United States              Office of Water (WH 550G)         EPA 570/9-91-036G
                    Environmental Protection                                January 1992
                    Agency




4>EPA        Best Management  Practices



                    For  Protecting  Ground  Water


                     For Printed Circuit Board Manufacturers

                            Using  Shallow Industrial Waste

                                        Disposal Wells

                        (Class V Well BMP Fact  Sheet Number 2E)


                    EPA recognizes that certain industrial waste disposal practices using drainage wells may pose unacceptable
                    risks to Underground Sources of Drinking Water These operations allow the discharge of various wastes to a
                    drainage system neither designed for nor capable of treating them. Accordingly, BMPs for Industrial Disposal
                    Wells focus on well closure and alternative disposal methods. We have also included BMPs for waste minimiza-
                    tion to help facilities reduce waste disposal costs, regardless of the disposal method they use. In addition local,
                    county, and State regulations may prohibit use of these wells Note: these practices are recommendations only
                    For more information, contact the person named below

                         The BMPs listed below apply to printed circuit board manufacturers. Fact Sheet
                         Number 2 in this series lists BMPs that are applicable to Industrial Disposal Wells
                         in general (including those used by printed circuit board manufacturers), particu-
                         larly for closure and alternative disposal.


                         Waste Minimization


                          • Substitute aqueous processable resists  for solvent processable resists where
                            feasible


                          • Replace chemical board production wrth computer-driven mechanical etching
                            processes for low-volume board production, such as for prototypes

                          • Replace chromic-sulfuric acid etchants with ferric chloride or ammonium
                            persulfate where possible


                          • Use thinner copper foil to clad laminated boards, where-feasible

                          • Decant and filter photoresist stripper to extend stripper life

                          • Extend plating bath life and recover metals and additives through treatment

                            —  For example, use electrolytic dummying to remove excess copper
                            —  Other methods  include high surface area electrowinning/electrorefining,
                               ion exchange, ion transfer, evaporators, and reverse osmosis

                          • Recycle spent chromic acid using an electrolytic diaphragm cell or other
                            method

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                    United States              Office of Water (WH 550G)         EPA 570/9-91-036G
                    Environmental Protection                                January 1992
                    Agency

v°/EPA        Best Management  Practices

                    For  Protecting  Ground  Water
                     For Printed Circuit Board  Manufacturers
                            Using Shallow Industrial  Waste
                                         Disposal Wells
                        (Class V Well BMP Fact  Sheet Number 2E)
                    EPA recognizes that certain industrial waste disposal practices using drainage wells may pose unacceptable
                    risks to Underground Sources of Drinking Water These operations allow the discharge of various wastes to a
                    drainage system neither designed for nor capable of treating them. Accordingly. BMPs for Industrial Disposal
                    Wells focus on well closure and alternative disposal methods. We have also included BMPs for waste minimiza-
                    tion to help facilities reduce waste disposal costs, regardless of the disposal method they use  In addition local,
                    county, and State regulations may prohibit use of these wells Note: these practices are recommendations only
                    For more information, contact the person named below
                         The BMPs listed below apply to printed circuit board manufacturers. Fact Sheet
                         Number 2 in this series lists BMPs that are applicable to Industrial Disposal Wells
                         in general (including those used by printed circuit board manufacturers), particu-
                         larly for closure and alternative disposal.
                         Waste Minimization
                          • Substitute aqueous processable resists for solvent processable resists where
                            feasible
                          • Replace chemical board production with computer-driven mechanical etching
                            processes for low-volume board production, such as for prototypes
                          • Replace chromic-sulfuric acid etchants with ferric chloride or ammonium
                            persulfate where possible
                          • Use thinner copper foil to clad laminated boards, where-feasible
                          • Decant and filter photoresist stripper to extend stripper life
                          • Extend plating bath life and recover metals and additives through treatment
                            —  For example, use electrolytic dummying to remove excess copper
                            —  Other methods include high surface area electrowinning/electrorefining,
                               ion exchange, ion transfer, evaporators, and reverse osmosis
                          • Recycle spent chromic acid using an electrolytic diaphragm cell or other
                            method

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