only  one facility,
 Plant 28086.   During an annealing  process, silica deposits
 develop  on  the surface  of the  quartz tube.  The  lamps are  dipped
 into a 70% hydrofluoric acid bath  to remove the  undesirable de-
 posits.  Several rinses follow the acid bath.

 This  is  a relatively low  volume operation in  which the rinse
 wastewater contains primarily  silica and fluorides at a flow
 rate  of  1817 I/day  (480 gpd).   At  this  particular facility,  the
 process  water  flow  rate is  independent  of production rate  be-
 cause the rinses continually overflow  regardless of the number
 of lamps cleaned.   Rinse  water flow rates can be controlled
 and  reduced significantly by not allowing the rinses to con-
 tinuously overflow  during periods  of lamp cleaning inactivity.

 Mandrel  Dissolution - Coiled tungsten  filaments,  wound on  mandrels
 of molybdenum, steel, and copper-clad  steel,  are dissolved  in
 very  strong solutions of  sulfuric-nitric acid or hydrochloric
 acid.  Mandrel dissolution  is  usually  a manual operation which
 commonly occurs  in  small  (57-76 liter)  tanks  or  in 2 liter  bea-
 kers.  Frequently,  mandrel  dissolution  is followed by a canister
 dip  to insure no further  acid  etching of the  tungsten filament.
 In addition, one plant, 28086,  uses a centrifuge for molybdenum
mandrel  dissolution processes.   All filament  manufacturing
 employs wet mandrel dissolution processes.  Most process water
 is used  for rinsing after dissolution,  filament  neutralization,
 cleaning processes, and for wet air scrubbing of acid fumes.
With  the exception  of one plant employing metal  recovery,  all
plants pH adjusted  their  raw wastewater  before discharging  to a
municipal treatment system.
                           VIII-29

-------
Total process water usage for rinsing and wet  air  scrubbing  at
visited plants ranges from 11,567 I/day  (3,056 gpd)  to  127,055
I/day (33,568 gpd), depending mainly upon the  number of scrubbers
per plant, the efficiency of each scrubber, and  the  size of  the
mandrel dissolution process.  Plant 33202 uses the most process
water.  It employs an automated system,  has a  high production
rate, and has several wet air scrubbers  discharging  water.
Plant 28077 uses the least process water, employs  a  manual
operation, has a lower production rate,  and has  one  wet air
scrubber discharging water.

Wastewater Analysis Data

Wet processes from electric lamp manufacturing processes were
sampled at five facilities.  Samples were analyzed for  parameters
identified on the list of 129 toxic pollutants,  non-toxic pol-
lutant metals, and other pollutant parameters  presented in
Table 8-4.

Tables 8-5 through 8-9 present analysis  data of  process waste-
waters and final discharged effluents for those  plants  sampled
within the electric lamp subcategory.  This table  presents pollu-
tant parameters, concentrations, and mass loadings of the processes
sampled.  Pollutant parameters are grouped according to toxic
pollutant organics, toxic pollutant metals, non-toxic pollutant
metals, and other pollutant parameters.  Summation of pollutant
concentrations greater than the minimum  detectable limit is  pre-
sented as well as mass loadings of those pollutant parameters
whose concentrations were measurable.  Mass loadings were derived
by multiplying concentration by the flow rate  and  the hours  per
day that a particular process is operated.  Some entries were
left blank for one of the following reasons:   the  parameter  was
not detected; the concentration used for the kg/day  calculation
is less than the lower quantifiable limits or  not  quantifiable.
The kg/day is not included in totals for calcium,  magnesium, and
sodium.'  The kg/day is not applicable to pH.   Totals do not  in-
clude values preceded by "less than".

Toxic pollutant organics, toxic pollutant metals,  and non-toxic
pollutant metals were detected at measurable levels  as  well  as
at levels below the quantitative limit.  Other pollutant para-
meters are all reported in measurable quantities.  The  following
conventions were followed in presenting  the data.

     Trace Levels - Pollutants detected  at levels  too low to
     be quantitatively measured are reported as  the  value
     preceded by a less than sign (<).   All other  pollutants
     are reported as the measured value.
                            VHI-30

-------
                                             TABLE 8-4
                                   POLLUTANT PARAMETERS ANALYZED
TOXIC POLLUTANT ORGANICS

 1.  Acenaphthene                               46.
 2.  Acrolein                                   47.
 3.  Acrylonitrile                              48.
 4.  Benzene                                    49.
 5.  Benzidine                                  50.
 6.  Carton Tetrachloride(Tetrachloromethane)   51.
 7.  Chlorobenzene                              52.
 8.  1,2,4-Trichlorobenzene                     53.
 9.  Hexachlorobenzene                          54.
10.  1,2-Dichlorethane                          55.
11.  1,1,1-Trichloroethene                      56.
12.  Hexachloroethane                           57.
13.  1,1-Dichloroethane                         58.
14.  1,1,2-Trichloroethane                      59.
15.  1,1,2,2-Tetrachloroethane                  60.
16.  Chloroethane                               61.
17.  Bis(Chloromethyl)Ether                     62.
18.  Bis(2-Oiloroethyl)Ether                    63.
19.  2-Chloroethyl Vinyl Ether(Mixed)           64.
20.  2-Chloronaphthalene                        65.
21.  2,4,6-Trichlorophenol                      66.
22.  Parachlorometa Cresol                      67.
23.  Ghloroform(Trichloromethane)               68.
24.  2-Chlorophenol                             69.
25.  1,2-Dichlorobenzene                        70.
26.  1,3-Dichlorobenzene                        71.
27.  1,4-Dichlorobenzene                        72.
28.  3,3'-Dichlorobenzidine                     73.
29.  1,1-Dichloroethylene                       74.
30.  1,2-Trans-Dichloroethylene                 75.
31.  2.4-Dichlorophenol                         76.
32.  1,2-Dichloropropane                        77.
33.  l,2-Dichloropropylene(l,3-Dichloropropene) 78.
34.  2,4-Dimethylphenol                         79.
35.  2,4-Dinitrotoluene                         80.
36.  2,6-Dinitrotoluene                         81.
37.  1,2-Diphenylhyclrazine                      82.
38.  Ethylbenzene                               83.
39.  Fluoranthene                               84.
40.  4-Chlorophenyl Phenyl Ether                85.
41.  4-Bromophenyl Phenyl Ether                 86.
42.  Bis(2-Chloroisopropyl)Ether                87.
43.  Bis(2-Chloroethoxy)Methane                 88.
44.  Methylene Chloride(Dichloromethane)        89.
45.  Methyl Chloride(Chloromethane)             90.
Methylbromide (Bromonethane)
Bromoform (Tribrpmcmethane)
Dichlorobromomethane
Trichlorofluoromethane
Dichlorodifluoronethane
Chlorodibromcxnethane
Hexachlorobutadiene
Hexachlorocyclopentadiene
Isophorone
Naphthalene
Nitrobenzene
2-Nitrophenol
4-Nitrophenol
2,4-Dinitrophenol
4,6-Dinitro-o-cresol
N-Nitrosodimethylamine
N-Nitrosodiphenylamine
N-Nitrosod i-N-Propylamine
Pentachlorophenol
Phenol
Bis(2-Ethylhexyl)Phthalate
Butyl Benzyl Phthalate
Di-N-Butyl Phthalate
Di-N-Cctyl Phthalate
Diethyl Phthalate
Dimethyl Phthalate
1,2-Benzanthracene(Benzo(A) Anthracene)
Benzo(A)Pyrene (3,4-Benzo-Pyrene)
3,4-Benzofluoranthene(Benzo (B)Fluoranthene)
11,12-Benzofluoranthene(Benzo(K)Fluoranthene)
Chrysene
Acenaphthylene
Anthracene
1,12-Benzoperylene(Benzo(C3JI)-Perylene)
Fluorene                                 ,
Phenanthrene
1,2,5,6-Dibenzanthracene(Dibenzo(A ,H)Anthracene
Indeno(1,2,3-CD)Pyrene(2,3-o-PhenyleneFyrene)
Pyrene
Tetrachloroethylene
Toluene
Trichloroethylene
Vinyl Chloride (Chloroethylene)
Aldrin
Dieldrin
                                              VIII-31

-------
                                          TABLE 8-4 Con't
 91.  Chlordane(TechnicalMixtureandMetabolites)
 92.  4,4'-DDT
 93.  4,4I-DDE(P,P'-DDX)
 94.  4,4I-DDD(P,P'-TOE)
 95.  Alpha-Endosulfan
 96.  Beta-Endosulfan
 97.  Endosulfan Sulfate
 98.  Endrin
 99.  Endrin Aldehyde
100.  Heptachlor
101.  IfeptachlorEpoxide(B!K-Hexachlorocyclo-
        hexane)
102.  Alpha-BHC
103.  Beta-BHC
104.  Ganma-BHC(Lindane)
105.  Delta-BHC(PCB-Polychlorinated Biphenyls)
106.  PCB-1242(Arochlor 1242)
107.  PCB-1254(ftrochlor 1254)
108.  PCB-1221(Arochlor 1221)
109.  PCB-1332(Arochlor 1232)
110.  PCB-1248(Arochlor 1248)
111.  PCB-1260(Arochlor 1260)
112.  PCB-1016(Arochlor 1016)
113.  Toxaphene
114.  Antimony
115.  Arsenic
117.  Beryllium
118.  Cadmium
119.  Chromium
120.  Copper
121.  Cyanide
122.  Lead
123.  Marcury

124.  Nickel
125.  Selenium
126.  Silver
127.  Thallium
128.  Zinc
129.  2,3,7,8-Ttetrachlorodibenzo-P-Dioxin(TCDD)
NON TOXIC POLLUTANT METALS

Calcium
Magnesium
Aluminum
Manganese
Vanadium
Boron
Barium
Molybdenum
Tin
Yttrium
Cobalt
Iron
Titanium
Potassium
Gallium
Uranium

OTHER POLLUTANTS

Oil & Grease
Total Organic Carbon
Biochemical Oxygen Demand
Total Suspended solids
Phenols
Fluoride
Xylenes
Alkyl Epoxides
Germanium
Rubidium
Strontium
Zirconium
Niobium
Palladium
Indium
Tellurium
Cesium
Tantalum
Tungsten
Osmium
Platinum
Gold
Bismuth
                                           VIII-32

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                                        VIII-43

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-------
      Mass Load - Total daily discharge in kilograms/day of a
      particular pollutant is termed the mass load.  This figure
      is computed by multiplying the measured concentration (mg/1)
      by the water discharge rate expressed in liters, per day.

      Sample Blanks - Blank samples of organic-free distilled
      water were placed adjacent to sampling points to detect
      airborne contamination of water samples.  These sample
      blank data are not subtracted from the analysis results,
      but, rather, are shown as a (B) next !to the pollutant
      found in both the sample and the blank.

 The  manufacture of electric lamps occurs alt ten visited plants,
 five of which were sampled.  Raw waste stream samples were taken
 of process wastewaters including five of the eight wet processes
 listed  in Table 8-3.

 Tungsten Filaments - Four plants manufacturing tungsten fila-
 ments were visited and sampled.   Tables 8-5 through 8-8 present
 the  analyses  of raw waste and effluent discharge streams for
 process water usage associated with filament mandrel dissolution.

 Quartz  Mercury Vapor Lamps - In  addition to filament manufacture,
 Table 8-8 presents a raw waste sample of hydrofluoric acid clean-
 ing  of  quartz mercury vapor lamps.

 Fluorescent Lamps  - Three plants manufacturing fluorescent lamps
 were  visited  of which one was sampled.   Table  8-9  presents the
 analyses  of raw waste and effluent  discharge streams for process
 water usage associated with  fluorescent lamp manufacturing.

 Summary of Raw Waste Stream Data

 Tables  8-10 and  8-11 summarize measurable  pollutant concentration
 data  of raw waste  streams sampled for the  electric lamp subcategory,
 Minimum,  maximum,  mean,  and  flow weighted  mean  concentrations
 have  been determined for the  summarized raw waste  streams.   The
 flow  weighted  mean concentration was  calculated  by dividing  the
 total mass rates  (mg/day)  by  the total  flow rate (I/day)  for   '
all sampled data for each parameter.   Pollutant' parameters
listed  in Tables 8-10  and 8-11 were  selected based upon their
occurrence and concentration  in  the  sampled  streams.  Those
parameters either  not  detected or detected  at trace  levels  in
all sampled streams  were  excluded from  these tables.
                               VIII-45

-------
                                           TABLE 8-10

                                  Summary of Raw Waste Data For
                                 Tungsten Filament Manufacturing
Toxic Organics

 23  Chloroform
 44  Methylene Chloride
 48  Dichlorobroroomethane

Toxic Metals

135  Arsenic
117  Beryllium
118  Cadmium
119  Chromium
120  Copper
122  Lead
124  Nickel
125  Selenium
126  Silver
127  Thallium
128  Zinc

NorHIbxic Metals

     Aluminum
     Manganese
     Vanadium
     Boron
     Barium
     Molybdenum
     Tin
     Yttrium
     Cobalt
     Iron
     Titanium
     Strontium
     Zirconium
     Niobium
     Palladium
     Indium
     Tungsten
     Gold*
     Uranium
   Minimum         Maximum         Mean
Concentration   Concentration   Concentration
     mg/1            mg/1            mg/1
   0.012
   0.021
   NO
  <0.005
  <0.001
   0.012
  <0.031
   0.208
  <0.070
  <0.103
  <0.003
   0.014
   0.065
  <0.010
 0.621
 0.270
 0.067
 0.234
 0.007
21.661
 0.051
 0.026
 0.061
13.421
 0.005
 0.082
<0.020
 0.040
<0.016
 1.64
 0.66
 0.400
 0.03
 0.040
 0.063
 0.010
<0.040
<0.010
 0.090
11.030
 3.600
 0.290
 0.500
 0.110
<0.130
 0.170
 0.160
                   2.230
                   0.426
                   1.040
                   0.809
                   0.040
                 678.
                  <0.515
                   0.072
                  <1.030
                 127.
                  <0.041
                   0.350
                   0.400
                   1.70
                   0.300
                   2.73
                   7.00
                   0.400
                  <0.300
0.029
0.035
0.003
0.022
0.004
0.044
3.712
1.347
0.175
0.302
0.039
0.068
0.102
0.077
                 1.550
                 0.354
                 0.396
                 0.474
                 0.019
               258.5
                 0.215
                 0.043
                 0.397
                66.45
                 0.019
                 0.198
                 0.157
                 0.61
                 0.125
                 2.07
                 4.32
                 0.400
                 0.133
                                                Flow Weighted
                                             Mean Concentration
                                                  mg/1

                                                0.024
                                                0.048
                                                0.003
                                                0.032
                                                0.007
                                                0.058
                                                0.714
                                                0.420
                                                0.110
                                                0.184
                                                0.075
                                                0.097
                                                0.073
                                                0.032
                1.764
                0.373
                0.714
                0.620
                0.010
              462.6
                0.362
                0.055
                0.709
               91.77
                0.028
                0.263
                0.270
                1.15
                0.202
                2.42
                5.17
                0.400
                0.214
                                                 V1II-46

-------
                                        TABLE 8-10 CON'T

                                   Summary of Raw Waste Data For
                                 Tungsten Filament: Manufacturing
Other Pollutants

121   Cyanide, Total               NO
      Total Organic Carbon        13
      Biochemical Oxygen Demand   30**
      Total Suspended Solids       1.0
      Phenols                      0.008
      Fluoride                     ND
                                  Minimum        Maximum         Mean            Flow tfeighted
                               Concentration   Concentration   Concentration   Mean Concentration
                                   mg/1             mg/1            mg/1
  0.010
188
 30**
660
  0.025
  0.540
  0.005
101
 30**
301
  0.017
  0.270
  0.002
156
 30**
110
  0.017
  0.095
 * 3 Single Stream Sample Value.
** = Toxic Response.  Value May Be As High As That Which is Indicated.
ND = Mot Detected
                                                VJII-47

-------
                                            TABLE 8-11
                                   Summary of Raw Waste Data
                                  Fluorescent Lamp Manufacturing
Stream Identification

Sample Number
Plow Rate - Liter/Day
   SO, Scrubber,
SnCl  Scrubber, and
   Sllicone Coat
    03749-85310
      65648
  Developed
SnCl. Scrubber
    29069
Glass Tube &
 Rack Rinse

 03750-85308
   93136
  Developed
Summary Process
     Waste
   122205
Toxic Organics

 44  Methlene chloride
 86  Tbluene

Toxic Metals

114  antimony
118  Cadmium
119  Chromium
120  Copper
122  Lead
126  Silver
128  Zinc

Non-Toxic Metals

     Aluminum
     Manganese
     Vanadium
     Boron
     Barium
     Tin
     Yttrium
     Cobalt
     Iron
  Concentration*
       rag/1

       0.063
       0.011
      <0.005
       0.005
       0.009
       0.112
       0.022
       0.005
       0.113
       0.143
       0.012
       0.035
       0.278
       0.025
      40.859
       0.010
       0.055
       0.200
Flow Weighted**
     Mean
Concentration   Concentration*
     mg/1            mg/1
      NC
      NC
    0.011
    0.020
    0.253
    0.050
    0.011
    0.255
    0.323
    0.027
    0.079
    0.628
    0.058
   92.273
    0.023
    0.011
    0.452
    NA
    NA
    0.597
    0.399
   <0.008
    0.148
    0.022
   <0.005
    0.146
    0.619
    0.445
    0.009
    0.064
    0.121
    0.033
    0.033
    0.003
    0.193
                                                                                  Flow Weighted***
                                                                                      Mean
                                                                                  Concentration
       NC
       NC
     0.458
     0.307
     0.011
     0.173
     0.029
     0.006
     0.172
     0.549
     0.346
     0.026
     0.198
     0.106
    21.974
     0.031
     0.005
     0.255
                                               VIII-48

-------
                                       TABLE 8-11 (Continued)
                                     Summary of Raw Waste Data
                                   Fluorescent Lamp Manufacturing
                            Concentration*
Other Pollutants
Oil  and Grease
Total Organic Carbon
Biochemical Oxygen Demand
Total Suspended Solids
Phenols
Fluoride
                                              Flow Weighted**
                                                Mean
                                              Concentration   Concentration*
                                                   mg/1            mg/l
                                   5
                                 159
                                 540
                                 194
                                   0.018
                                   5.2
    NC
    NC
    NC
434
    NC
 11.7
 NA
 NA
 NA
52
 NA
 0.170
                              Flow Weighted***
                                 Mean
                              Concentration
                                   mg/1
    NC
    NC
    NC
143
    NC
  2.9
  *
 **
***

 NA
! Single Stream Sample Value
! Developed Process Waste From Sample Stream 03749-85310.
• Summary Waste Includes Developed SnCl  Waste And Glass Tube And Rack Rinse Waste.
 It Does Not Include Equipment And FloSr Washdowns.
 Not Analyzed
 NC = Not Considered For Developed Streams
                                         VIII-49

-------
Table 8-10 summarizes mandrel dissolution raw waste streams
sampled at the following plants manufacturing tungsten filaments:
19082, 28077, and 33202.  Plant 28086 also manufactures tungsten
filaments.  However, data from this plant are not included in the
summarization because a total raw waste sample was not obtained.

Table 8-11 presents raw waste pollutant concentration data of
two samples taken at Plant 19121.  Sample 03749-85310 includes
process wastewater from tin chloride and sulfur dioxide wet air-
scrubbers as well as wastewater from a silicone coating operation.
Raw waste characteristics are developed for the tin chloride coat-
ing wet air scrubber from the existing sampled stream, sample
number 03749-85310.  Not all parameters summarized in Table 8-11
for this sampled stream are transferable to the developed tin
chloride scrubber stream.  The organic pollutants detected are
thought to originate from sampling equipment cleaning and pre-
paration.  Phenols and oil and grease may originate in the silicone
coating solution.  Total organic carbon and biochemical oxygen
demand are not readily equated to any one of the three process
wastes comprising the sampled stream.  The remaining pollutant
parameters as presented in Table 8-11 for the sampled stream,
03749-85310, are flow weighted for the developed tin chloride
scrubber stream.  These parameters include toxic and non-toxic
metals as well as total suspended solids and fluorides.   It is
expected that these pollutants result from the tin chloride coating
process.

Sample 03750-85308 is also presented in Table 8-11.  This sample
includes wastewater from glass tube and rack rinsing, but does
not include wastewater  from equipment and floor washdowns.  This
process waste stream is flow weighted together with the developed
tin chloride scrubber waste stream, producing a developed summary
process waste stream.   Pollutant parameters and wastewater  flow
rates attributed to the sulfur dioxide wet air scrubber and the
silicone coating process are not used in calculating the  sum-
mary process waste for  fluorescent lamp manufacturing.  The
sulfur dioxide scrubber is known only to exist at  this sampled
facility.  Wastewater from this process consists of sulfurous
and sulfuric acid.  In-place waste treatment utilizes  sodium
hydroxide pH adjustment of these acids.  Because of its limited
use and proper in-place treatment, no further consideration is
given to  characterizing sulfur dioxide scrubber wastes as they
relate to fluorescent lamp manufacturing.  Silicone coating
wastes will  also not receive  further consideration in  character-
izing fluorescent  lamp  manufacturing for several reasons.  Si-
licone coating of  fluorescent  lamps was observed at three
facilities.   Plant 19082 never discharges  their  coating solution.
Plant 33189  discharges  approximately 76 liters/month  and  Plant
19121 discharges approximately  242  liters/day.   It is  expected
that  the  volume  of silicone  coating wastes  is  relatively  low
throughout  the  industry.   In addition,  there  are  only a  limited
number of plants manufacturing  fluorescent  lamps.   It is  known
that  at  least one  plant employs  solvents  in  their  silicone
coating  solution.   Therefore,  recommended  treatment for  silicone
coating  process  wastes  is  solution collection and  removal.


                                VIII-50

-------
Process wastewater from fluorescent lamp manufacturing was
sampled at one facility, Plant 19121.   In-place  treatment tech-
nologies  include pH adjustment and gravitational settling as
shown  in  Figure 8-5.  Table 8-12 presents performance for gravi-
tational  settling of wastewater containing phosphor materials.
In addition to process wastewater from  glass  tube and rack rinsing,
equipment and floor washdowns from the  phosphor preparation area
flow to the settling tank.  A flow could not  be determined for
this process because of its irregular occurrence.  The raw waste
sample contained only wastewater from the glass  tube and rack
rinse.  The effluent sample contained treated wastewater from the
washdowns from the phosphor preparation area  as well as that
from glass tube and rack rinsing.  Although settling did occur,
the pollutant concentrations in the effluent  were higher for
most parameters than those of the sampled raw waste.  This
occurred because of the additional raw  waste  source not contained
in the raw waste as sampled.

Treatment-In-Place

The following is a plant-by-plant discussion  of raw waste and
final effluent process wastewaters sampled at plants manu-
facturing electric lamps.  A discussion of waste treatment
technologies presently in existence at  these  sampled plants
is also presented.  The treatment systems at  several plants
visited but not sampled are also discussed.   Table 8-13
summarizes treatment in-place and effluent discharge destina-
tions of ten plants visited during this study.

Plant 28086 produces incandescent lamps, quartz mercury vapor
lamps and coiled tungsten filaments for use in incandescent and
fluorescent lamp manufacturing.  Process wastewaters produced from
the manufacturing of quartz mercury vapor lamps and coiled tung-
sten filaments were sampled and analytical results were presented
in Table 8-8.  Figure 8-5 depicts sampling locations and wastewater
treatment.  A grab sample was taken of  the hydrofluoric acid
bath used in cleaning quartz envelope mercury vapor lamps.  The
rinse after acid cleaning was of low volume discharging directly
to the municipal treatment system and was not sampled.  With the
exception of spent acid used for molybdenum mandrel dissolution,
all other mandrel dissolution process wastewaters from filament
neutralization, cleaning, and rinsing flow to a pH adjustment
tank.  The spent acid used for molybdenum mandrel dissolution is
sent to a holding tank from which a grab sample was taken.  To
this 303 liters (80 gallons) of acid, 1211 liters (320 gallons)
of water is added.  TJie solution is pH  adjusted to a level of
2.5 with the use of ammonia, and precipitation of ammonium
molybdate occurs.  After a 12 hour settling period, the decant
is sent to pH adjustment.  A grab sample was  taken of this
decant.  At this point, a cold water rinse of approximately 1136
liters (300 gallons) is added to the remaining ammonium molybdate
                         VTII-51

-------
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-------
                                    TABLE  8-12
                  Performance of  In-Place  Treatment Technologies
                                   Plant 19121
Stream Identification

Sample Number


Parameters

Toxic  Organics

 44  Methylene chloride
 86  Toluene

Toxic  Metals

114  Antimony
118  Cadmium
119  Chromium
120  Copper
122  Lead
126  Silver
128  Zinc

Non-Toxic Metals

     Aluminum
     Manganese
     Vanadium
     Boron
     Barium
     Tin
     Yttrium
     Cobalt
     Iron

Other  Pollutants
       Glass Tube and Rack
        Rinse Pre-Settle

           03750-85308

       Concentration (mg/1)
                NA
                NA
              0.597
              0.399
             <0.008
              0.148
              0.022
             <0.005
              0.146
              0.619
              0.445
              0.009
              0.064
              0.121
              0.033
              0.033
              0.003
              0.193
     Oil and Grease                   NA
     Total Organic Carbon             NA
     Biochemical Oxygen Demand        NA
     Total Suspended Solids        52
     Phenols                          NA
     Fluoride                       0.170
Glass Tube, Rack Rinse, and
   Washdown Post-Settle

        03751-85309

    Concentration (mg/1)
          <0.010
             ND
           0.893
           0.668
          <0.008
           0.186
           0.054
          <0.005
           0.172
           1.217
           0.774
           0.021
           0.132
           0.350
           0.056
           0.148
           0.002
           0.463
                                          0
                                         17
                                         60*
                                         82
                                          0.023
                                          0.150
NA = Not Analyzed
ND * Not Detected
 * = Toxic Response.
Value May Be As High As That Which Is Reported.
                                VIII-53

-------
                         TABLE 8-13
                 Electric Lamp Manufacture
     Summary Of Wastewater Treatment At Visited Plants
Plant ID No.
     19121
     33189
     19082
     28077
     33202
     28086

     28120
     34044
     28126
     28127
          Treatment In-Place
pH adjust, settling
Chemical precipitation,
pH adjust, settling,
contractor removal,•
recycle (99.8%)
pH adjust
pH adjust
pH adjust
Chemical precipitation, settling,
vacuum filtration, pH adjust,
contractor removal
None
None
Contractor removal (solvents)
No water usage
Discharge
    I
    I


    D
    I
    I
    I

    I
    I
    D
    NA
 I 3 Indirect
 D » Direct
NA » Not Applicable
                             VIII-54

-------
precipitate.  The mixture is stirred, settled, decanted and the
procedure repeated.  However, during the sampling visit, proper
settling did not occur.  As a result,-this 1136 liter  (300
gallon) mixture rather than the usual settled material was sent
through the vacuum filtration unit.  The filtrate flows to
pH adjustment and the sludge is contractor removed.

Together with wastewater from the molybdenum recovery process,
other mandrel dissolution wastewater flows to a pH adjustment
tank.  The wastewater is pH adjusted with ammonia and flows
to a second pH adjustment unit where it is mixed with  the 303
liter (80 gallon) batch discharge from a wet air scrubber.  A
final pH adjustment with ammonia to a pH of 8.9 occurs prior
to discharge to the sanitary sewer.

Plant 19121 manufactures fluorescent lamps.  Table 8-9 pre-
sented analytical results for those wet processes sampled.
Figure 8-5 depicts sampling locations and wastewater treatment
at this plant.  Glass tube rinse, doubling as a rack rinse,
sends process wastewater to a 2044 liter (540 gallon) settling
tank.  The settling tank is baffled twice.  Wastewater under-
flows the first baffle, overflows the second, and is discharged
from the settling tank to the municipal treatment system.  The
settled phosphors are recovered by gravitational settling and
returned to phosphor preparation.

Wastewater from a wet air scrubber associated with tin chloride
coating flows to a pH adjustment tank.  The pH is adjusted to
approximately 7-8 with sodium hydroxide, and the wastewater is
stirred continuously so as to prevent settling of a tin hydrox-
ide precipitate.  The wastewater is discharged to the municipal
treatment system.

A wet air scrubber associated with sulfur dioxide glass flare
manufacturing sends wastewater to a pH adjustment tank.  The
pH is adjusted to approximately 8-9 before final discharge to
the municipal treatment system.

The silicone coating solution continually overflows its coating
basin and flows directly to the municipal treatment system.
A flow proportioned composite sample was taken of wastewater
produced from the two wet air scrubbers and the silicone
coating overflow.

At Plant 19082 a total raw waste sample was taken of waste-
water generated from the mandrel dissolution process, and the
analysis results were presented in Table 8-5.  There is no for-
mal waste treatment system at this plant.  All process waste-
water from the manufacturing of coiled tungsten filaments flows
                           VIII-55

-------
 to a dry well containing a 45,420  liter (12,000  gallon)  tank
 of calcium carbonate marble chips.   The pH adjusted wastewater
 subsequently percolates into the ground.   Figure 8-6 depicts
 sampling locations and wastewater  treatment at this facility.

 Plant 28077 manufactures incandescent lamps,  mercury vapor
 lamps,  and coiled  tungsten filaments for  use, in  incandescent
 and  fluorescent lamp manufacturing.   The  only wet process  at
 this facility is filament mandrel  dissolution.  Filaments
 wound on molybdenum mandrels are used in  fluorescent lamp
 manufacturing,  and filaments wound on steel and  copper-clad
 steel mandrels  are used in incandescent lamp  manufacturing.

 An attempt was  made to segregate the two  different mandrel dis-
 solution processes.   However,  because of  the  variability in
 number and size of the solution  dumps,  not all bath dumps  could
 be sampled proportionally.   Therefore,  the two raw waste samples
 are  not truly representative of  the  individual dissolution pro-
 cesses.   Analysis  of these raw waste streams  was presented in
 Table 8-6,  and  sampling locations and wastewater treatment are
 depicted in Figure 8-6.

 All  mandrel dissolution wastewater flows  to a twice baffled
 3,482 liter (920 gallon')  pH adjustment tank.   The wastewater
 underflows  the  first baffle and  overflows the second baffle
 before  discharge to  the muninipal treatment system.   Because the
 mandrel  dissolution  wastewater is generally very acidic, pH
 adjustment  employs sodium hydroxide  addition  only.   The  caustic
 addition is automatically controlled,  and the wastewater is
 continually mixed.   During the sampling visit the pH control
 monitoring  device  was  malfunctioning.   A  pH of 8-9  is normally
 maintained,  but a  level  of 11.6  was  recorded  for the 8-hour
 sampling period.   An 8-hour continuous  composite sample  of the
 final effluent  was  taken,  and  analysis  results were  presented  in
 Table 8-6.

 Plant 33202  manufactures  coiled  tungsten  filaments  and employs
 a wet mandrel dissolution process.   All process  wastewater flows
 to a  pH  adjustment  tank  prior  to discharge to the municipal
 treatment system.  Process  wastewater  at  a pH of 2.0-2.5 is  pH
 adjusted  to  a level  of  8-9.  Analytical results  of  the final
 effluent were presented  in  Table 8-7,  and Figure 8-6 depicts
 sampling  locations and wastewater treatment.

 Plant 33189 manufactures  fluorescent lamps.   This plant  was
visited but  not sampled.  Wastewater treatment in-place  is
depicted  in  Figure 8-7.   Process wastewater from a wet air
scrubber associated  with  tin chloride coating is  sent to a
 2082 liter  (550 gallon)  settling tank  in  which chemical  pre-
cipitation occurs.    Sodium  hydroxide  is added to precipitate
                            VIII-56

-------

         c
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 M     CO
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-------
     Tin
    Chloride
    Scrubber
     Waste
                 Return
                   To
                 Process
                      ±
   Chemical
Precipitation
  & Settling
                      I
                    Settling
                      1
                    Settling
                       t
                Contract Haul
                    Municipal
                   ' Treatment
                     System


                    Municipal
                   •Treatment
                     System
                Return
                  To
                Process
Glass Tube
Sponge Wipe -w
   Waste
 Settling
                       t
              Phosphors Reprocessed
                Return
                  To
                Process
Glass Tube .^
Rinse Waste.
Deionization
               PLANT  33189
                FIGURE 8-7

        IN PLACE WASTE TREATMENT'


                  VIII-58

-------
tin hydroxide and the treated wastewater is returned  to process.
Once a week the settled sludge is pumped to another settling
tank and settled for three days.  The decant  is sent  to the muni-
cipal treatment system, and the settling procedure is repeated.
The sludge is then contractor removed.  At the time of contractor
removal of sludge/ a total of 379 liters (100 gallons) or  less
of wastewater has been discharged to the municipal treatment system.

Process wastewater from glass tube sponge wiping  flows to  a
189 liter (50 gallon) settling tank.  The phosphors are re-
covered and reprocessed, and the treated wastewater is returned
to process.  Process wastewater from deionized glass  tube  rinsing
is sent to a holding tank, deionized, and returned to process.

POTENTIAL POLLUTANT PARAMETERS

Potential pollutant parameters for the  electric lamp  subcategory
were selected from the list of pollutant parameters analyzed for
as presented in Table 8-4.  Rationale for selection as a potential
pollutant parameter was based on the followingj

          Presence of toxic pollutants, non-toxic
          metals, and other pollutants

          Occurrence of pollutant as a  raw material or process
          chemical in electric lamp manufacturing processes

     .    Treatability of pollutants at reported  concen-
          tration levels

          Toxicity of pollutants at reported  concentration
          levels

Table 8-14 presents the potential pollutant parameters  for the
electric lamp subcategory.

Tables 8-15 and 8-16 list pollutants other  than  those selected
as potential parameters that were analyzed  in the process  raw
waste streams sampled  for the electric  lamp subcategory.   Pol-
lutants are presented  according  to  the  following  criteria:
not detected, detected at trace  levels, or  detected  at levels
too low to be effectively treated prior to  discharge.  Pollutant
concentrations are determined too low to  be effectively treated
for any or all of the  following  reasons:

          Levels of treatability for many non-toxic
          parameters are unknown.
                            VIII-59

-------
                         TABLE  8-14

               POTENTIAL POLLUTANT PARAMETERS
Toxic Metals

114  Antimony
118  Cadmium
119  Chromium
120  Copper
122  Lead
126  Selenium

Non-Toxic Metals

     Molybdenum
     Tin
     Iron
     Tungsten

Other Pollutants

     Total Suspended Solids
Fluorescent Lamps

       X
       X
Tungsten Filaments
       X
       X
       X
       X
       X
                             X
                             X
       X
X - Potential Parameters
                                 VIII-60

-------
                   TABLE 8-15

POTENTIAL POLLUTANT PARAMETERS NOT SELECTED FOR
              FILAMENT MANUFACTURE
       NOT DETECTED IN RAW WASTE STREAMS
Toxic Organics

 1.  Acenaphthene                                46.
 2.  Acrolein                                    47.
 4.  Benzene                                    49.
 5.  Benzidine                                   50.
 6.  Carbon Tetrachloride(Tetrachlororaethane)    52.
 7.  Chlorobenzene                              53.
- 8.  1,2,4-Trichlorobenzene                     54.
 9.  Hexachlorobenzene                          56.
10.  1,2-Dichlorethane                          57.
12.  Hexachloroethane                           59.
13.  1,1-Dichloroethane                         60.
14.  1,1,2-Trichloroethane                      61.
15.  1,1,2,2-Tetrachloroethane                  62.
16.  Chloroethane                                63.
17.  Bis(Chloronethyl)Ether                     64.
18.  Bis(2-Chloroethyl)Ether                    67.
19.  2-Chloroethyl Vinyl Ether (Mixed)           69.
20.  2-Chloronaphthalene                        71.
21.  2,4,6-Trichlorophenol                      72.
22.  Parachlorometci Cresol                      73.
24.  2-Chlorophenol                             74.
25.  1,2-Dichlorobenzene                        75.
26.  1,3-Dichlorobenzene                        76.
27.  1,4-Dichlorobenzene                        77.
28.  3,3'-Dichlorobenzidine                     79.
29.  1,1-Dichloroethylene                       80.
30.  1,2-Trans-Dichloroethylene                 82.
 31.  2.4-Dichlorophenol                         83.
 32.  1,2-Dichloropropane                        84.
 33.  1,2-Dichloropropylene(1,3-Dichloropropene).85.
 34.  2,4HDimethylphenol                         87.
 35.  2,4-Dinitrotoluene                         88.
 36.  2,6-Dinitrotoluene                         89.
 37.  1,2-Diphenylhydrazine                      90.
 38.  Ethylbenzene                               91.
 39.  Fluoranthene                               92.
 40.  4-Chlorophenyl Phenyl Ether                93.
 41.  4-Bromophenyl Phenyl Ether                 94.
 42.  Bis(2-Chloroisopropyl)Ether                95.
 43.  Bis(2-Chloroethoxy)Methane                 96.
 45.  Methyl Chloride(Chloromethane)             97.
                           Methylbromide (Bronomethane)
                           Brcsnoform  (Tribrcairanethane)
                           Trichlorofluoronethane
                           Dichlorodifluorcsnethane
                           Hexachlorobutadiene
                           Hexachlorocyclc^entadiene
                           Nitrobenzene
                           2-Nitrophenol
                           2, 4H3initrophenol
                           4, 6-Dinitro-o-Cresol
                           N-Nitrosodimethylamine
                           N-«itrosodiphenylamine
                           N-^Iitrosodi-N-Propylamine
                           Pentachlorophenol
                           Butyl Benzyl Phthalate
                           Di-W-Octyl Phthalate
                           Dimethyl Phthalate
                           1,2-Benzanthracene  (Benzo(A)Anthracene)
                           Benzo  (A) Pyrene  (3,4-Benzo-Pyrene)
                           3, 4^enzofluoranthene  (Benzo(B)Fluoranthene)
                           11 , 12-fienzof luoranthene (Benzo ( K ) Fluoranthene )
                           Chrysene
                           Acenaphthylene
                           1, 12-Benzoperylene (Benzo (GHI ) -Perylene )
                           Fluorene
                           1, 2, 5, 6-€>ibenzathracene(Dibenzo(A,H)Anthracene)
                           Indeno (1,2, 3-CD ) Pyrene ( 2 , 3-0-Phenylene Pyrene )
                           Pyrene
                           Tetrachloroethylene
                          _ Trichloroethylene
                          "vinyl  Chloride  (Chloroethylene)
                           Aldrin
                           Dieldrin
                           Chlordane (Technical Mixture and Metabolites)
                           4, 4 '-DDT
                           4,4'-DDE  (P,P'-DDX)
                           4, 4 '-ODD  (P,P-JTDE)
                           Alpha-Endosulfan
                           Beta-Endosulfan
                           Endosulfan Sulfate
                      VIII-61

-------
                                   TABLE 8-15 CON'T


                     POTENTIAL POLLUTANT PARAMETERS NOT  SELECTED FOR
                                   FILAMENT MANUFACTURE
                           NOT DETECTED IN RAW WASTE STREAMS
  98.  Endrin                                     106.
  99.  Endrin Aldehyde                            107.
100.  Heptachlor                                108.
101.  Heptachlor Epoxide  (BHC= Hexachloro-       109.
        cyclohexane)
102.  Alpha-BHC                                  110.
103.  Beta-BHC                                   111.
104.  Gamma-BBC  (Lindane)                        112.
105.  Delta-BHC  (PCB-Polychlorinated Biphenyls)  113.
                                                 129.

OTHER POLLUTANTS

      Oil and Grease
      Xylenes
      Alkyl Epoxides
      PCB-1242  (Aroclor 1242)
      PCB-1254  (Aroclor 1254)
      PCB-1221  (Aroclor 1221)
      PCB-1232  (Aroclor 1232)
      PCB-1248
      PCB-1260
(Aroclor 1248)
(Aroclor 1260)
      PCB-1016 (Aroclor 1016)
      Toxaphene
      2,3,7,8-Tetrachlordibenzo-P-Dioxin (TCDD)
                                      DETECTED AT TRACE LEVELS
TOXIC ORGANICS

  3.  Acrylonitrile
 11.  1,1,1-Trichloroethane
 51.  Chlorcdibrcmomethane
 55.  Naphthalene
 58.  4-Nitrophenol
 65.  Phenol
 66.  Bis(2-Ethylhexyl) Phthalate
 68.  DiHfl-Butyl Phthalate
 70.  Diethyl Phthalate
 78.  Anthracene
 81.  Phenanthrene
 86.  Toluene
TOXIC METALS

114.  Antimony
123.  Mercury

KOHTOXIC METALS

      Potassium
      Gallium
      Germanium
      Rubidium
Tellurium
Osmium
Platinum
Bismuth
                                             VIII-62

-------
                               TABLE 8-15 (Continued)

                      DETECTED AT LEVELS NOT REQUIRING TREATMENT
TOXIC ORGANICS
 23.  Chloroform
 44.  Methylene Chloride
 48.  Dichlorobronome thane

TOXIC METALS
115.
117.
124.
126.
127.
128.
      Arsenic
      Beryllium
      Nickel
      Silver
      Thallium
      Zinc
NON-TOXIC METALS

      Aluminum
      Manganese
      Vanadium
      Boron
      Barium
      Tin
      Yttrium
      Cobalt
      Titanium
      Strontium
      Zirconium
      Niobium
      Palladium
      Indium
      Gold
      Uranium

OTHER POLLUTANTS

121.  Cyanide Total
      Total Organic Carbon
      Biochemical Oxygen Demand
      Phenols
      Fluoride
                                                  Mean Concentration
                                                        mgA

                                                      0.039
                                                      0.035
                                                      0.007
0.022
0.004
0.302
0.068*
0.102
0.077
                                                       1.550
                                                       0.354
                                                       0.396
                                                       0.474
                                                       0.019
                                                       0.215*
                                                       0.043
                                                       0.397*
                                                       0.019*
                                                       0.198
                                                       0.157
                                                       0.61
                                                       0.125
                                                       2.07
                                                       0.400**
                                                       0.133*
                                                       0.005
                                                     101
                                                      30
                                                       0.017
                                                       0.270
  * = Does Not Require Treatment As Maximum Value  Is At A Trace Level,
 ** = Single Stream Sample Value.
                                    VIII-63

-------
                                             TABLE 8-16

                          POTENTIAL POLLUTANT PARAMETERS NOT SELECTED FOR
                                    FLUORESCENT LAMP MANUFACTURE
                                 NOT DETECTED IN RAW WASTE STREAMS
TOXIC ORGflNICS

 1.  Acenaphthene                     .          46.
 2.  Acrolein                                   47.
 3.  Acrylonitrile                              49.
 5.  Benzidine                                  50.
 6.  Carbon Tetrachloride(Tetrachlorcjnethane)   51.
 7.  Chlorobenzene                              52.
 8.  1,2,4-Trichlorobenzene                     53.
 9.  Hexachlorobenzene                          54.
10.  1,2-Dichlorethane                          55.
12.  Hexachloroethane                           56.
13.  1,1-Dichloroethane                         57.
14.  1,1,2-Trichloroethane                      58.
15.  1,1,2,2-Tetrachloroethane                  59.
16.  Chloroethane                               60.
17.  Bis(Chloromethyl)Et±er                     61.
18.  Bis(2-Chloroethyl)Ether                    62.
19.  2-Chloroethyl Vinyl Ether (Mixed)          63.
20.  2-Chloronaphthalene                        64.
21.  2,4,6-Trichlorophenol                      67.
22.  Parachlorometa Cresol                      69.
24.  2-Chlorophenol                             72.
25.  1,2-Dichlorobenzene                        73.
26.  1,3-Dichlorobenzene                        74.
27.  1,4-Dichlorobenzene                        75.
28.  3,3'-Dichlorobenzidine                     76.
29.  1,1-Dichloroethylene                       77.
30.  1,2-Trans-Dichloroethylene                 79.
31.  2.4-Dichlorophenol                         80.
32.  1,2-Dichloropropane                        82.
33.  l,2-Di<±loroprcpylene(l,3-Dichloropropene) 83.
34.  2,4-Diroethylphenol                         84.
35.  2,4-Dinitrotoluene                         85.
36.  2,6-Dinitrotoluene                         87.
37.  1,2-Diphenylhydrazine                      88.
38.  Ethylbenzene                               89.
39.  Pluoranthene                               90.
40.  4-Chlorophenyl Phenyl Ether                91.
41.  4-Brcmophenyl Phenyl Ether                 92.
42.  Bis(2-Chloroisopropyl)Ether                93.
43.  Bis(2-Chloroethoxy)Methane                 94.
45.  Mathyl Chloride(Chlororaethane)             95.
Methylbromide (Bromoraethane)
Bromoform (Tribromoraethane)
Trichlorofluoronethane
Dichlorodifluoromethane
Chlorodibromcxnethane
Hexaohlorobutadiene
Hexachlorocyclopentadiene
Isophorone
Naphthalene
Nitrobenzene
2-Nitrophenol
4-^Iitrophenol
2,4-Dinitrophenol
4,6-Dinitro-o-cresol
N-Nitrosodimethylamine
N-Nitrosodiphenylamine
N-Nitrosodi-N-Propylamine
Pentachlorophenol
Butyl Benzyl Phthalate
Di-«-Octyl Phthalate
l,2HBenzanthracene (Benzo(A)Anthracene)
Benzo (A) Pyrene (3,4-Benzo-Pyrene)
3,4-Benzofluoranthene (Benzo(B)Floranthene)
ll,12^enzofluoranthene(Benzo(K)Fluoranthene)
Crysene
Acenaphthylene
1,12-Benzoperylene(Benzo(GHI)-Perylene)
Fluorene
1,2,5,6-Dibenzathracene(Dibenzo(A,H)Anthracene)
Indeno(1,2,3-CD)Pyrene(2,3-0-Phenylene Pyrene)
Pyrene
Tetrachloroethylene
Trichloroethylene
Vinyl Chloride (Chloroethylene)
Aldrin
Dieldrin
Chlordane (Technical Mixture and Metabolites)
4,4'-DDT
4,4'-DDE (P,P'-DDX)
4,4'-ODD (P,P-TDE)
Alpha-Endosulfan
                                          VIII-64

-------
                                         TABLE 8-16 CON'T
                          POTENTIAL POLLUTANT PARAMETERS NOT SELECTED FOR
                                    FLUORESCENT LAMP MANUFACTURE
                                 NOT DETECTED IN RAW WASTE STREAMS
 95.  Alpha-Endosulfan
 96.  Beta-Endosulfan
 97.  Endosulfan Sulfate
 98.  Endrin
 99.  Endrin Aldehyde
100.  Heptachlor
101.  Heptachlor Epoxide (BHC=Hexachloro-
        cyclohexane)
102.  Alpha-^HC
103.  Beta-BHC
104.  Gamma-BHC (Lindane)
105.  Delta-BHC (PCB-Polychlorinated Biphenyls)
106.  PCB-1242 (Aroclor 1242)
107.  PCB-1254 (Aroclor 1254)
108.  PCB-1221 (Aroclor 1221)
109.  PCB-1232 (Aroclor 1232)
110.  PCB-1248 (Aroclor 1248)

111.  PCB-1260 (Aroclor 1260)
112.  PCB-1016 (Aroclor 1016)
113.  Toxaphene
129.  2,3,7,8-Tetrachlorodibenzo-P-Dioxin (TCDD)
OTHER POLLUTANTS

121  Cyanide, total
     Xylenes
     Alkyl Epoxides
                                      DETECTED AT TRACE LEVELS
TOXIC ORGANICS

 4.  Benzene
11.  1,1,1-Trichloroethane
23.  Chloroform
48.  Dichlorobromomethane
65.  Phenol
66.  Bis(2-Ethylhexyl) Phthalate
 68.  Di-N-butyl Phthalate
 70.  Diethyl Phthalate
 71.  Dimethyl Phthalate
 78.  Anthracene
 81.  Phenanthrene
TOXIC METALS

115.  Arsenic
123.  Mercury
124.  Nickel
127.  Thallium
117.  Beryllium
125.  Selenium
NON-TOXIC METALS
     Molybdenum
     Titanium
                                             VIII-65

-------
                                        TABLE 8-16 CON'T

                           DETECTED AT LEVELS NOT REQUIRING TREATMENT
TOXIC ORGANICS

 44.  Methylene Chloride
 86.  Toluene

TOXIC METALS

119.  Chromium
120.  Copper
126.  Silver
128.  Zinc

NON-TOXIC METALS

     Aluminum
     Manganese
     Vanadium
     Boron
     Barium
     Yttrium
     Cobalt

OTHER POLUJEANTS

     Oil and Grease
     Total Organic Carbon
     Biochemical Oxygen Demand
     Phenols
     Fluoride
                                                      Developed
                                                    Plow Weighted*
                                                  Mean Concentration
                                                        (mg/1)

                                                       0.063**
                                                       0.011**
                                                       0.011
                                                       0.173
                                                       0.006
                                                       0.172
                                                       0.549
                                                       0.036
                                                       0.026
                                                       0.198
                                                       0.106
                                                       0.031
                                                       0.005
                                                       5    **
                                                       159  **
                                                       540  **
                                                       0.018**
                                                       2.9
**
     Single Stream Sample Value
     Parameters Do Not Require Treatment Based On Single Stream Sample Values.
                                                VIII-66

-------
          Pollutants are not selected if raw waste
   ="      concentrations are less than the long terra
          average concentrations established for the
          levels of recommended treatment.

Aluminum, silver, tin, cobalt, titanium, and manganese have not
been selected as potential pollutant parameters for filament
manufacture because the three recommended levels of treatment
will effectively reduce their.concentrations while precipitat-
ing other potential pollutant metals.  Additionally silver,
tin, cobalt, and titanium, as well as uranium, have not been
selected because the maximum concentrations reported for
these metals are at nonquantifiable levels*  Therefore, when
these nonquantifiable levels are used in calculating the mean
concentrations and the flow weighted mean concentrations,  they
increase these calculated values to concentration levels that
are potentially controllable.

An example of this situation exists for tin.  Table 8-10
presents minimum, maximum, mean, and flow weighted mean con-
centrations for filament mandrel dissolution as sampled at
three facilities.  Tin concentrations for the three sampled
streams include:  0.051 mg/1, 0.080 mg/1, and <0.515 mg/1.
If only measurable concentrations, 0..051 mg/1 and 0.080 mg/1,
are used in determining mean and flow weighted mean concentra-
tions, then resultant concentration levels are 0.060 mg/1
and 0.056 mg/1 respectively.  These levels are less than that
which is achievable by the levels of recommended treatment.
However, if all three streams are utilized in determining  the
mean and flow weighted mean concentrations,increased concentra-
tion levels occur as presented in Table 8-10.  These concentra-
tions are indeed attainable by the levels of recommended treat-
ment.  Because they were determined using a nonquantifiable value
which is also the maximum reported value, this parameter is pre-
sented in Table 8-14 at a concentration not requiring treatment.

Wastewater analysis for gold was performed at one of three plants
considered in summarizing raw waste data for Table  8-10.   The
sample for which gold was analyzed contains 7.0 mg/1 of tungsten.
Gold and tungsten have been observed on several occasions  to
appear together on emission spectra.  Therefore, it As possible
that an analytical interference occurs between gold and tungsten.
This would explain the presence of gold in samples  known to
contain tungsten and which should not contain gold.

APPLICABLE TREATMENT TECHNOLOGIES

Based on the potential pollutant parameters selected and actual
treatment technologies observed within the electric lamp industry,
the following treatment technologies are recommended for pollu-
tant control within this subcategory:

          Chemical precipitation and sedimentation
                              VIII-67

-------
           Settling
           Reverse osmosis
           Sludge dewatering
           Final  pH adjustment
           Multimedia filtration
           Pressure filtration
           Contract removal

 These  technologies are discussed in detail in Section XI1 of this
 report.

 Recommended  Treatment Systems

 Alternative  waste treatment technologies  are presented for the
 electric  lamp  subcategory.  Treatment technologies are defined
 for process  wastes from the manufacture of fluorescent lamps,
 tungsten  filaments,  and quartz  mercury vapor lamps.   The following
 discussion presents  2 levels of waste treatment  for fluorescent
 lamp manufacture,  3  levels of waste treatment for filament manufac-
 ture,  and  1  level  of waste treatment for  quartz  mercury vapor
 lamp manufacture.

 Fluorescent  Lamps  -  Level 1 - Treatment of process wastewater
 for fluorescent  lamp manufacture requires only two levels of
 treatment  to achieve total recycle.   The  recommended Level 1
 treatment  system is  shown in Figure 8-8.   Level  1 treatment
 consists of  the  following:

           Settling of phosphor  wastes
           Chemical precipitation and sedimentation in a
           clarifier  of wet air  scrubber wastes using lime,
           a  coagulant aid, and  a polyelectrolyte
     .     Sludge  dewatering
     .     Final  pH adjustment
     .     Collection and  removal of  silicone coating
           wastes

 Level  2 -  Recommended treatment includes  the system  described
 for Level  1  with  two additions.   Level  2  treatment is shown
 in Figure  8-8  and  the additions are  as  follows:

           Total  recycle of treated wastes for the wet
           air  scrubber associated with  tin chloride  coating.

     .     Total  recycle of treated wastewater for glass
           tube brush scrub or sponge  wipe,  and rack  cleaning.

Tungsten Filaments - Level 1  -  Recommended treatment for  fila-
ment mandrel dissolution  is  shown in  Figure 8-9.   The Level  1
treatment  system includes:

           Chemical precipitation and  sedimentation in a
           clarifier  with  the  use of  lime,  ferric  sulfate,  a
           coagulant  aid,  and  a  polyelectrolyte
                                VIIl-68

-------
LEVEL 1
* Lime
Wet Air
Waste , i

Sponge Wipe "" ' '*"""
Brush Scrub &
Hack Clean " " 	
Phosphor a
Reprocessing
LEVEL 2

Wet Air ,,._,' 	
Waste i
Chemical
Precipitation
i '
Vacuum Filter
1 '
Contract Haul
Lime
Chemical
Precipitation
Return to
Process!
Sponge Wipe """ "" 	 1
or . 	 •. Settling — »
Brush Scrub &
Hack Clean 	 "•'"
Phosphor _
Reprocessing
Vacuum Filter

i
Contract Haul


Return to Process
"I



                                        FIGURE 8-8



                             FLUORESCENT LAMP WASTE TREATMENT
                                           VIII-69

-------
LEVEL 1
   Mandrel
Dissolution-
    Haste
                                    Ferric Sulfate
                                          &
                                        Lime

                                    	t
  Chemical
Precipitation
                                   Vacuum Filter
                                   Contract Haul
pH Adjustment
LEVEL  2
                                    Ferric Sulfate
                                         &
                                        Lime
   Mandrel
Dissolution-
    Haste
   Chemical
Precipitation
                                   Vacuum Filter
Contract
Haul
LEVEL 3
   Mandrel
Dissolution-
    Haste
Return to

Holding
Tank
1
EH
Adjustment
NoOH
to
pH 5
Process

Reverse
Osmosis
i
I
Pressure
Filtration
1


1
Contract Haul
1


Ferric Sulfate
S
Lime
Chemical
Precipitation
i

Vacuum Filter
i

Contract Haul
Multimedia . ..
Filtration

                                                  FIGURE  8-9

                                        FILflHIMT MANUFACTURE HASTE TREATMENT

                                                      vm-70

-------
          Sludge dewatering
          Final pH  adjustment

Level 2 - Recommended  treatment  consists  of  Level  1  treatment with
the addition of multimedia filtration  to  reduce  the  concentration
of suspended solids.   Multimedia filtration  for  effluent polishing
is used in many industries as  well  as  in  municipal treatment appli-
cations, and the technology  is readily transferable.   Level  2
treatment is also shown  schematically  in  Figure  8-9.

Level 3 - Recommended  treatment  consists  of  Level  2  treatment with
two additional processes.  The additions  are shown in  Figure 8-9
and comprise;

          pH adjustment  with sodium hydroxide to precipitate iron
          Pressure  filtration  to remove iron oxide precipitate
          prior to  reverse osmosis
          Reverse osmosis to concentrate  the wastes.
          Recycle of the permeate from the reverse osmosis to
          the process.

Quartz Mercury Vapor Lamps - Level  1 - Recommended treatment for
the acid cleaning of quartz  mercury vapor lamps  is presented in
Figure 8-10.  This  low volume  wet process was observed at only
one facility, Plant 28086.   It is not  known  if there are other
lamp manufacturing  facilities  employing a similar  process.   There-
fore, only Level 1  treatment is  recommended  for  quartz mercury
vapor lamp manufacture and includes wastewater collection and
contract removal.

Performance of In-Place  Treatment Systems

The performance of  treatment .components that have  been sampled
as in-place technology for the electric lamp subcategc-ry is
presented in Tables 8-12 and 8-17.   Filament mandrel dissolution
was observed and sampled at  four facilities.   Plants 19082,
28077, and 33202 employed pH adjustment of the final effluent
as their only wastewater treatment  process.   The fourth plant,
28086, had some additional treatment processes as  well.   These
processes are shown in Figure  8-5 and  performance  of the treatment
components is presented  in Table 8-17.  None of  the  three levels of
treatment recommended  for filament  manufacture has been observed
as in-place treatment  systems  within the  industry.  Performance of
in-place treatment  for fluorescent  lamp manufacturing  was observed
and sampled at one  facility, Plant  19121.  Discussion  and performance
of treatment technologies is presented  under the "Summary of Raw
Waste Stream Data"  section and in Table 8-12,  respectively.
                            VIII-71

-------
LEVEL 1
Quartz
Lamp fc
Cleaning
tfoeji-ia
Holding
Tank


Contract
Haul


                               FIGURE 8-10

                   Quartz Mercury Vapor Lamp Manufacture
                            Waste Treatment
                                 VUI-72

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                                             VIII-73

-------
 Performance of Recommended Treatment Systems
   <•
 Performance of the two levels of recommended treatment for fluor-
 escent  lamp manufacture is presented in Table 8-18.  Performance
 of  the  three levels of recommended treatment for tungsten filament
 manufacture is presented in Table 8-19.  Performance is based on
 sampling  data obtained from visited plants in the E&EC Category as
 well  as data from plants from other industries with similar wastes
 and treatment.  Because of similarity in raw waste characteristics
 to  other  industries,  the performance of treatment technologies
 in  other  industries is applicable to the E&EC Category.  Performance
 of  the  individual treatment components is presented in Section XII.

 A Level 1 treatment system for fluorescent lamp manufacture was
 not observed in-place at any of the visited plants and thus per-
 formance  of the recommended treatment system is transferred from
 other industries.  However, phosphor settling of glass tube and
 rack  rinse wastes was observed and sampled at Plant 19121.  Sampl-
 ing data  for gravitational settling of phosphors was presented in
 Table 8-12.   The raw  waste sample and flow rate does not include
 equipment and floor wasdowns which were not obtained during the
 sampling  effort.   The effluent does contain all wastewater sent
 through the settling  tank.   Therefore, true performance of this
 treatment technology  is not complete.  In addition, retention time
 for the gravitational settling of phosphors was at most twenty
 minutes if based only on the known flow rate entering the settling
 tank.   The additional unknown flow rate from equipment and floor
 washdowns will reduce the retention time below twenty minutes.

 Level 2 treatment for fluorescent lamp manufacturing does not
 include any treatment technology additional to the recommended
 Level 1 treatment system.   Pollutant discharge is eliminated by
 total recycle of  treated wastes.   Level 2 treatment for fluorescent
 lamp  manufacture  was  observed but not sampled at Plant 33189.  This
 treatment system is.known to exist as in-place treatment at two
 other fluorescent lamp manufacturing facilities.

 None  of the  three levels of recommended treatment for tungsten
 filament  manufacture  have been observed as in-place treatment
 and performance of  the recommended treatment systems is trans-
 ferred  from other industries.  This performance is presented in
 Table 8-19.   Levels 2 and 3 treatment for tungsten filament manu-
 facture employ the  addition of a multimedia filter to the Level
 1 treatment  system.   This improves metals removal while lowering
 the total  suspended solids  level.   This occurs because some of
 the metal  hydroxide precipitates  will be further removed by the
multimedia filter.  In addition,  Level 3 utilizes reverse osmosis
 to  concentrate wastes and produce a treated permeate for process
 reuse.  It is estimated that 85 percent of the treated wastewatef
will  be returned  to process.

-------
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-------
Recommended treatment for quartz mercury vapor lamp manufacturing
was not observed in-place.  However, recommended treatment is based
on a low volume lamp cleaning process which occurs at Plant 28086.

Estimated Cost of Recommended Treatment Systems

The determination of estimated costs for recommended treatment
system components is discussed in Section XIII of this report.
Tables 8-20 through 8-28 show the estimated costs for each of
the recommended treatment systems discussed previously for the
electric lamp subcategory.  Costs have been estimated for Levels
1, 2, and 3 recommended treatment for filament manufacture and
Levels 1 and 2 for fluorescent lamp manufacture.  The variations
in system costs resulting from changes in system flow rate are re-
presented by using three flow rates for filament manufacture and
two flow rates for fluorescent lamp manufacture.  The three fila-
ment manufacturer flow rates represent small, medium, and large
size facilities.  The two fluorescent lamp manufacturer flow rates
represent medium size facilities.  These treatment system costs
reflect complete installation of the recommended treatment systems
and do not account for treatment in-place at electric lamp faci-
lities.  Quartz mercury vapor lamp manufacture was observed at
one facility, Plant 28086.  Cost of treatment is presented for a
flow rate of 606 I/day (160 gpd).  Because the flow rates and
number of facilities manufacturing quartz mercury vapor lamps
are expected to be small, further costs for benefit analysis are
not presented.

BENEFIT ANALYSIS

This section presents an analysis of the industry-wide benefit
estimated to result from applying the three levels of treatment
previously discussed in this section to the total process waste-
water generated by the electric lamp subcategory.  This analysis
estimates the amount of pollutants that would not be discharged
to the environment if each of the three levels of treatment were
applied on a subcategory-wide basis.  An analysis of the benefit
versus estimated subcategory-wide cost for each of the treatment
levels will also be provided.

Industry-wide Costs

By multiplying the annual and investment costs of each level of
treatment at various flow rates by the number of plants in each
flow regime in the industry, subcategory-wide annual and invest-
ment cost figures are estimated (Tables 8-29 and 8-30).  These
figures represent the cost of each treatment level for fluorescent
lamp and tungsten filament manufacture contained within the electric
lamp subcategory.  This calculation does not make any allowance for
waste treatment that is currently in-rplace at electric lamp
facilities.
                             VIII-77

-------
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                              TABLE 8-29

                     Industry-Wide Cost Analysis


                          Fluorescent Lamps


                                         Level 1      Level 2

Investment (Thousands of Dollars)        2463.831     2156.814

Annual Costs (Thousands of Dollars)

   Capital Costs                          207.739      181.851
   Depreciation                           492.766      431.363
   Operation and Maintenance              193.167      179.531
   Energy and Power                        14.856       10.567

Total Annual Cost (Thousands of           908.528      623.781
   Dollars)

Discharge Flow (million I/year)           251.597        0
                              VIII-87

-------
                         TABLE 8-30

                Industry-Wide Cost Analysis


                     Tungsten Filaments
Investment (Thousands
  of Dollars)

Annual Costs (Thousands
   of Dollars)
Level 1

3860.397
Level 2

4537.570
Level 3

5982.878
   Capital Costs          325.491
   Depreciation           772.079
   Operation and          286.747
   Maintenance
   Energy and Power        23.175

Total Annual Cost (Thou-
  sands of Dollars)      1407.792
Discharge Plow
   (million I/year)
 557.531
              382.588
              907.514
              356.553

               26.177
1672.832

 557.531
              504.447
             1196.575
             1187.971

               73.825
2962.818

  83.630
                                   VIII-88

-------
Industry-wide Cost and Benefit

Tables 8-31 and 8-32 present  the  estimate  of  total  annual  cost
to the electric lamp subcategory  to  reduce pollutant  discharge.
This table also presents the  benefit of  reduced  pollutant  discharge
for the electric lamp subcategory resulting from the  application
of the three levels of recommended treatment.  Benefit  was
calculated by multiplying the estimated  number of gallons  discharged
by the subcategory times the  performance attainable by  each  of
the recommended treatment systems as shown in Table 8-18.
Values are presented for each of  the selected subcategory  pollutant
parameters.

The column "Raw Waste" shows  the  total amount of pollutants  that
would be discharged to the environment if  no  treatment  were  employed
by any facility in the industry.  The columns "Levels 1,2, and 3
treated effluent" show the amount of pollutants  that  would be dis-
charged if any one of these three levels of treatment were applied
to the total wastewater estimated to be  discharged  by the  electric
lamp subcategory.

The total amount of wastewater discharged  from each level  of
treatment is also presented in this  table  to  indicate the  amount
of process wastewater to be recycled by  each of  the three  levels
of treatment.  Process wastewater recycle  is a major  step  toward
water conservation and reduction  in  pollutant discharge.
                             VIII-89

-------
Parameter

Flew (million I/year)

114.  Antimony
118.  Cadmium
122.  Lead
      Tin

Total Suspended Solids

Total Annual Cost (thou-,
   sand dollars) ,
                                     TABLE 8-31

                                   Cost and Benefit

                                  Fluorescent Lamps
                           Raw Waste
                           (kg/year)
251.597
               Level 1 Treated
               Effluent
               (kg/year)
251.597
115.231
77.403
34.180
5528.592
35978.371

12.580
3.019
12.580
31.701
4478.427
908.528
                      Level 2 Treated*
                      Effluent
                      (kg/year)
                                         0
                                         0
                                         0
                                         0
                                       623.781
* =* Level 2 Pollutant Discharge Eliminated With 100% Reuse Of Treated
    Process Wastewater
                                  VIII- 90

-------
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-------
                           SECTION IX

            ELECTRON TUBE SUBCATEGORY DISCUSSION
INTRODUCTION

This discussion of the electron tube industry consists of the
following major sections:

          Products
          Size of the Industry
          Manufacturing Processes
          Materials
          Water Usage
          Production Normalizing Parameter
          Waste Characterization and Treatment in Place
          Potential Pollutant Parameters
          Applicable Treatment Technologies
          Benefit Analysis

Data contained in this section were obtained from several sources.
Engineering visits were made to five plants within  the subcategory.
Wastewater samples were collected from three of  these five  facili-
ties.  A total of thirty-six electron tube manufacturing plants
were contacted by telephone.  A literature survey was also  conducted
to ascertain differences between types of electron  tube products, pro-
cess chemicals used, and typical manufacturing processes.

PRODUCTS

Electron tubes are devices  in which electrons or ions are con-
ducted between electrodes through a vacuum or ionized gas within
a gas tight envelope which  may be glass, quartz, ceramic, or
metal.  Electron tubes depend upon two basic phenomena for  their
operation.  The first is the emission of electrons  by certain
elements and compounds when the energy of the surface atoms is
raised by the addition of heat, light photons, kinetic energy of
bombarding particles, or potential energy.  The  second phenomenon
is the control of the movement of these electrons by  the force
exerted upon them by electric and magnetic fields.  The three
types of electron tubes which are to be discussed in  this section
are:

          Receiving type electron tubes
          Television picture tubes
      .    Transmitting type electron tubes

Receiving type electron  tubes  (Reference Figure  9-1)  are noted
for  their low voltage and low power applications.   They are used
in radio and television  receivers, computers, and sensitive
                            IX-1

-------
                     exhaust tip
                getter
   screen grid
suppressor grid
 glass-metal seal
                                  base pin
                 FIGURE  9-1





               RECEIVING TUBE
                     IX-2

-------
control and measuring equipment.  Structurally, electron tubes
are classified according to the number of electrodes they contain.
The electrodes are usually made of nickel mounted on a base
penetrated by electrical connections and are encapsulated in a
glass or metal envelope which is evacuated.  The tube is evacu-
ated to 10  mm of mercury and the electrodes and/or the envelope
is heated to remove absorbed gases.  The passage between the
tube and pumping system is sealed off.  A getter material (usually
magnesium, calcium, sodium, or phosphorus) previously introduced
in the evacuated envelope is flashed.  Flashing occurs by applying
an electric current to the electrodes of the tube for several
seconds.  The getter material condenses on the inside surface
and absorbs any gas molecules.  The result is that the vacuum
within the tube becomes progressively stronger until an equili-
brium value of 10  mm is reached.

Television picture tubes function by modification of a horizontal
scanning of high velocity electrons striking a luminescent
surface.  The number of electrons in the stream at any instant
of time is varied by electrical impulses corresponding to the
transmitted signal.  A typical color television tube is shown in
Figure 9-2.

The tube is a large glass envelope.  A special composition of
glass is used to minimize optical defects and to provide electri-
cal insulation for high voltages.  The structural design of  the
glass bulb is made to withstand 3-6 times the force of atmos-
pheric pressure.  The light-emitting screen is made up of small
elemental areas, each capable of emitting light in one of the
three primary colors (red, green, blue).  An electron gun for
each color produces a stream of high velocity electrons which is
aimed and focused by static and dynamic convergence mechanisms
and an electro-magnetic deflection yoke.  An aperture mask
behind the face of the screen allows phosphor excitation according
to incident beam direction.  Commercially available aperture
mask tubes are manufactured in a number of sizes.

Transmitting type electron tubes are characterized by the use
of electrostatic and electromagnetic fields applied externally
to a stream of electrons. There are several different types  of
transmitting tubes.  They generally are high powered devices
operating over a wide frequency range, are larger and struc-
turally more rugged than receiving tubes, and are completely
evacuated.  Figure 9-3 is a diagram of a klystron tube, which is
typical of a transmitting type tube.  In a klystron tube, a
stream of electrons from a concave thermionic cathode is focused
into a smaller cylindrical beam by the converging electrostatic
fields between the anode, cathode, and focusing electrode.   The
beam passes through a hole in the anode and enters a magnetic
field parallel to the beam axis.  The magnetic field holds the
beam together, overcoming the electrostatic repulsion between
electrons.  The electron beam goes through the cavities of the
klystron, emerges from the magnetic field, spreads out and is
                              IX-3

-------
               mask
                  three
                 electron
                  beams
              special
           glass bulb
     static and dynamic
       convergence
         of three
      electron beams
        (magnetic)
  base
/•onnections
      three
     electron
      guns
      electromagnetic
       deflection yoke
high-voltage contact
                fluorescent light-emitting
                   three-color screen
                    (with aluminum
                    mirror backing)
              FIGURE 9-2


 COLOR  TELEVISION PICTURE TUBE
                      IX-4

-------
    collector
fully bunched
    electrons
     input
    coaxial
 transmission
     line
      high
    voltage
    supply
    spreading
    electron  beam

      magnetic polepiece

           output catcher
        ^s cavity

             output
             waveguide

             output
             coupling ins

             antibunch

             electron bunch
             forming

             intermediate
             cascade cavity

             iron magnet
             shell

             electromagnet
             solenoid coil

             input buncher
             cavity

             anode
            converging
            electron beam

          focus electrode

        insulating bushing

     thermionic cathode

  heater filament

heater leads
                             FIGURE  9-3
                       TRANSMITTING TUBE
                                 IX-5

-------
stopped  in  a  hollow  collector where  the  remaining  kinetic  energy
pf  the electrons  is  dissipated  as  heat.

The electron  tube  subcategory includes products  which  were
classified  under  SIC 3671,  Electron  Tubes, Receiving Type;  SIC
3672, Cathode Ray  Picture Tubes; and SIC 3673, Electron Tubes,
Transmitting  Type.   These industries have been included under
SIC 3671 by the Department  of Commerce for their Census of
Manufactures  for  the year 1977.  The three SIC groups  have been
classified  together  because of  the declining  size  of the industry,
The major products of the electron tube  subcategory are as
follows:

      .    Receiving  Type Electron  Tubes

          Television Picture Tubes
               -     Color Picture  Tubes
               -     Black and White  Picture Tubes
               -     Rebuilt Picture  Tubes

      .    Transmitting Type Electron Tubes
               -     Power and Special Tubes
                         Vacuum Tubes
                         Gas and Vapor Tubes
                         Klystrons
                         Magnetrons
                         Traveling Wave  Tubes
               -     Light Sensing  Tubes
                         Camera Tubes, Photoemissive and
                         Photoconductive
                         Image Intensifiers and  Converters
                         Photomultipliers
               -     Light Emitting Devices
                         Storage Tubes
                         Cathode-Ray Tubes, Industrial and
                         Military

SIZE OF INDUSTRY

This discussion estimates the number of  plants and the number of
employees for plants  engaged in the  manufacture  of electron
tubes, SIC  3671.

Number of Plants

It is estimated that  143 plants are  engaged in the manufacture of
electron tubes.  This estimate is  from the Department of Commerce
1977 Census of Manufactures (Preliminary Statistics).
                             IX-6

-------
Number of Employees

It is estimated that 27,200 production employees are engaged in the
manufacture of electron tubes.  This estimate is from the Department
of Commerce 1977 Census of Manufactures  (Preliminary Statistics).

Production Rate

The total number of electron tubes produced is not available.  How-
ever, partial information was obtained from the Department of Commerce
1977 Census of Manufactures.  This information is summarized in,Table
9-1.

MANUFACTURING PROCESSES

Discussion of electron tube manufacturing is arranged by the primary
electron tube types:  Receiving, Television Picture, and Transmitting.

Receiving Tube Manufacture

The manufacture of a receiving tube is similar to that of a transmit-
ting tube and is depicted schematically  in Figure 9-4.  Raw materials
required for receiving tube manufacture  include glass envelopes,
kovar and other specialty metals, tungsten wire, and copper wire.
The metal parts are punched and formed,  chemically cleaned, and
electroplated with copper, nickel, chromium, gold, or silver.  The
iron or nickel cathode is coated with a  getter solution.  The metal
pacts are hand assembled into a tube mount assembly.  Glass parts for
the tube base are cut and heat treated.  Copper lead wires are sealed
in the "glass mount" machine.  The glass mount piece is then heat
treated by baking in an oven.  The metal tube mount assembly is then
hand welded to the glass mount piece.  The upper glass bulb is rinsed.
On a "sealex" machine, the bulb is evacuated, sealed, and the glass
extensions are cut off.  The glass exterior is rinsed and the com-
pleted tube is aged, tested, and packaged.

Television Picture Tube Manufacture

The manufacture of a television picture  tube is a highly complex,
automated process as depicted in Figure .9-5.  Television picture
tubes comprise four major components:  the glass panel, steel aper-
ture mask, glass funnel, and the electron gun mount assembly.  The
glass panel is the front of the picture  tube through which the picture
is viewed.  The steel aperture mask is used to direct the electron
beam to the phosphor coated glass panel.  The glass funnel is the
casing which extends back from the glass panel and is the largest
component of the picture tube.  The mount assembly is attached to
the funnel and contains the electron gun and the electrical base
connections.  Most manufacturing operations utilizing a chemical
process will be accompanied by one or several water rinses.

Manufacture of a television picture tube begins with a steel aperture
mask degrease.  Steel aperture masks are produced at other facilities,
received by the picture tube manufacturer, formed to size, solvent
degreased, and oxidized.  The steel aperture masks are inserted
within the glass panel which is commonly referred to as a panel-mask
"mate".  The panel-mask mate is annealed and the mask is removed.
                              IX-7

-------
                            TABLE 9-1
             PRODUCTS AND PRODUCT CLASSES, QUANTITY
             AND VALUE OF SHIPMENTS BY ALL PRODUCERS
                    0? ELECTRON TUBE PRODUCTS
SIC
3671
 Receiving Tubes, All
   Types (except Cathode-
   Ray Tubes)
 Receiving Tubes, Not
   Specified by Kind
                              Millions of Tubes
                               Per Year (1977)
                                    90.4

                                     N/A
     Television Picture Tubes
       Color, New                    7.7
       Color, Rebuilt; Black and
         White, New; Black and
         White, Rebuilt              5.6

     Television Picture Tubes,
       Not Specified by Kind        N/A

     Transmitting Tubes
       Power and Special Tubes
         Vacuum Tubes              2151.3
         Gas and Vapor Tubes       8223.0
         Klystrons                   51.9
         Magnetrons                 138.2*
         Traveling Wave Tubes        37.8

       Light Sensing Tubes
         Camera Tubes, Photoemissive
           and Photoconductive       273.6
         Image Intensifiers and
           Converters                 45.8
         Photomultipliers            310.7

       Light Emitting Devices
         Storage. Tubes                42.3
         Cathode Ray Tubes,
           Industrial and Military   717.0

       Other Special Purpose Tubes     X
                                                   Value in
                                              Millions of Dollars
                                                    (1977)
 92.3

 13.6


513.9


 77.1


  1.4
                                                     74.7
                                                     33.7
                                                     48.1
                                                     56.1
                                                     90.3
                                                     34.9

                                                     30.8
                                                     20.3
                                                     18.3

                                                     61.2

                                                     76.1
N/A
X
  Not Available
  This number does not include pulsed, fixed, and tunable
  magnetrons.
  Data Not Collected
                              IX-8

-------
                                 Metal Components
    Glass Tubes
         J
                                      Metal
                                      Form


ad
res
1
' m.





Glass
Cut
t
Anneal
t
Glass
Mount
Machine



Catl
1
aet
Co



a



iod
f
ter
at

'





e

--*-







Parts
Clean
t
Electroplate
t
Tube Mount
Assembly


Weld
Components
                                     Glass Tube
                                        Rinse
                                      Exhaust &
                                        Seal	
                                     Glass Tube j_
                                        Rinse .  I
                                         I
                                      Age  &
                                       Test
                                        Ship
                                         T
'•—**"= Denotes Water
          Plow Path
                                     Figure 9-4

                               RECEIVING TUBE MANUFACTURE
                                 IX-9

-------
  PANEL HASH
                                      Glass  Panels
Aperture Masks

       J
    Mask
   Degrease
                                       Panel and
                                       Mask Mace
                      Rejected.
                       Panels
PHOTORESIST APPLIGYTICN
	
—
—
Anneal
1
Panel
i

Mash
1
1 Photoresist
Application
i
Panel
Mask

and
Hate
Mask
—
!

                                                                                               PICTURE TUBE RECLAIM
                                      Spent
                                   Picture Tubes
                                                                                                     Eanel-FunneJl
                                                                                                       Defrit   I
HIOSHOR APPLICATION
Rejected"
Panels

—
Light
Exposure


1 Phosphor-
Application
f
Panel and
Mask Mate

—
Mask


                                                                Mask
'


Panel
Clean


Panel-Mask
Separation



*

_J
—El
Mask |_
Clean |




inel
can
                                                                                                    Return to
                                                                                             Picture Tube Manufacture
                                                                                                    .».     Electron Gun
                                                                                     Figure 9-5

                                                                         TELEVISION PICTURE TUBE MRNUFACTURE

-------
The  glass  panels  proceed  to  panel  wash.   Panel  wash includes  several
hydrofluoric-sulfuric  acid glass washes  and  subsequent  water  rinses.
The  panels  are  then  sent  to  photoresist  application.  The glass
panels  are  coated  with a  photoresist  and the masks  are  mated  to  the
panel.  The panel  is then exposed  to  light through  the  mask.   The
mask is removed,  and the  panel  is  developed.  The panel is graphite
coated  and  cleaned in  a hydrofluoric-sulfuric acid  solution.   The
panel at this point  has surrounding clear dots  onto which the
phosphors  will  be  deposited.  The  panels then proceed to phosphor
application.  The  panels  undergo another photoresist application.
Phosphors  are then deposited  onto  the panels applying each of the
three phosphor  colors  to  their  respective clear dots on the panel
matrix.  The panel and mask  are mated and the panel is  exposed to
light.  The mask  and panel are  separated, and the panel is developed,
lacquer coated  to  seal the phosphors,  aluminum  is vacuum-deposited
to enhance  reflection,  the mask is mated with the panel,  and  the
panel is cleaned.

Glass funnels are  cleaned and coated  with graphite.  Electron shields
are  degreased arid  attached to the  panel.  Panel-mask assemblies
and  glass  funnels  are  then joined  together using a  heat-fused lead
frit, followed  by  annealing.  The  electron gun  mount is cleaned,
aged, and  heat  sealed  to  the  base  of  the funnel.  At this stage  the
assembled panel, funnel,  and  mount are termed a "bulb."  The  bulb  is
exhausted,  sealed, and aged  by  applying  current to  the  cathode.
The  tube is tested, an external graphite coating is applied,  and an
implosion band  is  secured to  the tube.   The  tube is retested  before
shipment to facilities that  assemble  television sets.

Panels  may  be rejected upon  inspection at many  points along the
manufacturing process.  If completely rejected,  panels  may be sent
back to the panel  wash at the beginning  of the  manufacturing  sequence.
If panels need  only to be "rescreened",  they are returned to  the
phosphor application process.

In addition, there may or may not  be  a picture  tube salvage area to
reclaim spent picture  tubes.  Wet  processes  include a panel-funnel
acid defrit, acid  cleaning of panels  and funnels, and cleaning of
aperture masks.  These reclaimed components  are returned  to process
for  reuse.

Transmitting Tube Manufacture

The  manufacture of a typical  transmitting tube  presented  schematically
in Figure 9-6 is typified by  a  magnetron.  Intricately  shaped and
machined copper and steel parts are cleaned  and rinsed.   Some of
these parts are then electroplated using  materials  such as copper,
gold, and silver.  Assembly of  the electron  tube is  generally a
manual operation.  The  electron tube  components consist of the metal
parts, a tungsten  filament, a glass window,  and a glass tube.  The
components  undergo a number of  soldering, brazing,  welding, heat
treating,  and polishing operations.   A significant  energy user is
the  heat treating  area with associated non-contact  cooling water.
The  assembled electron tube undergoes  an extensive  series of  elec-
trical and  mechanical  testing procedures  and  an aging process before
final shipment.   There  are specialized types  of transmitting  type
                               IX-11

-------
                               Metal Components
                                    Metal
                                    Form
                                    Parts
                                    Clean
Glass
Tube
Glass   Filament
Window
ube    window     I
I        I        I
                                       i
                                 Electroplate
                                       I
                                    Solder
                                     Braze
                                     Weld
                                     Anneal
                                       I
                                    Evacuate
                                    & Seal
                                    Polish
                                     Age &
                                      Test
                                       I
                                     Ship
                                       t
         Denotes Water
           Flow Path
                                  Figure 9-6
                           TRANSMITTING TUBE MANUFACTURE
                                  IX-12

-------
electron tubes, such as image intensifiers, that are produced in a
manner similar to that of a magnetron.  However, there are two
wet processes utilized in addition to those depicted in Figure 9-6.
These additional wet processes include alkaline cleaning-rinsing
and alcohol dipping-rinsing of ceramic or glass envelopes brazed
to metal; and acid cleaning of glass tube bodies.  Because these
processes are known to exist at only one facility, they are not
included in Figure 9-6 as processes common to most transmitting
type electron tube manufacture.

MATERIALS

The materials used to manufacture all types of electron tubes
(SIC 3671) are classified as raw materials and process materials.
The raw materials are conductors, wire leads, encapsulating mater-
ials, inert gases, glass funnels and panels, masks, photosensitive
materials, phosphors, and various solders and pastes.  Raw materials
and process materials consist of the following:

          Conductors - Copper and steel basis materials with
          various plated surfaces such as copper, nickel, gold,
          silver, and chromium are used extensively in electron
          tube manufacture.  These materials are used because
          they are good conductors and/or supporting mediums,
          are easily shaped and formed, and are most cost
          effective.

          Leads - Copper and nickel are the most common material
          for electron tube leads.  Often the leads are a simple
          extension of one of the conducting electrodes.

          Encapsulating materials - Glass, ceramics, and various
          metals such as steel are used for electron tube 'encap-
          sulating materials.  These materials provide overall
          structural strength and assure integrity of the applied
          vacuum or gas filling.

     .    Inert gases - Electron tubes may either be filled with
          special inert gases such as neon, argon, and krypton
          or completely evacuated.  Either method provides a
          dielectric medium of a predetermined resistance to the
          flow of electrons.
         ! •    ' •
          Glass funnels and panels - Special glass is used to
          enhance optical and electrical characteristics while
          maintaining reasonable strength with minimum weight in
          television picture tubes.

          Mask - The steel aperture mask is placed behind the
          panel and is used to allow electron beams to strike
          the phosphors selectively on the panel in a color
          television picture tube.
                              IX-13

-------
Photosensitive materials - These materials are used to
prepare the glass surface for phosphor application.
The solution commonly contains dichromate, an alcohol,
and other proprietary substances.  Developer solutions
often are composed of hydrogen peroxide and/or deion-
ized water.

Phosphors - Phosphors are the heart of color tele-
vision picture tube performance.  Common phosphor
materials include cadmium sulfide, zinc sulfide,
yttrium oxide, and europium oxide.  Many proprietary
processes have been observed in applying these mate-
rials as red, green, and blue phosphors to the glass
panel.  Application of the phosphors themselves and
many of the associated operations produce wastewater
discharges containing priority and other pollutants.

Protective Coatings - Toluene based lacquer and silicate
coatings are commonly applied over the phosphor coatings
in picture tubes.  These processes seal the phosphors
in place protecting them from damage.

Graphite coatings - These materials are applied to
inner surfaces of the panel and funnel to prevent
reflection within the picture tube.

Solders - The assembly of the picture tube is a highly
mechanized process whereby the four basic parts of the
picture tube are held together with various solders.
The most prominent solder used in picture tube manu-
facture contains lead oxide and is used to fuse the
glass panel and funnel together.

Process materials - Acids, plating solutions and
various types of solvents are used in the manufacture
of all types of electron tubes.  Acids, such as
hydrofluoric, hydrochloric, sulfuric, and nitric, are
used primarily in cleaning and conditioning of metal
parts and glass encapsulating materials.  A number of
these metal parts are electroplated with a variety of
highly conductive metals such as gold, silver, copper,
nickel, and chromium.  Solvents such as methylene
chloride and trichloroethylene are used in a number of
clean-up operations for receiving and transmitting
tubes.  Color picture tubes use solvents, such as
methylene chloride, trichloroethylene, methanol,
isopropanol, acetone, and polyvinyl alcohol.  These
solvents are used primarily in cleaning processes such
as aperture mask degreasing as well as phosphor appli-
cation and development steps.
                        IX-14

-------
WATER USAGE

Process water  is used  in  solutions  and  rinses  associated  with
electroplating of anodes/  cathodes,  and grids.  Water  is  also
used to wash glass and  ceramic  tube bodies  both before and  after
seating to the base, or at the  conclusion of the  manufacturing
process.

Receiving and  transmitting electron tube manufacturing processes
produce wastewater discharges primarily through metal  finishing
operations which are covered under  the  Metal Finishing Category.
A number of ancillary operations such as deionized water  back-
wash, cooling  tower blowdown, and boiler blpwdown contribute
sizeable discharge rates  compared to metal  finishing operations.
                                                     *
In addition, there are  some isolated instances of plants  manu-
facturing specialized transmitting  type electron  tubes such as
image intensifiers and  photomultipliers that require process water.
Alkaline cleaning and acid etching  of glass-metal and  ceramic tube
components discharge process wastewater as  a result of alkaline
and acid bath dumps and their associated water rinses.  These wet
processes are similar to  several found  in television picture tube
manufacture.  There is  also a glass tube rinse or rinses  which
conclude the manufacture  of receiving tubes.  These are intended to
remove surface particutates and dust deposited on the  tube  body
during the manufacturing  process.

Wastewater producing operations for manufacture of television picture
tubes and other types of  cathode ray tubes  are unique  and sizeable.
Process wastewater sources include  both bath dumps and subsequent rin-
sing associated with:   glass panel  wash, aperture mask degrease,
photoresist application,  phosphor application, glass funnel and
mount cleaning, and tube  salvage.   In addition, there  is  process
wastewater at those facilities manufacturing aperture  masks by a
chemical etching process  which  is also  followed by rinsing.
Segregation of process  wastewater to obtain flow  rates and  dispo-
sition is very difficult  because of the proprietary nature  and large
size of picture tube manufacturing  facilities.

PRODUCTION NORMALIZING  PARAMETERS

Production normalizing  parameters are used.to relate the  pollutant
mass discharge to the production level  of a plant.  Regulations
expressed in terms of this production normalizing parameter are
multiplied by the value of this parameter at each pla'nt to  deter-
mine the allowable pollutant mass that  can  be discharged.   However,
the following problems  arise in defining meaningful production nor-
malizing parameters for electron tubes:

          Size, complexity and other product attributes affect
          the amount of pollution generated during manufacture
          of a unit.
                              IX-15

-------
.    Differences in manufacturing processes for the same
     product result in differing amounts of pollution.

.    Lack of applicable production records may impede
     determination of production rates in terms of desired
     normalizing parameters.

Several broad strategies have been developed to analyze applicable
production normalizing parameters.  They are as follows:

     .    The process approach - In this approach, the production
          normalizing parameter is a direct measure of the produc-
          tion rate for each wastewater producing manufacturing
          operation.  These parameters may be expressed as sg.m.
          processed per hour, kg of product processed per hour, etc.
          This approach requires knowledge of all the wet processes
          used by a plant because the allowable pollutant discharge
          rates for each process are added to determine the allowable
          pollutant discharge rate for the plant.  Regulations based
          on the production normalizing parameter are multiplied by
          the value of the parameter for each process to determine
          allowable discharge rates from each wastewater producing
          process.

          Concentration limit/flow guidance - This strategy limits
          effluent concentration.  It can be applied to an entire
          plant or to individual processes.  To avoid compliance
          by dilution, concentration limits are accompanied by
          flow guidelines, in turn, are expressed in terms of the
          production normalizing parameters to relate flow discharge
          to the production rate at the plant.

Discussion of production normalizing parameters for the electron
tube subcategory will be restricted to television picture tubes.
Other types of cathode ray tubes and electron tubes have wet
processes other than meta finishing operations.  These wet
processes are also common to those found in television picture
tube manufacture.  However, they do not have manufacturing
operations that are as diverse or require as much process water
as those involved in television picture tube manufacture.
Therefore, a discussion of television picture tubes will encom-
pass wet processes common to other electron tube manufacture.

Potential candidates for production normalizing parameters for
television picture tube manufacturing include surface area of
product processed, number of picture tubes processed, and amount
of process chemicals consumed.  Surface area processed has been
determined to be the best production normalizing parameter for
picture tube manufacturing.

Area Processed

Three picture tube components use wet manufacturing processes:
glass panels, glass funnels, and steel aperture masks.  There are
three wet processes directly involved with glass panels:  panel wash,
photoresist application, and phosphor application.  All of these wet


                              IX-16

-------
 processes have associated rinses.  The pollutant discharge from each
 of these three wet processes is directly related to the surface area
 of the glass panel.

 Aperture masks, used in conjunction with the panel to produce a
 visual image, are manufactured by a chemical etching and rinsing pro-
 cess,  commonly employing ferric chloride.  The aperture masks are
 subsequently detergent degreased and rinsed at the tube assembly plant.
 Every  glass panel processed has an accompanying aperture mask
 which  has the same surface area as the panel.  Thus, the mass of
 wastewater pollutants resulting from aperture mask manufacture
 is proportional to the panel area.

 Pollutant discharge from the glass funnel washes and rinses do not
 directly reflect the surface area of the glass panel.   However,
 there  is a specific funnel for every panel size, so that the sur-
 face areas of the panels and funnels are in direct proportion to
 each other.

 Tube salvage is an additional operation observed at two picture
 tube plants.   Tube salvage uses wet processes that have pollut-
 ant mass discharges that reflect the surface area of the glass
 panels.   Expended picture tubes are separated into panel and
 funnel by a nitric acid defritting and rinsing process.  This
 process  breaks the bond holding the funnel to the panel.  This
 bonded area is a function of the circumference of the  glass panel,
 and is thus  in proportion to its surface area as well.   Other tube
 salvage  wet processes are:   stripping the funnel and panel surface
 coatings in a sodium hydroxide solution; glass panel and funnel
 hydrofluoric  acid cleaning and aluminum oxide or iron  oxide buf-
 fing;  and aperture mask cleaning in a morpholine solution.   All
 of  these processes have associated water rinses.  The  amount of
 material removed,  and thus the pollutant mass discharged,  is in
 direct proportion to the surface area of the panel.

 The manufacture of transmitting electron tubes such as  image inten-
 sifiers  and photomultipliers use wet processes that discharge waste-
 water  pollutants  at a rate that is directly related to  surface area.
 The inner glass or ceramic envelope is alkaline cleaned, water rinsed,
 alcohol  dipped,  and water rinsed.   The outer glass tube body is acid
 cleaned  and rinsed.   In both cases, the entire surface  area of the
 component is  processed.   Surface area of each electron  tube processed
 together with a production rate yields a total surface  area
 processed.

 Number of  Picture  Tubes Processed

As  in  lamp manufacturing,  the  number of units produced  cannot stand
 alone  as  a production normalizing  parameter because  of  varying pro-
duct sizes and  types  which  affect  the pollutant mass discharged.
However, when the  number of  units  produced  is used in conjunction
with the processed  area for  each picture tube type*  a total processed
area is  easily  determined  for  use  in calculating allowable  mass
discharge.
                               IX-17

-------
Amounts of Process Matecials and Chemicals Consumed

Process chemical usage varies considerably for picture tube manufacture,
In particular, photoresist and phosphor applications have formulations
for process materials and chemicals in accordance with individual
plant specifications and types of tubes produced.  One example of
process chemical variation is the different phosphors used for green
cathode-ray tubes, black and white picture tubes, and color picture
tubes.  In addition, both the composition and consumption of both
photoresist and phosphors is considered proprietary.  Thus, no direct
correlation can be made between pollutants discharged and process
materials and chemicals used, which eliminates process materials
and chemicals as a production normalizing parameter.

WASTE CHARACTERIZATION AND TREATMENT IN PLACE

This section will present the sources of waste in the electron tube
subcategory and sampling results of this wastewater.  The in-place
waste treatment systems will also be discussed and effluent sample
data from these systems will be presented.

Process Descriptions and Water Use

There are ten wet processes used by the electron tube industry.
Seven of the wet processes are characteristic of television
picture tube and other types of cathode ray tube manufacture.
Other cathode ray tube manufacture employs many but  not  all of
those wet processes found in television picture tube manufacture.
Therefore, discussion of wet processes for these two product
types will be limited to television picture tube manufacture.
Two of the three remaining wet processes are known to exist for
transmitting type electron tube manufacture.  The third  remaining
wet process is known to exist for receiving type electron  tube
manufacture.  The wet processes are:
Television Picture Tubes

   Panel Wash and Rinses
.  Aperture Mask Degrease  and
     Rinses
.  Photoresist Application and
     Rinses
   Phosphor Application and Rinses
   Funnel and Mount  Cleaning and  Rinses
   Tube Salvage and  Rinses
   Aperture Mask Formation and  Rinses
Transmitting Electron Tubes

   Acid Etch and Rinses
   Alkaline Clean and
     Rinses

Receiving Electron Tubes

   Glass Tube Rinse
The  electron  tube  manufacturing  processes  that employ water in
their  operations are  described  below.   Wastewater generation
depends  upon  product  type,  production  rate,  size  of facility,.
aad  degree  of automation.   Table 9-2 presents product type, wasfce-
vater  producing manufacturing processes,  volume of water used,  and
number'of employees for those plants contacted within the electron
tube industry.
                               IX-18

-------
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                                 a-
                                 (N
                               I
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                                                 CM
                                                 OI
                                                     IX-19

-------
Television Picture Tube Processes -  Picture tube manufacturing is
a highly automated operation involving .many water consuming processes.
Picture tubes consist of four major components:  the glass panel,
steel aperture mask, glass funnel, and cathode ray tube mount assembly,

The manufacture of television picture tubes is a highly complex pro-
cess.  Discrete wet process water flow rates at picture tube
facilities were unobtainable.  However, water usage for the produc-
tion of aperture masks was obtained.  The following process descrip-
tions discuss wet operations involved in the manufacture of picture
tubes as observed at two plants, Plant 30172 and Plant 11114.  The
manufacture of aperture masks which was observed at a third plant,
Plant 36146, is also discussed.

Panel Wash - Glass panels are the front glass section of a pic-
ture tube through which the picture is viewed.  The panels are
cleaned in a hydrofluoric acid-sulfuric acid solution.  This
prepares the glass for photoresist application.  Process water
is used for rinsing after each acid cleaning step.  High concen-
trations of acids and fluorides result from this process.

During the manufacture of television picture tubes, the panels are
inspected at various points along the process sequence.  A percen-
tage of panels are rejected and returned to the initial panel wash
to be reprocessed.  Therefore, pollutants generated at panel wash
also include pollutants typically found in wastewater from subse-
quent photoresist and phosphor applications.

Aperture Mask Degrease - Steel aperture masks are used in direc-
ting the electron beam from the cathode to the panel for use
both in photoresist development and eventually for phosphor
excitation.  The masks are vapor degreased in trichloroethylene
prior to other processing operations.  A low volume of waste-
water is produced by a carbon adsorption solvent recovery system.
The wastewater results from condensing steam used to regenerate
the carbon bed.  Wastewater produced by the solvent recovery
system has a moderate concentration of trichloroethylene.

Photoresist Application - A chromium bearing photoresist solution
is applied to the panel to prepare the surface for selective
phosphor application.  The photoresist solution is applied, the
mask is placed over the panel, the panel is exposed to light,
developed, graphite coated, re-developed, and cleaned in several
hydrofluoric-sulfuric acid solutions.  The photoresist application
process results in a graphite coated panel surface with a multi-
tude of uncoated dots.  These dots are then coated with phosphors
during phosphor application.  Wastewater from spent ac.id, photo-
resist, developer solutions and rinses contain high concentrations
of hexavalent chromium, strong acids, fluorides, graphite, and
proprietary chemicals included in the photoresist solutions.

Phosphor Application - This process is commonly referred to as
screening.  A photoresist solution is coated over the panel sur-
face followed by a red, blue, and green phosphor coating.  The
                                IX-20

-------
 Acid Clean - The glass tube body is fused to a metal base, hydro-
 chloric acid etched to remove metal oxides from the glass surface,
 and rinsed twice.   The tube body is polished with a wet hone using
 glass beads and then rinsed.

 The phosphor coated fiber optic window is inserted into the tube
 body, fused to the base of the glass tube, evacuated, sealed, aged,
 and tested.  Combined process water usage for alkaline cleaning and
 acid etching is estimated to  be 18168-22710 liters/hr at this one
 facility contacted.

 Plant 19102 produces a variety of specialized electron tube pro-
 ducts which include:  magnetrons, klystrons, cross field amplifiers,
 modulators and electron tube  sub-assemblies.  Water usage is limited
 to  electroplating  of tube parts, which is included in the Metal
 Finishing Category.  No process water is used in the assembly of
 electron tube products at this facility.

 Receiving Type Electron Tube  Processes - Plant 23337 produces power
 amplifiers and microwave tubes.  The majority of process water
 usage is for electroplating of tube parts, which,is included in the
 Metal Finishing Category.   In addition,  there are two glass tube body
 rinses that require no chemical cleaning processes and,  therefore,
 produce no pollutants in their effluent  discharge.  These
 wet processes will not receive any further consideration.   These
 rinses are intended to remove dust and particulate matter from the
 surface of the glass tube.

 Wastewater Analysis Data

 Wet processes from television picture tube manufacturing were
 sampled at two facilities.  Samples were analyzed for parameters
 identified on the  list of  129 toxic pollutants,  non-toxic  pol-
 lutant metals,  and other pollutant parameters presented  in Table 9-3.

 Tables  9-4 through 9-6 present analysis  data of  process  wastewaters
 and  final  effluents for those picture tube plants sampled  within the
 electron tube subcategory.  This table presents  pollutant  parameters,
 concentrations,  and mass loadings  of the processes sampled.   Pollu-
 tant parameters  are grouped according to toxic pollutant organics,
 toxic  pollutant  metals,  non-toxic  pollutant metals,  and  other
 pollutant  parameters.   Summation of pollutant concentrations  greater
 than the minimum detectable limit  are presented  as well  as mass
 loadings of  those  pollutant parameters whose concentrations  were
measurable.   Mass  loadings were derived  by multiplying concentration
by  the  flow  rate and the hours  per  day that a particular process is
operated.   Some  entries  were  left  blank  for one  of the following
reasons:   the parameter  was not detected;  the concentration  used for
 the  kg/day  calculation is  less  than the  lower quantifiable limits or
not quantifiable.   The  kg/day is not included in  totals  for  calcium,
magnesium,  and sodium,   The kg/day  is  not  applicable  to  pH.   Totals
do not  include values  preceded  by  "less  than".

Toxic pollutant  organics,  toxic  pollutant  metals  and  non-toxic
pollutant metals were  detected  at measurable  levels  as well  as
at levels  below  the  quantitative limit.  Other pollutant parameters
are all  reported in measurable  quantities.   The  following  conventions
were  followed in presenting the data:

                              IX-21

-------
panel is exposed to light, developed, precoated, lacquer coated,
and aluminized.  After the mask and panel are mated for the final
time, the panel face and edge are cleaned.  The phosphor materials
adhere to the uncoated dots on the glass panel surface and are the
elements of the finished tube that produce a colored visual image.
Wastewater from phosphor coating solutions, developer solutions,
aluminizing, panel face and edge cleaning, and rinses contain high
levels of phosphor materials such as cadmium sulfide, zinc sulfide,
yttrium, and europium.  In addition, there are moderate levels of
proprietary photoresists.

Funnel and Mount Cleaning - Glass funnels are the casing extended
back from the panel and are the largest component of a picture
tube.  The funnel is alkaline cleaned, rinsed, and graphite coated.
Electron shields are solvent degreased and attached to the panel-
mask assembly.  The panel is fused to the funnel with a lead
frit.  Lastly, the mount assembly is cleaned, aged, inserted
into the neck of the glass funnel, and the entire unit becomes
a picture tube.  The tube is aged, receives an external coat-
ing, and is tested prior to shipment.  Wastewater'from the
funnel cleaning rinse contains lov; level of silicates.  Waste-
water from mount cleaning contains oily materials from mount
manufacture.

Tube Salvage - Expended picture  tubes  are  received  and  disas-
sembled  to recover  the panel,  funnel,  and  mask.  The  unit is  de-
fritted  in a strong  acid  solution,  the mount  assembly is  discar-
ded, and the remaining components  are  cleaned and  reprocessed to
become part of a  new picture  tube.   Levels of nitric  and  hydro-
fluoric  acids, lead.,  and  fluoride  pollutants  are  high.   Pollutant
levels of aluminum  and  iron  resulting  from rinsing after  abrasive
oxide cleaning of the masks  are  moderate.

Aperture Mask  Formation - Steel  aperture masks,  which line the.
inner face of  the glass panel,  are produced at facilities other
than those manufacturing  the television picture tubes.   At Plant
36146 sheet  steel is cleaned,  flow coated with photosensitive
material, covered with  a  perforated pattern,  and exposed to light.
A developer  is  then applied  and  air dried.  Holes in the aperture
mask are etched  with ferric  chloride and rinsed.   Pollutants
include  iron,  chromium,  zinc,  trichloroethylene,  total suspended
solids,  oil  and  grease,  and  photochemicals.

Transmitting  Type Electron Tube Processes - The following process
description discusses the wet operations involved in the manufacture
of a light  sensing  image intensifier.   These wet processes existed
at one  contacted plant,  Plant 41122.

Alkaline Clean - A ceramic or glass envelope is brazed to several
metal components.  This unit is then alkaline cleaned, rinsed,
alcohol dipped,  rinsed,  and the metal portion of the unit is
phosphor coated.  This phosphor coated component is the fiber
optic window used to portray the light image in the assembled
product.
                             IX-22

-------
                                    TABLE 9-3
                         POLLOTANT PARAMETERS ANALYZED
 TOXIC POLLOTANT OBGANICS

  1.   Acenaphthene                       47.
  2.   Acrolein                           48.
  3.   Acrylonitrile                      49.
  4.   Benzene                            50.
  5.   Benzidine                          51.
  6.   Carbon Tetrachloride               52.
      (Tetrachloromethane)               53.
  7.   Chlorobenzene                      54.
  8.   1,2,4-Trichlorobenzene             55.
  9.   Hexachlorobenzene                  56.
 10.   1,2-Dichloroethane                 57.
 11.   1,1,1-Trichloroethane              58.
 12.   Hexachloroethane                   59.
 13.   1,1-Dichloroethane                 60.
 14.   1,1,2-Trichloroethane              61.
 15.   1,1,2,2,-Tetrachloroethane         62.
 16.   Chloroethane                       63.
 17.   Bis (Chlorornethyl) Ether             64.
 18.   Bis(2-Chloroethyl)Ether            65.
 19.   2-Chloroethyl Vinyl Ether (Mixed)   66.
 20.   2-Chloronaphthalene                67.
 21.   2,4,6-Trichlorophenol              68.
 22.   Parachlorometa Cresol              69.
 23.   Chloroform (Trichlorpmethane)       70.
 24.   2-Chlorophenol                      71.
 25.   1,2-Dichlorobenzene                72.
 26.   1,3-Dichlorobenzene                73.
 27.   1,4-Dichlorobenzene                74.
 28.   3,3'-Dichlorobenzidine
 29.   lfl-Dichloroethylene               75.
 30.   1,2-Trans-Dichlorethylene
 31.   2,4-Dichlorophenol                  76.
 32.   1,2-Dichloropropane                77.
 33.   1,2-Dichloropropyiene              78.
      (1,3-Dichloropropene)               79.
 34.   2,4-Dimethylphenol                  80.
 35.   2,4-Dinitrotoluene                  81.
 36.   2,6-Dinitrotoluene                  82.
 37.   1,2-Diphenylhydrazine
 38.   Ethylbenzene                        83.
 39.   Fluorantfrene
 40.   4~Chlorophenyl Phenyl Ether         84.
 41.   4-Bromaphenyl Phenyl  Ether          85.
 42.  Bis(2-Chloro.isopropyl) Ether        86.
43.  Bis(2-Chloroethoxy)Methane          87.
44.  Methylene Chloride                  88.
45.  Methyl Chloride  (Chloromethane)     90.
46.  Methyl Bromide (Bromomethane)       91.

                                         92.
 Bromoform (Tribrcanomethane)
 Dichlorobromomethane
 Trichlorofluoromethane
 Dichlorodifluoromethane
 Chlorodibromomethane
 Hexachlorobutadiene
 Hexachlorcx^clopentadiene
 Isophorone
 Naphthalene
 Nitrobenzene
 2-Nitrophenol
 4HSlitrophenol
 2,4HDinitrophenol
 4,6-Dinitro-O-Cresol
 N-Nitrosodimethylamine
 N-Nitrosodiphenylamine
 N-Wi trosod i-N-Propylamine
 Pentachlorophenol
 Phenol
 Bis(2-ethylhexyl) Phthalate
 Butyl Benzyl Phthalate
 Di-N-Butyl Phthalate
 Di-^-Octyl Phthalate
 Diethyl  Phthalate
 Dimethyl Phthalate
 1r2-Benzanthracene (Benzo(A)Anthracene)
 Benzo (A)  Pyrene  (3,4-Benzo-Pyrene)
 3,4-^enzofluoranthene  (Benzo(B)
 (Fluoranthene)
 11,12-Benzofluoranthene  (Benzo(K)
 Fluoranthene)
 Chrysene
 Acenaphthylene
 Anthracene
 1,12-Benzoperylene(Benzo(GHI)-Perylene)
 Fluorene
 Phenanthrene
 1,2,5,6-Dibenzathracene(Dibenzo(A,H)
 Anthracene)
 Idenb(l,2,3-CD)Pyrene(2,3-0-Phenylene
 Pyrene)
 Pyrene
 Tetrachloroethylene
 Toluene
 Trichloroethylene
Vinyl Chloride (Chloroethylene)
 Dieldrin
 ChlordaneCltechnical Mixture and
Metabolites)
 4,4'-DDT
                                    IX-23

-------
                              TABLE 9-3 CONTINUED
 93.  4f4'-DDE (P,P'-DDX)                    113.
 94.  4,4'-DDD (P,P-TDE)                     114.
 95.  Alpha-Endosulfan                       115.
 96.  Beta-Endosulfan                        117.
 97.  Endosulfan Sulfate                     118.
 98.  Endrin                                 119.
 99.  Endrin Aldehyde                        120.
100.  Heptachlor                             121.
101.  Heptachlor Epoxide (BHC~Hexachloro-    122.
        cyclophexane)                        123.
102.  Alpha-BHC                              124.
103.  Beta-BHC                               125.
104.  Gamma-BHC (Lindane)                    126.
105.  Delta-BHC (PCB-Polychlorinated         127.
        Biphenyls )                           128 .
106.  PCB-1242 (Arochlor 1242)               129.
107.  PCB-1254 (Arochlor 1254)
108.  PCB-1221 (Arochlor 1221)
109.  PCB-1232 (Arochlor 1232)
110.  PCB-1248 (Arochlor 1248)
111.  PCB-1260 (Arochlor 1260)
112.  PCB-1016 (Arochlor 1016)
NON-TOXIC POLLUTANT MSIALS

Calcium                                      Germanium
Magnesium                                    Rubidium
Sodium                                       Strontium
Aluminum                                     Zirconium
Manganese                                    Niobium
Vanadium                                     Palladium
Boron                                        Indium
Barium                                       Tellurium
Molybdenum                                   Cesium
Tin                                          Tantalum
Yttrium                                      Tungsten
Cobalt                                       Osmium
Iron                                         Platinum
Titanium                                     Gold
Potassium                                    Bismuth
Gallium                                      Uranium

OTHER POLLUTANT

Oil and Grease
Total Organic Carbon
Biological Oxygen Demand   ,
Total Suspended Solids
Phenols
Fluoride
Xylenes
Alkyl Epoxides
Toxaphene
Antimony
Arsenic
Beryllium
Cadmium
Chromium
Copper
Cyanide
lead
Mercury
Nickel
Selenium
Silver
Thallium
Zinc
2,3,4,8-Tetrachlorodibenzo-P-
Dioxin (TCDD)
                                      IX-24

-------
 Stream Identification
 Sample Number
 Flow Pate Liters/Hr-Gallons/Hr
 Duration Hours/Day

 TOXIC ORGANICS

   1 Acenapthene
   4 Benzene
  11 1,1,1-Trichloroethane
  13 1,1-Dichloroethane
  23 Chloroform
  29 1,1-Dichloroethylene
  30 1,2-Trans-dichloroethylene
  38 Ethylbenzene
  39 Pluoranthene
  44 Methylene chloride
  48 Dichlorcbronoraethane
  51 Chlorodibrcroomethane
  55 Napthalene
  65 Phenol
  66 Bis(2-ethylhexyl)phthalate
  67 Butyl benzyl phthalate
  68 Di-N-butyl phthalate
  70 Diethyl phthalate
  78 Anthracene
  81 Phenanthrene
  84 Pyrene
  86 Toluene
  87 Trichloroethylene
  95 Alpha-Endosulfan
 102 Alpha-BHC
 105 Delta-BHC

 Total Toxic Organics

 TOXIC ^ETALS

 114 Antimony
 115 Arsenic
 117 Beryllium
 118 Cadmium
 119 Chrcciium
 120 Copper
 122 Lead
 123 Mercury
 124 Nickel
 125 Selenium
 126 Silver
 127 Thallium
 128 Zinc
 Total Toxic Metals
                                                             TABLE 9-4A
                                                     PICTURE TUBE PROCESS WASTES
                                                          (PLANT ID# 30172)
 mg/1      kg/day
 Chromium Treatment
       Influent
 03661
 491 - 130
 24
< 0.010
  0.058(B) .0.0007

       (B)
< 0.010
  0.490(B) 0.006
< 0.010

  0.460
  0.010
0.005
0.0001
< 0.010
< 0.010
< 0.010
  0.029    0.0003
  O.OIO(B) 0.0001
  1.057
0.122
0.003
< 0.004*
0.001
< 0.002
86.800
0.028
< 0.040
< 0.001
0.009
0.004
<- 0.001
< 0.001
< 0.001
0.00004

0.00001

1.02
0.0003


0.0001
0.00005



               rag/1      kg/day
                Lead Treatment
                   Influent
               85125
               45 - 12
               24
                          Nbt
                          Analyzed
rag/1 .     kg/day
 Total Raw Waste Into
   Primary Treatment
85127
13028 - 3442
24
                                        Nbt
                                        Analyzed
                                         86.845    1.0205
0.092
0.250
0.004
1.070
4.670
< 0.050
891.000
0.001
18.500
< 0.020
0.060
0.002
1510.000
2425.649
0.0001
0.0003
0.000004
0.001
0.005

0.962
0.000001
0.02

0.00006
0.000002
1.631
2.619467
0*188
0.100
< 0.001
0.215
2.470
0.093
20.700
< 0.001
0.062
< 0.004
0.001
< 0.001
6.770
30.599
0.059
0.031

0.067
0.772
0.029
6.47

0.019

0.0003

2.117
9.5643
Interference Present
                                                     IX-25

-------
                                               TABLE 9-4A (COOT.)
                                           PICTURE TUBE PROCESS WASTES
                                                (PLANT ID# 30172)
NOB-TOXIC METALS
Calcium *
Magnesium *
Sodium *
Aluninun
Manganese
Vanadium
Boron
Barium
Molybdenum
Tin
Yttrium
Cobalt
Iron
Titanium
Potassium
Gallium
Germanium
Rubidium
Strontium
Zirconium
Niobium
Palladium
Indium
Tellurium
Tungsten
Osniun
Platinum
Gold
Bianuth
Uranium
Total Hoasureable Non-Toxic Metals
4.960 0.058
1.220 0.014
11.200 0.132
0.034 0.0004
0.008 0.00009
0.016 0.0002
< 0.002
0.027 0.0003
0.180 0.002
0.111 0.001
0.013 0.0002
< 0.050
0.173 0.002
0.006 0.00007


Not
Analyzed



< 0.003
Not Analyzed
< 0.003
Not Analyzed

0.006 0.00007
< 0.002
Not Analyzed

0.574 0.00633
87.800 0.095
30.900 0.033
640.000 0.691
12.000 0.013
5.860 0.006
0.161 0.0002
346.000 0.374
205.000 0.221
1.600 0.002
3.010 0.003
16.800 0.018
2.650 0.003
1940.000 2.095
0.314 0.0003


Not
Analyzed



0.318 0.0003
Nbt Analyzed
0.029 0.00003
Not Analyzed

0.090 0.0001
< 0.004**
Not Analyzer!

2533.832 2.73593
88.600 27.702
7.970 2.492
173.000 54.
3.250 1.016
0.040 0.013
0.010 0.003
9.170 2.867
1.100 0.344
< 0.035
0.119 0.037
2.290 0.716
< 0.050
7.720 2.414
0.222 0.069


Not
Analyzed



< 0.003
Not Analyzed
0.003 0.0009
Not Analyzed

< 0.005
< 0.002
Not Analyzed

23.924 7.4799
OTHER EOUOTANTS
                o
    Temperature  C
121 Cyanide, Total
    Oil & Grease
    Total Organic Carbon
    Biochemical Oxygen Demand
    Total Suspended Solids
    Phenols
    Fluoride
5.3
21
<0.005
66
1000
2
2
0.01
0.82



0.78
11.78
0.02
0.02
0.0001
0.010
< 2.0
19
<0.005
11
< 1.0
< 1.0
190
0.01
160



0.012


0.205
0.00001
0.173
2.7
21
<0.005
14
47
< 1.0
130
0.01
260



4.4
14.70

40.6
0.003
81.3
  * Metals Not Included In Total
 ** Interference Present
                                                      IX-26

-------
 Stream Identification
 Sample Number
 Flow Rate Liters/Hr
 Duration Hours/Day-

 TOXIC ORGANICS

   1 Acenapthene
   3 Acrylonitrile
   4 Benzene
  11 1,1,1-Trichloroethane
  13 1,1-Dichloroethane
  23 Chloroform
  29 1,1-Dichloroethylene
  30 1,2-Trans-dichloroethylene
  38 Ethylbenzene'
  39 Fluoranthene
  44 Methylene chloride
  48 Didilorobrcmomethane
  51 Chlorodibrcmoroethane
  55 Napthalene
  58 4-Nitrophenol
  65 Phenol
  66 Bis(2-ethylhexyl)phthalate
  67 Butyl benzyl phthalate
  68 Di-N-butyl phthalate
  70 Diethyl phthalate
  71 Dimethyl phthalate
  78 Anthracene
  81 Phenanthrene
  84 Pyrene
  85 Tetrachloroethylene
  86 Toluene
  87 Trichloroethylene
  95 Alpha-Endosulfan
  102 Alpha BHC
  105 Delta BHC

  Total  Toxic Organics

  TOXIC  METALS

  114 Antimony
  115 Arsenic
  117 Beryllium
  118 Cadmium
  119 Chrotiium
  120 Copper
  122 Lead
  123 Mercury
  124 Nickel
  125 Selenium
  126 Silver
  127 Thallium
  128  Zinc
  Total Toxic Metals
                                                            TABLE 9-4A
                                                    PICTURE TUBE PROCESS WASTES
                                                          (PLANT ID# 30172)
                                                               (CONT)
mg/1      kg/day
Chromium Treatment
     Effluent
85124
491 - 130
24
Not
Analyzed
0.005
0.044
< 0.001
< 0.002
76.400
0.027
0.106
< 0.001
< 0.005
0.013
< 0.001
< 0.001
0.038
76.633
0.00006
0.0005


0.900
0.0003
0.001


0.0002


0.0004
0.90246
mg/1      kg/day
 .Lead Treatment
    Effluent
85126
157 - 42
7
Not
analyzed
< 0.015
0.010
< 0.001
< 0.005
0.027
0.048
1.900
< 0.001
0.641
< 0.004
< 0.002
< 0.010*
11.400
14.026

0.00001


0.00003
0.00005
0.002

0.0007



0.013
0.01579
mg/1      kg/day
 Primary Treatment
 Clarifier Effluent
85128
13028 - 3442
24
NOt
Analyzed
0.146
0.008
0.001
0.002
0.292
0.015
0.273
0.001
0.010
0.005
0.001
0.001
0.112
0.862
0.046
0.003


0.091
0.005
0.085

0.003
0.002
0.0003

0.035
0.2703
*Interference Present
                                                     IX-27

-------
 NOJ-TOXIC 1«TALS

     Calcium *
     Magnesiuri * ,
     Sodium  *
     Aluminum
     Manganese
     Vanadium
     Boron
     Barium
     Molybdenum
     Tin
     Yttrium
     Cobalt
     Iron
     Titanium
     Potassium
     Gallium
     Germanium
     Rubidium
     Strontium
     Zirconium
     Niobium
     Palladium
     Indium
     Tellurium
     Tungsten
     Osmium
     Platinum
     Gold
     Bi smith
     Uranium
 Total Non-Toxic Metals

 OTHER POLLUTANTS
     Temperature  C
 121 Cyanide, Total
     Oil & Grease
     Total Organic Carbon
     Biochemical Oxygen Demand
     Total Suspended Solids
     Phenols
     Fluoride
                                                       TABLE 9-4A (COMT.)
                                                  PICTURE TUBE PROCESS WASTES
                                                       (PLANT ID# 30172)
5.400
1.220
62.300
0.054
0.039
0.011
0.239
0.037
0.106
0.102
0.023
< 0.050
5.220
0.003
wot
Analyzed
0.064
0.014
0.734
0.0006
0.0005
0.0001
0.003
0.0004
0.001
0.001
0.0003

0.062
0.00004


< 0.010**
 Not Analyzed
  0.020    0.0002
< 0.005
< 0.002
 Hot Analyzed

  5.854    0.06914
< 2.0
22
<0.005
10
880
< 1.0
2
0.02
0.40



0.118
10.4

0.024
0.0002
0.005
28.800
18.500
13400.000
0.679
0.546
0.024
395.000
12.400
0.171
0.392
< 0.008
< 0.119
0.378
0.043
Not
Analyzed
0.032
0.020
14.7
0.0007
0.0006
0.00003
0.434
0.014
0.0002
0.0004


0.0004
0.00005


< 0.003
 Not Analyzed
  0.013    0.00001
  0.020    0.00002
< 0.050**
 Not Analyzed

409.666    0.45041
7.3
19
<0.005
14
160
< 1.0
17
0.08
76



0.015
0.176

0.019
0.00009
0.084
334.000 104.4
7.950
126.000
, 0.309
0.006
0.004
1.880
0.182
< 0.035
0.119
0.006
< 0.050
0.197
< 0.002
Mot
Analyzed
2.49
39.4
0.097
0.002
0.001
0.588
0.057

0.037
0.002

0.062



< 0.003
 Not Analyzed
  0.004    0.001
< 0.005
< 0.002
 Not Analyzed
  2.707
0.847
8.5
19
<0.005
10
49
5
2
0.03
6.5



3.1
15.3
1.56
0.625
0.009
2.0
 * Metals Not Incluccc In Total
** Interference Present
                                                  IX-28

-------
                                                            TABLE 9-4A
                                                    PICTURE TUBE PROCESS WASTES
                                                         (PLSNT ID# 30172)
                                                              (CONT)
Stream Identification
Sample Number
Plow Rate Liters/Hr
Duration Hours/Day

TOXIC &ETALS

  1 Acenapthene
  3 Acrylonitrile
  4 Benzene
 11 l,lfl-Trichloroethane
 13 1,1-Dichloroethane
 23 Chloroform
 29 1,1-Dichloroethylene
 30 1,2-Trans-dichloroethylene
 38 Ethylbenzene
 39 Fluoranthene
 44 Methylene chloride
 48 Dichlorobrcmomethane
 51 Chlorodibromomethane
 55 Napthalene
 58 4-Nitrophenol
 65 Phenol
 66 Bis(2-ethylhexyl)phthalate
 67 Butyl benzyl phthalate
 68 Di-N-butyl phthalate
 70 Diethyl phthalate
 71 Dimethyl phthalate
 78 Anthracene
 81 Phenanthrene
 84 Pyrene
 85 Tetrachloroethylene
 86 Toluene
 87 Trichloroethylene
 95 Alpha-Endosulfan
102 Alpha-BHC  •
105 Delta-BHC

Total Toxic Organics

TOXIC METALS

114 Antimony
115 Arsenic
117 Beryllium
118 Cadmium
119 Chromium  ,
120 Copper
122 Lead
123 Mercury
124 Nickel
125 Selenium
126 Silver
127 Thallium
128 Zinc
Total Toxic Metals
 mg/1      kg/day
 Primary Treatment
 Sand Filter Effluent
 03662
 13028 - 3442
 24
< 0.010

< 0.010
< 0.010

< O.OIO(B)
  0.400(B)
< 0.010
< 0.010
<.0.010

< 0.010
< 0.010
< 0.010
< 0.010
< 0.010

<0.010
<0.010
 <0.010
 <0.010
  0..400
  0.117
  0.010
 <0.001
 <0.002
  0.247
  0.017
  0.152
< 0.001
  0.012
< 0.004
  0.001
< 0.001
  0.055
  0.611
0.125
0.125
0.037
0.003
0.077
0.005
0.048

0.004

0.0003

0.017
0.1913
                                           IX-29

-------
NOtMXJXIC METALS

    Calcium *
    Magnesium *
    Sodium «
    Aluminum
    Manganese
    Vanadium
    Boron
    Barium
    Molybdenum
    Tin
    Yttriura
    Cobalt
    Iron
    Titanium
    Potassium
    Gallium
    Germanium
    Rubidium
    Strontium
    Zirconium
    Niobium
    Palladium
    Indium
    Tellurium
    Tungsten
    OsraLum
    Platinum
    Gold
    Bismuth
    Uranium
Total Non-Toxic Metals

OTHER POIIOTANTS
    Temperature  C
121 Cyanide, Total
    Oil & Grease
    Total Organic Carbon
    Biochemical Oxygen Demand
    Total Suspended Solids
    Phenols
    Fluoride
                                                   TABLE 9-4A (GOUT.)
                                              PICTURE TUBE PROCESS WASTES
                                                   (PLANT ID# 30172)
345.000
8.230
123.000
0.239
0.005
0.002
1.530
0.155
< 0.035
0.117
< 0.003
< 0.050
0.048
0.002
108
2.573
38.5
0.075
0.002
0.0006
0.478
0.049

0.037


0.015

 Not
 Analyzed
< 0.005*
 Not Analyzed
< 0.004
 Not Analyzed

< 0.005
< 0.002
 Not Analyzed
  2.096
0.6566
8.5
19
<0.01
5
40
4
1.4
0.02
10



1.6
12.5
1.3
0.44
0.006
3.1
 *Metals Not Included In Totals
**Interferences Present
                                           IX-30

-------
                                                            TABLE 9-4B
                                                    PICTURE TUBE PROCESS WRSTES
                                                         (PLANT H3# 30172)
Stream Identification
Sample Number
Flew Rate Liters/Hr
Duration Hours/Day

TOXIC ORGANICS

  1 Acenapthene
  3 Acrylonitrile
  4 Benzene
 11 1,1,1-Trichloroethane
 13 1,1-Dichloroethane
 23 Chloroform
 29 l,l-Bic±iloroethylene
 30 1,2-Trans-diciiloroethylene
 38 Ethylbenzene
 39 Pluoranthene
 44 Methylene chloride
 48 Dichlorobromoniethane
 51 Chlorodibrcmoinethane
 55 Napthalene
 58 4-Nitrophenol
 65 Phenol
 66 Bis(2-ethylhexyl)phthalate
 67 Butyl benzyl phthalate
 68 Di-N-butyl phthalate
 70 Diethyl phthalate
 71 Dimethyl phthalate
 78 Anthracene
 81 Phenanthrene
 84 Pyrene
 85 Tetrachloroethylene
 86 Toluene
 87 Trichloroethylene
 95 Alpha-Endosulfan
 102 Alpha-BHC
 105 Delta-BHC

 Total Toxic Organics

 TOXIC NETALS

 114 Antimony
 115 Arsenic
 117 Beryllium
 118 Cadmium
 119 Chromium
 120 Copper
 122 Lead
 123 Mercury
 124 Nickel
 125 Selenium
 126 Silver
 127 Thallium
 128 Zinc
 Total Toxic Metals
mg/1      kg/day
Chromium Treatment
     Influent
85129
377 - 100
24
 Not
 Analyzed
< 0.003
  0.006
  0.001
<0.002
100.000
  0.012
  0.295
< 0.001
< 0.005
< 0.004
< 0.001
< 0.001
  0.038
100.352
0.00005
0.000009

0.905
0.0001
0.003
0.0003
0.908459
              mg/1      kg/day
              Total Raw Waste
              Primary Treatment
              85138
              13716 - 3624
              24
              Not
              Analyzed
0.126
0.102
< 0.001
0.135
3.150
0.052
11.200
< 0.001
0.070
< 0.004
0.002
< 0.001
5.120
19.957
0.041
0.034

0.044
1.037
0.017
3.687

0.023

0.0007

1.685
6.5687
mg/1      kg/day
Chromium Treatment
 Effluent
85131
377 - 100
24
Not
Analyzed
0.003
0.004
< 0.001
< 0.002
74.200
0.011
< 0.040
< 0.001
< 0.005
< 0.004
< 0.001
< 0.001
< 0.001
0.00003
0.00004


0.671
0.0001







 74.218    0.67117
                                                   IX-31

-------
                                                 TABLE  9-4B  (CUNT.)
                                             PICTURE TUBE PROCESS WASTES
                                                  (PLANT ID#  30172)
NCN-TOKIC M3TALS

    Calcium  *
    Magnesium  *
    Sodium *
    Aluminum
    Manganese
    Vanadium
    Boron
    Barium
    Molybdenum
    Tin
    Yttrium
    Cobalt
    Iron
    Titanium
    Potassium
    Gallium
    Germanium
    Rubidium
    Strontium
    Zirconium
    Niobium
    Palladium
    Indium
    Tellurium
    Tungsten
    Oanium
    Platinum
    Gold
    Bismuth
    Uranium
Total Non-Toxic Metals

OTHER POUiOTANTS

    pH
    Temperature °C
121 Cyanide, Total
    Oil & Grease
    Total Organic Carbon
    Biochemical Oxygen Demand
    Total Suspended Solids
    Phenols
    Fluoride
2.230
0.474
6.200
0.066
0.005
0.017
0.196
0.044
0.089
0.127
0.102
0.050
0.094
0.007
0.020
0.004
0.056
0.0006
0.00005
0.0002
0.002
0.0004
0.0008
0.001
0.0009

0.0009
0.00006
Not
Analyzed
 0.747
0.00691
                         68.900
                          8.640
                        114.000
                          4.060
                          0.043
                          0.003
                          9.520
                          0.586
                          0.059
                          0.025
                          1.290
                          0.050
                          8.640
                          0.002
                        22.68
                         2.84
                        37.5
                         1.336
                         0.014
                         0.001
                         3.134
                         0.193
                         0.019

                         0.425

                         2.844
               Not
               Analyzed
24.201
                                   7.966
4.7
23
<0.005
10
170
2
0.8
0.02
0.90



0.091
1.5
0.002
0.007
0.0002
0.008
2.1
21
<0.005
11
58
< 1.0
88
< 0.01
270



3.6
19.09

29

88.9
4.830
1.170
111.000
0.053
0.014
0.004
0.079
0.022
0.156
0.082
0.011
< 0.050
1.130
< 0.002
0.044
0.011
1.004
0.0005
0.0001
0.00004
0.0007
0.0002
0.001
0.0007
0.0001

0.010

                         Not
                         Analyzed
                                         1.551
                                                            0.01334
1.9
23
•C0.005
330
490
50
0.6
0.01
0.30



2.99
4.43
0.45
0.005
0.00009
0.003
*Metals Not Included In Totals
                                                 IX-32

-------
                                                           TABLE  9-4B
                                                    PICUTRE TUBE PROCESS WASTES
                                                         (PLANT ID#  30172)
                                                              (CONT)
Stream Identification
Sample Hunter
Plow Rate Liters/a?
Duration Hours/Day

TOXIC ORGANICS

  1 Acenapthene
  3 Acrylonitrile
  4 Benzene
 11 1,1,1-Trichloroethane
 13 1,1-Dichloroethane
 23 Chloroform
 29 1,1-Dichloroethylene
. 30 1,2-Trans-dichloroethylene
 38 Ethylbenzene
 39 Pluoranthene
 44 Methylene chloride
 48 Dichlorobronamethane
 51 (Morodibranomethane
 55 Napthalene
 58 4-Nitrophenol
 65 Phenol
 66 Bis(2-ethylhex/l)phthalate
 67 Butyl benzyl phthalate
 68 Di-N-butyl phthalate
 70 Diethyl phthalate
 71 Dimethyl phthalate
 78 Anthracene
 81 Phenanthrene
 84 Pyrene
 85 Tetrachloroethylene
 86 Toluene
 87 Trichloroethylene
 95 Alpha-endosulfan
102 Alpha-BHC
105 Delta-BHC

Total Toxic Organics

TOXIC ^ETAIlS

114 Antimony
115 Arsenic
117 Beryllium
118 Cadmium
119 Chromium
120 Copper
122 Lead
123 Mercury
124 Nickel
125 Selenium
126 Silver
127 Thallium
128 Zinc
Total Toxic Metals
mg/1      kg/day
Primary Treatment
Clarifier Effluent
85132
13716 - 3624
24
     mg/1      kg/day
     Primary Treatment
     Sand Filter Effluent
     85130
     13716 - 3624
     24
Sample
Lost
Not
Analyzed
Sample
Lost
      0.136
      0.008
    < 0.001
    < 0.002
      0.250
      0.009
      0.228
    < 0.001
      0.006
    < 0.004
      0.001
    < 0.001
      0.110
      0.748
                                    0.045
                                    0.003
0.082
0.003
0.075

0.002

0.0003

0.036
0.2463
                                              IX-33

-------
                                                            TABLE 9-4B  (CONT.)
                                                       PICTURE TUBE PROCESS WASTES
                                                            (PLANT ID#  30172)
NON-TOXIC ^£TALS

    Calcium *
    Magnesium  *
    Sodium  *
    Aluminum
    Manganese
    Vanadium
    Boron
    Barium
    ttolybdenum
    Tin
    Yttrium
    Cobalt
    Iron
    Titanium
    Potassium
    Gallium
    Germanium
    Rubidium
    Strontium
    Zirconium
    Niobium
    Palladium
    Indium
    Tellurium
    Tungsten
    Osmium
    Platinum
    Gold
    Bismuth
    Uranium
Total Non-Toxic Metals

OTHER POLLUTANTS
                o
    Terjerature  C
121 Cyanide, Total
    Oil & Grease
    Total Organic Caitoon
    Biochemical Oxygen Demand
    Total Suspended Solids
    Phenols
    Fluoride
 Sample
 Lost
  7.1
 19
 <0.005
 52
 Sanyle
 Lost
17.12
             273.000
               9.040
             172.00
               0.237
               0.009
             < 0.001
               2.450
               0.142
             < 0.035
               0.068
             < 0.003
             < 0.050
               0.227
             < 0.002
                          Not
                          Analyzed
< 0.01
 Saraple Lost
                           3.133
 6.9
18
•C0.005
37
40
10
 7
 0.02
 8.2
                                    89.9
                                     2.976
                                    56.6
                                     0.078
                                     0.003

                                     0.807
                                     0.047

                                     0.022
                                     0.075
                         1.032
12.18
13.17
 3.29
 2.3
 0.007
 2.7
*Metals Not Included In Totals
                                              IX-34

-------
                                                            TABLE 9-4C
                                                    PICTURE TUBE PROCESS WASTES
                                                         (PLANT IDf 30172)
Stream Identification
Sample Number
Flow Rate Liters/Hr
Duration Hours/Day

TOXIC ORGANICS

  1 Acenapthene
  3 Acrylonitrile
  4 Benzene
 11 1,1,1-Tridiloroethane
 13 1,1-Dichloroethane
 23 Chloroform .
 29 1,1-Dichloroethylene
 30 1,2-Trans-dichloroethylene
 38 Ethylbenzene
 39 Pluoranthene
 44 Methylene chloride
 48 Didhlorcbrcrnomethane
 51 Chlorodibronomethiane
 55 Napthalene
 58 4-Nitrophenol
 65 Phenol
 66 Bis(2-ethylhexyl)phthalate
 67 Butyl benzyl phthalate
 68 Di-N-butyl phthalate
 70 Diethyl phthalate
 71 Diitiethyl phthalate
 78 Anthracene
 81 Phenanthrene
 84 Pyrene
 85 Tetrachloroethylene
 86 Toluene
 87 Trichloroethylene
 95 Alpha-Endosulfan
 102 Alpha-BHC
 105 Delta-BHC

 Total Toxic Organics

.TOXIC NETALS

 114 Antimony
 115 Arsenic
 117 Beryllium
 118 Cadmium
 119 Chromium
 120 Copper
 122 Lead
 123 Mercury
 124 Nickel
 125 Selenium
 126 Silver
 127 Thallium
 128 Zinc
 Total Toxic Metals
mg/1      kg/day
Chromium Treatment
     Influent
85133
454 - 120
24
Not
Analyzed
  0.004
  0.006
  0.001
< 0.002
 80.400
  0.017
< 0.040
< 0.001
< 0.005
  0.004
  0.001
  0.050
< 0.001
 80.483
0.00004
0.00007
0.00001

0.876
0.0002
0.00004
0.00001
0.0005

0.87687
              mg/1      kg/day
              Total Raw Waste Into
              Primary Treatment
              85137
              11972 - 3163
              24
              Not
              Analyzed
  0.146
  0.160
C  0.001
  0.163
  2.980
  0.052
 10.600
< 0.001
  0.089
< 0.004
  0.001
< 0.001
  6.340
 20.531
0.042
0.046

0.047
0.856
0.015
3.046

0.026

0.0003

1.822
5.9003
                         mg/1-     . kg/day
                         Chromium Treatment
                              Effluent
                         85135
                         454 - 120
                         24
                         Not
                         Analyzed
0.003
0.004
< 0.001
< 0.002
69.400
0.008
< 0.040
< 0.001
< 0.005
0.016
< 0.001
< 0.001
0.023
69.454
0.00003
0.00004


0.756
0.00009



0.0002


0.0003
0.75666
                                                          IX-35

-------
 NON-TOXIC
     Calcium »
     Magnesium *
     Sodium *
     Aluminum
     Manganese
     Vanadium
     Boron
     Barium
     Molybdenum
     Tin
     Yttrium
     Cobalt
     Iron
     Titanium
     Potassium
     Gallium
     Germanium
     Rubidium
     Strontium
     Zirconium
     Niobium
     Palladium
     Indium
     Tellurium
     Tungsten
     Osmium
     Platinum
     Gold
     Bismuth
     Uranium
Total Non-Toxic Metals

OTHER POLLUTANTS
                o
    Temperature  C
121 Cyanide, Total
    Oil & Grease
    Total Organic Carbon
    Biochemical Oxygen Demand
    Total Suspended Solids
    Phenols
    Fluoride
                                                         TABLE 9-4C (CONT.)
                                                    tTCTURE TUBE PROCESS WASTES
                                                         (PLANT ID# 30172)
1.260
0.398
7.010
0.011
0.005
0.008
0.167
0.019
0.128
0.064
0.010
0.073
0.049
0.002
0.0137
0.004
0.0764
0.0001
0.00005
0.00009
0.002
0.0002
0.001
0.0007
0.0001
0.0008
0.0005

91.300
8.340
149.000
4.190
0.050
0.005
7.080
0.626
0.098
< 0.025
1.470
0.050
9.320
< 0.002
26.2
2.396
42.8
1.204
0.014
0.001
2.034
0.180
0.028

0.422

2.678

Not
analyzed
 0.534    0.00554
5.4
24
•C0.005
24
950
20
< 1.0
0.01
1.8



0.262
10.4
0.218

0.0001
0.020
Not
Analyzed
                         22.839
                          1.7
                         22
                         <0.005
                         12
                         43
                        < 1.0
                         50
                        < 0.01
                        490
          6.561
          3.45
         12.4

         14.4

        141
                                                   7.230
                                                   1.590
                                                  66.100
                                                   0.112
                                                   0.040
                                                   0.002
                                                   0.115
                                                   0.059
                                                   0.113
                                                   0.088
                                                   0.033
                                                 C  0.050
                                                   5.260
                                                   0.002
 Not
 Analyzed
                                                   5.822
< 2.0
 25
 <0.005
 36
860
 30
  3
  0.02
  0.60
                                   0.079
                                   0.017
                                   0.720
                                   0.001
                                   0.0004
                                   0.00002
                                   0.001
                                   0.0006
                                   0.001
                                   0.001
                                   0.0004

                                   0.057
                                                            0.06242
0.392
9.37
0.327
0.033
0.0002
0.007
*Metals Not Included In Totals
                                                  IX-36

-------
Stream Identification
Sample Number
Flow Pate Liters/Hr
Duration Hours/Day

TOXIC ORGANICS

  1 Acenapthene
  3 Acrylonitrile
  4 Benzene
 11 1,1,1-Trichloroethane
 13 1,1-Dichloroethane
 23 Chloroform
 29 1,1-Dichloroethylene
 30 1,2-Trans-dichloroethylene
 38 Ethylbenzene
 39 Fluoranthene
 44 Methylene chloride
 48 Dichlorobranonethane
 51 Chlorodibrctnottiethane
 55 Napthalene
 58 4-Nitrophenol
 65 Phenol
 66 Bis(2-ethylhex^l)phthalate
 67 Butyl benzyl phthalate
 68 Di-N-butyl phthalate
 70 Diethyl phthalate
 71 Dimethyl phthalate
 78 anthracene
 81 Phenanthrene
 84 Pyrene
 85 Tetrachloroethylene
 86 Toluene
 87 Trichloroethylene
 95 Alpha-Endosulfan
102 ftlpha-BHC
105 Delta-BHC

Total Toxic Organics

TOXIC METALS

114 Antimony
115 Arsenic
117 Beryllium
118 Cadmium
119 Chromium
120 Copper
122 Lead
123 Mercury
124 Nickel
125 Selenium
126 Silver
127 Thallium
128 Zinc
Total Toxic Metals
                                                            TABLE 9-4C
                                                    PICTURE TUBE PROCESS WASTES
                                                         (PLANT ID# 30172)
                                                              (COOT)
mg/1      kg/day
Lead Treatment
   Effluent
85139
97 - 26
8
Not
Analyzed
0.123
0.008
< 0.001
< 0.004
0.017
0.035
0.479
< 0.001
1.180
0.008
< 0.001
0.002
26.000
27.852
0.0001
0.000006


0.00001
0.00003
0.0004

0.0009
0.000006

0.000002
0.020
0.021454
mg/1      kg/day
Primary Treatment
Clarifier Effluent
85136
11972 - 3163
24
Not
Analyzed
                          0.119
                          0.010
                         < 0.001
                         < 0.002
                          0.195
                          0.014
                          0.233
                         < 0.001
                          0.016
                         < 0.004
                         < 0.001
                         < 0.001
                          0.150
                          0.737
          0.034
          0.003
          0.056
          0.004
          0.067

          0.005
          0.043
          0.212
mg/1      kg/day
Primary Treatment
Sand Filter Effluent
85134
11972 - 3163
24
Not
Analyzed
0.106
0.010
< 0.001
< 0.002
0.128
0.016
0.109
< 0.001
0.026
< 0.004
< 0.001
< 0.001
0.059
0.454
0.030
0.003


0.037
0.005
0.031

0.007



0.017
0.130
                                                 IX-37

-------
 NON-TOXIC t-ETALS

     Calcium *
     Magnesium  *
     Sodium *
     Aluminum
     Manganese
     Vanadium
     Boron
     Barium
     Molybdenum
     Tin
     Yttrium
     Cobalt
     Iron
     Titanium
     Potassium
     Gallium
     Germanium
     Rubidium
     Strontium
     Zirconium
     Niobium
     Palladium
     Indium
     Tellurium
     Tungsten
     Osmium
     Platinum
     Gold
     Bismuth
     Uranium
Total Non-Toxic Metals

OTHER POLLUTANTS
                                                   TABLE 9-4C (CONT.)
                                              PICTURE TUBE PROCESS WASTES
                                                    (PLANT ID# 30172)
30.400
16.100
10500.
0.577
0.634
0.010
250.
8.140
0.256
0.105
0.012
0.496
0.080
0.021
0.024
0.012
8.148
0.0004
0.0005
0.000008
0.194
0.006
0.0002
0.00008
0.000009
0.0004
0.00006
0.00002
309.
6.150
139.
0.485
0.008
< 0.001
2.060
0.150
0.043
< 0.025
0.005
< 0.050
0.262
< 0.002
88.8
1.767
39.9
0.139
0.002

0.592
0.043
0.012

0.001

0.075

 NOt
 analyzed
260.331
           0.201677
Not
Analyzed
                           3.013
                                    0.864
301.
6.160
140.
0.427
0.007
< 0.001
2.090
0.135
0.037
< 0.025
< 0.003
< 0.050
0.071
< 0.002
86.5
1.770
40.2
0.123
0.002

0.601
0.039
0.011



0.020

Not
Analyzed
                                                    2.767
                                                             0.796
                o
    Teraperataire  C
121 Cyanide, Total
    Oil & Grease
    Total Organic Carbon
    Biochemical Oxygen Demand
    Total Suspended Solids
    Phenols
    Fluoride
6.4
19
<0.005
8
19
< 1.0
5
0.01
81



0.006
0.015

0.004
0.000008
0.063
8.1
20
<0.005
830
22
< 1.0
3
0.02
7.7



238.5
6.3

0.86
0.006
2.2
                                                    7.8
                                                   20
                                                   <0.005
                                                   20
                                                   39
                                                    2
                                                    1
                                                    0.03
                                                   15
                                   5.75
                                  11.2
                                   0.575
                                   0.287
                                   0.009
                                   4.31
*Metals Not Included In Totals
                                                IX-38

-------
                                                             TABLE 9-5A
                                                     PICTURE TUBE PROCESS WASTES
                                                           (PLANT ID! 11114)
                                                         Treatment System I
                                                                
-------
                NON-TOXIC METALS

                    Calcium *
                    Magnesium *
                    Sodium *
                    Aluminum
                    Manganese
                    Vanadium
                    Boron
                    Barium
                    tfolybdenum
                    Tin
                    Xttrium
                    Cobalt
                    Iron
                    Titanium
                    Potassium
                    Gallium
                    Germanium
                    Rubidium
                    Strontium
                    Zirconium
                    Niobium
                    Palladium
                    Indium
                    Tellurian
                    Tungsten
                    Osnium
                    Platinum
                    Gold
                    Bismuth
                    Uranium
               Total Non-Toxic Metals
                                                   TABLE 9-5A  (COOT.)
                                               PICTURE TUBE PROCESS WASTES
                                                    (PLANT IDf  11114)
                                                   TREATMENT SYSTEM I
   8.260
   8.300
1170.
   7.070
   0.023
 < 0.002
  21.20
   0.289
 < 0.036
 < 0.026
   0.358
 < 0.051
   1.600
   0.037
                                                  2.210
                                                  2.22
                                                313.
                                                  1.891
                                                  0.006

                                                  5.672
                                                  0.077
                                                  0.096

                                                  0.428
                                                  0.010
                                        Not
                                        Analyzed
                4.420
                6.800
             1180.
                6.790
                0.024
              < 0.001
               18.00
                0.163
              < 0.035
              <, 0.025
                0.053
              < 0.050
                1.120
                0.032
          1.182
          1.819
        315.7
          1.817
          0.006

          4.8
          0.044
          0.014

          0.300
          0.009
               Not
               Analyzed
19.60
4.850
35.70
9.150
0.012
0.005
11.50
0.397
< 0.035
< 0.025
0.590
< 0.050
1.280
0.127
5.235
1.295
9.534
2.444
0.003
0.001
3.071
0.106


0.158

0.342
0.034
                         Not
                         Analyzed
                                        30.577
8.180
26.182
                                    6.970
23.061
6.159
i/'ta

OTHER POIIOTANTS

    pH               '                    6.2                      6.0                      2.7
    Temperature °C                      26                       27                       24
121 Cyanide, Total                       0.011    0.003           0.185    0.049           0.009    0.002
    Oil & Grease                        20        5.35           20        5.35            1        0.3
    Total Organic Carbon                 7        l'.9             4        1.07          139       37.1
    Biochemical Oxygen Demand           12        3.2            22        5.6             0        0
    Total Suspended Solids              39       10.43           22        5.89          185       49.4
    Phenols                              00               00               0.027    0.007
    Fluoride                           910      243.5          1070      286.3          1925      514.1


 * Metals Not Included In Totals
                                                                  IX-42

-------
                    . TABLE 9-5A
             PICTORB TUBE PROCESS WASTES
                  (PUNT IDf 11114)
                 Treatment System I
                       (COOT)
 Stream Identification
 Sample Number
 Flow Rate: liters/Hr-Gallons/Hr
 Duration Hours/Day

 TOXIC ORGANICS

   1  Acenapthene
   3  Acrylonitrile
   4  Benzene
  11  1,1,1-Trichloroethane
  13  1,1-Dichloroethane
  23  Chloroform
  29  1,1-Dichloroethylene
  30  1,2-Trans-dichloroethylene
  38  Ethylbenzene
  39  Fluoranthene
  44  Methylene chloride
  48  Dichlorobrcraomethane
  51  Chlorodibromomethane
  55  Napthalene
  58  4-Nitrophenol
  65  Phenol
  66  Bis(2-ethylhexyl)phthalate
  67  Butyl benzyl phthalate
  68  Di-N-butyl phthalate
  70  Diethyl phthalate
  71  Dimethyl phthalate
  78  Anthracene
  81  Phenanthrene
  84  Pyrene
  85  Tetraehloroethylene
  86  Toluene
  87  Trichloroetnylene
  95  Alpha-Endosulfan
 102  Alpha-BHC
 105  Delta-BHC

 Total Toxic Organics

 TOXIC MET.M.S

 114  Antimony
 115  Arsenic
 117  Beryllium
 118 Cadmium
 119  Chromium
 120  Copper
 122  Lead
 123 Mercury
 124  Nickel
 125  Selenium
 126 Silver
 127 Thallium
 128  Zinc
Total Toxic Metals
 rng/1      kg/day
 Final Effluent
 85270
 22275 - 5885 .
 24
 NOt
 Analyzed
  0.061
  0.064
( 0.005
  0.370
  0.305
  0.030
 13.800
< 0.001
  0.111
< 0.002
  0.002
< 0.001
 32.800
 47.543
 0.033
 0.034

 0.198
 0.163
 0.016
 7.377

 0.059

•0.001

17.535
25.416
       IX-43

-------
NON-TOXIC ^ETALS

    Calcium*
    Magnesium *
    Sodium*
    Aluminum
    Manganese
    Vanadium
    Boron
    Barium
    Molybdenum
    Tin
    Yttrium
    Cobalt
    Iron
    Titanium
    Potassium
    Gallium
    Germanium
    Rubidium
    Strontium
    Zirconium
    Niobium
    Palladium
   , Indium
    Tellurium
    Tungsten
    Osmium
     Platinum
    Gold
     Bismuth
     Uranium
 Total Non-Toxic Metals

 OTHER POUOTANTS
     Tsjperature  C
 121 Cyanide, Total
     on & Grease
     Total Organic Carbon
     Biochemical Oxygen Demand
     Total Suspended Solids
     Phenols
     Fluoride
                                                    TABLE 9-5A (COOT.)
                                               PICTURE TUBE PB3CESS WASTES
                                                    (PLANT ID* 11114)
                                                    TREATMENT SYSTEM  I
8.310
7.730
1200.
7.610
0.048
< 0.001
19.40
0.503
< 0.035
< 0.025
0.049
< 0.050
2.040
0.122
4.443
4.132
641.5
4.068
0.026

10.4
0.269


0.026

1.091
0.065
 Not
 Analyzed
 •29.772     15.919
   6.1
  24
   0.525
  51
  89
   0
  80
   0.034
1140
  0.281
 27.26
 47.58
  0
 42.77
  0.018
609.4
  *Metals Not Included In Totals
                                                IX-44

-------
  Stream Identification
  Sample Niinber
  Plow Rat« Liters/Hr-Gallons/Hr
  Duration Hours/Day

  TOXIC ORC3ANICS

    1 Acen.jpthene
    3 Acrylonitrile
    4 Benzcine
   11 1,1,1-Trichloroethane
   13 1,1-Oichloroethane
   23 Chloroform
   29 1,1-Dichloroethylene.
   30 1,2-lScans-dichloroethylene
   38 Ethy].benzene
   39 Fluoranthene
   44 Msthylene chloride
   48 Di<^iorobramomethane
   51 Gilorodibromomethane
   55 Naptlialene
   58 4-Nilaxphenol
   65 Phenol
   66 Bis(;>^thylhexyl)phthalate
   67 Butyl benzyl phthalate
   68 Di-N--butyl phthalate
   70 Diethyl phthalate
   71 DiroeWiyl phthalate
   78 Anthracene
   81 Phencinthrene
   84 Pyrerie
   85 Tetrachloroethylene
   86 Tolucoie
   •87 Trichloroethylene
   95 AlphEi-Endosulfan
  102 Alphct-BHC
  105 Deltci-BHC

  Total Tosdc Organics

  TOXIC MEl'KLS

  114 flntinony
  115 Arsenic
  117 Beryllium
  118 Cadmium
  119 Chrcniiian
  120 CcKJeir
  122 Lead
  123 Mercury
  124 Nickel
  125 Selenium
  126 Silveir
  127 Thallium
  128 Zinc
  Total Tcoiic Metals
                                                              TABLE 9-5B
                                                      PICTURE TUBE PROCESS WASTES
                                                           (PLANT ID# 11114)
                                                          Treatment System II
tng/1      kg/day
    HP Etch
  Post Settle
03686
20439 - 5400
16
Not
Analyzed
mg/1      kg/day
  Other Process
    Raw Waste
03680
17033 - 4500
24
                        < 0.010



                        < 0.010

                        < 0.010

                          0.020    0.008
Not
Analyzed
                          0.010

                        < 0.010
          0.004
                        < 0.010
                          0.030
                          0.060
          0.012
          0.024
0.003
0.005
< 0.005
< 0.005
5.580
0.127
< 0.050
< 0.001
0.144
< 0.010 *
0.001
< 0.001
0.194
6.054
0.001
0.002


2.737
0.062


0.071

0.0005

0.095
2.9685
0.440
0.266
< 0.005
0.076
0.025
0.013
2.570
< 0.001
0.014
< 0.002
< 0.001
< 0.001
2.130
5.534
0.180
0.109

0.031
0.010
0.005
1.051

0.006



0.871
2.263
                                                                                            mg/1
          kg/day
Post Filtration
03684
17033 - 4500
24
Not
Analyzed
0.440
0.191
< 0.005
0.018
0.015
0.016
0.883
< 0.001
< 0.013
0.004
0.002
< 0.001
0.605
2.174
0.180
0.078

0.007
0.006
0.007
0.361


0.002
0.0008

0.247
0.8888
"Interference Present
                                                        IX-45

-------
NON-TOXIC METALS

    Calcium *
    Magnesium *
    Sodium *
    Aluminum
    Manganese
    Vanadium
    Boron
    Barium
    ftolybdenura
    Tin
    Yttrium
    Cobalt
    Iron
    Titanium
    Potassium
    Gallium
    Germanium
    Rubidium
    Strontium
    Zirconium
    Niobium
    Palladium
    Indium
    Tellurium
    Tungsten
    Osniura
    Platinum
    Gold
    Bismuth
    Uranium
Total Non-Toxic Metals

OTHER POLLUTANTS
    Temperature  C
121 Cyanide, Total
    Oil & Grease
    Total Organic Carbon
    Biochemical Oxygen Demand
    Total Suspended Solids
    Phenols
    Fluoride
                                                     TABLE 9-5B (CONT.)
                                                PICTURE TUBE PROCESS WASTES
                                                     (PLANT ID# 11114)
                                                    TREATMENT SYSTEM II
19.7Q
7.080
786.
0.121
0.296
< 0.001
0.770
0.034
< 0.035
< 0.025
0.042
< 0.050
80.
< 0.002
9.66
3.47
385.6
0.060
0.145

0.378
0.017


0.021

39.24

Not
Analyzed
81.263   39.86
26.20
8.270
637.
9.830
0.007
0.002
17.700
1.900
0.074
< 0.025
0.681
< 0.050
1.220
0.453
10.71
3.381
260.4
4.018
0.003
0.0008
7.236
0.777
0'.030

0.278

0.499
0.185
6.090
3.340
1810.
9.410
0.003
0.003
17.800
0.616
< 0.036
< 0.025
0.152
< 0.051
0.636
0.313
2.490
1.365
739.9
3.847
0.001
0.001
7.276
0.252


0.062

0.260
0.128
Not
Analyzed
31.867   13.0268
Not
Analyzed
28.933   11.827
7.7
27
0.002
18
5
16
178
0
15


0.001
8.83
2.45
7.85
87.32
0
7.36
2.3
36
0.009
14
8
0
137
0
1800


0.004
5.72
3.27
0
56
0
735.8
6.6
36
0
18
10
11
16
0
4000


0
7.4
4.1
4.5
6.5
0
1635.2
 "Metals Not Included In Totals
                                                     IX-46

-------
 Stream Identification
 Sample Number
 Plow Rate Liters/Hr-Gallons/Hr
 Duration Hours/Day

 TOXIC ORGiiNICS

   1 Acenapthene
   3 flcrylonitrile
   4 Benzene
  11 1,1,1-Trichloroethane
  13 1,1-Dichloroethane
  23 Chlorofoim
  29 1,1-Dichloroethylehe
  30 l,2-ri:ans-dichloroethylene
  38 Ethyllsenzene
  39 FluoKjnthene
  44 tfethylene chloride
  48 Dichlorcbrcrnonethane
  51 ChlorcxiLbranomethane
  55 Naptheilene
  58 4-Nitaxphenol
  65 Phenol;
  66 Bis(2"etnylhexyl)phthalate
  67 Butyl benzyl phthalate
  68 Di-N-*»utyl phthalate
  70 Diethyl phthalate
  71 Dimethyl phthalate
  78 Anthracene
  81 Phenanthrene
  84 Pyrena
  85 Tetra<4iloroethylene
  86 Toluene
  87 Trichloroethylene
  95 Alpha-Endosulfan
 102 Alpha-BHC
 105 Delta-BHC

 Total Tosd-c Organics

 TOXIC
 114 Antimony
 115 Arsend.c
 117 Beryllium
 118 Cadmium
 119 Chromum
 120 Coppeir
 122 Lead
 123 Mercuiy
 124 Nickel
 125 Selenium
 126 Silver
 127 Thalli.um
 128 Zinc
 Total Toxic Metals
                                                             TABLE 9-5B
                                                     PICTURE TUBE PROCESS WASTES
                                                           (PLANT ID#  11114)
                                                         Treatment System II
                                                                (CONT)
mg/1      kg/day
 Final Effluent
 03685
 30659 - 8100
 24
mg/1      kg/day
    HP Dump
85268
17033 - 4500
Batch
Not
Analyzed
Nat
Analyzed
0.079
0.062
< 0.005
0.006
•3.750
0.100
0.315
< 0.001
0.097
< 0.010 *
< 0,001
< 0.001
0.318
4.727
0.058
0.046

0.004
2.759
0.074
0.232

0.071



0.234
3.478
mg/1      kg/day
 Final Effluent
03681
20439 - 5000
Batch
                                                 < 0.010
                                                <  0.010
                                                 < 0.010
                                                 < 0.010
                                                 < 0.010
27.000
9.000
< 0.010
0.975
1.500
0.074
6.820
0.002
0.420
< 0.300 *
0.001
< 0.025 *
10.300
56.092
0.092
0.031

0.003
0.005
0.0003
0.023
0.000007
0.001

0.000003

0.035
0.19031
3.200
1.570
< 0.005
0.031
0.020
0.020
3.190
< 0.001
< 0.013
< 0.025 *
0.004
< 0.010 *
1.080
9.115
0.013
0.006

0.0001
0.00008
0.00008
0.013



0.00002

0.004
0.03628
"Interference Present
                                                       IX-47

-------
NON-TOXIC M3TALS

    Calcium *
    Magnesiun *
    Sodium *
    Aluminum
    Manganese
    Vanadium
    Boron
    Barium
    Molybdenum
    Tin
    yttrium
    Cobalt
    Iron
    Titanium
    Potassium
    Gallium
    Germanium
    Rubidium
    Strontium
    Zirconium
    Niobium
    Palladium
    Indium
    Tellurium
    Tungsten
    Osmium
    Platinum
    Gold
    Bismuth
    Uranium
Total Non-Toxic Metals
     Temperature C
 121 Cyanide, Total
     Oil & Grease
     Total Organic  Carbon
     Biochemical Oxygen Demand
     Total Suspended Solids
     Phenols
     Fluoride
                                                  TABLE 9-5B  (CONT.)
                                              PICTURE TUBE PROCESS WASTES
                                                   (PLANT IDS  11114)
                                                 TREATMENT SYSTEM II
15.10
5.700
1050.
5.060
0.196
0.002
11.00
0.229
0.037
< 0.025
0.081
< 0.050
56.70
0.112
11.11
4.194
772.6
3.723
0.144
0.001
8.09
0.169
0.027

0.060

41.72
0.082
6.220
2.920
5250.
311.
0.540
0.326
862.
5.110
1.840
0.311
0.047
< 0.100
22.20
15.20
0.021
0.010
17.88
1.059
0.002
0.001
2.936
0.017
0.006
0.001
0.0002

0.076
0.052
3.310
1.190
10800.
62.600
< 0.001
0.045
193.
1.630
0.087
0.089
0.025
0.548
1.050
0.412
0.014
0.005
44.148
0.256

0.0002
0.789
0.007
0.0004
0.0004
0.0001
0.002
0.004
0.002
 Not
 Analyzed
 73.417   54.016
  7.5
 36
  0.520
 10
  8
  0
135
  0
700
  0.383
  7.36
  5.89
  0
 99.34
  0
515.1
                Not
                Analyzed
                        1218.574
                          4.1522
Not
Analyzed
                                                 259.486
                                                            1.0611
0.011
17
24
0
3350
0.008
8400
0.00004
0.058
0.082
0
11.412
0.00003
28.615
0.007
17
472
0
38
0.008
4500
0.00003
0.069
1.929
0
0.155
0.00003
18.39
  *Metals Not Included In Totals
                                                    IX-48

-------
                                                             TABLE 9-5C
                                                     PICTURE TUBE PROCESS WASTES
                                                          (PUNT IDf 11114)
                                                        Treatment System III
                                                               (CONT)
 Stream Identification
 Sample Numtxjr
 Flew Rate L±ters/Hr-Gallons/Hr
 Duration Hours/Day

 TOXIC ORGBNICS

   1 Acenaptliene
   3 AcrylonJLtrile
   4 Benzene
  11 1,1,1-Trichloroethane
  13 1,1-Dichloroethane
 , 23 Chloroform
  29 1,1-Dichloroethylene
  30 l,2y£raiis~dichloroetnylene
  38 Ethylbenzene
  39 Fluorantliene
 : 44 Methylene chloride
  48 Dichlorobranctnethane
  51 Chlorodjiaranoniathane
  55 Naptnalesne
  58 4-Nitropnenol
  65 Phenol
  66 Bis(2-et:hylhexyl)phthalate
  67 Butyl benzyl phthalate
  68 Di-N-butyl phthalate
  70 Diethyl phthalate
  71 Diraethyl  phthalate
  78 Anthracene
 , 81 Phenant±irene
  84 Pyrene
  85 Tetrachloroethylene
  86 Toluene
  87 Trichloxoethylene
  95 Alpha-Endosulfan
 102 Alpha-BBC
 105 Delta-BBC

 Total Toxic Organics

TOXIC MJTALS

 114 Antimony
 115 Arsenic
 117 Beryllium
 118 Cadmium
 119 Chromium
 120 Copper
 122 Lead
 123 Mercury
 124 Nickel
 125 Selenium
126 Silver
127 Thallium
128  Zinc
Total Toxic Metals
 mg/1      kg/day
 Total Phosphor
     Effluent
 03682
 5110 - 1350
 24
< 0.010
< 0.010

< 0.010
< 0.010
 < 0.010

  0.020
 Not
 Analyzed
< 0.010

< 0.010
0.002
  0.030    0.004
< 0.010
  0.050    0.006
 Not
 Analyzed
               mg/1      kg/day
               Green Phosphor
                   Effluent
               85276
               1703 - 450
               24
               Not
               Analyzed
                0.004
              <  0.002
              <  0.005
              11.600
                2.380
                0.013
                0.050
                0.001
                0.013
                0.002
                0.001
              (  0.001
              19.100
              33.085
                                    0.0002
                                    0.474
                                    0.097
                                    0.00004

                                    0.781
                                    1.35224
  mg/1      kg/day
  Blue Phosphor
     Effluent
  85275
  1703 - 450
  24
 Not
 Analyzed
< 0.001
< 0.002
< 0.005
  0.020
  /3.750
  0.013
  0.050
  0.001
  0.013
  0.002
  0.008
 < 0.001
  31.500
  35.278
0.0008
0.153
0.0003

1.29
1.4441
                                                    IX-49

-------
NON-TOXIC ^ETALS

    Calcivn  *
    Magnesium *
    Sodium *
    Aluminum
    Manganese
    Vanadium
    Boron
    Barium
    l-blybdenura
    Tin
    Yttriun
    Cobalt
    Iron
    Titanium
    Potassium
    Gallium
    Germanium
    Rubidium
    Strontium
    Zirconium
    Niobium
    Palladium
    indium
    Tellurium
    Tungsten
    Osnium
    Platinum
    Gold
    Bismuth
    Oraniun
Total Non-Toxic Metals
             TABLE 9-5C (GOMT.)
        PICTURE TUBE PROCESS WASTES
             (PLANT ID# 11114)
            TREATMENT SYSTEM II

                           0.257
                         < 0.025
                          18.300
                           0.021
                         < 0.001
                         < 0.001
                           0.094
                           0.538
                         < 0.035
                         < 0.025
                           0.037
                           0.212
 Not                      0.004
 Analyzed               < 0.002
    Teraperature  C
Rl Cyanide, Total
    Oil 6 Grease
    Total Organic Carbon
    Biochemical Oxygon Demand
 '   Total Suspended Solids
    Phenols
    Fluoride
   0
 505
 J30
  48
1030
   0
  45
  0
 61.9
 15.9
  5.9
132.5
  0
  5.5
                          0.011

                          0.748
                          0.0009
                          0.004
                          0.022
                          0.002
                          0.009
                          0.0002
                          Not
                          Analyzed
                            0.906     0.0381
 4.8
28        1.14

Not Analyzed

35        1.43
Not Analyzed
                         1.110
                         0.187
                        20.200
                         0.158
                         0.001
                         0.001
                         0.137
                         0.552
                        : 0.035
                        : 0.025
                         0.142
                         0.193
                         0.009
                        : 0.002
         0.045
         0.008
         0.826
         0.006
          0.006
          0.023
          0.006
          0.008
          0.0004
                                         Not
                                         Analyzed
                                                    1.191    0.0494
 5.0
28        1.14

Not Analyzed

36        1.47
Not Analyzed
 *Metals Not Included In Totals
                                                    IX-50

-------
  Stream identification
  Sample number
  Plow Rate Liters/Hr - Gallons/Hr
  Duration Hours/Day

  TOXIC OIX3ANICS
                                                              TABLE 9-SC
                                                      PICTURE TUBE PROCESS HASTES
                                                            (PLANT ID*  11114)
                                                         Treatment System III
  mg/1      kg/day
   Green Phosphor
     Raw Waste
  85273
  1703 - 450
  24
                mg/1      kg/day
                 Blue Phospher
                   Raw Waste
                85272    *
                1703 - 450
                24
                                                                                          mg/1      kg/day
                                                                                           Red Phosphor
                                                                                            Raw Waste
                                                                                          85271
                                                                                          1703 -  450
                                                                                          24
  1 Acenapthene
  3 Acrylonitrile.
  4 Benxene
 11 1,1,.1-Trichloroethane
 13 l,l--Dichloroethane
 23 Chloroform
 29 1,1-Dichloroethylene
 30 l,2"Trans-dichloroethylene
 38 Ethylbenzene
 39 Fluoranthene
 44 tfethylene chloride
 48 Dichlorobrgmomethane  .
 51 Chlorodibranotnethane
 55 Napliialene
 58 4-Nitrophenol
 65 Phenol
 66 Bis(2-ethylhexyl)phtnalate
 67 Butyl benzyl phthalate
 68 Di-N-butyl phthalate
 70 Dielihyl phthalate
 71 Dimeithyl phthalate
 78 Anttiracene
 81 Pheiianthrene
 84 Pyrtsne
 85 Tetrachloroethylene
 86 Toluene
 87 Tricjhloroethylene
 95 Alpha-Endosulfan
102 Alpha-BHC
105 Dslta-BHC

Total TcscLc Organics

TOXIC MITALS

114 AntJjnony
115 Arscsnic
117 Berjrllium
118 Cadmium
119 Chrttnium
120 Copjier
122 Leafl
123 ffercwry
124 Nid-el
125 Selenium
126 Silver
127 Thallium
128 Zinc:
Total Toxic Metals
                                          Not
                                          Analyzed
                           Not
                           Analyzed
 < 0.001
   0.006
 < 0.005
 184.
   4.970
   0.240
                                          < 0.
                                          <0.
    .050
    .001
 < 0.013
 < 0.010*
   0.005
 < 0.001
1540
1729.221
 0.0002

 7.52
 0.203
 0.010
 0.0002

62.94
70.6735
   0.001
   0.002
 < 0.005
   0.756
   4.480
 < 0.013
 < 0.050
 < 0.001
 < 0.013
 < 0.010 *
   0.360
 < 0.001
1910.
1915.599
                                                                              0.00004
                                                                              0.00008

                                                                              0.031
                                                                              0.183
                                                                              0.015

                                                                             78.07
                                                                             78.29912
                                                                                                                    ?•»*•' *i
                                                                                                                    sfes'
                                         Not
                                         Analyzed
< 0.001
0.008
< 0.005
0.120
3.710
< 0.013
< 0.050
< 0.001
< 0.013 ,
< 0.010*
0.004
< 0.001
2.860
6.702

0.0003

0.005
0.152

-,



0.0002

0.117
0.2745
* Interference Present
                                                         IX-51

-------
NON-TOXIC MSTALS

    Calcium *
    Magnesiur *
    Sodium *
    Aluminum
    Manganese
    Vanadium
    Boron
    Barium
    Molybdenum
    Tin
    Yttrium
    Cobalt
    Iron
    Titanium
    Potassium
    Gallium
    Germanium
    Rubidium
    Strontium
    Zirconium
    Niobium
    Palladium
    Indium
    Tellurium
    Tungsten
    Osraiun
    Platinum
    Gold
    Bisnuth
    Uranium
Total Non-Toxic Metals

OTHER POLLOTANTS
    Temperature  C
121 Cyanide, Total
    Oil & Grease
    Total Organic Carbon
    Biochemical Oxygen Demand
    Total Suspended Solids
    Phenols
    Fluoride
                                                       TABLE 9-5C  (OOMf.)
                                                   PICTURE TUBE PROCESS WASTES
                                                        (PIAWT ID#  11114)
                                                      TREATMENT SYSTEM II
0.481
< 0.049
787.
0.426
< 0.001
< 0.003
2.390
0.825
< 0.069
0.123
0.411
0.293
0.093
< 0.004
0.020

32.2
0.017


0.098
0.034

0.005
0.017
0.012
0.004

5.120
0.794
1280.
1.010
< 0.001
< 0.001
< 0.002
0.151
< 0.035
0.111
8.160
< 0.050
0.024
< 0.002
0.209
0.032
52.3
0.041



0.006

0.005
0.334

0.001

  Not
  Analyzed
   4.561    0.187
   4.9
  31

  NOt
  Analyzed
2450
  Not
  Analyzed
100.1
                Not
                Analyzed
0.271
0.496
149.
0.188
< 0.001
0.172
0.721
0.012
0.133
0.591
1300.
4.730
< 0.001
0.038
0.011
0.020
6.09
0.008

0.007
0.030
0.0005
0.005
0.024
53.13
0.193

0.002
                           Not
                           Analyzed
                 9.456
   4.9   sr
  28     |p

   Not    '
   Analyzed

2560
  Not
  Analyzed
                                     0.387
                                                 1306.586   53.3995
                                          5.0
                                         35

                                         Not
                                         Analyzed
                                   104.6
1840
  Not
  Analyzed
                                                            75.20
 *Matals Not Included In Totals
                                                   IX-52

-------
                                                          TABLE 9-5C (OONT)
                                                     PICTURE TUBE PROCESS WASTES
                                                          (PLANT IDS H114)
                                                        Treatment System III
 Stream Mortification
 Sample Nuritoer
 Flow Rate Liters/Hr-Gallons/Hr
 Duration Hours/Day

 TOXIC ORQiNICS

   1 Acenapthene
   4 Benzene
  11 1,1,1-Trichloroethane
  13 1,1-Dichloroethane
  23 Chloroform
  29 1,1-Dichloroethylene
  30 1,2-tirans-dichloroethylene
  38 Ethyltenzene
  39 Fluorcinthene
  44 Methylene chloride
  48 Dicftlorcbrcrrtcmethane
  51 Chlorodibrancmethane
  55 Napthsilene
  58 4-Nitrophenol
  65 Phenol
  66 Bis(2-ethylhexyl)phthalate
  67 Butyl benzyl phthalate
  68 Di-N-biutyl phthalate
  70 Diethyl phthalate
  71 Dimethyl phtnalate
  78 Anthracene
  81 Phenanthrene
  84 Pyrenei
  85 Tetrachloroethylene
  86 Toluene
  87 Trichloroethylene
  95 Alpha-Endosulfan
 102 Alpha-BHC
 105 Delta-BHC

 Total Toxic Organics

 TOXIC ^ETACS

 114 Antimony
 115 Arsenic
 117 Beryllium
 118 Cadmium
 119 Chromium
 120 Copper
 122 Lead
 123 Mercury
 124 Nickel
 125 Selenium
126 Silver
127 Thallium
128  Zinc
Total Toxio Metals
•s?
      mg/1      kg/day
       Red Phosphor
         Effluent
      85274
      1703 - 450
      24
      Not
      Analyzed
       0.001
       0.002
       0.005
       0.065
       2.620
       0.013
       0.050
       0.001
       0.013
       0.020
       0.001
       0.001
       0.718
       3.423
0.003
0.107
0.0008
0.029
0.1398
                mg/1      kg/day
                  Total Plant
                    Effluent
                03683
                283875 - 75000
                24
                                O.OIO(B)
                                0.050
                                0.010
                                     (B)
                                O.OIO(B)
                                0.010
                                0.010
                            0.341
                                0.060
                               < 0.010
                               < 0.010
                0.010
                0.090
                0.030

                0.005
                0.005

                0.230
 0.052
 0.037
: 0.005
 1.310
 1.230
 0.045
 1.960
 O'.OOl
 0.047
 0.002
: 0.001
: o.ooi
 7.310
11.993
                           0.409
                                           0.613
                                           0.204
                                           1.567
 0.354
 0.252

 8.925
 8.380
 0.307
13.353

 0.320
 0.014
49.80
81.706
                                                IX-53

-------
NON-TOXIC METALS

    Calcium *
    Magnesium * •
    Sodium *
    Aluminum
    Manganese
    Vanadium
    Boron
    Barium
    Molybdenum
    Tin
    Yttrium
    Cobalt
    Iron
    Titanium
    Potassium
    Gallium
    Germanium
    Rubidium
    Strontium
    Zirconium
    Niobium
    Palladium
    Indium
    .Tellurium
    Tungsten
    Osmium
    Platinum
    Gold
    Bismuth
    Oranium
Total Non-Toxic Metals

OTHER POLLUTANTS
    Temperature  C
121 Cyanide, Total
    Oil & Grease
    Total Organic Carbon
    Biochemical Oxygen Demand
    Total Suspended Solids
    Phenols
    Fluoride
                                                TABLE 9-5C (COOT.)
                                           PICTURE TUBE PROCESS WftSTES
                                                (PLANT IDS 11114)
                                               •TREATMENT SYSTEM II
0.157
< 0.025
9.930
2.400
< 0.001
< 0.001
0.383
0.005
< 0.035
< 0.025
2.460
0.186
0.031
0.007
0.006

0.406
0.098


0.016
0.0002


0.101
0.008
0.001
0.0003
23.200
8.380
454.
4.100
0.037
0.002
9.420
0.186
< 0.035
< 0.025
0.237
< 0.050
9.930
0.045
158.1
57.09
3093.
27.9
0.252
0.014
64.18
1.267


1.615

67.65
0.307
NOt
Analyzed
 5.472    0.2245
                                         5.0
                                        32
Not Analyzed
 8
          0.327
 Not
 Analyzed
 23.957    163.185



  7.2

  0.002      0.014
 49
101
 71
 63
334
688.1
484
429
                          0.046
                                     0.313
Not Analyzed
                        480
                                  3270
 *Metals Not Included In Totals
                                                 IX-54

-------
                                                             •CABLE 9-6
                                                      APERTURE MASK PROCESS WASTES
                                                           (PLANT ID#  36146)
 Stream Identification
 Sample Numljer
 Flow Rate I,iters/Hr-Gallons/Hr
 Duration Hours/Day

 TOXIC  ORGAMICS

   1 Acenaptftene
   3 Acryloriitrile
   4 Benzene!
  11 1,1,1-Irichloroethane
  13 1,1-Dichloroethane
  23 Chloroform
  29 1,1-Dichloroethylene
;  30 1,2-Trans-dichloroethylene
  38 Ethylbenzene
  39 Fluoranthene
  44 Metnylene chloride
  48 Dichlorobrcmomethane
  51 Chlorodibrcitcraethane
  55 Napthalene   .
  58 4-Nitrophenol
  65 Phenol
  66 Bis(2-ethylhe3{yl)phthalate
  67 Butyl bsnzyl phthalate
  68 Di-N-butyl phthalate
  70 Diethyl phthalate
  71 Dimethyl phthalate
  78 Anthraoane
  81 Phenantlirene
,  84 Pyrene
  85 Tetxadiloroethylene
  86 Toluene
  87 Trichlojcoethylene
  95  Alpha-Eildosulfan
102  Alpha-BHC
105  Delta-HIC

Total Toxic Qrganics

PRIORITY MKi!ALS

114 Antimony
115 Arsenic
117 Beryllium
118 Cadmium
119 Chronium
120 Copper
122 Lead
123 Mercury
124 Nickel
125 Selenium
126 Silver
127 Thallium
128 Zinc
Total Toxic Metals
mg/1      kg/day
   Aperture Mask
   Etch Waste
M17-1-1
39515 - 10440
24
 0.060(B)  0.057
0.060
0.0005
0.005
0.005
0.0002
3.480
0.570
0.009
0.001
0.025
0.005
0.015
0.0005
0.193
4.2522
         0.057
0.0002
3.300
0.541
0.009
0.183
4.0332
                                                IX-55

-------
                                              TABLE 9-6 (COOT.)
                                        APERTURE MASK PROCESS WASTES
                                             (PLANT IDf 36146)
NON-TOXIC METALS

    Calcium *
    Magnesium  *
    Sodium *
    Aluminum
    Manganese
    Vanadium
    Boron
    Barium
    tfelybdenum
    Tin
    Yttrium
    Cobalt
    Iron
    Titanium
    Potassium
    Gallium
    Germanium
    Rubidium
    Strontium
    Zirconium
    Niobium
    Palladium
    Indium
    Tellurium
    Tungsten
    Osmium
    Platinum
    Gold
    Bismuth
    Uranium
Total Non-Toxic Metals

OTHER POLLOTANTS
    Temperature  C
121 Cyanide, Total
    Oil & Grease
    Total Organic Carbon
    Biochemical Oxygen Demand
    Total Suspended Solids
    Phenols
    Fluoride
 Not
 Analyzed
  3.1
 23
  2.1
  8.4
  4.0
 18
 52
< 0.002
 Not Analyzed
 1.992
 7.966
 3.793
17.07
49.315
*Matals Not Included In Totals
                                              IX-56

-------
           Trace Levels - Pollutants detected at levels too low
           to be measured quantitatively are reported as the value
           preceded by a less tlmn sign U-^.  All other pollu-
           tants are reported as^ihe' measured value.

      .  :   Mass Load - Total daily discharge in kilograms/day of
           a particular pollutant is termed the mass load.  This
        {   figure is computed by multiplying the measured concen-
        !   tration (mg/1)  by the water discharge rate expressed
           in liters per day.

           Sample Blanks - Blank samples of organic-free, distilled
           water were placed adjacent to sampling points to
           detect airborne contamination of water samples.  These
           sample blank data are not subtracted from the analysis
        ;   results,, but, rather, are shown as a (B)  next to the
           pollutant found in both the sample and the blank.

Television picture tube manufacture was sampled at  two plants.
Manufacture of steel aperture masks, used in subsequent picture
tube manufacturing,  was sampled at one plant.   Because of the
complexity of  picture tube manufacturing, segregation of the wet
processes  for  wastewater  sampling was impractical,  and discrete
process samples were not  obtained.   Many samples taken include
wastewater from more than one of the wet processes  listed in
Table 9--2.

Television Picture Tubes  - Two plants manufacturing television pic-
ture tubes were visited and sampled.   Tables 9-4 and 9-5 present the
analysis of raw waste and treated effluent discharge streams for
process water  usage  associated with television picture tube manu-
facture,,

Aperture Mask  Manufacture - One plant manufacturing aperture masks
was visa.ted and sampled.   Table 9-6 presents analysis of a raw waste
sample for process water  usage associated with aperture mask manu-
facture.

Summary of  Raw Waste Stream Data

Tables 9-7  and 9-8 summarize  pollutant concentration data for
the raw waste  streams  sampled  for the electron tube subcategory.
Minimum, maximum,  mean, and flow weighted mean concentrations have
been determined  for  the summarized  raw waste streams.   The flow
weighted! mean  concentration was calculated by  dividing the total
mass rates  (mg/day)  by  the  total flow rate (liters/day)  for all
sampled data for each parameter.  Pollutant parameters listed in
Tables 9-7  and  9-8 were selected based upon their occurrence and
concentration  in the  sampled  streams.   Those parameters either not
detected or detected  at trace  levels  in all sampled streams were
excluded from  these  tables.
                           IX-57

-------
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      'li'SSg  J|
      ^H 4J t-« -^ g3  E

      'H'SSSH  o
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      -<«;
-------
                                      TABLE 9-8

                            Summary of Raw Waste Data for
                              Aperture Mask Manufacture

                                     Plant 36146
Toxic Organics

Methylene chloride

Toxic Metals

118 Cadmium
119 Chromium
120 Copper
122 Lead
128 Zinc

Other Pollutants

121 Cyanide, Total
    Oil and Grease
    Total Organic Carbon
    Biochemical Oxygen Demand
    Total Suspended Solids
Concentration*
    (mg/D

     0.060
     0.0002
     3.480
     0.570
     0.009
     0.193
     2.1
     8.4
     4.0
    18
    52
    Single Stream Sample Value
                                  IX-59

-------
The manufacture of television picture tubes and of steel aperture
masks for use in television picture tubes were ' the only electron
tube product areas sampled.  The other two major electron tube
product types, transmitting and receiving, utilize process water
primarily for electroplating which is included iin the Metal Fini-
shing Category.                                |

Plants having wet processes other than electroplating are limited
in number and in most instances limited in process water usage.
These plants consist of those manufacturing cathode-ray tubes
other than television picture tubes and plants manufacturing
particular types of transmitting tubes.  These!plants have wet
processes similar to many found within television picture tube
manufacture.                                   i

Table 9-7 summarizes raw waste streams sampled|at two plants manu-
facturing television picture tubes, Plants 301?2 and 11114.  Plant
30172 was composite sampled for three 24-hour periods, and Plant
11114 was composite sampled for one 24-hour period.  Obtaining total
raw waste samples at both plants was impractical.  Therefore,
individual process raw waste samples are summarized to produce a
combined raw waste stream for each plant.  The total raw waste stream
developed for Plant 30172 includes all process wastes that, receive
wastewater treatment, but does not include untreated process- wastes
discharged directly.  The total raw waste stream developed for Plant
11114 includes all process wastes that receive wastewater treatment
as well as those process wastes that do not receive treatment.  The
untreated process wastewater flows are significant .and constitute 48
and 78 percent of the total process wastewater;at Plants 30172 and
11114, respectively.  These untreated process wastewaters predomi-
nantly include dilute rinse waters associated with wet process opera-
tions.  In addition, both facilities have raw pastes that are not
included in the summary raw wastes and are discussed below.

At Plant 30172 phosphor coating raw waste samples could not be
obtained prior to treatment because of the proprietary nature of
the process.  Phosphor coating raw wastes were|obtained at Plant
11114 and account for much of the differences between several
metals concentrations for the two plants.  These metals include
cadmium, zinc, and yttrium, all of which are prime constituents
of phosphor coating materials.                 !

At Plant 11114, eight of nine raw waste streams were sampled and
proportioned together as a total raw waste.  Tl^e ninth raw waste
stream was a hydrofluoric acid etch waste that;was discontinued
the week following the sampling visit.  'Therefore, this raw
waste stream was not included as a component o£ the summary raw
waste for this facility.

Table 9-8 presents raw waste concentration data for one sample
taken at Plant 36146.  This sample represents all process waste-
water from the manufacture of aperture masks by chemical etching.
                            IX-60

-------
In addition, an organics analysis of total raw waste was  not obtained
at the  two  facilities manufacturing picture  tubes.  However, indivi-
dual process wastes were sampled and analyzed for organic pollutants
if organic  pollutants were known to be used  in a particular manufac-
turing  process.  Therefore, organic analysis is not available  for
all sampled raw waste streams.  However, organic analysis is pre-
sented  for  the raw waste stream developed on a pollutant  mass  balance
on the  sampled streams at Plant 11114.  Organic analysis  is presented
in Table 9-8 for Plant 36146 which manufactures steel aperture masks.

Treatment In-Place

The following is a plant-by-plant discuss ton-of raw waste and  final
effluent process ^astewatecs sampled for this study at plants  manu-
facturing television picture tubes and aperture masks for use  in
television  picture tubes.  A discussion of waste treatment techno-
logies  presently in use at these same plants is also presented.
Table 9-9 summarizes treatment in-place and  effluent discharge des-
tinations of plants visited during this study.

Plant 30172 produces color television picture tubes.  Figure 9-7 de-
picts sampling locations and wastewater treatment at Plant 30172.
Sampling locations were selected on two bases.  First, wastewater from
many of the wet processes was sent to «H fire cent treatment systems
because of  the different pollutant characteristics of each process
waste stream,  Second, accessibility to process operations was
restricted  during the sampling visit.  Analytical results were
presented in Tables 9-4A, 9-4B, an'd 9-4C.

Wastewaters produced from red, green, and blue phosphor applica-
tions flow  to separate settling tanks*  Wastewater from the red
phosphor settling tank is subsequently sent  through a paper
filtration  unit.  The phosphors are recovered by gravitational
settling and returned to phosphor preparation.  The wastewater
is sent to  a final holding lagoon.

Process wastes from the tube salvage operation are sent to lead
treatment.  The wastes flow to a 6613 liter  (1800 gallon) treat-
ment tank where sodium carbonate is added.  The partially treated
wastes  are  sent through a sludge dewatering  unit.  Approximately fifty
208 liter (55 gallon) drums per year of carbonate sludge  are sent to
a toxic chemical landfill and the filtrate is sent to primary
treatment.  Samples were taken before and after lead treatment.

The photoresist solution and the deionized water developer
solution are sent to chromium treatment.  The chromium bearing
wastewater  is reduced'from the hexavalent to the trivalent state
using sulfuric acid and sodium bisulfite.  The partially  treated
wastes  then flow to primary treatment.  Wastewater samples were
taken before and after chromium treatment.
                              IX-61

-------
                         TABLE  9-9


                 ELECTRON TUBE  MANUFACTURE
     SUMMARY OF WASTEWATER TREATMENT AT  VISITED  PLANTS
Plant ID No.
    30172
    11114




    36146

    41122

    19102



    23337
 I « Indirect
 D * Direct
NA s Not Applicable
Treatment In-Place                  Discharge

Chemical precipitation and clari-      D
fication, multimedia filtration,
sludge dewatering, chromium reduc-
tion, phosphor settling, sludge
drying lagoon, solvent collection
and incineration, holding lagoon

Chemical precipitation and sedi-       I
mentation, pH adjustment, phosphor
settling
pH adjustment, settling                D

pH adjustment                          I

No Wet Processes For Electron          NA
Tube Manufacture      !
No Wet Processes For Electron          NA
Tube Manufacture
                              IX-62

-------
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-------
 Process wastewaters from the following operations receive no
 chemical waste treatment and flow directly to the final holding
 lagoon:  final deionized water rinses after photoresist applica-
 tion;  phosphor settling associated with screening; an ultrasonic
 cleaning rinse associated with mount assembly; ai funnel deter-
 gent clean rinse; the rinse that concludes paneli cleaning from
 the tube salvage process; and wastewater from a trichloroethylene
 carbon adsorption recovery system.

 All Bother process wastewatecs aot associated with phosphor appli-
 cation,  which include rinses from many oE the wejt processes, to-
 i/efchec with the partially treated wastes (from chromium d'ul l«d«l
 bceafcment,  flow to a primary fluoride treatment system.  Primary
 fluoride waste treatment is intended to reduce pollutant levels of
 metals,  solids,  and fluorides,  as well as to adjust the wastewater
 pH.  The wastes are sent to one of two holding tanks and then to a
 flash  mix tank where sodium bisulfite, calcium chloride, and lime are
 added.  A polyelectrolyte is added prior to sedimentation in a 113,550
 liter  (30,000 gallon)  clarifier.   The settled sludge is sent through
 a  rotary vacuum filtration unit and then to a sludge drying bed.
 Recently,  570,909 kg (628 tons) of dried sludge collected over an 8
 year period was sent to a toxic materials landfill.   The filtrate
 from the sludge dewatering unit is returned to trie clarifier.  The
 effluent from the clarifier flows through a series of dual-media
 sand/carbon filters and a holding lagoon before peing discharged to
 a  river.   All organic  solvents  from cleaning and!coating operations
 are  collected from their respective processes an<3 incinerated.
 Sampling within primary fluoride  treatment occurred at the
 following  locations:   prior to  rapid mixing;  after the clarifier,
 and  after  sand/carbon  filtration.               j

 Plant  11114 produces color television picture tubes.   Because of
 the  size  of the  plant,  process  wastewater is sent: to one of
 three  treatment  systems according to the locatioft of the waste-
 water  source within the facility.  Wastewater treatment consists
 of pH  adjustment,  settling,  and filtration.   In all  cases,  pH
 adjustment  is accomplished with sodium carbonate!and settling
 occurs in 18,925  liter  (5,000 gallon)  tanks.   All settled material
 is contractor removed.   Tables  9-5A,  9-5B,  and 9^5C  presented
 analytical  results,  and Figure  9-8 presents  waste treatment
 technologies  and  sampling  locations at Plant 11114.
                                                 i
One  treatment system receives hydrofluoric acid  (Containing
wastes from tube  salvage.   The  wastewater is  sent to a holding
 tank for pH  adjustment  before entering a settling tank.   A
 sample was  taken  of  these  wastes  prior to pH  adjustment and
 after  the  initial  settling.  Other wastewater from the tube
 salvage process  is  pH adjusted  and sent to another settling
 tank,  A sample was  taken  of  these wastes prior  to pH adjust-
 ment.  Wastewater  from  the  two  settling tanks flow together
 through a series  of  three  more  settling tanks and a  cartridge
filter.  Samples were taken before and after  the ; filtration unit.
                               IX-64

-------
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-------
 Wastewaters  from aperture mask degreasing and panel wash are pH
 adjusted  and settled.   This wastewater,  together with waste-
 water from the  filtration unit,  flows through three settling
 tanks prior  to  final  discharge to the municipal treatment system.
 Samples were taken of  aperture mask degreasing and panel wash
 wastewater prior to pH adjustment.   Samplesj were also taken of
 the  final treated effluent.                I
                                            i
 The  second treatment  system receives wastewater from another
 area of the  facility  containing  aperture ma^k hydrofluoric acid
 etching wastes.   These wastes  are first  pH Adjusted and then flow
 through three settling tanks.  Wastewater was sampled after the
 third settling  tank.   The process producing this wastewater was
 discontinued the week  following  the sampling visit.  Other pro-
 cess wastewater is pH  adjusted,  settled  twice,  and sent through
 a cartridge  filter.  This partially treated1 waste then flows to a
 finalsettling  tank together with the treated hydr9fluoric acid
 containing wastes.  Wastewater was  sampled prior to pH adjustment,
 after the filtration unit,  and before discharge to the municipal
 treatment system.                           j
                                            j
 There are some  additional hydrofluoric acidj containing wastes
 that are  pH  adjusted,  settled, and  sent  to the municipal treat-
 ment system.  Wastewater  was sampled before; and after this
 treatment process.

 The  remaining treatment system recovers  phosphor materials.   There
 are  six subsystems, two each for red,  greenl  and blue phosphors.
 In each subsystem,  phosphor coating solution flows to a holding
 tank,  then through  a settling  tank  and a ceiitrifugation filter
 before being  discharged to  the municipal treatment system.
 Samples were  taken  before and  after settling.   The filtration
 units were not  in  operation during  the sampling visit.

 All  treated  process wastewater,  untreated process wasteiwater,
 and  non-contact  cooling water  flow  together;to the municipal
 treatment system.   A composite sample was taken of this final
 plant effluent.                             j

 Plant 36146 produces steel  aperture masks foe use in color
 television picture  tubes.   The masks are produced by a photo-
 graphic etching  process.  A composite sample was taken of waste-
water from the  etching  process,  including both dumps and rinses,
 and  analytical  results  were presented in Takle 9-6.  Figure  9-9
depicts'the  sampling location  and wastewatei: treatment at this
plant.  The  etching wastewater is pH adjusted with lime and  sent
 to a settling pond  before discharge to a riyer.
                             IX-66

-------
                        Lime
                         1
 Aperture Mask
Formation Waste
M17-1-1
a
pH Adjustment


Settling
Pond
                                                      •River
                  FIGURE 9-9

SAMPLING LOCATION AND IN-PLACE WASTE  TREATMENT
                 PLANT 36146
                       IX-67

-------
 POTENTIAL POLLUTANT PARAMETERS              i

 Potential pollutant parameters for the electron tube subcategory
 are based on the list of pollutants presented in Table 9-3.
 Rationale for pollutant selection was based on information from
 the following:                              ;
                                             i
           Presence of toxic pollutants, non-toxic metals,
           and other pollutant parameters    ;

           Occurrence of pollutant as a raw material or process
           chemical in television picture tube and aperture mask
           manufacturing processes

           Treatability of pollutants at repotted concentration
           levels                            I
                                             i
           Toxicity of pollutants at reported\concentration
           levels                     ,       |

 Table 9-10 presents the potential pollutant parameters for the
 manufacture of television picture tube  products and steel aper-
 ture masks.                                  j
                                             1
 Tables 9-11 and 9-12 list pollutants not selected as potential
 parameters that were analyzed in the raw wastle streams sampled
 for television picture tube manufacture and aperture mask manu-
 facture.   Both Tables 9-11 and 9-12 present pollutants according
 to  the following classifications:   not  detected,  detected at trace
 levels or detected  at levels too low to be effectively treated
 prior to  discharge.   Pollutant concentration^  are determined to
 be  too low for effective treatment for  any or  all of the  following
 reasons:                                     !

           Levels of  treatability for many non-toxic parameters
           are  unknown.                       I
                                             i
                                             i
           Pollutants  are not selected if raw jwaste concentrations
           are  less  than  the long  term average!  concentrations
           established  for the levels  of recom'mended treatment.

Organic analysis was  not obtained  for total r|aw waste  samples  at
Plants 30172 and 11114,  which manufacture television picture  tubes.
Samples were obtained  and  organic  analysis .pe'rformed for  those
process wastes  either  known to discharge  or suspected  of  dis-
charging  organic pollutants.   The  remaining process wastes,
treated and untreated, should not  contain organic  pollutants.
Therefore, those organic pollutant  parameters!  found in  individual
process wastes  will become  relatively insignificant when  included
in  the total process raw waste stream.   For these  reasons,  organic
pollutants have  been selected  as potential  parameters  based upon
their known occurrence in  the  manufacturing  processes  and  their pre-
sence  in  the sampled streams.       '         !
                              IX-68

-------
                                    TABLE 9-10

                         POTENTIAL POLLUTANT PARAMETERS

                                        Television Picture Tubes
                  Aperture Masks
Toxic Org
-------
                                    TABLE 9-11
                     	POTENTIAL POLLOTANT PARAMETERS NOT
                 SELECTED FOR TELEVISION PICTURE TUBE MANUFACTURE

                         NOT DETECTED IN RAW WASTE STREAMS
 TOXIC ORGANICS
  2.  Acrolein                           47.
  3.  Acrylonitrile                      49.
  5.  Benzidine                          50.
  6.  Carbon Tetrachloride               52.
      (Tetrachloromethane)               53.
  7.  Chlorobenzene                      54.
  8.  1,2,4-Trichlorobenzene             56.
  9.  Hexachlorobenzene                  57.
 10.  1,2-Dichloroethane                 58.
 12.  Hexachloroethane                   59.
 14.  1,1,2-Trichloroethane              60.
 15.  l,l,2,2,-
-------
                               TABLE 9-11 CONTINUED
 93.
 94.
 96.
 97,
 98.
 99.
100.
101,

103.
104.
106.
107.
108.
109.
110,
111.
112.
i 4,4'-DDE  (P,P'-DDX)
 4,4'-DDD  (P,P-TDE)        129,
 Beta-Endosulfan
 Endosulfan Sulfate
 Endrin
 Endrin Aldehyde
 Heptachlor
 Heptachlor Epoxide  (BHC=Hexachloro-
   cyclophexane)
 Beta-BHC
 Gamma-BHC (Lindane)
 PCB-1242  (Arochlor  1242)
 PCB-1254  (Arochlor  1254)
 PCB-1221  (Arochlor  1221)
 PCB-1232  (Arochlor  1232)
 PCB-1248  (Arochlor  1248)
 PCB-1260  (Arochlor  1260)
 PCB-1016  s;(Arochlor  1016)
Toxaphene
2,3,7,8-Tetrachlorodibenzo-P-
Dioxin (TCDD)
OTHER POLLUTANTS

Biochemical Oxygen Demand
Xylenes
Alkyl Epoxides
                                IX-71

-------
                                    TABLE 9-11 (CON'T)

                                  DETECTED AT TRACE LEVELS
 TOXIC ORGANICS

  1.   Acenaphthene
  4.   Benzene
 13.   1,1-Dichloroethane
 23.   Chloroform (Trichloromethane)
 29.   lrl-Dichloroethylene
 30.   Ir2-Jrrans-Dichloroethylene
 38.   Ethylbenzene
 39.   Fluoranthene
 44.   Methylene Chloride (Dichloromethane)
 48.  DicW.orobromomethane
 51.  Chlorodibromome thane
 55.  Naphthalene
 65.  Phenol
 66.  Bis(2-ethylhexyl) Phthalate
 67.  Butyl Benzyl Phthalate
 68.  DiHSItButyl Phthalate
 70.  Diethyl Phthalate
 78.  Anthracene
 81.  Phenanthrene
 84.  Pyrene
 95.  Alpha-Endosulfan
102.  Alpha-BHC
105.  Delt?L-BHC (PCB-Polychlorinated
      Biphenyls)
129.  2,3,7,,8-TeteachlorQdibenzo-P-
      Dioxin (TCDD)
TOXIC METALS

117.  Beryllium
123.  Marcury
125.  Selenium
127.  Thallium

OTHER POLLOTftNTS

Phenols
                                   IX-72

-------
                              TABLE 9-11 CONTINUED

                  DETECTED AT LEVELS NOT REQUIRING TREATMENT
TOXIC METALS

120.  Copper
124.  Nickel
126.  Silver

NON-TOXIC METALS

Aluminum
Manganese
Vanadium
Molyix3enum
Tin
Cobalt
Titanium

OTHER POLLUTANTS

121.  Cyanide, Total
      Total Organic Carbon
    Single Stream Sanple Value
     Developed
  Flow Weighted
Mean Concentration*
       mg/1

     0.059
     0.076
     0.004
     6.055
     0.019
     0.005
     0.050
     0.039
     0.101
     0.089
     0.002
   134.6
                                  IX-73

-------
                                   TABLE  9-12
                   POTENTIAL IOLLUTANT PARAMETERS NOT SELECTED
                          FOR APERTURE MASK MANUFACTURE  j
                                                         I
                        NOT DETECTED IN RAW WASTE STREAMS
TOXIC ORGANICS
 1.  Acenaphthene                        47.
 2.  Acrolein                            48.
 3.  Acrylonitrile                       49.
 4.  Benzene                             50.
 5.  Benzidine                           51.
 6.  Carbon Tetrachloride                52.
     (Tetrachloromethane)                53.
 7.  Chlorobenzene                       54.
 8.  1,2,4-Trichlorobenzene              55.
 9.  Hexachlorobenzene                   56.
10.  1,2-Dichloroethane                  57.
11.  1,1,1-Trichloroethane               58.
12.  Hexachloroethane                    59.
13.  1,1-Dichloroethane                  60.
14.  1,1,2-Trichloroethane               61.
15.  1,1,2,2,-Tetrachloroethane          62.
16.  Chloroethane                        63.
17.  Bis(Chloromethyl)Ether              64.
18.  Bis(2-Chloroethyl)Ether             65.
19.  2-Chloroethyl Vinyl Ether (Mixed)   66.
20.  2-Chloronaphthalene                 67.
21.  2,4,6-Trichlorophenol               68.
22.  Parachlorometa Cresol               69.
23.  Chloroform (Trichloromethane)       70.
24.  2-Chlorophenol                      71.
25.  1,2-Dichlorobenzene                 72.
26.  1,3-Dichlorobenzene                 73.
27.> 1,4-Dichlorobenzene                 74.
28.' 3,3'-Dichlorobenzidine
29.  1,1-Dichloroethylene                75.
30.  1,2-Trans-Dichlorethylene
31.  2,4-Dichloropropylene               76.
32.  1,2-Dichloropropane                 77.
33.  1,2-Dichloropropylene               78.
     (1,3-Dichloropropene)               79.
34.  2,4-Dimethylphenol                  80.
35.  2,4-Dinitrotoluene                  81.
36.  2,6-Dinitrotoluene                  82.
37.  1,2-Diphenylhydrazine
38.  Ethylbenzene                        83.
39.  Fluoranthene
40.  4-Chlorophenyl Phenyl Ether         84.
41.  4-BrornDphenyl Phenyl Ether          85.
42.  Bis(2-Chloroisopropyl) Ether        86.
43.  Bis(2-Chloroethoxy)Methane          88.
44.  Methylene Chloride                  89.
     (Dichloromethane)                   90.
45.  Methyl Chloride (Chloromethane)     91.
46.  Mathyl Bromide (Bromomethane)
                                         92.
Bromoform  (Tribromomethane)
Dichlorobromomethane
Trichlorofluoromethane
Dichlorodifluoromethane
Chlorodibroijnome thane
Hexachlorotnli t ad iene
Hexachlorocyclopentadiene
Isophorone  i
Naphthalene i
Nitrobenzene
2-Nitrophenol
4-Nitrophenol
2,4-Dinitrophenol
4,6-Dinitro~O-Cresol
NHSIitrosodinTethylamine
N-Nitrosodiphenylamine
NHdtrosodi-N-Propylamine
Pentachlorophenol
Phenol
Bis(2-ethylhexyl) Phthalate
Butyl Benzyl Phthalate
DiHfl-Butyl Phthalate
Di-N-Octyl i>hthalate
Diethyl Phthalate
Dimethyl Phii>alate
1,2-Benzant^iracene (Benzo(A)Anthracene)
Benzo (A) Pyrene (3,4-Benzo-Pyrene)
3,4-Benzofluoranthene (Benzo(B)
Fluoranthene)
11,12-Benzofluoranthene (Benzo(K)
Fluoranthen^)
Chrysene
Acenaphthylene
Anthracene  \
1,12-^enzoperylene(Benzo(GHI)-Perylene)
Fluorene    !
Phenanthrene
1,2,5,6-Dibenzathracene(Dibenzo (A,H)
Anthracene)i
Indeno(1,2,3-CD)Pyrene(2,3-0-Phenylene
Pyrene)     ,
Pyrene      !
Tetrachloro^thylene
Toluene     i
Vinyl Chloride (Chloroethylene)
Aldrin      !
Dieldrin    I
Chlordane(Technical Mixture and
Metabolites)
4,4'-DDT    i
                                     IX-74

-------
                               TABLE  9-12 CONTINUED
  93.   4,4'-DDE (P,P'-DDX)
  S>4.   4,4'-DDD (P/P-TDE)
  95.   Alpha-Endosulfan
  96.   Beta-Endosulfan
  97.   Endosulfan Sulfate
  98.   Endrin
  99.   Endrin Aldehyde
 100.   Heptachlor
 101.   Heptachlor Epoxide  (BHC=Hexachloro-
        cyclophexane)
 102.   Alpha-BHC
 103.   Beta-BHC
 104.   Gamma-BHC  (Lindane)
 105.   Delta-BHC  (PCB-Polychlorinated
        Biphenyls)
 106.   PCB-1242 (Arochlor 1242)
 107.   PCB-1254 (Arochlor 1254)
 108.   PCB-1221 (Arochlor 1221)
 109.   PCB-1232 (Arochlor 1232)
 110.   PCB-1248 (Arochlor 1248)
 111.   PCB-1260 (Arochlor 1260)
 112.   PCB-1016 (Arochlor 1016)
113.  Tbxaphene
129.  2,3,7,8-Tetrachlorodibenzo-P-
      Dioxin (TCDD)
OTHER POLLUTMCTS

Xylenes
Alkyl Epoxides
                               IX-75

-------
                               TABLE 9-12 OONT.

                            DEHiCTEDAT TRACE LEVELS
TOXIC METALS

114.   Antimony
115*   Arsenic
'117.   Beryllium
123.   Mercury
124.   Nickel
125.   Selenium
126.   Silver
127.   Thallium

OfflER FOmJTANTS

Phenols
                            AT LEVELS NOT REQUIRING -TREATMENT
TOXIC OSGftNICS

 87.  Trichloroethylene

TOXIC METALS

118.  Cadmium
122.  Lead
128.  Zinc

OTHER POLLUTANTS

121.  Cyanide, Total
      Total Organic Carbon
      Biological Oxygen Demand
                                            Mean Concentration*
                                                   •Ong/1)

                                                       0.060
                                                       0.0002
                                                       0.0009
                                                       0.193
                                                       2.1
                                                       4.0
                                                      18
* 3 Single Stream Sample Value
                                   IX-76

-------
 Aluminum and  titanium are  presented in Table 9-11 as metals detected
 at  levels not requiring  treatment.   Although both metals are at •
 treatable levels,  they have  not  been selected as potential pollutant
 parameters for two reasons.   First, both metals  in the elemental form
 are not  considered to be highly  toxic.   Secondly,  both metals will
 be  treated incidentally  by any of  the three levels of recommended
 treatment to  acceptable  concentration levels.

 Table  9-12 presents  potential pollutant parameters not selected
 for aperture  mask  manufacture as sampled at one  facility.   Cyanide
 is  listed as  a parameter detected  at too low a level to require
 treatment.  Although the reported  concentration  level is treat-
 able,  cyanide is not used  in the manufacture of  aperture masks.
 Cyanide  is used in electroplating  processes also found at this
 facility,  and it is  believed that  this  is the origin of this
 pollutant.  Therefore, cyanide is  not selected as a potential
 pollutant parameter.

 APPLICABLE TREATMENT TECHNOLOGIES

 Based  on  the  potential pollutant parameters selected and actual
 treatment technologies observed  within  the  electron tube industry,
 the  following  treatment  technologies are recommended for pollutant
 control within this  subcategory:

           Chemical precipitation and sedimentation
           Fluoride treatment
           Chromium reduction
           Settling
           Sludge dewatering
           Multimedia filtration
           Final pH adjustment
           Solvent  collection and removal

These  technologies are discussed in detail  in Section XII  of
 this report.

Recommended Treatment Systems

Alternative waste  treatment  technologies are  presented for the
electron  tube  subcategory.   Treatment technologies are defined for
process wastes  from  the  manufacture of  television  picture  tubes  and
steel  aperture masks.  The following  discussion  presents three levels
of waste  treatment for television picture tube and steel aperture  mask
manufacture.
                              IX-77

-------
 Level 1 - Recommended treatment for each levelj requires three treat-
 ment systems,  two for picture tubes and one for aperture masks,  to
 control the great diversity of process wastes.'  Level 1 treatment is
 presented schematically in Figure 9-10 and combines the following
 technologies into three separate treatment systems.

           Solvent collection and removal      ;
      .     Chemical precipitation and sedimentation for concen-
           trated metal wastes employing chemical additions of
           lime,  sodium carbonate, a coagulant aid, and a polyelec-
           trolyte                             ;
           Fluoride treatment to precipitate caicium fluoride
           with the use of lime and calcium chloride
           Chromium reduction with the use of sjalfuric acid and
           sodium bisulfite                    i
           Settling and reclamation of phosphor; wastes
           Sludge dewatering
           Final  pH adjustment                 \

 Level 2  - Recommended treatment consists of Level 1 treatment with an
 additional multimedia filtration step on all three treatment systems.
 Level 2  treatment is  depicted in Figure 9-11.  j

 Level 3   - Recommended treatment consists of Level 2  treatment
 with  the addition of  water reuse where possible.   Level 3  recommended
 treatment for  aperture mask manufacture reuses!100% of treated
 process  wastewater.   Level 3 recommended treatment for television
 picture  tube and aperture mask manufacture reuses approximately
 60% and  100% of  treated process wastewater,respectively.   Figure
 9-12 presents  Level 3  treatment for television;picture tube  and
 aperture mask  manufacture.                     j

 Performance of In-Place Treatment Systems

 The performance  of treatment technologies that!have been  sampled
 in-place for the  electron tube subcategory is presented in Tables
 9-13 through 9-18.  The manufacture of television picture  tubes was
 observed and sampled  at two facilities,  Plants!30172  and  11114.
 The manufacture  of steel aperture masks was  observed  and  sampled  at
 one facility,  Plant 36146.   Tables 9-13,  9-14,;and 9-15 present per-
 formance of treatment  technologies and systems!for Plant  30172.
 Tables 9-16, 9-17, and  9-18 present performance  of treatment tech-
 nologies  and systems  for Plant 11114.   No performance  of  in-place
 treatment  is available  for  Plant  36146 as only I a  raw  waste sample
was obtained.  Sample  numbers  and stream identification as pre-
 sented in  Tables  9-13  through  9-18 correspond to  sampling  location
 and sample numbers of  in-place treatment presented previously  in
Figures  9-7 and  9-8.  Other types  of  electron tube manufacture
were observed  but not sampled.  However,  process  water usage  at
                             IX-78

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                                   TABLE 9-13
Parameter

Sairple Number

TOXIC METALS

114 Antimony
115 Arsenic
118 Cadmium
119 Chromium
122 Lead
128 Zinc

NCKKEOXIC JffiTALS

Boron
Barium
Iron
Yttrium

OTHER EOLU7TANTS

OH and Grease
Total Suspended Solids
Fluoride
pH
 PERFORMANCE OF IN-PLACE TREATMENT TECHNOLOGIES

Plant 30172 - Chemical Precipitation and Settling
                                    ]
              Influent Concentration!   Effluent Concentration
                        (mg/1)                   (mg/1)
                        85125
                        0.092
                        0.250
                        1.070
                        4.670
                      891.
                     1510.
                      346.
                      205.
                     1940.
                       16.80
                       11.
                     190.
                     160.
                       <2.0
 85126
 <0.015
  0.010
 <0.005
  0.027
  1.9
 11.4
395.
 12.4
  0.378
 <0.008
 14.
 17.
 76.
  7.3
                                  IX-82

-------
                                   TABLE 9-14
                 PERFORMANCE OF IN-PLACE TREATMENT TECHNOLOGIES
        I

Plant 30172 - Chemical Precipitation and Sedimentation in a Clarifier
Parameter



Sample Numbers

Toxic Metals

114 Antimony
115 Arsenic
118 Cadmium
119 Chrcmium
122 Lead
128 Zinc

Non-Toxic Metals
        i
Boron
Barium  !
Iron    j
Yttrium |

Other Pollutants

Oil and Grease
Total Suspended
  Solids
Fluoride
pH      ;
  Influent Concentration
        (ing/1)
Day 1
85127
0.188
0.100
0.215
2.470
20.700
6.770
9.170
1.100
7.720
2.290
Day 2
85138
0.126
0.102
0.135
3.150
11.200
5.120
9.520
0.586
8.640
1.290
Day 3
85137
0.146
0.160
0.163
2.980
10.600
6.340
7.080
0.626
9.320
1.470
 14

130
260
  2.7
 11

 88
270
  2.1
 12

 50
490
  1.7
                           Effluent Concentration
                                    (mg/1)
                                     Day 1
                                     85128
                                     0.146
                                     0.008
                                    <0.002
                                     0.292
                                     0.273
                                     0.112
                                     1.880
                                     0.182
                                     0.197
                                     0.006
10

 2
 6.5
 8.5
                                     Day 2*
                                     85132
                                     Day 3
                                     85136
                                               0.119
                                               0.010
                                              <0.002
                                               0.195
                                               0.233
                                               0.150
                                               2.060
                                               0.150
                                               0.262
                                               0.005
830
  3
  7.7
  8.1
    Sample Lost
                                     IX-83

-------
                                   TABLE 9-15
                 PERFORMANCE OF IN-PLACE TREATMENT TECHNOLOGIES
                      Plant 30172 - Dual-Media Filtrajtion
Parameter



Sample Numbers

TOXIC METALS

114 Antimony
115 Arsenic
118 Cadmium
119 Chromiisti
122 Lead
128 Zinc

NON-TOXIC METALS

Boron
Barium
Iron
Yttrium

OTHER POLLUTANTS

Oil and Grease
Total Suspended
  Solids
Fluoride
PH

* 3 Sairple Lost
 Influent Concentration
          (rog/1)
 Day 1
 85128
 0.146
 0.008
<0.002
 0.292
 0.273
 0.112
 1.880
 0.182
 0.197
 0.006
10

 2
 6.5
 8.5
Day 2*
85132
Day 3
85136
          0.119
          0.010
         <0.002
          0.195
          0.233
          0.150
          2.060
          0.150
          0.262
          0.005
        830

          3
          7.7
          8.1
                         Effluent Concentration
                                   (mg/1)
Day 1
03662

0.117
0.010
<0.002
0.247
0.152
0.055
'

1.530
0.155
0.048
<0.003
Day 2
85130

0.136
0.008
<0.002
0.250
0.228
0.110

2.450
0.142
0.227
<0.003
Day 3
85134

0.106
0.010
<0.002
0.128
0.109
0.059

2.090
0.135
0.071
<0.003
               1.4
              10
               8.5
37

 7
 8.2
 6.9
20

 1
15
 7.8
                                  IX-84

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these facilities is predominantly from electroplating and is thus
part of the Metal Finishing Category and not presented in this
document.  The remaining process water usage at these plants is
characteristically similar to that found at many picture tube
facilities.  Therefore, treatment technologies are transferable from
plants manufacturing television picture tubes 'to those manufacturing
other types of electron tube products.        i
                                              i
Because of the size and complexity of television picture tube
manufacture/ process wastewaters are not treated as a single
total raw waste.  Treatment technologies are employed in accor-
dance with industrial process raw waste characteristics as well
as the physical location within the facility, j

Collection and removal of sspent solvents, oil,! and photoresist
solutions were observed at Plants 30172 and 11J114.  Both plants
have good organic solvent collection and disposal procedures.

Performance of treatment components and systems is presented for
Plants 30172 and 11114.  A total raw waste sample only was
obtained at Plant 36146.  Therefore, no performance of in-place
treatment is presented for this facility.

Performance of Recommended Treatment Systems

Performance of the three levels of recommended treatment for
television picture tube and aperture mask manufacture are pre-
sented in Tables 9-19 and 9-20,respectively.  [Performance is based
on sampling data obtained from visited plants]in the E&EC category
as well as data from other industries.  Because of similarity in
raw waste characteristics to other industries, performance of treat-
ment technologies is applicable to the E&EC category.  Section XII
describes treatment components, systems, and performance achievable
by the recommended treatment technologies.    !
         1                                     i
None of the three levels of recommended treatment for aperture
mask manufacture were observed in-place at any of the visited plants.
Level 1 recommended treatment for television picture tube manufacture
as presented previously in Figure 9-10 was not observed in  its en-
tirety at any visited facility.  However, a close approximation  in-
corporating all treatment components utilized!in the Level  1 system
was observed and sampled at Plant 30172.  In addition, waste stream
location within the recommended treatment system is very similar  to
that observed at Plant 30172.                 |
                                              j
Level 2 treatment for television picture tubejmanufacture includes
the addition of multimedia filtration to the recommended Level 1
system.  Level 2 treatment for television picture tube manufac-
ture improves metals- removal performance whil4 lowering the suspended
                              IX-88

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solids and oil and grease  levels.  This occurs  because  some  of  the
metal hydroxide precipitate formed during  chemical precipitation
will be further removed by the addition of multimedia filtration
in  the Level 2 treatment system.  This additional treatment  tech-
nology was observed and sampled at Plant 30172, and  therefore,
approximates the Level 2 recommended  treatment  system.

Level 3 treatment for television picture tube manufacture does  not
include any treatment technology additional  to  the recommended
Level 2 system.  Pollutant discharge  from  television picture  tube
manufacture is reduced significantly  by reuse of treated wastes.
It  is estimated that 60-70 percent of the  treated wastes are
sufficiently purified for process reuse.  Level 3 treatment was not
observed at any visited plants.

All levels of recommended  treatment for television picture tube
manufacture include the collection and removal  of organic solvents.

Concentration levels in the sampled effluents of Plants 30172
and 11114 for organic pollutants were detected  at levels less
than that requiring treatment.  However, because of  their
acknowledged use in the manufacturing process,  four  toxic organic
pollutants have been selected as potential pollutant parameters
as  have total organics.  A total organic concentration  level  of
.290 mg/1 has been established for television picture tube
manufacture.  This is based on a total organic  concentration
level of a sampled effluent at Plant  11114.  Collection and re-
moval of organic solvents is discussed in detail in  Section XII.

Table 9-21 compares performance of observed  and recommended treat-
ment for the electron tube subcategory.  Performance of observed
treatment is based on data obtained from two television picture
tube manufacturers, Plants 30172 and  11114.  No performance of
observed treatment is available from  the one aperture mask manu-
facturer sampled, Plant 36146.  This  comparison supports the
transfer of performance data from the Metal  Finishing Category
as evidenced by the relative similarity in effluent  concentration
levels of these streams.  Comparison  of Level 3 treatment perform-
ance does not appear in Table 9-21 as it was not observed in-place
at any visited facilities.

Performance of Level 1 and 2 observed treatment as presented  in
Table 9-21 for toxic metals, non-toxic metals,  and other pollu-
tant parameters was obtained from Plant 30172.  This performance
data was previously presented in Tables 9-14 and 9-15.  Table
9-14 presented a Day 1 and Day 3 effluent oil and grease concen-
tration of 10 mg/1 and 830 mg/1, respectively. - The  calculated
mean as presented in Table 9-21 is 420 mg/1.  The Day 3 and the
calculated mean concentration levels do not  coincide with histor-
ical plant performance data or with the concentration level
                             IX-91

-------
                                        TABLE 9-21
                                ELECTRON TUBE SUBCATEGORY
                 COMPARISON OF OBSERVED AND RECOMMENDED TREATMENT SYSTEMS
Parameters

TOXIC ORGANICS

 11  1,1,1-TricU.oroethane
 44  Methylene chloride
 86  Toluene
 87  Trichlorpethylene

Total Toxic Organics

TOXIC METALS

114  Antimony
115  Arsenic
118  Cadmium
119  Chromium
122  Laad
128  .Zinc

NON-TOXIC METALS

     Boron
     Barium
     Iron
     Yttrium

OTHER POLLOTANTS

     Oil and Grease
     Total Suspended Solids
     Fluoride
                              Level 1"
                              Observed
                              Treatment
                                mg/1
    *
    *
    *
  0.290**
  0.133
  0.009
  <.002
  0.244
  0.253
  0.131
  1.970
  0.166
  0.230
  0.006
420
  2.5
  7.1
               Level 1B
              Recommended
               Treatment
                 mg/1
   *
   *
 0.290**
 0.05
 0.05
 0.012
 0.572
 0.050
 0.551
 1.970
 0.166
 0.797
 0.006
11.9
17.8
15.3
              Level 2A
              Observed
              Treatment
                mg/1
 0.290**
 0.112
 0.010
<0.002
 0.188
 0.131
 0.057
 1.810
 0.145
 0.060
 0.003
12.5
 1.2
12.5
              Level 2B
             Recommended
              Treatment
                mg/1
                  *
                  *
                  *
 0.290**
  NA
  NA
 0.011
 0.319
 0.034
 0.247
 1.810
 0.145
 0.257
 0.003
 7.1
12.7
 4.76
 A s Mean Concentration Of Day 1 And Day 3 Sampled Stream^ As Presented In Tables
     9-14 And 9-15.                                      ;
 B » Mean Concentration Obtained From Table .9-19.        j
 * » Included In Total Toxic Organics                    j
** * This Figure Is The Concentration Of The Sampled Effluent From Plant 11114.
                                          IX-92

-------
detected for ,the.Day 1 sampled effluent.  In addition, the  three
days of sampled  influent presented in Table 9-14 appear at  much
lower and consistent concentration levels than the Day 3 sampled
effluent.  It is for these reasons that the Day 3 concentration
level of 830 mg/1 has not been included in determining the  perform-
ance of oil and  grease removal by the recommended treatment systems,

Estimated Cost of Recommended Treatment Systems

The determination of estimated costs for recommended  treatment
system components is discussed in Section XIII of this report.
Tables 9-22 through 9-28 show the estimated costs for each  of
the recommended  treatment systems discussed previously for  the
electron tube subcategory.  Costs have been estimated for Levels
1,2, and 3 recommended treatment for television picture tube
and aperture mask manufacture.  The variation in system costs
resulting from changes in system flow rate are presented for two
flow raites associated with television picture tube manufacture
and one flow rate associated with aperture mask manufacture.  The
two flow rates for television picture tube manufacture are  char-
acteristic of medium and large size facilities.  The  one flow
rate presented for aperture mask manufacture is typical of  all
known aperture mask manufacturers.  These costs do not reflect
treatment already in-place in the electron tube subcategory that
are designed to  treat electron tube manufacturing .wastes exclu-
sively.;  Similarly, these costs may be misleading because they
do not account for mixing wastewaters from electron tube manu-r
facturing with wastewaters from other manufacturing 'processes
(such eis electroplating) for treatment in existing wastewater
treatment facilities.

BENEFIT ANALYSIS

This section presents an analysis of the industry-wide benefit
estimated to result from applying each of the three levels  of
treatment previously discussed in this section to the total
process wastewater generated by the electron tube subcategory.
This analysis estimates the amount of pollutants that would not
be discharged to the environment if each of the three levels of
treatment were applied on a subcategory-wide basis.   An analysis
of the benefit versus estimated subcategory-wide cost for each
of the treatment levels will also be provided.

Industry-wide Costs

By multiplying the annual and investment costs of each level of
treatmesnt at various flow rates by the number of plants in  each
flow regime in the industry, subcategory-wide annual  and invest-
                             IX-93

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merit cost  figures  are  estimated  (Tables  9-29 and 9-30).
These  figures  represent  the  cost of each treatment level for
the entire electron  tube subcategory.  This calculation  does
not make any allowance for waste treatment that is currently
in-place at electron tube facilities.

Industry-wide Cost and Benefit

Tables 9-31 and 9-32 present the  estimate  of total annual  cost
to the electron tube subcategory  to  reduce pollutant  discharge.
This table  also presents  the benefit of  reduced pollutant  dis-
charge for  the electron  tube subcategory resulting from  the
application of the three  levels  of  recommended  treatment.  Bene- •
fit was calculated by  multiplying the  estimated number of  gallons
by each of  the recommended treatment systems as shown in Table
9-18. ; Values are presented  for  each of  the selected  subcategory
pollutant parameters.

The column  "Raw Waste" shows the  total amount of pollutants  that
would  be discharged  to the environment if  no treatment were  em-
ployed by  any facility in the  industry.   The columns  "Levels 1,
2, and 3"  treatment  show the amount of pollutants that would be
discharged  if any one  of  these three levels of  treatment were
applied to  the total wastewater  estimated  to be 'discharged by
the electron tube subcategory.
      i
The total  amount of  wastewater discharged  from  each level  of treat-
ment is also presented in this table to  indicate the  amount  of  pro-
cess wastewater to be  recycled by each of  the three levels of treat-
ment.  Process wastewater recycle is a major step toward water  con-
servation  and  reduction  in pollutant discharge.
                            IX-101

-------
                              TABLE  9-29       l
                     INDUSTRY-WIDE COST ANALYSIS

                     TELEVISION  PICTURE TUBES
Investment
(Thousands Of Dollars)

Annual Costs
(Thousands Of Dollars)

     Capital Costs
     Depreciation
     Operation &
      Maintenance

     Energy & Power

Total Annual Costs
(Thousands Of Dollars)

Discharge Plow
(million I/year)
LEVEL 1

9732.318
820.590
1946.463
1510.138
117.063

4394.254


2554.875
LEVEL 2

11488.674
968.679
2297.735
1717.916
126.142

5il0.472
2554.875
LEVEL 3

11649.174
982.209
2329.835
1724.336
131.632

5168.012


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                                IX-102

-------
Annual
                         TABLE 9-30
                INDUSTRY-WIDE COST ANALYSIS

                       APERTURE MASKS
Investment
(Thousands Of Dollars)
Costs
(Thousands Of Dollars)

     Capital Costs
     Depreciation
     Operation &
      Maintenance

     Energy & Power

Total Annual Costs
(Thousands Of Dollars)

Discharge Flow
(million I/year)
                       LEVEL 1

                       1989.748
                       1178.611
LEVEL 2

2406.905
1178.611
                                                            LEVEL 3

                                                            2622.905
167.767
397.951
295.072
15.969
876.759
202.940
481.381
338.566
18.163
1041.050
221.148
524.581
347.206
50.163
1143.098
                                 IX-103

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                         SECTION X
            SEMICONDUCTOR SUBCATEGORY DISCUSSION
 INTRODUCTION

 This discussion of the semiconductor industry consists of the
 following major sections:

          Products
          Size of the Industry
     ;    Manufacturing Processes
          Materials                .
          Water Usage
     .    Production Normalizing Parameter
          Waste Characterization and Treatment in Place
          Potential Pollutant Parameters
          Applicable Treatment Technologies
          Benefit Analysis

 Data contained in this section were obtained from several
 sources.  Engineering visits were made to twenty plants
 within the subcategory.  Of these twenty plants, wastewater
 samples were collected from twelve of these facilities.  A
 total of fifty-two semiconductor manufacturing plants were con-
 tacted by telephone.  A literature survey was also conducted
 to ascertain differences between types of semiconductor pro-
 ducts, process chemicals used, and typical manufacturing
processes.

 PRODUCTS

 Semiconductors are solid state electrical devices which perform
 a variety of  functions.  These functions include information
processing and display, power handling, and the conversion be-
 tween light energy and electrical energy.  The semiconductors
 range from the simple diode, which may be turned on or off like
a light bulb, to the integrated circuit which may have the equi-
valent of 250,000 active switching components in a 0.635 cm
 (1/4 inch) square.

Semiconductors are used throughout the electronics industry.
The major semiconductor products a^e:

          Silicon based integrated circuits which include
          bipolar, MOS (metal oxide silicon), and analog
          devices.
                                X-l

-------
          Gallium arsenide and gallium phbsphide wafers
          for the production of light emitting diodes  (LED's).
                                          F
          Silicon and germanium for diode and transistor
          production.                     |

          Glass wafer devices such as for liquid crystal
          display (LCD) production.       '
Semiconductors are included within the Sl   (Standard Industrial
Classification) codes 3674 (Semiconductors  and Related Devices)
and 3679  (Electronic Components, Not Elsewhere Classified).
The major product areas of SIC code 3674 are:

          Hybrid Integrated Circuits - thick film, thin film and
          multichip devices.

          Bipolar Integrated Circuits    ;

      .    Metal Oxide Semiconductor Devices

      .    Transistors                    j

          Diodes and Rectifiers          ;

      .    Selenium Rectifiers            ;

      .    Light Sensitive and Light. Emitting Devices (solar
          cells and light emitting diodes)
                                         !
      .    Thyristors                     '
                                         i
The major product areas of SIC code 3679 are:

      .    Magnetic Bubble Memories       j

      .    Liquid Crystal Displays        j

SIZE OF INDUSTRY                         !
                                         i
The size of the semiconductor industry is [presented in the fol-
lowing paragraphs in terms of number of plants , number of pro-
duction employees, and production rate.  Size estimates are
based upon data collected from visited facilities, telephone
surveys, and literature surveys.
                              X-2

-------
Number of Plants -  It  is estimated that approximately 257 plants
are involved in the production of semiconductors.  This estimate
comes from an August 1979 list-ing of plant locations compiled by
the Semiconductor Industry Association.

Number of Production Employees - It is estimated that approximately
62,000 production employees are engaged in the manufacture of
semiconductor products.  This estimate is from the U.S. Depart-
ment of Commerce 1977 Census of Manufactures  (Preliminary Statis-
tics) .

Typical plants surveyed or visited during this study employ be-
tween 30 and 2500 production employees.  The majority of plants
employ between 150 and 500 production employees.  Only nine of
the 51 plants in the data base have more than 500 production
employees.

Production Rate - The total number of semiconductor products for
the year 1978 was obtained from the Semiconductor Industry Asso-
ciation.  During that year, 8.844 billion units were produced
for a total revenue of $3.123 billion.

A typical medium-sized plant employing 350 production employees
produces an estimated 299 million units per year.  This figure
is based upon an average output of 142,380 units per production
employee (total units produced divided by total production em-
ployees ) .

MANUFACTURING PROCESSES

The manufacturing processes for semiconductor production are
described in the following paragraphs.  Each type of semicon-
ductor and associated manufacturing operations is discussed
separately because production processes differ depending on the
basis material.

Silicon-based integrated circuits - (Reference Figure 10-1) -
These circuits require high purity polycrystalline silicon as
a basis material.  Most of the companies involved in silicon-based
integrated circuit production purchase ingots (cylindrical cry-
stals which can be sliced into wafers) or purchase slices or wafers
from outside sources rather than grow their own crystals.

When the ingot is received it is sliced into round wafers approxi-
mately 0.76mm (0.030 inches) thick.  These slices are then lapped
or polished by means of a mechanical grinding machine or are chemi-
cally etched to provide a smooth surface.  Wastewater results
from cooling the diamond tipped saws used for slicing and from
deionlzed (DI) water rinses following chemical etching and mil-
ling operations.
                                  X-3

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    SILICON INTEGRATED CIRCUIT PRODUCTION


                    X-4        '

-------
The next step  in  the manufacturing  process  is  the- growth of an
oxide  layer  on the  surface  of  the wafer.  This oxide layer
is the! area  where all  of  the subsequent processing occurs.  The
,epitaxial  layer is  grown  on the  wafer  in  a  furnace where the
wafer  is heated in  a silane gas  atmosphere  at  appr&xtrifately
1000°C for several  hours.                              ''."". ~

The wafer  is then coated  with  a  photoresist, a photosensitive
emulsion that  hardens  and clings to the wafer  when exposed.
to light.  The wafer is next exposed to ultraviolet.light using
glass  photomasks  that  allow the  light  to  strike .only selected
areas.  After  exposure to ultraviolet  light, unexpos'ed resist
is removed from the wafer,  usually  in  a DI  water  rinse.  The wafer
is then visually  inspected  under a  microscope  and etched in a
solution containing hydrofluoric acid  (HP).  The  etchant produces
depressions, called holes or Windows,  where  the diffusion of
dopants later  occurs.  Dopants are  impurities  such as boron,
phosphorus and other specific  metals.  These impurities eventually
form circuits  through  which electrical impulses can be transmitted,
The wafer  is then rinsed  in an acid or solvent solution to remove
the remainder  of  the hardened  photoresist material.

Diffusion  of dopants is an  evaporative process in which the
dopant to  be diffused  is  heated  in  a furnace,  causing the do-
pant to reach  a gaseous state.  The atoms of the  dopant bombard
the wafer  and  enter the silicon  through the windows at controlled
depths to  form the  electrical  pathways within  the wafer.  Then
a second oxide layer is grown  on the wafer, and the process is
repeated.  This photolithographic-etching-diffusion-oxide process
sequence may occur  as  many  as  20 times depending  upon the appli-
cation of  the  semiconductor.

During the photolithographic-etching-diffusion-oxide processes,
the wafer  may  be  cleaned many  times in mild acid  or alkali solu-
tions  followed by DI water  rinses and  solvent  drying with ace-
tone or isopropyl alcohol.  This is necessary  to  maintain wafer
cleanliness.

After  the.diffusion processes  are completed, a layer of metal is
deposited  onto the  surface  of  the wafer to  provide contact points
for final  assembly.  One of the  following three processes are
used to deposit this metal  layer:

           Sputtering - a process whereby  a  thin layer of metal
           is deposited on a solid surface in a vacuum.  In this
           process,  ions bombard  a cathode which emits the metal
           atom.
                                  X-5

-------
           Evaporation - palladium,  titanium,! or aluminum is
           evaporated onto the surface of the! wafer to provide
           a surface for contact connections.!
                                             i

           Electroplating - gold, nickel, copper, chromium,  tin,
           or silver is electroplated onto thle surface of the
           wafer.                             j
                                             i
 Finally,  the wafer receives a protective oxi<3e layer (passivation)
 coating before being back lapped to produce  ja wafer of the
 desired thickness.  Then the individual  chips are diced from
 the  wafer and are  assembled in lead frames fior use.  Many companies
 involved  in semiconductor production do  not  dice finished wafers
 in the  United States.   Rather, the  completed wafer is packed and
 sent to overseas facilities where dicing and' assembly operations
 are  less  costly.   This cost effectiveness is the result of  the
 amount  of hand labor necessary to inspect and assemble finished
 products.

 Gallium arsenide and gallium phosphide waferis - (Reference  Figure
 10-2) These wafers are purchased from crystal growers and upon
 receipt are placed in  a furnace where a  silicon nitride layer
 is grown  on the wafer.  The wafer then receives a thin layer of
 photoresist, is exposed through a photomask,! and is developed
 with a  xylene-based developer.  Following this, the wafer is
 etched  using hydrofluoric acid or a plasma-gaseous-etch process,
 rinsed  in DI water,  and then stripped of resist.  The wafer  is
 again rinsed in DI water before a dopant is  diffused into the
 surface of the wafer.   A metal oxide covering is applied next,
 and  then  a photoresist is applied.   The  wafer is then masked,
 etched  in a solution of aurostrip (a cyanide-containing chemical
 commonly  used in gold  stripping), and rinsed;in DI water. The
 desired thickness  is produced by backlapping!and a layer of  metal,
 usually gold,  is sputtered onto the back of  the wafer to provide
 electrical contacts.  Testing and assembly complete the production
 process.                                     j

 Silicon and germanium  chips - (Reference Figure 10-3) 'These  chips
 are  used  in transistors and diodes.   They are usually small  chips
 of the  pure crystal  placed between  two or three contacts., These
 devices,  called discrete  devices, are manufactured on a large
 scale,  and  their use is mainly in older  or less sophisticated
 equipment  designs,  although discrete devices  still play an im-
portant role  in high power switching and amplification.

The  crystal material is cleaned in  an acid or alkali  solution,
rinsed  in  DI water,  and coated with 'a layer  of photoresist.  The
wafer is  then  exposed  and etched in  a hydrofluoric acid solution.
This is followed by  rinsing in DI water,  drying,  and  doping  in
diffusion  furnaces where  boron,  phosphorus,  or gold are  diffused
into the surface of  the wafer.   The  wafers are then diced into
individual  chips and sent to  the assembly ar4a.   In the  assembly
area the chip  is placed between contacts  and;is  sealed  in rubber,
glass,  plastic, or ceramic  material.   Wires  are  attached and the
device  is  inspected  and prepared for  shipment.
                                 X-6

-------
GALLIUM
  ARSENIDE:
    PHOSPHIDE

  WAFERS
   APPLY


PHOTORESIST
 UV LIGHT

 EXPOSURE
DEVELOP
   METAL  OXIDE

     COVERING
    STRIP

    RESIST
DIFFUSION
               ACID ETCH
      APPLY


    PHOTORESIST
   UV LIGHT

   EXPOSURE
 DEVELOP
                  ETCH
   ASSEMBLY
ELECTRICAL

EVALUATION
                                      SPUTTER
                                                     BACKLAP
                                         DENOTES LIQUID WASTE GENERATION
                           FIGURE 10-2


                        LED PRODUCTION
                               X-7

-------
WAFE RS
(SILICON,
GERMANIUM)

I


*"

t
-*»• ASSEMBLY
T
APPLY UV LIGHT
PHOTORESIST EXPOSURE
!
t
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ACID
•4 DIFFUSION «•«- ' •«- DEVELOP •"*
ETCH
1 : t
I
i
                           DENOTES LIQUID WASTE GENERATION
3-jTBS
                               I
            FIGURE 10-3
SILICON, GERMANIUM DIODE PRODUCTION
                 X-8

-------
 Liquid Crystal Display (LCD) Production - (Reference Figure
 10-4)A typical LCD production line begins with optically flat
; glass that is cut into four inch squares.  The squares are then
 cleaned in a solution containing ammonium hydroxide, immersed
 in a mild alkaline stripping solution, and rinsed, in deionized
 water.  The plates are spun dry and sent to the photolithography
 area for further processing.        ,   •-

 In the photolithographic process a liquid mask is applied with a
 roller, and the square is exposed and developed.  This square
 then goes through deionized water, rinses and is dried, inspected,
 etched in an acid solution, and rinsed in deionized water.  A
 solvent drying step is followed by another alkaline stripping
;solutipn.  The square then goes through DI water rinses, is spun
 dry, and inspected.

 The next step of the LCD production process is passivation.  An
 oxide jlayer is deposited on the glass by using liquid silicon
 dioxide, or by using silicon and oxygen gas with phosphene gas
; as -a dopant.  This layer is used to keep harmful sodium ions on
 the glass away from the surface where they could alter the elec-
 tronic characteristics of the device.  Several production steps
 may occur here if it is necessary to rework the piece.  These
 include immersion in an ammonium bifluoride bath to strip sili-
 con oxide from a defective piece followed by deionized water
 rinses and a spin dry step.  The glass is then returned to the
 passivation area for reprocessing.

 After passivation, the glass is screen printed with devitrified
 liquid glass in a matrix.  Subsequent baking causes the devi-
 trified glass to become vitrified,  and the squares are cut into
 the patterns outlined by the vitrified glass boundaries.  The
 saws used to cut the glass employ contact cooling water which
 is filtered and discharged to the waste treatment system.

 The glass is then cleaned in an alkaline solution and rinsed
 in deionized water.   Following inspection, a layer of silicon
 oxide is evaporated onto the surface to provide alignment for
 the liquid crystal.^  The two mirror-image pieces of glass are
 aligned and heated in a furnace bonding the vitrified glass
 and creating a space between the two pieces of glass.  The glass
 is placed in a vacuum chamber, air  is evacuated, and the liquid
 crystal (a biphenyl compound)  is injected into the space between
 the glass pieces.  The glass is then sealed with epoxy, vapor
 degreased in a solvent, shaped on a diamond wheel, inspected,
 and sent to assembly.

 MATERIALS

 The materials required to manufacture semiconductors may be
 classed as raw materials and process chemicals.  Raw materials
 include basis, dopant, and layer materials.   Process chemicals
 are used for unit operations such as etching,  rinsing
 and photolithography.
                                 X-9

-------





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   FIGURE 10-4


LCD PRODUCTION


       X-10

-------
                                                     .     .
 Basis  Materials  -  Several  different basis materials are used
 depending  upon the product to be manufactured.

           Silicon  - in  its purest form,  silicon acts as an
           excellent insulating material,  holds  up under ele-
           vated  temperatures, and its  thin oxide layers are
           used in  photolithographic etching steps.   Approxi-
           mately 90-96% of the semiconductor industry utilizes
           silicon  as  a  basis  material.

           Germanium - used primarily in  the production of
           discrete devices such as diodes.  First manufactured"
           in  the early  1950's, it is still manufactured to  -
           supply and  maintain existing equipment but has
           been replaced by silicon in  recent applications.

           Gallium  Arsenide and Gallium Phosphide -  used in
           the production of (LED's)  light emitting  diodes.
           At one time,  the LED was in  great demand  but
           production  has fallen off drastically in  the last
           4-5 years because of the LCD.   However, production of
           LED's  is increasing again for  applications where
           high speed  transmission is necessary.               :

           Glass  -  used  for LCD (liquid crystal  display) pro-
           duction.  This product type  has increased in pro-
           duction  due to its  desirability over  LED's.   The
           LCD requires  less energy than  LED's and requires
           little or no  maintenance.

Dopants -  A dopant is an impurity added  to the  structure of the
semiconductor to produce the  electronic  pathways.  The following
dopants are diffused  into  the wafer in their gaseous or solid
form.

     .     Arsenic  in  the form of arsene  gas

           Phosphorus  in  the form of phosphene gas

           Boron, gold,  and  antimony in their solid  forms

Layer Materials  -  These  are used to form  working layers on the
wafer and  to create the  electrical pathways or  circuitry within
the layer.  Included  are:

           Silicon  oxides and  silicon nitride -  used to grow
           layers on the  wafers.   These materials are used prior
           to each  photolithographic  process to  provide
           electrical  layers,  and also as  a passivation
           or protective  oxide  layer  on the finished wafer.
                                X-ll

-------
      .    Metals - are sputtered or evaporated onto the surface
          of the wafer to provide electrical contacts.  These
          metals include aluminum, gold, chromium, tin, palla-
          dium, nickel, titanium, copper, and platinum.  Also,
          combinations of these metals such as titanium and
          copper may be used.  Some metals may be electroplated
          onto the wafer's metal surface to^provide the external
          contacts.  These metals include gold, tin, copper,
          silver, and chromium.            i

Process Chemicals - The process chemicals are grouped below by
process step in which they are used.       !
                                           i
      .    Flammable solvents such as acetone, isopropyl .alcohol,
          methanol, and propanol are used mainly to dry the
          wafer after DI water rinses.     •

          Chlorinated solvents such as 1,1,1-trichloroethane,
          trichloroethylene, and tetrachloroethylene are used
          as solvent degreasers or as cleaning agents to pre-
          pare the wafer for further processing.

          Photoresists are photosensitive emulsions used in the
          photolithographic process.  They are either positive
          or negative in their action on the wafer.  The positive
          photoresist forms a positive image of the mask and
          after being exposed to ultraviolet light, may be re-
          moved with a water based alkaline material, such as
          potassium hydroxide, or with a solvent.  The excess
          resist may be removed from the wafer after etching
          by using a strong solvent stripper.  The negative
          photoresist is developed in a xylene-based solution
          after exposure to ultraviolet light.  The negative
          photoresist is removed from the w^fer after etching
          the oxide layer with a solution of sulfuric and
          nitric acid, or in a gaseous plasma step called
          ashering.  When the negative resist is used over
          metals,  however, a xylene-based resist stripper is
          used.                            |
                                           I
          Acids such as sulfuric (H2SO.), nitric (HNO,), hydro-
          fluoric  (HP, NH. HP), hydfocnloric (HC1), afid combina-
          tions of  these such as aqua-regia (nitric and hydro-
          chloric  acids)  and sulfuric peroxide (H2SO4 and f^O,,)
          are used  as cleaners in dilute forms ana as etchants
          in more  concentrated forms.  Hydrofluoric acid is the
          most frequently used acid.   It is used to etch the
          silicon  and silicon oxide layers from the wafers.
          This  is  the major contributor of fluoride in waste-
          waters generated by semiconductor production.
                                   X-12

-------
           Other  process  chemicals  used include mild alkaline
           detergents  for wafer and equipment  cleaning,  vinyl
           coverings used to protect the surface of the  wafer
           during processing, wax and ceramic  mountings  used to
       |    hold the wafers during some processing steps, an
       !    acetic acid solution used to remove the wax mounts,
       ;    epbxy  used  in  the assembly processes to attach the
           semiconductor  to the lead frame,  and several  gases
           such as argon  and nitrogen which  are used to  pro-
           vide inert  atmospheres in the growing and diffusing
           furnaces.

WATER  USAGE

Contact water is used throughout the production of semiconductors.
Plant  incoming water  is  first pretreated by deionization to pro-
vide ultrapure water  for processing steps.  This ultrapure water
or deionized  (DI) water  is used  to formulate  acids;  to  rinse
wafers after processing  steps;  to  provide a medium for  collecting
exhaust gases from diffusion furnaces,  solvents, and acid baths;
and to clean equipment and materials used in  semiconductor produc-
tion.  Water also cools  and lubricates  the  diamond saws and grind-
ing machines used to  slice, lap, and dice wafers during processing,

From information gathered  during plant  visits  and phone contacts,
process water usage for  the entire  semiconductor industry is esti-
mated  to be 628  million  liters  (166 million gallons)  per day.
(257 plants x average flow rate  from Table  10-2.)   All  of
the thirteen larger plants  visited  or surveyed  use between
0.67. million and  11.12 million liters (0.18 million  gallons and
2.94 million gallons) of process water  per  day.   (Reference
Table 10-2.)  For these  visited  plants,  process  water recycle
and reuse  ranged  from no water recycle  or reuse  to 80 percent
process water recycle and  reuse.   Most  of the  plants  involved
in semiconductor  production do not  recycle  or  reuse  any process
water and  the plants  that  do  recycle  or  reuse  process water
are generally only the larger plants.

Based upon observations  from visited  facilities,  it  is  estimated
that 100% of all process water used  (approximately 628  million
liters) is treated prior to discharge.   Treatment  techniques
very considerably throughout the industry and  consist mainly of
pH adjustment only.  Treatment techniques presently  in  place at
semiconductor facilities are listed  in Table 10-1.
                                 X-13

-------
                               TABLE 10-1         i

                       WASTKWATER TREATMENT TECHNIQUES
             IN PLACE IN SEMICONDUCTOR MANUFACTURING FACILITIES
         OPERATION
Slicing, Dicing, Lapping
Diffusion
Acid Etch, Acid Clean, DI
Regeneration (Concentrated
Acids and DI W&ter Rinses)

Photoresist Application,
Solvent Cleaning,
Photoresist Strippers,
Developers
Hydrofluoric Acid Etching
Buffered HF (NH4HF)
Etching
TREATMENT SYSTEMS OBSERVED

Discharg<2 through clarifier;
sludge dewatered and contrac-
tor removed

Wet air scrubbers to collect
gases, volatile organics, acid
fumes.  Discharge to on-site
treatment facility.

Discharge to pH adjustment tank
(pH adjust with sodium hydroxide
or lime)!
        I
Collected in barrels or tank
for contractor removal and
disposal;
Collected and sold for reclaim
(some solvents)
        I
Treat with lime (Ca(OH)?) and
discharge to sludge dewatering
for solids removal

Fluoride, treatment and ammonia
treatment by mixing with cyanides
from electroplating then to
clarifier for solids removal
                                      X-14

-------
PRODUCTION NORMALIZING PARAMETERS

Production normalizing parameters  are  used  to  relate  the  pollu-
tant mass discharge  to the production  level of a  plant.   Regu-
lations expressed  in terms of  this production  normalizing parameter
are multiplied by  the value of this parameter  at  each plant  to
determine the allowable pollutant  mass  that can be  discharged.
However,, the following problems  arise  in defining meaningful
production normalizing parameters  for  semiconductors:

          Size, complexity and other product attributes affect
          the amount of pollution  generated during  manufacture
          of a unit.

     .    Differences in manufacturing  processes  for  the  same
        ;  product  result in differing  amounts  of  pollution.

          Lack of  applicable production records may impede
          determination of production  rates in terms  of de-
          sired normalizing parameters.

Several broad strategies have  been developed to analyze ap-
plicable production normalizing parameters.  They are  as
follows:

          The process approach - In this approach,  the pro-
          duction  normalizing  parameter is  a direct measure of
          the production rate  for each wastewater producing
          manufacturing operation.  These parameters  may  be
          expressed as sq m processed per hour, kg  of  pro-
          duct processed per hour, etc.  This  approach requires
          knowledge of all the wet processes used by  a plant
          because  the allowable pollutant discharge rates  for
          each process are added to determine  the allowable
          pollutant discharge  rate for the  plant.   Regulations
          based on the production normalizing  parameter are
          multiplied by the value of the parameter  for each
        I  process  to determine allowable discharge  rates  from
        ;  each wastewater producing process.

          Concentration limit/flow guidance -  This  strategy
          limits effluent' concentration.  It can  be applied
          to an entire plant or to individual  processes.  To
          avoid compliance by dilution, concentration  limits
;        ;  are accompanied by effluent flow guidelines.
        .:,.. The flow guidelines, in turn, are expressed  in
        •',  terms of the production normalizing parameter to
        ;  relate flow discharge to the production rate at
          the plant.
                                    X-15

-------
 The  selected  production  normalizing  parameter  for  the  semi-
 conductor industry is  the  total  volume  of  ultrapure  water  pro-
 duced  by a facility.   As the  production rate varies, the use
 of ultrapure  water will  also  vary.   Consequently,  the  production
 of ultrapure  water can be  directly related to  the  plant pro-
 duction  rate.   The amount  of  ultrapure  water produced  is also a
 more readily  available figure than the  number  or mass  of product
 exposed  to water  producing operations.   Using  the  production
 normalizing parameter, a regulation  can be determined  expressed
 in concentration  (mg/1)  of a  specific pollutant and  million
 liters of ultrapure water  produced per  day at  a given  facility.

 WASTE  CHARACTERIZATION AND TREATMENT IN PLACE

 This section  presents  both the sources  of  waste in the semi-
 conductor subcategory  and  process' wastewaterj sample  data.
 The  in place  waste treatment  systems are also  discussed,
 and  effluent  sample data from these  systems for the  twelve
 semiconductor plants sampled  are  presented, i

 Process  Descriptions and Water Use          ;

 The  "front end" operations, those processes iwhich  produce  the cir-
 cuitry within the  wafer, may  be  classified by  the  six  wet  processes
 used in  the manufacture  of semiconductors, namely:
                                            i

 .    Wafer cleaning and  subsequent water rinsing

 .    Photoresist developing and  subsequent water rinsing

     Silicon oxide etching and metal etching and subsequent
     water rinsing
                                            i
     Epitaxial diffusion furnace  and fume  hood wet air scrub-
     bing                                   ',

 .    Photoresist stripping and subsequent  waiter rinsing

 .    Wafer lapping and dicing              I

 These wet  processes are  used  in varying degrees by individual
 plants depending primarily upon the  product being  manufactured.
 The discrete semiconductor (such  as  a diode)i requires  only one
 layer of diffused  material, whereas  the integrated circuit re-
 quires an  average  of 12 diffused  layers.   Therefore, process
 water use  varies among plants relative  to  th'e  product,  tn*e pro-
 duction rate, and  other  factors.  Process  water use  a!|gSO"varies
 depending  upon the  flow rate  from the deionized (DI) water rin-
 ses used.  These rinses have  a flow  range  of' 0.87  to 17.4  liters/
minute with an average continuous flow  rate !of 7 liters/minute
 at the sampled plants.  Table 10-2 delineates  available wet pro-
 cess data.  Also included  are  size information, product type,
 and plant  effluent  flow rates.              j
                                  X-16

-------
                                      TABLE 10-2

              SEMICONDUCTOR AVAILABLE RAW WASTE DATA & EFFLUENT FLOW RATE
 Plant ID No.
Size
Product"
02040
02347
04152
04213
04249 ;
04290
04291
04292
04294
04296
06143
19100
19101
30167
35035 ',
36133
36135
36136
41061
42044
Large
Medium
Medium
Medium
Medium
Large
Small
Small
Small
Medium
Medium
Small
Medium
Large
Medium
Medium
Large
Medium
Large
Medium
Silc
Silc
Silc
LED
Silc
Silc, LED
LED
YIG, LED
Silc
Silc
Silc
Silc, Ger Diodes
Silc
Silc
Silc, LCD
Silc
Silc, LED
Silc
Silc
Silc, LCD
                                                Raw Waste Data

                                                      S
                                                      S
                                                      NA
                                                      NA
                                                      NA
                                                      NA
                                                      NA
                                                      NA
                                                      S
                                                      S
                                                      S
                                                      NA
                                                      NA
                                                      S
                                                      S
                                                      S
                                                      S
                                                      S
                                                      S
                                                      S

                                               Averaqe Flow Rate -
Effluent Flow I/day

   11,124,000
    3,136,512
      151,400
    1,090,080
           NA
    2,509,200
        4,704
      130,680
      150,552
    1,254,600
    1,080,000
      190,800
      669,120
    4,530,528
      169,584
    6,720,000
    3,120,000
    1,392,000
   10,560,000
      894,960

    2,443,936
Note 1:
  NA - not available
   S - sampled

Note 2:
  Silc - Silicon Integrated Circuit

  LED - Light Emitting Diode

  YIG - Yttrium Iron Garnet crystals

  Gar Dio3es - Germanium Diodes

  LCD - Liquid Crystal Display
                                           X-17

-------
Wafer Cleaning - This process  is  associated  with  all  types  of
semiconductor manufacture.   The semiconductor  material  is  fre-
quently cleaned in mild  acid or alkaline  solutions  to minimize
the  introduction of  contaminants  into  the wafer or  into the che-
mical baths.  Typical cleaning solutions  include  mildly alkaline
detergent  solutions  and  dilute nitric,  sulfuric,  and  hydro-
fluoric acids.  A typical discharge  from  the cleaning operation
at the visited plants includes a  four  to  seven liter  batch  dis-
charge of  concentrate and approximately seven  liters  per minute
of deionized  (DI) rinsewater.  This  cleaning process  may be
utilized either prior to every process  step  or infrequently,
depending  upon the requirement of the  operation and the elapsed
time between process steps.

Photoresist Developing - This  process  folloWs  the application of
photosensitive emulsion  on  the wafer and  exposure of  the photo-
resist material through  a glass mask.   The yrafer  is then immersed
in a developing solution which removes  unex^osed  resist from the
wafer.  The exposed  resist  is  quite  hard  and insoluble  in  the
developing solution.  The positive type phojtoresist uses a  water-
based developer, whereas the negative  type photoresist  requires
a xylene-based developer.   After  the xylener-based developer is
spent, it  is collected and  contractor  removed.  The water-based
developer  is discharged  to  the waste treatment system along
with the subsequent  DI water rinse.  Typically, the DI  water
rinse discharged at  approximately seven liters per  minute  at
the visited plants.                        i

Silicon Oxide and Metal  Etching - After the!  wafer is  masked with
photoresist, it is etched in an acid solution  either  to create
windows for diffusion (silicon oxide etching)  or  to create  ex-
ternal contacts for  electrical connections !(metal etching).
Hydrofluoric acid is used throughout the  semiconductor  industry  as
a silicon oxide etchant  and  is discharged tb the  on-site waste
treatment  system when spent.   The metal etchants  include a  gold
stripper; phosphoric acid to dissolve  alumihum; a solution  of
nitric and hydrochloric  acids  to  dissolve platinum; and several
other less frequently used  acids.  All  of the  spent etchants  are
discharged to the waste  treatment system  as>  are the associated
DI water rinses.                           |

Epitaxial Diffusion  Furnace  and Fume Hood Wgt  Air Scrubbers -
After the windows have been  etched into thej  wafer,  the  wafer is
placed in a furnace  where dopants are  deposited into  the windows.
The furnaces are vented  to  wet air scrubberp to remove  pollutants
from the air prior to discharge.   These scrjubbers are used  in all
of the twenty plants which  were visited during this study.   The
water from the wet air scrubbers  recirculates  but has an average
bleed-off rate of 35 liters  per minute  discharging  to the waste
treatment  facility.  This bleed-off  is  necessary  because the
water in the scrubber becomes  very acidic and  laden with .pollu-
tants,                                     i
                                 X-18

-------
Eighteen of the visited plants vented their fume hoods to  the
wet air scrubber system also.  In the other two plants, fumes
from acids and solvents were discharged with large amounts of
air to the atmosphere.  These two plants conduct regular analysis
to meet clean air requirements.

Photoresist Stripping - After the dopant has been added to the
wafer, the protective photoresist material must be removed.  The
hardened photoresist is stripped from the wafer with a phenolic
and xylene-based stripper on metal surfaces.  An acid or alkaline
strippier is used on an oxide layer.  The spent phenolic and xylene
stripper is collected and stored for contractor removal, while
the spent acidic or alkaline stripper (potassium hydroxide, sul-
furic-peroxide, sulfuric-nitric acid) is discharged to the waste
treatment system with the accompanying DI water rinses.  The
DI water rinse flow averaged seven liters per minute in these
processes at the visited plants.

Wafer Lapping and Dicing - After the wafer has completed the photo-
lithographic cycle, it must be machined to the proper thickness,
and the individual chips or dice must be removed.  The water used
for cooling and lubrication in the process of grinding or  lapping
the wafer produces wastewater.  This water forms a slurry with the
ground material (kerf) and is discharged to the treatment  facili-
ty'   \

The wafer is diced in a computer-controlled saw.  After cutting,
the dice are removed and prepared for assembly.  In some facili-
ties the dice are separated from the wafer by selectively etching
the perimeter of each die.  This process involves the application
of a photoresist, exposure through a mask, developing, etching,
and resist stripping.  Dicing a wafer by using the photolithogra-
phic process is not an industry-wide procedure but will become
more frequently used in the future because it will allow more de-
tailed etching than the cutting process.

Many of the semiconductor facilities contacted do not lap or dice
wafers in the United States.  The wafers are shipped to assembly
plants outside the U.S. where the wafers are lapped, diced, and
assembled.  Thus, sample analysis data are not available for finish
lapping and dicing operations at any of the facilities visited
during this study.

Wastewater Analysis Data

Table 10-3 is a list of the 129 toxic pollutants and 23 other
pollutants for which sample analyses in the semiconductor
subcategory were conducted.  Of the 129 toxic pollutants 31
were found in measurable quantities or were found at trace
levels.  All other toxic pollutants were not detected in the
sampled streams.
                                  X-19

-------
                                              TftBLE 10-3
                                   POLLUTANT PARAMETERS ANALYZED
TOXIC POLLUEftNT
 1.
 2.
 3.
 4.
 5.
 6.
 7.
 8.
 9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
     Acenaphthene
     Acrolein
     Acrylonitrile
     Benzene
     Benzidine
     Carbon Tetrachloride(Tetrachlorcmethane)
     Chlorobenzene
     1,2,4-Trichlorobenzene
     Hexachlorbenzene
     1,2-Dichlorethane
     Hexachlocoethane
     1,1-Dichloroethane
     1,1,2-Trichlroethane
     Iflf2f2-Tetrachloroethane
     Chloroethane
     Bis(Chloronethyl)Ether
     Bis(2-Chlow>2thyl)Ether
     2-CW.oroethyl Vinyl Ether(Mixed)
     2-Chloronaphthalene
     2,4,6-Trichlorophenol
     Parachloroneta Cresol
     Chlorofonn(Trichloraiethane)
     2-Chlorophenol
     1,2-Dichlorobenzene
     1,3-Dichlorobenzene
     1,4-Dichlorobenzene
     3,3'HDichlorobenzidine
     1,1-Dichldroethylene
     1,2-Trans-Dichloroethylene
     2.4-Dichlorcphenol
     1,2-Dichlorcprcpane
     lf2-DichlorcECCpylene(l,3-DichloroEiropene)
     2,4-Diroeti^lphenol
     2,4~Dinitrotoluene
     2,6-Dinitrotoluene
     1,2-Diphenylhydrazine
     Ethylbenzene
     Pluoranthene
     4-CM.ocophenylPhynyl Ether
     4-^roraophenylPhenyl Ether
     Bis (2-CWLoroisopropyl) Ether
     Bis(2-Chlciroethoxy)Methane
     Methylene Chloride(Dichloranethane)
     ^5ethyl Chloride (Chlcaxraethane)
46.  Methylbromide (Bromonethane)
47.  Bromoform (Tribromanethane)
48.  Dichlorobromomethane
49.  Trichlorofluoromethane
50.  Dichlorodifluoromethane
51.  Chlorodibromonethane
52.  Hexachlorobutadiene
53.  Hexachlorocyclopentadiene
54.  Isophorone
55.  Naphthalene  ;
56.  Nitrobenzene j
57.  2-Nitrophenol
58.  4-Nitrophenol
59.  2,4-Dinitrophenol
60.  4,6-Dinitro-o-cresol
61.  N-Nitrosodimethylamine
62.  N-Nitrosodiptienylamine
63.  N-^Iitrosodi-N-Propylamine
64.  Pentachlorophenol
65.  Phenol       I
66.  Bis(2-Ethylhexyl)Phthalate
67.  Butyl Benzyl Phthalate
68.  Di-NHButyl Phthalate
69.  Di-N-Octyl Phthalate
70.  Diethyl Phthalate
71.  Dimethyl Phthalate
72.  1,2-Benzanthracene(Benzo(A) Anthracene)
73.  Benzo(A)Pyrerje (3,4-Benzo-Pyrene)
74.  3,4-^enzofluoranthene(Benzo  (B)Fluoranthene)
75.  ll,12-Benzofiuoranthene(Benzo(K)Fluoranthene)
76.  Chrysene     '
77.  Acenaphthylene
78.  Anthracene   !
79.  l,12H3enzoperylene(Benzo(GHI)-Perylene)
80.  Fluorene     ]
81.  Phenanthrene:
82.  l,2,5,6-Dibenzathracene(Dibenzo(A,H)Anthracene)
83.  Indeno(1,2,3-^DC)Pyrene(2,3-o-PhenylenePyrene)
84.  Pyrene       !
85.  Tetrachloroethylene
86.  Toluene      l
87.  Trichloroethylene
88.  Vinyl Chloride (Chloroethylene)
89.-  Aldrin       |
90.  Dieldrin     ;
                                                 X-20

-------
                                            TABLE 10-3  Con't
 91.  Chlordane(TechnicalMixtureandMetabDlites) 112.
 92.  4,4'-DDT                                  113.
 93.  4,4'-DDB(P,P'-DDX)                        114.
 94.  4,4I-DDD(P,PI-TDE)                        115.
 95.  Alpha-Endosulfan                          117.
 96.  Beta-Endosulfan                           118.
 97.  Endosulfan Sulfate                        119.
 98.  Endrin  ,                                  120.
 99.  Endrin Aldehyde                           121.
100.  Heptachlor                                122.
101.  HeiptachlorEpoxide(BHC-Hexachlorocyclo-    123.
        hexane)
102.  Alpha-«HC                                 124.
103.  Beita-BHC                                  125.
104.  Gamna-BHC(LIndane)                        126.
105.  Deilta-BHC(PCB-Polychlorinated Biphenyls)  127.
106.  PCB-1242(Arochlor 1242)                   128.
107.  PCB-1254(Arochlor 1254)                   129.
108.  PCB-1221(Arochlor 1221)
109.  PCB-1332(Arochlor 1232)
110.  PCB-1248(Arochlor 1248)
111.  KB-1260(Arochlor 1260)
PCB-1016(Arochlor 1016)
Toxaphene
Antimony
Arsenic
Beryllium
Cadmium
Chronium
Copper
Cyanide
Lead
Mercury

Nickel
Selenium
Silver
Thallium
Zinc
2,3,7,8-^etrachlorcdibenzo-P-Dioxin(TCI»)
POSER KILLUEANTS

Calcium          Platinum
Magnesium        Palladium
Aluminum         Gold
Manganesse        Tellurium
Vanadium
Boron
Barium
Molybdenum
Tin
Yttrium
Cobalt
Iron
Titanium

Oil & Grease
Total Oiganic Carbon
BiochemJLcal Oxygen Demand
Total Suspended solids
Phenols
Fluoride
Xylenes
Alkyl E{X>xides
                                                  X-21

-------
 Detailed laboratory analysis data for the twelve sampled plants
 are presented by plant ID number in Tables 10-r4 through 10-15.
 The tables are in plant ID numerical order.   •

 The following conventions were used in quantifying the levels de-
 termined by analysis:

      Trace Levels - Pollutants detected at levels too low to
      be quantitatively measured are reported as the value
      preceded by a "less than" (<)  sign.  All other pollutants
      are reported as the measured value.      i
                                               1
                                               |
      Mass_Load - Total daily discharge in kilo;grams/day of a
      particular pollutant is termed the mass ioad.  This figure
      is computed by multiplying the measured concentration (mg/1)
      by the water discharge rate expressed in jliters per day.

      Sample Blanks - Blank samples  of organic-;free distilled
      water  were placed adjacent to  sampling po;ints to detect
      airborne contamination of water samples. ! These sample
      blank  data are not subtracted  from the analysis results,
      but, rather, are shown as a (B) next to the pollutant
      found  in both the sample and the blank.   |rhe tables show
      data for total toxic  organics,  toxic and non-toxic metals,
      and other pollutants.                     I

      Blank  Entries - Some  entries were left bljank for one  of
      the following reasons:   the parameter was, not detected;
      kg/day is not given when the concentration is lower than
      the minimum  detectable  limit or not quantifiable; kg/day
      is not given and  not'  included  in totals  for parameters
      typically found in incoming water (calcium, magnesium,
      and sodium);  kg/day is  not applicable to pH.

Analyses of the sampled semiconductor raw waste streams  show
high  concentrations  of some  metals such  as chrbmium,  copper,  and
nickel.   In addition,  in one  stream  the  arsenic concentration
was measured at 6.25 mg/1, whereas in  the  other eight streams
arsenic  was  found  at very low or  trace levels.   The  source  of arsenic
in this  case is arsene  gas used as a dopant  in!diffusion fur-
naces.  ^In  semiconductor facilities  where  arsenic  is  used  in
the basis material,  gallium  arsenide,  the  arsenic  concentration
may be  as high as  100 mg/1.   In three other streams  non-toxic
metals  such as calcium, magnesium, and sodium make up most  of
the discharge.  These pollutants  are contained;in  the incoming
water.   The highest discharge concentrations  of  organics are  for
chloroform, phthalates, and phenolic compounds.  Organics are
present  in solvents and other organic process chemicals.  High
levels of fluoride are present  in one wet  air scrubber stream
and in five of the eight raw waste streams sampled.   The fluoride
results  from the use of hydrofluoric acid  for etching.
                                 X-22

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