EPA 744-R-98-OO5
COMPUTER DISPLAY
INDUSTRY AND
TECHNOLOGY PROFILE
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ACKNOWLEDGEMENTS
This document was prepared by Colleen Mizuki and Gloria Schuldt of Microelectronics and
Computer Technology Corporation (MCC) as part of the collaborative Design for the
Environment (DfE) Computer Display Project. The Project Officer for this grant was
Kathy Hart of EPA's DfE Program, in the Office of Pollution Prevention and Toxics. This
report would not have been possible without the assistance of the industry members who
supplied information for this report.
DfE Computer Display Project Core Group members provided valuable guidance and
feedback during the preparation of this report. Core Group members include: Kathy Hart
(Core Group Co-Chair), EPA; David Isaacs, Electronic Industries Alliance (Core Group
Co-Chair); Dipti Singh, EPA (Technical Workgroup Co-Chair); Ross Young,
DisplaySearch (Technical Workgroup Co-Chair ); Lori Kincaid and Maria Socolof,
University of Tennessee Center for Clean Products and Clean Technologies; Greg Pitts,
Colleen Mizuki, and Gloria Schuldt, MCC; John Lott, DuPont Electronics; Jeff Lowry,
Techneglas; Frank Marella, Sharp Electronics Corporation; Bob Pinnel, U.S. Display
Consortium; Doug Smith, Sony Corporation; Ted Smith, Silicon Valley Toxics Coalition.;
Dan Steele, Motorola; and David Thompson, Matsushita Electronic Corporation of
America. We also thank the other industry representatives and interested parties who
reviewed and provided suggestions for this report. Industry representatives include: Rich
Beer, Lam Research Corporation; Robert Conner, Applied Komatsu Technology; Paul
Semenza, Stanford Resources, Inc.; Bill Simpson, Corning; Curt Ward, Candescent
Technologies Corporation; and Jeff Zeigler, R. Frazier, U.S.
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TABLE OF CONTENTS
1.0 INTRODUCTION 1
2.0 INDUSTRY MARKET PROFILE
2.1 COMPUTER MONITORS : VOLUME AND TECHNOLOGY TRENDS 3
2.1.1 CRTs 3
2.1.2 LCDs 4
2.2 MANUFACTURING LOCATIONS AND SUPPLIERS 6
2.2.1 CRTs 6
2.2.2 CRT materials and subassemblies 9
2.2.3 LCDs 10
2.2.4 LCD materials and subassemblies 11
3.0 TECHNOLOGY PROFILE 12
3.1 CRT OPERATION AND COMPONENTS 12
3.2 CRT MANUFACTURING PROCESS 14
3.2.1 CRT glass fabrication 15
3.2.2 Faceplate preparation (pattern) 15
3.2.3 Shadow mask fabrication and assembly to faceplate 17
3.2.4 Funnel preparation 18
3.2.5 Bulb joining 18
3.2.6 Electron gun fabrication and assembly 19
3.2.7 Final assembly 19
3.3 ACTIVE-MATRIX LCDs 21
3.3.1 Thin-film transistor (TFT) structures 21
3.3.2 Twisted-nematic TFT-LCD operation 22
3.4 TFT-LCD MANUFACTURING 24
3.4.1 Glass fabrication 24
3.4.2 Front panel patterning 25
3.4.2.1 Deposit ITO 25
3.4.2.2 Pattern color filter 25
3.4.2.3 Deposit alignment layer 26
3.4.2.4 Inspect and test 26
3.4.3 Rear Panel Patterning 26
3.4.3.1 Clean and inspect 26
3.4.3.2 Pattern TFTs 28
3.4.3.3 Deposit passivation layer/test/inspect 29
3.4.3.4 Deposit alignment layer 29
3.4.4FrontPanelPatterning-IPS 29
3.4.5 Rear Panel Patterning-IPS 29
3.4.6 Display cell and final module assembly 31
3.4.6.1 Seal panels 31
3.4.6.2 Inject LC 32
3.4.6.3 Attach polarizers 32
3.4.6.4 Inspect and test 32
3.4.7 Module Assembly 32
3.4.7.1 Attach backlights 32
3.4.7.2 Attach electronics 32
3.4.7.3 Final test and ship 33
APPENDIX A 34
FLAT PANEL DISPLAY TECHNOLOGIES 34
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APPENDIX B 39
CRT MANUFACTURE 39
APPENDIX C 42
NEC CRT: DETAILED BILL OF MATERIALS 42
APPENDIX D 46
TFT-LCD MANUFACTURE 46
Glass Panel 46
Front Panel Pattern-TN 47
Rear Panel Pattern-TN 49
Front Panel Pattern-IPS 52
Rear Panel Pattern-IPS 53
Display Cell Assembly 55
Display Module Assembly 56
APPENDIX E 57
CANNON FPD: DETAILED BILL OF MATERIALS 57
GLOSSARY 65
ill
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Computer Display Industry and Technology Profile
1.0 Introduction
Since World War II, cathode ray tube (CRT) electronic displays have played an
increasingly important role in our lives, with televisions and personal computers being the
primary applications. In the 1970's, the liquid crystal display (LCD) became popular in
wristwatches and calculators. In the early 1980s, Epson introduced the first portable
computer with a monochrome LCD display, followed soon by LCD monitor displays from
Tandy and Toshiba. These electronic displays are commonly referred to as flat panel
displays (FPDs).
There are now a number of flat panel displays (FPDs), each providing particular
advantages for a given application. Appendix A1 provides an overview of LCD and other
FPD technologies. The LCD is by far the most common type of FPD, and currently is the
only FPD used in commercial computer monitors, which includes laptop monitors.
Computer monitors constituted approximately 54.7 percent of the $13.9 billion LCD
market in 1997, and are predicted to increase to 67.4 percent of the $31.5 billion market in
2001.2 LCDs comprised 87.6 percent of all FPD applications in 1997, and are expected to
drop only slightly to 85.8 percent in 2003.3 LCDs have greatly increased in number, type,
and applications, including growth in the desktop monitor application. LCD desktop
monitors, although not yet numerous in the commercial sector, appear to be a likely
replacement technology for CRTs. Therefore, the potential for high market penetration and
an increased LCD material volume is significant.
Concern over the environmental impact associated with the manufacture, use, and
disposition of electronic products has emerged in recent years. These concerns have been
driven in part because computer manufacturing requires the use of some toxic materials that
may pose occupational and environmental risks. Concern has also been raised by the
1 Socolof, M.L., et al., Environmental Life-Cycle Assessment of Desktop Computer Displays: Goal Definition
and Scoping, (Draft Final), University of Tennessee Center for Clean Products and Clean Technologies,
July 24, 1998.
2 Stanford Resources, presentation at the 1998 United States Display Consortium (USDC) Business Conference,
San Jose, CA.
3 Ibid.
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growing numbers of consumer electronic products in the marketplace, creating an
increasing volume of end-of-life (EOL) materials and some calls for changes in EOL
management, especially in Europe. Producers, customers, legislators, regulators, and
municipalities are interested in examining the resources used to produce and use these
products, and in reducing environmental impacts throughout the entire computer product
life cycle, especially during disposition at EOL.
In the consumer realm, CRT displays in televisions and computers dominate in terms of
material volume, while LCDs found in household equipment (e.g., microwaves, stereos)
and consumer items (e.g., watches, cell phones, pagers) dominate in terms of number of
displays. Looking at all electronic displays in terms of material volume, it is helpful to
analyze three categories separately. The largest displays (>40-inches) are generally in
projection format, and thus consume relatively small material volumes; they are also
produced in relatively small unit volumes. The smallest displays (<5-inches) are produced
in large volumes (over 1.6 billion units in 1998), but tend to be part of larger systems
(appliances, stereos) and so are a relatively small part of the overall material volume. It is
in the middle sizes (5- to 40-inches) that the display material volume is a large fraction of
the system, and unit volumes are significant.
In order to assess environmental impacts of both CRTs and LCDs during manufacturing,
use, and disposition stages, the United States Environmental Protection Agency Design for
the Environment (DfE) Program formed a voluntary partnership with the display industry.
The goal of the DfE Computer Display Project is to study the life cycle environmental
impacts of CRT and LCD desktop computer displays, and generate data that will assist the
display industry to make environmentally informed decisions and identify areas for
improvement. The selection of these two types of displays was based on potential end-of-
life material volume, widespread use, and the ability to compare two display types with the
same functional unit—desktop computer application.
The purpose of the Computer Display Industry and Technology Profile is to provide an
overview of the CRT and LCD computer monitor markets and technologies. Section 2.0
presents a market profile based on currently available data. The profile is not an exhaustive
market assessment, and does not intend to imply preference to one technology type.
Section 3.0, Technology Profile, presents an explanation of the basic operation and
manufacturing of CRTs and thin-film transistor (TFT) -LCDs to readers relatively
unfamiliar with the topic.
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2.0 Industry Market Profile
2.1 Computer Monitors: Volume and Technology Trends
Virtually a one-to-one ratio exists between the number of computers and the number of
displays in the marketplace. Because the world market for computers has grown so
rapidly, a corresponding increase in displays can also be expected. Sales of personal
computers (PCs) are expected to continue to grow beyond the year 2000. Many PCs will
be desktop systems. ADI Corporation estimated worldwide demand for PCs at 66 million
units in 1996, growing to 86.63 million in 1998, and over 100 million in 2000.4 Desktop
applications make up most of these sales.
The United States has been a major market for computers. The U.S. Bureau of the Census
estimates that in 1993, 43.2 percent of the U.S. working population used a computer at
work, compared with 34.8 percent in 1989 and 23.2 percent in 1984. Also in 1993,
22,605,000 households owned a home computer, up from 13,683,000 in 1989, and
6,980,000 in 1984.5
2.1.1 CRTs
The computer monitor has been one of the two largest applications for CRTs; the other has
been television. According to a report published by Fuji Chimera Research, the 1995
worldwide market for monitor CRTs was 57.8 million units, 28 million of which (48.5
percent) were consumed in North America.6 According to the same source, 1996
worldwide CRT monitor demand increased to 67.1 million units.7 Stanford Resources
reports that the CRT monitor market reached 84.2 million units in 1997 (25.6 million in the
United States), and anticipates a worldwide growth to more than 100 million units in 2002,
reaching 113.5 million in 2003.8
4 Nikkei Microdevices' Flat Panel Display 1997 Yearbook, Nikkei Business Publications, Inc., p. 98.
5 "Computer Use in the United States: October 1993," U.S. Bureau of the Census, Current Population Reports,
Special Series P-23.
" The Future of Liquid Crystal and Related Display Materials, Fuji Chimera Research, 1997, p. 12.
7 Ibid.
Stanford Resources, Inc., web site.
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In order to keep pace with more demanding computer applications, CRTs have been
continually improved: larger screen sizes, higher resolution (for Windows, Macintosh OS,
and Web-page font challenges), and higher luminance (for videos). This improvement is
likely to continue, as the market moves away from sales of smaller (14-inch and 15-inch)
monitors, toward 19-inch and 21-inch monitors. Features that were once accompanied by
a high price tag are becoming more standard. Reduced dot pitch; color matching; flatter,
lighter weight, touch-sensitive screens; and digital cameras are some of the new offerings at
lower prices. This is due, in part, to an increased number of CRT suppliers in the
marketplace and improvements in technologies, such as aperture grille, Invar shadow
mask, and the flatter Trinitron CRT.
The marketplace is seeing other changes in CRTs, such as shorter necks that reduce the
depth by at least three inches on a 17-inch monitor. Display Search reports that while a
wider deflection yoke angle enables this development, it causes problems with focusing,
which may require more circuitry to resolve. A number of companies have recently
released new monitors, many in the 17-inch and 19-inch range.
2.1.2 LCDs
Although market analysts predict growth in the CRT monitor market through the first few
years of the 21st century, it is widely anticipated that after that point, LCDs will begin to
erode the CRT stronghold. Although the portable computer is currently the major
application for LCDs, industry analysts expect this technology to increasingly penetrate the
desktop monitor market, particularly in the 15-inch to 20-inch range. Industry experts
anticipate that by 2000, LCDs will have captured 5.4 percent of the monitor market. The
United States is a primary market for LCD monitors, and will grow into an even stronger
market by the end of the century. NEC estimates that the United States will receive over
half of the forecasted 6.4 million LCD monitors shipped in 2001 (see Figure 2-1).
Display Search also forecasts that the United States will constitute 30 percent of the
worldwide LCD monitor market in 2001, with total LCD monitor sales of 7.7 million units.
DisplaySearch predicts a worldwide LCD monitor market of $4.2 billion by 2000.9
DisplaySearch Monitor, April 1997.
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(1,000 units/yr)
7000 T
6000-
5000-
4000-
3000-
2000-
1000-
II Japan
Europe
North America
1997 1998 1999 2000 2001
Figure 2-1: LCD Monitor Forecast10
LCD monitors are primarily active-matrix LCD (AMLCD), most of which are thin-film
transistor (TFT) structures. Super-twisted nematic (STN), a passive-matrix LCD
(PMLCD) technology, competes in some areas with AMLCD. Although some monitors
are based on an STN structure, STN-LCDs are primarily found in electronic organizers and
measurement devices. While STN-LCDs offer a cost advantage over TFT-LCDs, prices
for the latter technology have been dropping. DisplaySearch reports that the TFT market
will grow from $4.87 billion in 1996 to $13.7 billion in 2000, whereas the STN market is
expected to drop slightly from $4.3 billion to $4.2 billion during the same time period.11
At Computex Taipei '97, a leading computer exhibition, over 20 companies displayed more
than 100 models of LCD monitors.12 A number of companies promoted both AMLCD and
PMLCD monitors. More recently, DisplaySearch reported that over 180 LCD monitors are
marketed by 50-some companies, 81 percent of which use thin-film TFT-LCD technology,
10 Nikkei Microdevices' Flat Panel Display 1998 Yearbook, Nikkei Business Publications, Inc., p. 80.
11 DisplaySearch Monitor, April 1997.
Information Display, Official Publication of the Society for Information Display, October 1997, p. 37.
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and 19 percent of which use STN technology.13 According to Display Search, TFT-LCD
monitor shipments will grow from 1.1 million in 1998 to 13.1 million in 2002.14 Between
1998 and 2001, the 15-inch display is expected to make up the greatest share of these
monitors.15
Currently, the greatest obstacle facing LCDs in the desktop monitor market is not
competition from other LCD technologies, but a high price tag relative to that of CRTs.
TFT-LCD monitors currently cost several times that of a CRT monitor, with a 15-inch unit
costing $1200. There are indications that the price of TFT-LCDs will continue to decrease,
prices have already dropped to $900. Most of the LCD monitor sales have been to the
medical and financial community, but expectations are that the customer base will spread
when a 3:1 cost ratio with CRTs is reached, and even more so as prices continue to decline.
Surveys indicate that given a 1.5:1 cost ratio of FPDs to CRTs, 30 percent of consumers
would opt for the FPD. DisplaySearch reports that low prices by Korean LCD suppliers
will likely bring prices of 15- and 18-inch LCD monitors down to a 2X price ratio with 17"
and 19" CRTs by the end of 1998.
2.2 Manufacturing Locations and Suppliers
2.2.1 CRTs
The majority of CRT display fabrication takes place outside of the United States. In 1997,
Asia (excluding Japan) produced 54 percent of all color TVs and 79 percent of all CRT
monitors.16 DisplaySearch reports that Japan supplies between 10 and 15 percent of CRTs
produced worldwide, primarily 17-inch and larger. The greatest concentration of CRT
manufacturers is in Taiwan, where 33.6 percent of total world production took place in
1996.17 South Korea and China are also becoming major sites for CRT monitor
production. Most color CRT monitors and small TV CRTs (less than 19 inches) are
produced outside the United States. Due to the cost of transporting heavier displays, some
TV CRTs, 19 inches and larger, are produced in the United States. It is possible that a
13 Presentation by DisplaySearch at the USDC Business Conference: Enabling New Display Markets, Display
Works, January 20, 1998, San Jose, CA.
14 DisplaySearch FPD Equipment and Materials Analysis and Forecast, Austin, Texas, June 1998.
15 Ibid.
16 The Future of Liquid Crystal and Related Display Materials, Fuji Chimera Research, 1997, p. 12.
Stanford Resources, Inc., web site.
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similar situation will arise with larger CRTs monitors.18 See Table 2-1 for regional
production figures for CRT monitors.
1994
Europe
North
America
Asia
Japan
So-Central
America
Total
3,500
800
41,000
5,300
800
51,400
1995
3,850
1,000
45,650
6,080
1,200
57,780
1996
4,300
1,200
53,000
7,100
1,500
67,100
1997
4,800
1,500
60,000
8,000
1,900
76,200
1998 2000
5,300
1,800
65,000
9,000
2,500
83,600
6,000
2,400
75,000
10,000
3,200
96,600
Table 2-1: Color CRT Monitors Production by Region (,000 units)19
As is the case with most commodity goods, CRT monitors are distributed by the
manufacturer via different routes. They may be sold under the manufacturer's name
through retail channels, or to original equipment manufacturers (OEMs) or other system
retailers, such as Dell Computers. Major manufacturers and retailers include Acer, Apple,
Compaq, CTX, Dell, Digital, Eizo, Hitachi, Hewlett Packard, IBM, liyama, LG, MAG,
Mitsubishi, NEC, Nokia, Panasonic, Samsung, Sharp, Siemens Nixdorf, Sony, Toshiba,
and Viewsonic.
Figure 2-2 shows the 1997 market share in the United States per CRT monitor brand name.
In this table, some manufacturers (such as Sony) will be under-represented, as the
monitors they manufacture for other companies may carry the brand name of the other
company (e.g., Sony monitors manufactured for Dell). Figure 2-3 provides data on the
1996 industry market share for main color CRT monitor-tube manufacturers.
18 Reported at the Glass Roundtable meeting, February 6, 1997, University of Texas at Austin.
The Future of Liquid Crystal and Related Display Materials, Fuji Chimera Research, 1997.
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1 0
6
2
I — |
H6
Compaq Dell Packard Gateway IBM ViewSonic NEC
Bell 2000
CRT Brand Name
=
CTX
Sony
t
Acer
Figure 2-2: CRT U.S. Market Share (Percent) by Brand Name20
25
20
15
10
5
Hitachi Sony Samsung Chunghwa Matsushita Toshiba
Tube Manufacturers
Philips
Lucky
Goldstar
Figure 2-3: Worldwide Market Share (Percent) of Color CRT Tube
Manufacturers21
Source: Stanford Resources, 1997 data.
Source: Stanford Resources, 1996 data.
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2.2.2 CRT materials and subassemblies
The majority of CRTs (TVs and monitors) and CRT-related components and materials are
manufactured outside of the United States. The major materials, components and
subassemblies are as follows:
• Faceplate • Shadow mask assembly
• Funnel • Electron gun assembly
• Neck • Deflection yoke
• Phosphors • Deflection amps
• Frit • Centering magnets
• Aquadag • Printed wiring boards (PWBs)
• Lacquer coating • Anti-static/anti-glare coating
For a more extensive listing, see the CRT process flow and bill of materials in Appendices
A and B, respectively .
There are approximately 100 CRT manufacturers worldwide.22 In the United States, there
are five CRT glass manufacturing plants, producing approximately 600K tons of product
annually: Thomson, Techneglas (two sites), and Corning (three sites, with one being a
joint venture with Sony). Glass is imported from Asahi, NEC, Samsung, Schott, and
Philips.
Sony is the only manufacturer of color monitor tubes in the United States, although they,
along with Hitachi, Matsushita, Philips, Thomson, Toshiba, and Zenith, do produce TV-
tubes in the United States. Aydin, Compaq, Display Tech, Digital Equipment Corporation,
IBM, Modicon, NCR, and Unysis assemble computer displays domestically.
Techneglas, in addition to being a major North American manufacturer of panel and funnel
glass, is a large producer of frit, planar dopants, and glass resins. Phosphors are supplied
internally from vertically integrated manufacturing facilities and by foreign manufacturers
(primarily in Japan).
Electronic Engineering Times, December 1, 1997, num. 983, p. 27.
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The remainder of the components and subassemblies are produced primarily in Asia.
Although shadow masks for TVs are produced in United States, no United States
manufacturer has established a high-volume, high-resolution shadow mask facility for
monitors. Nippon Printing and Dai Nippon Screening are primary producers in Asia.
Electron guns are made from precision metals parts, a significant portion being
manufactured by Premium Allied Tube. Insulator glass used in the gun assembly is
supplied by Corning Asahi Video and Techneglas. Deflection yokes and amps are
produced primarily in the United States, Canada, and Taiwan, and there are a couple of
domestic producers of centering magnets.
2.2.3 LCDs
The number of LCD suppliers is significantly lower than the number of CRT suppliers,
primarily due to the high capital cost of manufacturing FPDs. As shown in Figure 2-4,
Japan leads in AMLCD investment, followed by South Korea. More recent data from
DisplaySearch shows that LCD capital investment by Japanese and Korean companies will
decrease significantly in 1998 to $676 million, down from $3.85 billion the previous year.
Taiwan
$400
Europe
$350
United States
$250
Source: POSTECH
Figure 2-4: Capital Investment in AMLCD Production 1994-1996
(Smillions)
10
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In 1995, Japan manufactured 94.7 percent of all LCDs, followed by Korea at 3.5 percent
and Taiwan at 1.7 percent; 0.1 percent were produced outside of these regions. By 2005,
Japan is forecasted to lead LCD production, with 75 percent. Korea is expected to increase
its share to 12.9 percent, and Taiwan to 11.9 percent; 0.2 percent will be produced
elsewhere.
Korean and Taiwanese LCD manufacturers have been able to enter this market partially due
to strategic relationships with Japanese companies. Samsung Electronics has established
technical cooperation with Fujitsu for TFT-LCDs. LG (Lucky Goldstar) Electronics jointly
developed technology with Alps Electric. CPT is in technical cooperation with Mitsubishi
for TFT-LCDs. Chunghwa Picture Tubes has a partnership with Toshiba for STN-LCDs
and is searching for a partner in TFT development. In addition, IBM and Acer are working
together on TFTs, as are Toshiba and Walsin Linwa.
2.2.4 LCD materials and subassemblies
The LCD manufacturing process, particularly for TFT-LCD, is more complex in terms of
types of materials and process steps than is the CRT process. The following list has been
abbreviated to provide only the major materials, components, and subassemblies. For a
more complete listing, refer to Appendices C and D for the TFT-LCD process flow and bill
of materials, respectively.
• Front glass panel • Photoresists
• Col or filter materials • Developing solution
• Indium tin oxide • Sealer
• Back glass panel • Spacers
• Liquid crystal materials • Polarizing material
• Transistor metals • Driver ICs
• Alignment material • Backlight units
• Etchants • PWB
Almost all of the materials, components, and subassemblies for LCD monitors are made in
Asia. The exceptions are backlights and some driver integrated circuit (1C) devices, which
are produced in North America or Europe.
11
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3.0 Technology Profile
3.1 CRT Operation and Components
The cathode ray tube (CRT), whose basic components are shown in Figure 3-1, uses high
voltages to move electrons toward a display screen. The electrons are emitted from a
cathode and concentrated into a beam with focusing grids. The beam is accelerated toward
the screen, which acts as an anode, due to a conductive coating. The screen is also coated
with a luminescent material (a phosphor), typically zinc sulfide. This phosphor converts
electromagnetic radiation (the kinetic energy of the electrons) into light—a phenomenon
called phosphorescence.23 The cathode ray is essentially an electric discharge— the stream
of electrons— in a vacuum tube.
The beam passes through either horizontal and vertical deflection plates (mutually
perpendicular pairs of electrodes) or magnetic deflecting coils in the deflection yoke.
Voltage is applied to these plates (or coils) to control the position of the beam and its line-
by-line scanning across the screen.
Video signal (information to be displayed on the screen) is applied to the electrode
(cathode) and is contained in the electron beam. This video signal, which controls the
current to the electron-beam, is applied in synchronization with the deflection signals. The
result is two-dimensional information displayed on the screen.
The materials that phosphoresce are referred to as phosphors. Phosphors do not contain phosphorous.
12
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Or.d1
Del lea ion Hard vacuum
Figure 3-1: Cathode Ray Tube Fundamentals
Color images are made possible through several techniques. The most common technique
is the use of a shadow mask, widely used in consumer TVs and monitors (see Figure 3-2).
This technique requires three electron guns, which emit electrons that then pass through an
aperture—a shadow mask—before hitting the screen. Different phosphorescing colors are
obtained by adding materials to the zinc sulfide coating on the screen. The beam impacts
the screen at precise locations, striking only one of three colored regions: a red, green, or
blue area, and emits visible light. When this point source of light strikes the corresponding
dot, a shadow of the mask falls on the inside of the screen. The three beams are controlled
(deflected) by one yoke, enabling the three beams to strike the corresponding dots
simultaneously, and requiring only one focus control.
13
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DTJl.E4.11tf>
UJD BEAM
DOT
PITCH
GRKKN
PHOSPHOR
SCREEN
Figure 3-2: Shadow Mask Color CRT24
The most common alternative to the shadow-mask technique is the Trinitron, which uses an
aperture grill (rather than a shadow mask) that is composed of parallel, colored stripes,
(rather than dots). A grid positioned in front of the stripes directs the beam to the
appropriate color. Although the Trinitron design offers certain performance and warrants
investigation, the scope of this operational and manufacturing description is limited to the
shadow mask structure.
3.2 CRT Manufacturing Process25
The traditional CRT glass manufacturing process is comprised of the following main
categories of activities:
• Glass fabrication
• Faceplate (screen) preparation
• Shadow mask fabrication/assembly
• Funnel preparation
Castellano, LA.,Handbook of Display Technology, Academic Press, Inc., 1992, pg. 42,
•" Environmental Consciousness: A Strategic Competitiveness Issue for the Electronics and Computer Industry,
MCC, 1993.
14
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• Bulb joining
• Electron gun fabrication
• Final assembly
3.2.1 CRT glass fabrication
Raw materials are converted to a homogeneous melt at high temperatures and then formed
into the glass panel (see Figure 3-3). Sand is the most common ingredient and must be
chosen according to high quality, high purity, and grain-size standards. The sand and soda
ash can be sourced within the western United States, whereas limestone may come from
the coast of the Bahamas. Other raw materials such as boron (used as anhydrous borax or
boric acid) come from California or Turkey.
Dry blending mixes the raw materials, and small amounts of liquid may be added for wet
blending. The batch is then preheated to temperatures approaching that of the furnace and
charged into the furnace, where melting and other reactions (dissolution, volatilization, and
redox) take place. The next phase, fining, removes bubbles chemically and physically
from the molten glass melt. The most commonly used fining agents are sulfates, sodium or
potassium nitrates, and arsenic or antimony trioxides. The melt is then conditioned, or
homogenized, and then cooled prior to fabrication. After forming, the glass must be
prepared to withstand upcoming chemical, thermal, and physical activities and to meet high
quality standards for optical glass. These activities include some, or all, of the following:
beveling, chamfering, grinding, polishing, and annealing at 350-450 degrees Celsius. In
some cases, breakage occurs during the manufacturing process, in which case the broken
glass—cullet—can be reintroduced into the batch melt.
3.2.2 Faceplate preparation (pattern)
The CRT faceplate, also referred to as a panel or screen, is coated with a conductive
material and a luminescent material (the phosphors). The conductive coating, an aquadag,
acts as an anode, attracting the electrons emitted from the electron guns. The coating is
composed of electrically conductive carbon particles, with silicate binders suspended in
water. It is deposited by painting, sponging, spinning, or spraying, and then baked to
increase durability.
15
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Glass sand
SiO2
Soda ash
Na2CO3
Limestone
CaCO2
Feldspar
Batch mixing
Melt 1500C
Fine 1550C
Condition 1300C
Form 800-1100C
Inspect and
test product
Ship
Other
(K2O, MgO, ZnO, BaO,
PbO (fining, coloring,
oxidizing)
Crush cullet
Figure 3-3: Glass Manufacturing Process Flow26
26 Encyclopedia of Chemical Technology, 3rd Edition, vol 11, 1980, p. 847.
16
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The luminescent phosphor and contrast-enhancing materials are applied to the inside
surface of the faceplate in aqueous solutions, using spin coaters. These coatings are
patterned by photolithography, using polyvinyl alcohol (PVA) photoresists and near-ultra-
violet exposure lamps. Exposure of the photoresist material from light passing through the
apertures in the shadow mask creates a pattern of dots (or stripes) where the red, green,
and blue phosphors will be placed in subsequent steps. These phosphor materials are
powders that are applied one at a time in dichromate-sensitized PVA slurries (a thin paste
that has solids suspended in liquids).
The pattern is developed by rinsing with a solvent to wash away the unexposed resist.
Next, a coating of contrast-enhancing material (grille dag) is applied and dried. A lift-off
process digests the resist that remains between the glass and the grille material. The
digested resist lifts off the glass, carrying away unwanted grille material on top of it and
opening windows in the black grille material. In subsequent coating and photolithographic
steps, the red, green, and blue phosphors are deposited in these windows. The result is a
patterned luminescent screen with the emissive elements separated by the non-reflecting
grille material.
The grille dag and phosphor deposition processes leave a non-uniform screen surface. To
level this surface, lacquer is applied as an extrusion film, or it is sprayed onto the screen
and then dried. A layer of aluminum is then evaporated onto the screen to enhance
reflection.
3.2.3 Shadow mask fabrication and assembly to faceplate
The shadow mask foil is a thin structure made of aluminum-killed steel that is etched with
the appropriate pattern of round apertures (may also be slits or slots). It is patterned
through a series of photolithographic steps. The mask foil is coated with a casein type
resist (a food industry by-product) and exposed with ultraviolet (UV) lamps. The design is
developed and the apertures etched away with a ferric chloride solution.27
The ferric chloride etchant is reduced by the dissolving iron, producing ferrous chloride
from both the etchant and the dissolving iron. The etchant is regenerated using chlorine,
producing by-product chemicals and ferric chloride.
The etch process for monitors takes place in Europe or the Pacific-Rim countries. No United States
manufacturer has established a high volume, high-resolution shadow mask etching facility.
17
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The mask, which is flat when delivered to the CRT manufacturer, is first curved to
approximately the shape of the faceplate in a large hydraulic press. In the CRT, it is
supported on a heavy frame, which is typically manufactured by metal cutting, welding and
stamping. Springs are welded to the formed frame and the shadow mask is welded on
while the parts are held in an alignment fixture. The parts are then oven-blackened to
increase the brightness capability of the finished CRT.
3.2.4 Funnel preparation
The funnel provides the back half of the vacuum shell and electrically connects the electron
gun in the neck of the CRT and the faceplate to the anode button (a metal connector button
in the funnel provided for attachment of the power supply). The conductive coating on the
inner surface is an aquadag; similar to the type used on the screen. The major difference is
the graphite particle size and the addition of electrical conductivity modifiers. Silicate
binder concentration may be higher, and iron oxide may be added, to reduce the
conductivity.
Funnel dag is applied by sponge, flow coating, or spraying, and is then baked to evaporate
the solvent in the dag. The surface of the dry funnel that will be mated with the faceplate
(screen, panel) is coated with a frit (solder glass). This frit is a low melting temperature
glass powder made of lead oxide, zinc oxide, and boron oxide, which is mixed with
nitrocellulose binder and amyl acetate vehicle to form a paste (with the consistency of
toothpaste). It is typically formulated so that the final melting temperature is significantly
higher than the original melting temperature, thereby allowing it to be reheated in repair and
recovery processes.
3.2.5 Bulb joining
The panel and shadow mask assembly and internal magnetic shield are joined together by
clips to form a faceplate assembly. This assembly is placed on the fritted funnel in a fixture
that carries the two halves in precise alignment through a high temperature oven, where the
frit is cured (hardened). The resulting assembly is a vacuum tight bulb, ready to receive the
electron gun and to be evacuated to become a finished CRT.
18
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3.2.6 Electron gun fabrication and assembly
The electron gun is composed of a number of electrostatic field-shaping electrodes made of
300 and 400 series steels. These steels are similar to those used in other industries, but
have higher purity requirements and contain iron (Fe), nickel (Ni), and chrome (Cr). The
electron gun metals are typically annealed hydrogen fired before being assembled and
attached to insulating glass support pillars. The pillars, made of a borosilicate glass, are
heated to their softening temperature and pressed over tabs on metal electrodes. After the
pillars cool, they captivate the electrodes, making a monolithic structure. This structure is
mounted to a glass stem that will be joined to the neck portion of the bulb assembly by
melting. The glass stem is provided with electrical feed-though pins, which carry the
electrical connections from the external circuitry to the electrodes.
Hidden within the lower end of the gun are three cathodes consisting of hollow nickel
tubes, with one end closed and coated with an electron emitting material, typically a mixture
of barium, strontium, and calcium carbonates. A tungsten wire heater, coated with a layer
of insulating aluminum oxide, is placed in the center of the cathode tube.
Additional ribbon conductors are welded between the upper electrodes and the remaining
pins in the stem. Finally, the upper cup of the gun, steel centering springs, and a vacuum
getter ring on a long wand are welded on. Additional parts are added at this stage, such as
anti-arcing wires, magnet pole pieces, or magnetic shunts, depending upon the design.
This finished electron gun assembly is ready for sealing to the bulb.
3.2.7 Final assembly
The frit-sealed bulb assembly and the electron gun assembly are joined by fusing the stem
and neck tubing together in a gun-seal machine that melts the two glasses together. During
this fusing operation, the two pieces are fixtured into precise alignment. Typically, the
neck is slightly longer than necessary and the excess glass is "cut off by the sealing fires,
falls into a reclaim container, and is returned directly to a glass company to be remelted and
reformed into a new neck.
19
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Figure 3-4: CRT Manufacturing Process
20
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After joining, the entire CRT is attached to a vacuum exhaust machine that carries the
assembly through a high-temperature oven while exhausting the air from inside the CRT.
The combination of high temperature while pumping the air out of the CRT produces a high
vacuum inside. After cooling, the vacuum getter is vaporized and the evaporated metal
(barium, zinc) coats the inside surface of the CRT. This film absorbs the residual gases
inside the envelope and reduces the gas pressure inside the CRT to its final operating
pressure.
The electron emissive cathode material, which was initially sprayed on the nickel cathode
cap as a carbonate, is first converted to an oxide by electrically heating the cathode to high
temperature. The surface metal oxides are then reduced to a monolayer of metal by emitting
an electrical current from the cathode while it is at high temperature. The resulting surface
emits large quantities of electrons that can be controlled by voltages applied to the
electrodes of the gun.
The final CRT manufacturing stage is electrical test and visual inspection. Having passed
these tests, the CRT faceplate is fitted with a steel implosion band for safety. The band
compresses the CRT, thereby increasing the strength of the glass, making the tube more
resistant to implosion. A flow-chart description of the CRT manufacturing process is
shown in Figure 3-4.28
3.3 Active-Matrix LCDs
3.3.1 Thin-film transistor (TFT) structures
Computer displays need very fast response speed, high contrast, and high brightness to
handle the information content and graphic demands. One way to achieve this speed is by
having a switch at each pixel, which is the basis for active-matrix addressing. This switch
can be a transistor or a diode (Appendix A). This profile will cover only the transistor
structure, which basically consists of a gate, source and drain, and channel. Electrons flow
through the channel between the source and drain when voltage is applied to the gate.
There is an insulating layer between the gate and the source/drain region, referred to as a
dielectric.
Socolof, M.L., et al., Environmental Life-Cycle Assessment of Desktop Computer Displays: Goal Definition
and Scoping, (Draft Final), University of Tennessee Center for Clean Products and Clean Technologies,
July 24, 1998.
21
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The transistors are patterned on the rear panel of the display, on a base of amorphous
silicon (a-Si) or polysilicon (poly-Si). Currently, most flat panel displays (FPDs) use a-Si,
although poly-Si does offer some performance advantages in smaller displays. These
advantages have not overcome the fact that the technique for depositing thin-film a-Si is
very well understood and established. Therefore, most TFT-LCDs are currently based on
a-Si, which is the subject of this profile.
TFT a-Si devices are typically characterized as staggered, which refers to the fact that the
pixel electrodes are on opposite panels (one on the front and one on the rear). More
recently, a new design has emerged in the marketplace, called in-plane switching (IPS).
This profile will cover the manufacturing processes for the bottom-gate etch stop (E/S)—a
staggered structure—and the in-plane switching (ISP) design. Most TFT-LCD monitors
are based on the E/S transistor structure, although NEC and Hitachi have released monitors
using IPS.
3.3.2 Twisted-nematic TFT-LCD operation
Whereas the E/S or IPS designation relates to the addressing mechanism for each pixel, the
principle behind light transmission of the display is related to characteristics of the liquid
crystal (LC). This profile covers the operation of twisted nematic (TN) technology, which
is used in most computer monitors.
All LCDs work on the same principle: information on the screen is displayed via an array
of pixels, controlled by voltage and the orientation of the LC molecules. LC materials are
organic compounds that align themselves in the direction of an electric field and have the
properties of both solid crystals and viscous liquids. There are almost 400 different types
of LC compounds in use for displays. Generally, they are polycyclic aromatic
hydrocarbons, or halogenated aromatic hydrocarbons.
The following section describes one way in which light is transmitted or blocked from
transmission in a TN-LCD. Figure 3-5 illustrates this process.
Light, which in a TFT-LCD originates from the backlight source or unit, passes through a
polarizer before striking the rear panel. This polarizer blocks the transmission of all but a
single plane of lightwave vibration. This polarization orientation is parallel to the
orientation of the LC molecules and perpendicular to the polarizer plane on the opposite
22
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panel. The orientation of the LC is determined by the rubbing direction of the polyimide
alignment layers, to which the closest molecules appear to be anchored. The layer on one
panel is rubbed at 90 degrees to the other, thereby causing the LC molecular chain to twist
90 degrees between the two panels.
With no voltage applied, the twisted LC structure is fixed. Therefore, light entering from
the rear and travelling through the LC cells follows the twist and arrives at the front panel in
a plane parallel with this polarizer. As a result, the light is transmitted. When voltage is
applied, an electric field is set up between electrodes, one on each of the two panels. The
LC molecules align themselves in the direction of the electric field, thereby destroying the
twist. The light travels through the cells, arriving at the front panel in a plane perpendicular
to the rear polarizer, and is blocked. The field strength will determine how much of the
light is blocked, thereby creating a grayscale.
NCHttMT
Figure 3-5: TN Field-Effect LCD Operating Principles
29
Castellano, J.A., Handbook of Display Technology, Academic Press, 1992.
23
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Addressing occurs when the pixels are manipulated with voltage to turn off and on,
creating an image on the display screen. The active-matrix LCD uses direct addressing,
which requires a switch (the TFT) and a capacitor at each pixel. The TFT is controlled by
electrodes, which are the gate and source/drain regions on the transistor. The pixel is
addressed by controlling current to the TFT, allowing the transistor to turn on and off.
When voltage is applied, there is a short delay while LC molecules align themselves,
resulting in a slightly opaque pixel. Also, the capacitor holds the charge for a short period
of time after the voltage is removed and the molecules must reorient themselves to their
original, 90-degree twist. These delays allow the display to scan the pixels and activate the
appropriate ones for the desired image.
The above description is for a black and white display—black, when light is blocked, and
white when all wavelengths of incident light is transmitted. Full color results when each
pixel is divided into three subpixels— red, green, and blue (RGB). Color filters, which
absorb all but a range of wavelengths of the incident light, are used to create the subpixel
color. By combining the subpixels, a wide range of color is possible.
3.4 TFT-LCD Manufacturing
The following sections discuss TFT-LCD manufacturing and display assembly processes.
This section is designed to provide an overview of these processes only. For available
details on equipment and materials used, refer to the TFT-LCD process flow in Appendix
D.
3.4.1 Glass fabrication
Molten glass is prepared into flat substrates by the float or fusion draw process. The
distinguishing difference between the technologies is the chemical type of the glass required
and the degree of flatness. Soda lime glass is acceptable for some LCDs, and borosilicate
for others. Whatever the glass material, strict controls are necessary during the glass
fabrication process in order to obtain optical quality glass with satisfactory mechanical
properties.
The float method of forming glass uses a flat surface, a bed, onto which molten glass (the
melt) flows. The glass floats on the source of the bed, made of molten tin, becoming flat
(sides are parallel) and smooth. In the glass fusion process, the homogeneous melt is
24
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drawn downward into a uniform sheet of glass. The speed of the drawing process
determines the glass sheet thickness.
After fabrication, the glass sheets are trimmed to the desired size and prepared to withstand
upcoming chemical, thermal, and physical activities and to meet high quality standards of
optical glass. These activities include some, and perhaps all, of the following: beveling,
chamfering, grinding, polishing, and annealing at 350-450 degrees Celsius.
3.4.2 Front panel patterning
Prior to patterning the front panel, the substrate must be clean. The glass is cleaned with
physical, chemical, or dry techniques. The list of cleaning methods covers all types that
may occur in the LCD panel process. Not all of these cleans occur immediately after the
glass manufacturing stage.
Physical cleaning encompasses brush scrubbing, jet spray, ultrasonic, and megasonic
methods. The chemical means include cleaning with organic solvents, a neutral detergent,
process-specifics cleans according to manufacturing step (etching, stripping, etc.), and
pure water cleans following chemical treatment. Dry cleaning processes use ultraviolet
ozone, plasma oxide (to clean photoresist residue), non-oxide plasma, and laser energy
(limited to localized needs rather than full-surface cleans). Because organic contamination
and particulates are significant factors in reduced manufacturing yield, all three methods
play important roles at different stages in the process.
3.4.2.1 Deposit ITO
Before creating the necessary layers on the front panel, the glass is physically cleaned,
typically using the ultrasonic method. Next, the transparent electrode material, indium tin
oxide (ITO), is sputtered onto the substrate. This creates the front panel (common)
electrode.
3.4.2.2 Pattern color filter
Next, the black matrix is deposited and patterned, which creates a border around the color
filter for contrast. Currently, most TFT-LCDs use a sputtered (physical vapor deposition,
or PVD) chrome as the black matrix material, although the trend may be headed toward the
use of black resin. The color filters are patterned onto the substrate in succession (RGB),
either by spin coating the filter material or by electrodeposition. In each case, the pattern is
25
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transferred via the photolithographic process described in Table 3-1. Spin coating is more
common than electrodeposition, and the same alternatives to the spin coater mentioned
above may be adopted. If a black resin is used for the matrix, it will be applied after the
color filter formation, rather than before, as is the case with chrome matrix. The color filter
process results in a non-uniform substrate, thereby requiring a planarization step before
moving on to the alignment layer creation. The surface is planarized with a layer of
polyimide.
3.4.2.3 Deposit alignment layer
The last material to be added to the front panel is the alignment layer, a polyimide that is
applied by roll coating and then rubbed to the desired molecular orientation.
3.4.2.4 Inspect and test
The substrate is finally inspected for visual defects and tested.
3.4.3 Rear Panel Patterning
3.4.3.1 Clean and inspect
The rear glass substrate must be cleaned and inspected prior to the detailed and costly
patterning processes. Typically, as with the front glass panel, this is accomplished with an
ultrasonic water clean.
26
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Coat
Photoresist, a photo-sensitive polyimide resin, is deposited on the substrate,
typically using a spin coater. The spin coater dispenses the photoresist into the
center of the substrate that is rotating. The centrifugal force resulting from the
rotation causes the resist to spread across the substrate toward the edge. This
method wastes approximately 90-95 percent of the photoresist material, as most is
spun off of the substrate. Several alternative coating techniques have been, or are
being, developed.
Prebake
After the photoresist is patterned, the substrate is baked to reduce the moisture
content in the photoresist.
Expose
After prebaking, the substrate is ready to be patterned. This is accomplished by
placing a mask with the desired pattern on top of the substrate and exposing the
photoresist to light of a specific wavelength.
Develop
Depending on the type of photoresist used, specific areas (either those exposed, or
those masked) are removed with a developing solution, leaving behind a pattern.
Clean
After developing the pattern, the substrate is cleaned in water to remove chemical
residue and then dried.
Bake
The photoresist may be baked once again in order to remove moisture and harden
the resist before the upcoming etch step.
Etch
The substrate is now etched to remove the material that was deposited onto the
entire substrate and patterned. In this case, the black matrix material (chrome) not
covered by photoresist is etched away, leaving a distinct, desired pattern.
Depending on the materials to be removed and the linewidth requirements, a wet or
dry etch is used. Wet etch involves a solvent immersion or spraying followed by a
water clean. Dry etch is a plasma-based reactive ion etch.
Strip/Clean/Inspect
The photoresist is then completely removed from the substrate and cleaned (with
water), dried, and inspected. The stripping solution is a solvent, typically either N-
methyl pyrrolidinone (NMP) or trimethylamine hydrochloride (TMAH), depending
on the type of photoresist.
The patterning process is similar for all standard photolithograhic patterning in
semiconductor and LCD manufacturing. The etchants and etching equipment used,
however, will vary depending on the material being patterned. A plasma etch may
be used for final resist cleaning.
Table 3-1: Standard Photolithographic Patterning Process
27
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3.4.3.2 Pattern TFTs
The rear panel is where the transistors are created, which requires many more steps than the
front panel. The transistors are made up of the regions illustrated in Figure 3-6 and
discussed below. Each region requires the full photolithographic patterning process.
Detailed process flow spreadsheets are provided in Appendix D.
Gate
The gate metal, typically aluminum, is sputtered onto the substrate and patterned. The
aluminum may be dry or wet etched.
Gate dielectric/channel/etch stop
The gate SiNx (or SiOx) dielectric, a-Si channel, and SiNx etch stop layer are deposited in
succession in a chemical vapor deposition tool. The a-Si is patterned and dry etched.
Pol^mldt
Alignment
raxxivatinn
C«nl«Ct*
Cat*
Insulator
SemkanductfH
Thin-film
Figure 3-6: Etch/Stop Structure TFT
TFT island
A doped a-Si layer is deposited using CVD, patterned, and dry etched.
Pixel electrode
The pixel electrode is formed by sputtering ITO. The ITO layer is annealed (to reduce film
stress) and patterned, using either wet or dry etch.
28
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Contact hole and source/drain metal
A contact between the doped (n+) a-Si layer and the source/drain metals (deposited in the
next step) is formed by patterning a hole and etching to expose the n+a-Si. Next, the
source/drain metal is sputtered (metal type) and patterned, using either wet or dry etch.
3.4.3.3 Deposit passivation layer/test/inspect
The surface must receive a passivation layer of SiNx for protection, after which the device
is inspected and electrically tested.
3.4.3.4 Deposit alignment layer
The substrate is cleaned prior to rubbing to ensure a paniculate and contaminant-free
surface. Contamination is detrimental to the success of the rubbing process. The thin
polymer alignment layer is deposited onto the glass surface by spin coating or printing, and
then baked to remove moisture. It is then "rubbed" with fabric in the direction desired for
LC orientation. The very fine grooves resulting in the layer help the LC molecules align
properly. The rubbing mechanism is typically a cloth on a belt that is attached to a roller,
which moves across the substrate, rubbing as it advances. The substrate is then cleaned
before moving to the next step.
3.4.4 Front Panel Patterning-IPS
The fabrication of the front panel for the IPS mode display is the same as that described
above with one exception: no ITO electrode is formed on the front panel.
3.4.5 Rear Panel Patterning-IPS
The structure described in the following section is a top-gate IPS TFT. The manufacturing
advantage is the reduction in the number of mask (patterning) layers from six or seven to
potentially four. In the IPS mode, the electrodes are on the same panel. Therefore, the
electric field is set up between the pixel and the common (counter) electrodes on the rear
panel (see Figure 3-7), rather than between the front and rear of the display (as is the case
in the typical TN structure). The LC used in this mode aligns itself horizontally, unlike the
vertical alignment of the TN.
Light shield metal
Figure 3-7 illustrates an IPS-mode TFT with a bottom-gate structure. Some IPS designs
create the gate at the top of the transistor. In this case, there is a risk of exposing the a-Si
29
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layer to backlight energy. This exposure could generate leakage (unwanted) current.
Therefore, a layer of chrome is sputtered to act as a light shield. The light shield is
patterned and either wet or dry etched.
Dielectric
A passivation layer of SiOx may be deposited through a CVD process. It may be
eliminated, as channel protection can be provided by the SiNx layer deposited as part of the
island formation.
Source/drain metal
The source/drain metal is sputtered, patterned, and wet etched. This metal can be
aluminum (Al)-based, titanium (Ti), molybdenum (Mo), chrome (Cr), tungsten (W),
molybdenum/tantalum (Mo/Ta), or Mo/W. The etch process is typically dry (see process
flow in Appendix D for etchant chemistry).
Analyzer
Black Matrix
Color Filter
Liquid Crystal Molecules
PolyirrJde
Alignment
Layer
Semiconductor
Thin-Film
Passivation (SiNx)
Drain
Gate
Pixel
Electrode
(Source)
Metal Counter
Electrode
Polarizer
Figure 3-7: Hitachi IPS TFT
30
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Island
The TFT island is created similarly to that for the E/S structure. A single-chamber CVD
process is used to deposit a doped (n+) a-Si, a-Si, SiNx combination. The a-Si layer is
patterned and dry etched.
Gate, pixel, common electrode
The gate, pixel, and common electrodes are all formed on the rear panel substrate
simultaneously, and then patterned in a single mask step. The metal is commonly wet
etched.
As with the traditional TN-based rear panel process, following the TFT formation the
substrate is coated with an alignment layer and rubbed.
3.4.6 Display cell and final module assembly
At this stage of the process, the color filter substrate (top glass) and TFT substrate (rear
glass) are joined with seal material, and liquid crystal (LC) material is injected into the small
space in between. Polarizing films are added to the outside of each substrate and the driver
electronic PWBs are attached. Finally, the backlight unit is added to complete the display
module, the remainder of the electronics is attached, and the entire unit is tested.
3.4.6.1 Seal panels
At this point, the color filter substrate and TFT substrate are ready to be assembled. First,
an adhesive seal material is applied, usually by either silkscreening or screen printing. A
hole is left in the seal for later LC material injection. After the adhesive is applied, it is
cured in order to outgas solvents in the material and achieve partial cross-linking of the
polymer. This makes the material less tacky (B-stage material), which allows the plates to
touch during alignment.
Before sealing the two substrates (accomplished by lamination), spacers are deposited on
one of the substrates to maintain a precise cell gap (between 5-10 micrometers) between the
two surfaces. These spacers are either glass or plastic. The substrates are then aligned and
laminated by heat and pressure to complete the cross-linking of the polymer.
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3.4.6.2 Inject LC
The LC material is injected into the gap produced by the spacer. The hole that was left
open for this injection is sealed with the same type of resin and cured.
3.4.6.3 Attach polarizers
The last step in the display cell assembly is the polarizer attachment. The polarizers are
typically in rolls or precut sheets, and are applied to the outside of each glass panel with the
help of an adhesive layer that is already on one side of the polarizer. The module is cleaned
before moving on to inspection and test.
3.4.6.4 Inspect and test
The display module is inspected and functionally tested. The most common display
failures can be traced back to particulates and problems with the cell gap.
3.4.7 Module Assembly
3.4.7.1 Attach backlights
The light source for the TFT-LCD is a backlight unit, which is usually a cold cathode
fluorescent tube (CCFT). A typical desktop unit has four backlights, which are placed
around the edges of the display. A light pipe projects the light across a diffuser screen to
provide uniform illumination. If the IPS TFT structure is used, eight backlights are
required.
3.4. 7.2 Attach electronics
After the cell is inspected and the printed wiring boards (PWBs) are cleaned, the electronics
are attached to complete the display module.
Driver chips are attached either on the glass substrate (chip-on-glass, or COG) or near it
with tape automated bonding (TAB) on flex circuit (chip-on-film, or COF). Alternatively,
the chips may be mounted on PWBs (chip-on-board, COB). The use of TAB bonding for
COF device attach is most common. The controller PWB is attached as are other passive
components and packaging hardware.
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3.4. 7.3 Final test and ship
Once all interconnects are attached, the unit goes through a final electrical test and is
shipped.
33
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Appendix A
Flat Panel Display Technologies30
Technology
Description
Applicability to DfE Project
Liquid Crystal
Displays (LCD)
A liquid crystal material, acting like a
shutter, blocks, dims, or passes light
unobstructed, depending on the
magnitude of the electric field across
the material.31 A backlight provides
the light source.
Included in the DfE Computer Display
Project life-cycle study. Descriptions
of the subtechnologies and whether or
not they are included in the study are
presented below.
(1) Passive matrix
(PMLCD)
Liquid crystal (LC) material is
sandwiched between two glass plates,
which contain parallel sets of
transparent electrical lines (electrodes)
in a row and column configuration to
form a matrix. Every intersection
forms a pixel, and the voltage across
the pixel causes the LC molecules to
align and determines the shade of that
pixel.32
Traditionally for low-end applications
(e.g., calculators, wrist watches).
Higher end applications use a super-
twisted nematic (STN)33 construction.
The liquid crystal material is twisted
between 180 and 270 degrees, which
improves the contrast between the "on"
and "off' states, resulting in a clearer
display than with the twisted nematic
(twisted only 90 degrees.34 However,
cost and performance issues limit this
technology from wide application in
the desktop market, therefore, it will
not be evaluated in the study.
(2) Active matrix
(AMLCD)
Similar to the PMLCD, except an
electronic switch at every pixel
provides faster switching and more
shades. The addressing mechanism
eliminates the viewing angle and
brightness problems suffered by
PMLCD. Requires more backlight
than PMLCD due to the additional
switching devices on the glass (at each
pixel). Various switching types are
listed below:
Provides vivid color graphics in
portable computer and television
screens.35 This technology meets the
functional unit specifications in this
study. Specific subcategories are
described below.
30 Socolof, M.L., et al., Environmental Life-Cycle Assessment of Desktop Computer Displays: Goal Definition and Scoping, (Draft
Final), University of Tennessee Center for Clean Products and Clean Technologies, July 24, 1998.
3! Office of Technology Assessment, Flat Panel Displays in Perceptive, OTA-ITC-631, Washington, DC: U. S.
Government Printing Office, September, 1995.
32 Ibid.
33 Traditional light modulating methods for LCD technologies include twisted nematic (TN), super-twisted nematic (STN), double
STN, triple STN, and film-compensated STN. The STN is the current standard for high-end PMLCD applications.
34 Office of Technology Assessment, Flat Panel Displays in Perceptive, OTA-ITC-631, Washington, DC: U. S.
Government Printing Office, September, 1995.
35 Ibid.
34
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Technology
Description
Applicability to DfE Project
AMLCD Switch Types:
(2a) Thin-film transistor (TFT):
The transistor acts as a valve allowing
current to flow to the pixel when a
signal is applied. The transistors are
made of various materials including:
amorphous silicon (a: Si),
polycrystalline silicon (p:Si), non-
Si[CdSe].36 Two different TFT light
modulating modes are twisted nematic
(TN) and in-plane switching (IPS).37
In comparison to the TN mode, the IPS
mode requires more backlight but fewer
manufacturing steps.
The current standard AMLCD
switching mechanism for computer
displays is a: Si TFT. Polycrystalline
Si is not suitable for larger than about
5" displays. Both the TN and IPS a: Si
TFT AMLCD technologies are
analyzed in the DfE project.
(2b) Diode matrix:
The diode acts as a check valve. When
closed, it allows current to flow to the
pixel charging it. When opened, the
pixel is disconnected and the charge is
maintained until the next frame.38
The diodes are found to short easily and
must be connected in series to achieve
long life usability. The diode displays
are also limited in size to smaller than
that of the functional unit defined for
the DfE study.
(2c) Metal-insulator metal (MIM):
The MIM is a diode type switch using
metal-insulated-metal fabrication
techniques.39
Temperature sensitive, which creates
gray scale nonuniformities. They are
also size-limited, like other diode type
displays and therefore not included in
the study.
(3) Active-addressed
LCD
Hybrid of passive and active matrix.
The pixels are addressed using signals
sent to the column and row as
determined using an algorithm encoded
into an integrated circuit (1C). The 1C
drives each row of pixels more or less
continuously and drives multiple rows
at one time.4
. 40
Employed in notebook and desktop
monitors > 12.1". However, they need
special drivers41 have slow response
times, and their contrast worsens as
panel size increases. Therefore, this
technology does not meet the
specifications of the functional unit and
is excluded from evaluation in the DfE
study.
(4) Plasma-addressed
liquid crystal (PALC)
The pixel is addressed using row
electrodes, which send the signal, and
column gas channels, which conduct a
current when ionized.42
PALC displays are in development to
be used as large low cost displays.
Production of the displays have not yet
occurred and they are not included in the
study.
36 Castellano, J., Handbook of Display Technology, Stanford Resources, Inc., San Jose, CA., 1992.
DsiplaySearch FPD Equipment and Materials Analysis and Forecast, Austin, TX, 1998.
38 Castellano, J., Handbook of Display Technology, Stanford Resources, Inc., San Jose, CA., 1992.
39 Office of Technology Assessment, Flat Panel Displays in Perceptive, OTA-ITC-631, Washington, DC: U. S.
Government Printing Office, September, 1995.
40 Ibid.
41 Ibid.
42 Ibid.
35
-------
Technology
Description
Applicability to DfE Project
(5) Ferroelectric
LCDs (FLCD or
FELCD)
The pixel is addressed using positive or
negatives pulses to orient the crystals.
The positive pulse allows light to pass
(light state) and the negative pulse
causes the blockage of light (dark
state).43 A ferroelectric liquid crystal is
bistable and holds its polarization when
an electric field is applied and
removed.44 They are also called surface
stabilized ferroelectric (SSF) LCDs.
Has high resolution with very good
brightness, but limited color palette.45
Limited color palette does not meet
color specification of functional unit.
Plasma Display
Panels (PDF)
An inert gas (e.g., He, Ne, Ar) trapped
between the glass plates emits light
when an electric current is passed
through the matrix of lines on the
glass. Glow discharge occurs when
ionized gas undergoes recombination.
lonization of atoms occurs (electrons
are removed), then electrons are
recombined to release energy in the
form of light. Full color plasma
displays use phosphors that glow when
illuminated by the gas.46
Established technology. Good for large
screens (e.g., wall-mounted
televisions), but are heavier and require
more power than LCDs.47 Designed
for large screens and are larger displays
than specified for desktop applications.
Therefore, not included in the study.
Electrolumines-
cent Displays
(EL)
A phosphor film between glass plates
emits light when an electric field is
created across the film.48 EL uses a
polycrystalline phosphor (similar to
LED technology, which is also an
electroluminescent emitter, but uses a
single crystal semi-conductor). ELs are
doped (as a semiconductor) with
specific impurities to provide energy
states that lie slightly below those of
mobile electrons and slightly above
those of electrons bound to atoms.
Impurity states are used to provide
initial and final states in emitting
transitions.49 Also referred to as thin-
film EL (TFEL). Variations: AC thin-
film EL (AC-TFEL), active matrix EL
(AMEL), DC EL, organic EL.
Lightweight and durable. Used in
emergency rooms, on factory floors,
and in commercial transportation
vehicles.50 Problems found in the
power consumption and controlling of
gray levels. Targeted toward military,
medical, and high-end commercial
products; therefore not included in the
scope of the DfE project.
43 Castellano, J., Handbook of Display Technology, Stanford Resources, Inc., San Jose, CA., 1992.
44 Peddie, Jon, High Resolution Graphics Design Systems, McGraw Hill, New York, NY, 1994.
45 Ibid.
46 Office of Technology Assessment, Flat Panel Displays in Perceptive, OTA-ITC-631, Washington, DC: U. S.
Government Printing Office, September, 1995.
47 Ibid.
48 Ibid.
49 Peddie, Jon, High Resolution Graphics Design Systems, McGraw Hill, New York, NY, 1994.
50 Office of Technology Assessment, Flat Panel Displays in Perceptive, OTA-ITC-631, Washington, DC: U. S.
Government Printing Office, September, 1995.
36
-------
Technology
Description
Applicability to DfE Project
Field Emission
Displays (FED)
Flat CRT with hundreds of cathodes
(emitters) per pixel (form of
cathodeluminescent display); eliminates
single scanning electron beam of the
CRT. Uses a flat cold (i.e., room
temperature) cathode to emit electrons.
Electrons are emitted from one side of
the display and energize colored
phosphors on the other side.51
Not commercially available, but
anticipated to fill many display
needs.52 Could potentially apply in all
LCD and CRT applications. High
image quality as with CRT, but less
bulky and less power use than with
CRT. A number of roadblocks to this
technology taking over the AMLCD
market include proven manufacturing
processes (problems found in the
reliability and reproducibility of the
devices), efficient low-voltage
phosphors, and high voltage drivers.
The technology is targeted toward
military, medical and high-end
commercial products and not included
in the DfE study.
Vacuum
Fluorescent
Displays (VFD)
Form of cathodeluminescent display
that employs a flat vacuum tube, a
filament wire, a control grid structure,
and a phosphor-coated anode. Can
operate at low voltages, because very
thin layers of highly efficient
phosphors are coated directly onto each
transparent anode.53
VFDs offer high brightness, wide
viewing angle, multi-color capability,
and mechanical reliability. Used in low
information content applications (e.g.,
VCRs, microwaves, audio equipment,
automobile instrument panels). No
significant uses seen for computer
displays.54
Digital
Micromirror
Devices (DMD)
Miniature array of tiny mirrors built on
a semiconductor chip. The DMD is
used in a projector that shines light on
the mirror array. Depending on the
position of a given mirror, that pixel in
the display reflects light either onto a
lens that projects it onto a screen
(resulting in a light pixel) or away
from the lens (resulting in a dark
pixel).55
Just beginning to be used mainly as
projection devices, and has not been
developed for use that would match the
functional unit of the DfE study.56
51 Office of Technology Assessment, Flat Panel Displays in Perceptive, OTA-ITC-631, Washington, DC: U.S.
Government Printing Office, September, 1995.
52 Ibid.
53 Peddie, Jon, High Resolution Graphics Design Systems, McGraw Hill, New York, NY, 1994.
54 Ibid
55 Office of Technology Assessment, Flat Panel Displays in Perceptive, OTA-ITC-631, Washington, DC: U.S.
Government Printing Office, September, 1995.
56 Ibid.
37
-------
Technology
Description
Applicability to DfE Project
Light Emitting
Diodes (LED)
The LED device is essentially a
semiconductor diode, emitting light
when a forward bias voltage is applied
to a p-n junction. The light intensity
is proportional to the bias current and
the color dependent on the material
used. The p-n junction is formed in a
III-V group material, such as
aluminum, gallium, indium,
phosphorous, antimony, or arsenic.
For low information display
applications, which makes it not
capable of meeting the requirements of
the functional unit of the study. Color,
power, and cost limitations prevent the
emergence into the high information
display market.57
Elect rochromic
Display
Open-circuit memory using liquid
electrolytes.58 Non-emitter (as LCDs),
as opposed to emitters (e.g., EL, FED,
PDF).
Outstanding contrast and normal and
wide viewing angles, open-circuit
memory. Complex and costly,
involving liquid electrolytes, poor
resolution, poor cycle life, lack of
multicolor capability, etc. Not suitable
for computer displays in past; however,
new technology may be promising.59
Light Emitting
Polymers
Developing technology (Holton
1997).60
Developing technology.
57 Castellano, J., Handbook of Display Technology, Stanford Resources, Inc., San Jose, CA., 1992.
58 Peddie, Jon, High Resolution Graphics Design Systems, McGraw Hill, New York, NY, 1994.
59 Ibid.
60 Holton, W.C., "Light-emitting polymers: increasing promise," Solid State Technology, vol. 40, no.. 5, p.
163, May 1997.
38
-------
Appendix B
CRT Manufacture
Process step
Fabricate glass
Mix batch
Melt
Fine
Condition
Form panel
Anneal
Finish
Clean
Cut
Grind and polish
Inspect
Test
Pattern panel glass
Clean
Bitch"
Apply (contrast) grille material
Dry aquadag
Apply green phosphor slurry
Dry phosphor
Expose green phosphor
Develop
Dry
Apply blue phosphor slurry
Expose blue phosphor
Develop
Dry
Apply red phosphor slurry
Expose red phosphor
Develop
Dry
Apply lacquer leveling film
Apply reflective layer
Equipment
spin coat
spin coat
IR lamp
near-UV lamps
spin coat
near-UV lamps
spin coat
near-UV lamps
spin coat or spray
evaporate
Process
Material/Chemical
acid
aquadag (polyvinyl alcohol}
slurry mixture: water,
wetting agents, polyvinyl
alcohol
water
ZnS'Ag
water
Y-,O;,S:Cu
water
polymer
aluminum
Notes
1
1000
angstroms
39
-------
Process step
Prepare funnel
Coat inside of funnel (dag)
Dry coating
Apply frit
Harden
Manufacture shadow mask
Etch hole pattern
Clean
Anneal
Draw to face plate contour
Blacken mask and side pieces
Weld side pieces
Anneal magnetic shield
Blacken shield
Manufacture electron gun
Hydrogen fire metals
Fixture metal parts
Heat glass pillars
Press pillars over tabs on
electrode
Mount to glass stem
Join stem to neck
insert cathodes into support
pins
Insert heater
Manufacture electron gun
Weld assembly to support pins
Weld ribbon conductors
Weld centering springs, getter
Add additional parts
Assemble mask to panel
Coat shadow mask back side
Curve shadow mask
Weld springs (brackets) to
frame
Weld mask
Position shield on brackets
Equipment
sponge, flow
coat, or spray
evap oven
evap oven
oven
oven
melt
hydraulic press
Process
Material/Chemical
aquadag
Pb glass frit (P'bO, ZnO,
BO), nitrocelluose binder,
amyl acetate
remove amyl acetate
rolled iron or Invar metal
etchant: ferric chloride
solution
water
aluminum-killed steel
bismuth oxide
Notes
2
3
4
5
40
-------
Process step
Join bulb and gun
Attach panel to funnel
Cure frit
Seal gun to bulb
Exhaust/finish assembly
Cut excess neck glass
Evacuate
Heat tube
Notes:
Equipment
clips
vacuum exhaust
Process 1 Notes
Material/Chemical }
total layer
<.002 inch
> 440 °C
fuse base ito
funnel neck
6
350 °C
(1) Electrically conductive carbon materials (graphite) w/silicate binders in water suspension.
(2) Aquadag with addition of electrical conductivity modifiers, higher concentration of silicate
binder, and possibly iron.
(3) 300/400 series steels (contain Fe, Ni, Cr); borosilicate glass insulation; Ni cathode; mix.
of Ba, Sr, Ca carbonates emitter material; W wire heater coated with Al oxide.
(4) Glass pillars heated to softening temperatures.
(5) Arcing wires, magnet pole pieces, magnetic shunts.
(6) Excess neck glass is reused by glass companies.
41
-------
Appendix C
NEC CRT: Detailed Bill of Materials
NEC JC-1549VNA
Sub No.
Entry No.
Name
Qty. 1 Material 1 Weight
1 1 (grams)
Total
(grams)
Bill of Materials for: NEC JC-1549VNA
1.1
1.2
1-S
.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
1.13
1.14
1.15
1.16
1.17
1.18
1.19
1.20
1.21
1.22
1.23
1.24
chassis
right hand shield
left hand shield
top shield
insulator pad
back shield
shield brackets
screws
swivel base large
rubber feet
brackets
swivel base small
base shield
base bracket
shadow mask
anode connection
anode cap
anode cap insert
flass
racket 1
bracket 2
bracket 4
xy control 1
xy control 2
Bill of Materials for: Neck assembly
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
2.14
base neck
top neck
neck ring large 1
neck ring small 1
neck ring small 2
meek ring large 2
ferrite magnet
Cu attached to magnet
Cu attached to neck
extraneous copper
insulating rings
brass ring
rubber gaskets
screw with washers
1 IPS
1 1 steel
1 I steel
1 1 steel
1 j polyester
1 1 steel
4 jbrass
46 izinc plated steel
1 IPS
4 Isilicone rubber
4 jbrass
1 IPS
1 j steel
2 IPS
1 1 steel
1 1 steel
1 j rubber
1 1 steel
1 j glass
1 1 steel
1 1 steel
1 1 steel
1 JPC
1 IPC
1 IPS
1 IPS
1 IPS
1 IPS
1 IPS
1 IP'S
i i
1 1 copper
1 i copper
1 1 copper
4 Ipolysulphone
1 1 brass
2 1 rubber
4 Izinc plated steel
1624.9
499.2
417.4
64.5
27.2
190.5
4
1.6
272.2
6.5
1
169.9
1079.5
46.4
626
3.3
16.4
3.6
5511.1
46.4
90.7
246.7
9.4
6.2
66.9
15. 9
15
4.5
4
14.5
295.6
134.5
108.9
6.4
4.1
2.1
6
2.9
1624.9
499.2
417.4
64.5
27.2
190.5
16
73.6
272.2
2
4
169.9
1079.5
92.8
626
3.3
16.4
3.6
5511.1
46.4
90.7
246.7
9.4
6.2
66.9
i'5.9
15
4.5
4
14.5
295.6
134.5
108.9
6.4
16.4
2.1
12
11.6
42
-------
Sub No.
Entry No.
Name
2.15 i neck clamp
2.16 1 brackets
Bill of Materials for: Gun
3.1 {gun
3.2 {'brackets
3.3 i attachment to glass
3.4 1 attachment to b oard 1
3.5 j attachment to b oard 2
3.6
3.7
connectors
screws
3.8 j shield
3.9 JPWB board 194 mm x 122
jmm
3.9a 1 heat sink
3.9b
3.9c
SOP
resistors
3.9d j capacitors
3.9e
3.9f
transistors
resistors
3.9g I variable resistors
3.9h j jumpers
3.9i
connector 12 pin
3 . 9j j connector 6 pin
3 . 9k" j connector 2 pin
Bill of Materials for: Power board
4. 1 jflyback transformer
4.1a
wire
4 . 1 b j connector 2 pin
4.1c
4.1d
wire
wire
4.1e I magnet
4. If j steel pin
4.1g Irubber cap
4.1h
misc. potting material
4.1i jcopper wire
4.2 JPWB additional 194mm x
J95 mm
4.2a {capacitors
4.2b
4.2c
4.2d
SOP
transistors
resistors
4.2e {jumpers
4.2f
4.2g
wire
connectors 5 pin
4.3 JPWB (x controller)
4.3a j'PWB
Qty. 1 Material 1 Weight
1 1 (grams)
1 j steel
4 {brass
1 j steel
2 {PC
1 jplastic
1 {polycarbonate
1 {polycarbonate
2 {aluminum
4 jzinc plated steel
1 j steel
1 14 layer
4 {aluminum
1 :
117 I
60 |
27 t
4 J7W
9 {
7 j
1 {
1 |
2 j
i i
1 {446 mm
1 i
2 {172mm
1 {194 mm
1 jferrite magnet
1 j steel
1 {rubber
1 j silicone
1 jcopper
1 14 layer
47 t
9 j
12 I
149 |
6 t
5 J156 mm
2 {
{2 layer
1 {114x20 mm
4.4
1.2
19.4
2.9
2.9
4.2
10.9
6.4
0.9
79.4
17.6
320.8
161.6
3.8
1
176.2
38.2
Total
(grams)
4.4
4.8
19.4
5.8
2.9
4.2
10.9
6.8
3.6
79.4
70.4
161.6
3.8
1
176.2
38.2
43
-------
Sub No.
Entry No.
Name
4.3b jinductor
4.3c
4.3d
wire
3 pin connector
4.4 JPWB (y controller)
4.4a IPWB
4.4b
wire
4.4c 13 pin connector
4.4d
resistor
4.5 1 knobs sm
4.6 jknobs Ig
4.7 j aluminum shielding
4.8 jheat sink 1
4.9 1 heat sink 2
4.10 jheat sink 3
4.11 ledge bracket
4.12
4.13
wire
connector 12 pin
4.14 JPWB power, 349.5 x 245
jmm
4.14a Ifuse
4.14b j variable resistors
4.14c
resistors
4.14d I capacitors
4.14e
transistors
4.14f JSOP
4.14g jdiod'e
4.14h jjunpers
4.141 1 inductor
j insulating tape
4.14J jinductor
4.14k
copper tape
4.141 jinductor
insulating tape
4.14m 1 inductor
j insulating tape
4.14n 1 inductor
Qty. 1 Material 1 Weight
1 1 (grams)
1 j copper
i Ibaciite
2 j 156 mm
i t
12 layer
1 135 x 74 mm
2 j 156 mm
i i
1 j
5 IPS
2 JPS
1 j aluminum
1 j aluminum
1 1 aluminum
1 j aluminum
i 1 steel
12 J32mm
2 1
1 |4 layer
i i
1 j
251 1
165 j
28 1
8 j
i t
25 j
i Ibaciite
1 I copper
1 Irerrite
1 j polyester
i Ibaciite
1 j copper
1 Irerrite
1 I copper
i jbaciite
1 j copper
1 Irerrite
1 j polyester
i Ibaciite
1 I copper
1 Irerrite
1 j polyester
i Ibaciite
1 j copper
1 Irerrite
5.4
4.6
2.8
4.4
' I36".T"
20.7
38.9
15.2
87.2
6.8
9.6
7.6
0.6
8.7
26.8
139.5
2.4
9.5
12
8.5
4.8
5.7
7.2
5.1
0.5
3.8
4.8
3.4
Total
(grams)
5.4
4.6
14
8.8
136T"
20.7
38.9
15.2
87.2
6.8
9.6
7.6
0.6
8.7
26.8
139.5
2.4
9.5
12
8.5
4.8
5.7
7.2
5.1
0.5
3.8
4.8
3.4
44
-------
Sub No.
Entry No.
4.14o
Name
insulating tape
inductor
4.14p
inductor
4.14q
4.14r
4.14s
4. Hit
4.14u
4.14v
4.14w
connector 15 pin
connector 3 pin
connector 5 pin
connector 6 pin
connector 2 pin
connector 4 pin
wire
4.15 1 power switch
4.16 j power cord receptacl e
4.17 j power cord
Bill of Materials for: PWB attached to power
5.1
5.2
5.3
5.4
5.5
5.6
PWB, 82 x 30 mm
SOP'
resistors
capacitors
transistors
connector 5 pin
Bill of Materials for: PWB attached to power
6.1
6.2
6.3
6.4
6.5
6.6
PWB, 53 x 52 mm
SOP
resistors
capacitors
transistors
connector l3 pin
6.7 j jumpers
Bill of Materials for: PWB attached to power
7.1
7.2
7.3
7.4
7.5
7.6
PWB, 44 x 96 mm
SOP
resistors
capacitors
transistors
connector 1 1 pin
7.7 j jumpers
Qty. 1 Material 1 Weight
1 1 (grams)
1
2
2
O
2
2
o
4
i
r\
i
4
i
i
i
board by
1
1
r\
4
1
i
board by
1
i
24
10
6
1
4
board by
r\
37
11
5
1
2
polyester
fertile magnet
copper
baclite
copper
ferrite
296mm
'PS
ABS
475 mm length
cable connector
4 layer
solder connecto
2 layer
solder connecto
'2 layer
0.4
17.9
1.8
5.4
4.6
4.2
5.2
34
292.7
r
r
Weight
Total
Total
(grams)
0.4
35.8
3.6
16.8
9.2
8.4
5.2
34
292.7
11636.8
45
-------
Appendix D
TFT-LCD Manufacture
Glass Panel
Process Step 1 Equipment
Fusion Method
Material/Chemical 1 Notes
barium borosilicate, e.g., Corning 7059:
aluminoborosilicate; 49% SiO2, 10%
0.7mm thick AL^; 15% B2O3;
25%BaO; 1% other
Mix 1
Melt glass
Fine
Condition
Flow glass
Draw glass
Cut glass ^band, wire, or circular blades
Bevel/chamfer/heat glass
Grind (may be eliminated)
Polish (may be eliminated)
Chemical finishing
Clean (physical)
or Clean (chemical)
or Clean (dry)
Anneal (back panel onl
Float method
Mix
Melt
Fine
Flow glass
Cool glass
Cut glass
sand, garnet, corundem, silicon, carbide,
boron carbide, or diamond
potassium nitrate
brush, scrub, ultrasonic, or megasonic
organic solvent; neutral detergent; or chemical
clean; and water
ultraviolet ozone; plasma oxide; plasma non oxide; or laser
y)
barium borosilicate or
aluminoborosilicate;
0.7mm thick
molten tin bed
float on bed of molten t
controlled atmosphere
still on molten tin
Bevel/chamfer/heat glass
Grind (may be eliminated)
Polish (may be eliminated)
Chemical finishing
potassium nitrate
Clean (physical) *b"rush, scrub, ultrasonic, or megasonic
or Clean (chemical)
350-400°C
e.g., Corning 7059:
49% SiO2, 10%
AL^; 15%B2O3;
25%BaO; 1% other
in in chemically
organic solvent; neutral detergent; or chemical
clean; and water
or Clean (dry) ^ultraviolet ozone; plasma oxide; plasma non oxide; or laser
Anneal (back panel only)
46
-------
Front Panel Pattern-TN
Process Step 1 Equipment
Process 1 Ancillary
Material 1 Material
Notes
Clean glass j Ultrasonic clean/spin rinse dryer JIPA, water, nitrogen
Deposit ITO JPVD
Coat photoresist j Spin coater
Bake jOven
Expose I Stepper
Develop | Developer
Clean I Spin rinse dryer
Bake photoresist jOven
Etch ITO j Plasma etcher
Strip photoresist IDeveloper
Clean I Spin rinse dryer
Deposit black j Sputter
matrix material j
Coat photoresist I Spin coater
Bake jOven
Expose j Stepper
Develop j Developer
Clean I Spin rinse dryer
Bake I Oven
EtchCr 1 Wet bench
Strip photoresist j Wet bench
Clean jSpin rinse dryer
Inspect j
Apply (R) color I Extrude/spin or
filter material ; slit/spin coater
Bake jOven
Expose I Stepper
Develop j Developer
Clean jSpin rinse dryer
Apply (G) color j Spin coater
filter material j
Bake lOven
Expose j Stepper
Develop IDeveloper
Clean j Spin rinse dryer
Apply (B) color 1 Spin coater
filter material j
Expose I Stepper
Develop IDeveloper
Clean I Spin rinse dryer
Planarize jCoat
I Indium tin oxide
1 Polyimide
ITMAH
1 Water
iClj; HBr; He; O-,
ITMAH
1 Water
Chrome j
1 Polyimide
ITMAH
1 Water
ITMAH
1 Water
6.8-2.6 um acryl 1 Same as process
epoxy resin, Sbq-; material
PVA j
ITMAH
1 Water
Wet etch: HCL
Alternative: black
resin & photo
process
Pigment-
dispersion
method, 99%
TFTs
Negative resist-
extra strip not
required
Pigment-diffused j Same as process material
acryl epoxy resin I
ITMAH
1 Water
Pigment-diffused 1 Same as process material
acryl epoxy resin j
ITMAH
1 Water
Polyimide 1
47
-------
Process Step
Deposit alignment
layer
Bake
Rub
Inspect
Test
Equipment
Roll coat
Oven
Rubbing machine
Microscope
Process 1
Material |
Polyvinyl alcohol; p
acid solution
Ancillary
Material
olyesters; poly- s
Notes
iloxanes; polyamic
48
-------
Rear Panel Pattern-TN
Process Step 1 Equipment
Clean bottom I Ultrasonic or
glass jbrush
inspect 1
Deposit gate metal; PVD
Coat photoresist I Spin coater
Bake I Oven
Expose 1 Stepper
Develop I Developer
Clean jSpin rinse dryer
Bake photoresist JOven
Etch gate metal I Plasma etcher
Strip photoresist IDeveloper
Clean 1 Spin rinse dryer
Inspect j
Deposit dielectric jPECVD
material 1
Deposit channel jPECVD
material I
Deposit etch stop jPECVD
layer j
Coat photoresist j Spin coater
Bake lOven
Expose j Stepper
Develop IDeveloper
Clean ISRD
Bake photoresist lOven
Etch SiNx j Plasma etcher
Etch a-Si I Plasma etcher
Etch SiNx j Plasma etcher
Strip photoresist IDeveloper
Clean ISRD
Deposit ohmic jPECVD
contact material 1
Coat photoresist j Spin coater
Bake I Oven
Expose i Stepper
Product 1 Ancillary
Materials | Materials
Notes
IIP A, nitrogen, 1 alkali-free likely
! water I future material
One of the following: jTi/Al/Ti possible
Al, Al + barrier, Al + metal, Al alloy jfuture metal
jlayers
jPolyimide 190- 95% wasted
; ; on traditional
; ; spin coater
INMP 1
1 Water 1
j lor wet etch +
; ; clean
|A1: Cl2+BCla/Cl2
lAl+barrier: CL; BCl; N7; CF4
lAl+metal: C12; BCl^; N2; CF4
1 Al alloy (Zr, Cu, Nd, Y): C12; B"C13;
|N2; CF,
INMP
I Water
SiO2 or SiN j
a-Si I
SiNx j
iPolyimide
INMP
I Water
|CHF3; CF4
ICF4; O2
jCF4;02orCl,
INMP
I Water
Doped Si (n-type: As,P)
iPolyimide
49
-------
Process Step 1 Equipment
Develop I Developer
Clean ISRD
Bake photoresist jOven
Etch doped a-Si jPlasma etcher
Strip photoresist jDeveloper
Clean I Spin rinse dryer
Deposit ITO JPVD
Anneal lOven
Coat photoresist j Spin coater
Bake lOven
Expose i Stepper
Develop ; Developer
Clean ISRD
Bake photoresist jOven
Etch ITO j Plasma etcher
Strip photoresist jDeveloper
Clean ISRD
Coat photoresist j Spin coater
Bake JOven
Expose I Stepper
Develop j Developer
Clean ISRD
Bake photoresist jOven
Etch n+ a- Si j Plasma etcher
(contact) j
Deposit JPVD
source/drain metal;
Coat photoresist 1 Coater
Bake I Oven
Expose I Oven
Develop j Stepper
Clean jDeveloper
Bake photoresist ISpin rinse dryer
Etch metal I Plasma etcher
Strip photoresist iDeveloper
Clean ISRD
Deposit jPECVD
passivation layer ;
Coat photoresist | Coater
Bake lOven
Expose j Oven
Product 1 Ancillary
Materials | Materials
INMP
1 Water
|Ci2orCF4+O2or
JNMP
; Water
Indium oxide/tin oxide
jPolyimide
;NMP
j Water
|Cl2+HBr;He;
10-,; CH4+H2
INMP
j Water
jPolyimide
INMP
1 Water
|ci2
One of the following:
Al, Al + barrier, Al + metal, Al alloy
Ti, Mo, Cr, W, MoTa, or MoW
jPolyimide
;NMP
j Water
lAletch:
|C12+BC13/C12
Notes
SFa+HCL
or wet etch +
clean
or wet etch +
clean
jAl+barrier: C12; BC13; N2; CF4
lAi'+metai': Cl2; B'Ci^; N2; CF4
1 Al alloy (Zr, Cu, Nd, Y): C12; BC13;
iN2; CF4
jNMP
j Water
SiNx ICF4+O2
jPolyimide
50
-------
Process Step 1 Equipment
Develop I Proximity printer
Clean jDeveloper
Bake photoresist JSRD
Etch SiNx 1 Plasma etcher
Strip photoresist j
Clean iSRD
Deposit alignment I Roll coater
material j
Bake lOven
Rub j Rubbing machine
Electrostatic discharge
Test JSRD
Product 1 Ancillary
Materials | Materials
INMP
IWater
JO,, N2, He, SiF,,
JNMP
! Water
Polyimide, 500 to 1000 A
Water
Notes
CHFa (mixture)
51
-------
Front Panel Pattern-IP S
Process Step j Equipment
Clean glass 1 Ultrasonic clean/S
Deposit black j Sputter
matrix material j
Coat photoresist I Spin coater
Bake jOven
Expose 1 Stepper
Develop | Developer
Clean 1 Spin rinse dryer
Bake jOven
Bitch Cr I Wet bench
Strip photoresist j Wet bench
Clean I Spin rinse dryer
Inspect j
Apply (R) color I Extrude/spin or
filter material j slit/spin coater
Bake jOven
Expose I Stepper
Develop j Developer
Clean 1 Spin rinse dryer
Apply (G) color j Spin coater
filter material |
Bake lOven
Expose j Stepper
Develop j Developer
Clean j Spin rinse dryer
Apply (B) color I Spin coater
filter material ;
Expose j Stepper
Develop I Developer
Clean jSRD
Deposit alignment; Roll coat
layer j
Bake lOven
Rub j Rubbing machine
inspect 1 Microscope
Test j
Process
Material
RD
Chrome
6.8-2.0 urn acryl
epoxy resin, Sbq-
PVA
Pigment-diffused
acryl epoxy resin
Pigment-diffused
acryl epoxy resin
Poiyvinyl alcohol;
siloxanes; polyarm
Ancillary
Material
IP A, water, nitrog
Poiyimide
TMAH
Water
TMAH
Water
Same as process
material
TMAH
Water
Notes
en
Alternative: black
resin & photo
process
Pigment-
dispersion
method, 99%
TFTs
Negative resist-
extra strip not
required
Same as process material
'TMAH
Water
Same as process material
TMAH
Water
polyesters; poly-
c acid solution
52
-------
Rear Panel Pattern-IP S
Process Step
Clean substrate
Inspect
Deposit light shield
metal
Coat photoresist
Bake
Expose
Develop
Clean
Bake
Etch Cr
Strip
Clean
Inspect
Deposit dielectric
Deposit source/drain
metal
Coat photoresist
Bake
Expose
Develop
Clean
Bake
1 Equipment
Product Materials (Ancillary Materials
IBrush, disk, US, or MS
JPVD
ICoater
I Oven
I Stepper
j Developer
I Spin rinse dryer
I Oven
1 Plasma etcher
jPlasma asher
1 Spin rinse dryer
JAOI
t'C'VD
JPVD
ICoater
j Oven
j Stepper
I Developer
1 Spin rinse dryer
I Oven
Etch" j
Strip
Clean
Create island 1
Coat photoresist
Expose
Develop
Clean
Bake
Etch island
Strip
Clean
JPVD
1 Plasma etcher
Inspect i
Cr
CL,;Oj
C12;O2 (or wet bench)
SiOj
One of the following:
Al, Al + barrier, Al +
metal, or Al alloy
SiNx, a-Si, n+ a-Si
n+ a- si
Positive photoresist
NMP
Water
NMP
Water
Al etch:
Cl-.+BCyCl.,
Al+barrier: C12; BC13;
N2; CF4
'Al+metal: C12; B"C13;
N2; CF4
Al alloy (Zr, Cu, Nd,
Y):C12;BCL,;N2;CF4
NMP
Water
*CF4; Qj; Cl.,
53
-------
Process Step 1 Equipment
Deposit gate electrode 1 CVD
Deposit pixel electrode; CVD
Deposit common jCVD
electrode j
Coat photoresist ICoater
Bake lOven
Expose j Stepper
Develop I Developer
Clean j Spin rinse dryer
Bake iOven
Etch metal(s) j Wet bench
Clean j Spin rinse dryer
Strip j Developer
Clean j Spin rinse dryer
Deposit alignment jRoll coater
layer j
Bake IOven
Rub j Rubbing machine
Electrostatic discharge I Spin rinse dryer
Test |
Product Materials (Ancillary Materials
Al, Al+barrier, Al+metal, or Al alloy
Al, Al+barrier, Al+metal, or Al alloy
Mo, Ta, MoTa, MoW, Al/Cr, or Ti/Al/Ti
j Al etch:
iCl2+BCl3/Cl2
lAl+barrier: C12; BCT3;
|N,; CF4
i Al+metal: C12; BC13;
|N2; CF4
1 Al alloy (Zr, Cu, Nd,
|Y):Cl2;BCla;N2;CF4
ITi: CLj; CF4
tivio: Cl2; O2; SF§
ICr: Cl_j; O2
IW: C\; 0,; SFg
IMoTa: C12; O2; SF£
Polyimide, 500 to 1000 A
Water
54
-------
Display Cell Assembly
Process Step Equipment Process Notes
I material/chemical |
Apply seal I Screen printer jEpoxy resin, acrylic resin, etc.
Cure :Qye.n : 1
Apply, ^pacers l?p.ac.e.r $.P.r.a.y.e.r (p)ymyib£nze.n?~typ.e. r??.m 9r ?!^c.a.
Inspection lE§i?.r£sc..°.Pe. I 1
Align and assemble plates ; tEach glass plate 1. i
; ; mm thick
Cure J9y.e.n ! 1
Scribe and break * j f 400 different types
j j exist; more than one
j lused
Inject liquid crystal Vacuum/injection j Poly cyclic j6.8 mg/cm2
system jaromatic/halogenated j
j hydrocarbon; j
jcyanobiphenyl; j
jphenylcyclohexane j
j compound j
Seal " jEpoxy resin, acrylic j Sealing LC-injection
I resin, etc. inpje
Cure ^Uy light source/oven j }
Clean
Attach front polarizer Laminator jPolyvinyl alcohol- j.2 - .3 mm cellulose
jiodine jtriacetate; cellulose
j j acetate butyrate-
I ^Pr^?£tiye. laye.r
Attach rear polarizer "Laminator jPolyvinyl alcohol- j.2 - .3 mm cellulose
jiodine jtriacetate; cellulose
j j acetate butyrate-
j j protective layer
Clean
inspect/test display
55
-------
Display Module Assembly
Process Step
Attach row drivers
Attach column drivers
Attach backlight
Inspect
i Process material/chemical j
JPWB, TAB (polyimide film, sealing resin)
1 TAB (polyimide film, sealing resin) 1
Notes
I Glass fluorescent material, 20ppm Hg (notebook computer)
Clean circuit boards I I
Test
Attach controller
Attach passive components
Attach packaging hardware
Attach interconnects
Test unit
j TAB (polyimide film, sealing resin) j
56
-------
Appendix E
Cannon FPD: Detailed Bill of Materials
Cannon FLCD 15C01
57
-------
Appendix E
Cannon FPD - Detailed BOM
Sub No. Entry No.
Name
Bill of Materials for: Canon FLCD 15CD01
1.1
1.2
1.4
1.5
1.7
1.9
1.10
1.11
1.14
1.15
1.16
1.17
1.19
1.20
1.21
1.22
1.23
1.24
1.26
1.27
1.30
1.31
1.32
1.33
1.34
Front bezel
LED light pipe
Adjustment PWB
scr M3, 4 pnh
Knob
Power supply PWB
Power switch bezel
scr M3, 4 pnh
LCD subassy
Backlight assy
scr M3, 4 pnh
scr M3, 4 pnh
Cable clamp
Power supply cover
scr M3, 10 pnh
insulator
Hitachi PWB
scr M3, 4pnh
NFX controller
scr M3, 4 pnh
Rear cover assy
scr M3, 10 pnh
Power supply assy
scr M3, 10 pnh
Base/stand
Bill of Materials for: LCD subassy 1.14
4.1
4.2
4.3
4.4
4.6
4.7
4.8
4.9
4.10
4.12
4.13
4.14
Plastic frame
Gasket
Brightness enhancer
scr M3, 4 pnh
Large gasket
Small gasket
LCD panel assy
Metal clip
scr M3, 4 pnh
Cable assy
Hold-down clip
scr M3, 4 pnh
Qty.
1
1
1
3
2
1
1
7
1
1
2
18
1
1
2
1
1
6
1
6
1
9
1
4
1
1
1
1
6
1
1
1
4
1
1
1
1
Material
ABS
polycarb
see subassy BOM
ABS
see subassy BOM
ABS
see subassy BOM
see subassy BOM
nylon
steel
polyester
see subassy BOM
see subassy BOM
see subassy BOM
see subassy BOM
see subassy BOM
PC-GF30
silicone rubber
polyester
silicone rubber
silicone rubber
see subassy BOM
BeCu
see cable assy summary
BeCu
Weight
(grams)
150
<1
1.7
4.2
<1
25
10
150
n/a
10
n/a
n/a
1
1
Formation Process
inj. mold
inj. mold
inj. mold
inj. mold
inj. mold
progressive die stamp
die cut
inj. mold
dispensed
extruded, die cut
dispensed
dispensed
stamped
stamped
Features
3 1 brass inserts
6 brass inserts
Supplier
Japan Synthetic
Rubber Company
3M
Finish (top)
screened logo
as molded
as molded
as molded
electro-galvanized
microembossed
Ni plate
Ni plate
Finish (bottom)
conductive paint
58
-------
Appendix E
Cannon FPD - Detailed BOM
Sub No. Entry No.
Name
Bill of Materials for: Backlight assy 1.15
5.1
5.2
5.4
5.5
5.6
5.8
5.9
5.10
5.11
5.12
5.13
5.14
5.16
5.17
5.19
Metal plate
Brass thd'd standoff
scr M3, 4 pnh
Foam gasket
Nylon strain relief
Clear protector
Opaque diffuser
Light pipe
Corner tape
White reflector
Light assy
scr M3, 4 pnh
Nylon clamp
scr M3, 4 pnh
Rear plate assy
Bill of Materials for: Light assy 5.13
5.13b
5.13c
5.13d
Cold cathode tube
Shock cushion
Cable assy
Bill of Materials for: Rear plate assy 5.19
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
Rear plate
Cable clamp
Plastic tube
scr M3, 10 pnh
Flat cable toroid
Hold-down plate
scr M3, 4 pnh
Caution label
Bill of Materials for: Rear cover assy 1.30
9.1
9.2
9.4
9.5
9.7
Rear cover
BeCu fingers
Cloth mesh
Metal plate
scr M3, 4 pnh
Qty.
1
4
4
4
1
1
1
1
4
1
4
4
6
6
1
1
2
2
1
3
2
2
6
2
4
1
1
6
2
1
4
Material
steel
brass
foam rubber
nylon
plexiglass
polyester
polycarbonate
aluminized mylar
polyester
see subassy BOM
nylon
see subassy BOM
glass, phosphor
silicone rubber
insulated Cu wire
steel
nylon
polycarb
hi-mu ferric
steel
paper
ABS
BeCu
polyester
steel
Weight
(grams)
175
2
<1
<1
75
10
550
«1
15
1
8.7
1.7
4.4
350
1.1
4.1
12
20.6
«1
325
1
<1
200
Formation Process
progressive die stamp
screw machine
adhesive backed foam tape
inj. mold
inj. mold
extruded, die cut
inj. mold
extrude/roll form/
e-less plate
extruded, die cut
inj. mold
complex
inj. mold
complex
progressive die stamp
inj mold
extrude/screw mach.
molded
progressive die stamp
inj mold
die stamped
woven
stamped
Features
inj. molded connector
2 piece 18 spot welds
heat staked to rear cover
glued to rear cover
2 pressed in screw
machine nuts
Supplier
3M
3M
3M
Tokin
Japan Synthetic
Rubber Company
Finish (top)
electro-galvanized
adhesive
etched both sides
Finish (bottom)
microembossed both sides
electro-galvanized
electro-galvanized
screen print ink
as molded
Ni plate
electro-galvanized
adhesive
conductive paint
59
-------
Appendix E
Cannon FPD - Detailed BOM
Sub No. Entry No.
9.8
9.10
9.11
Name
Shoulder screw
Insulator
scr M3, 5 type B
Bill of Materials for: Power supply assy 1.32
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
Housing
[nsulator
Power supply PWB assy
Pwr switch
Pwr cord recept.
scr M3, 4 pnh
Heat sink
scr M3, 4 pnh
Bill of Materials for: Base/Stand assy 1.34
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
11.12
11.13
11.14
11.15
11.16
11.17
11.18
11.19
11.20
11.21
11.22
11.23
11.24
Upright
Bracket 1
Bracket 2
Bracket 3
Bracket 4
Bracket 6
Axle
Spring
Bushing
Swivel bearing 1
Swivel bearing 2
Bracket 7
Base weight
Rubber feet
Cover 1
Cover 2
Cover 3
Cover 4
Cover 5
Cover 6
C-clip
Lg washers
Sm washers
Qty.
2
1
4
1
1
1
1
1
4
1
8
1
1
1
1
1
2
2
2
2
1
1
1
1
5
1
1
1
1
1
1
4
2
2
Material
polyester
steel
polyester
see subassy BOM
ABS/Cu
ABS/Cu
aluminum
UP-GF14
steel
steel
steel
steel
steel
steel
steel
nylon
stainless
POM
steel
steel
silicone rubber
ABS
ABS
ABS
ABS
ABS
ABS
steel
steel
steel
Weight
(grams)
20
150
24
5.2
34
60
450
44
52
65
175
10
15
8
3
68
31
460
450
<1
33
27
30
35
20
95
<1
3.6
<1
Formation Process
die cut
progressive die stamped
die cut
inj. mold
complex, inj. mold
inj. mold
stamped
stamped
stamped
stamped
stamped
screw machine
inj. mold
stamped
inj. mold
stamped
stamped
die cut
inj. mold
inj. mold
inj. mold
inj. mold
inj. mold
inj. mold
stamped
stamped
stamped
Features
2 piece, 2 spot welds
3 wire pigtail w/ ferrite
choke
2 piece, 22 spot welds
Supplier
Matsushita
Finish (top)
electro-galvanized
electro-galvanized
electro-galvanized
electro-galvanized
none
textured paint
adhesive
Finish (bottom)
60
-------
Appendix E
Cannon FPD - Detailed BOM
Sub No. Entry No.
Name
Qty.
Bill of Materials for: LCD panel Assembly 4.8
12.1
12.2
12.3
12.4
12.5
12.6
AMLCD cell
Row driver TAB
Column driver TAB
Row driver input PWB
Column driver input PWB
Connection flex
Bill of Material Summary for Cables
1
3
10
1
1
1
Material
glass, misc thin films
1C chip on polyimide tape
1C chip on polyimide tape
see subassy BOM
see subassy BOM
Cu thin film on polyimide
base
weight sub-total
Weight
(grams)
475
1
1
5
5136.6
Formation Process
complex
complex
complex
complex
Features
Supplier
Finish (top)
2mm X 12 mm 1C, 30mm X 15mm tape
1.5mm X 10mm 1C, 20mm X 12mm tape
35mm X 12cm
21 individual wires, AWG 36, totaling 352 inches; 9 connectors with average of 5 connections each and 1.5 g weight each
Bill of Materials for: NFX Controller 1.26
PWB:
Board Area in Sq Inches:
Components
Part Number
CG21503... Japan
AD7224KR-1
TD62595AFT9424K
J47AD 74 ACTQ244... National
P39AK DS26C32ATM
MC33174D XAG448... Motorola
SM128 LM324M
P41ADDS26C31TM
AH6-0054-01N335E3B
403 592C
SCC 357
Trace
VialD
Thick.
38.156
Qty
1
1
1
6
5
2
1
1
1
1
2
4
4
1
1
3
16
0.008
0.012
0.062
Space
ViaOD
#Layers
(total both sides)
#IO
208
20
18
20
16
14
14
16
100
100
3
3
4
4
4
6
3
0.008
0.024
4
Pitch
Material
Weight
All Dimensions in Inches
Type Pkg
QFP
SOP
SOP
SOP
SOP
SOP
SOP
SOP
QFP
I.C. Socket
SOT-23
SOT-23
SOT
SOT
SOT
SOT
SOT-23
Lead Pitch
0.02
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.025
0.025
0.2
0.1
0.06
0.1
0.1
0.025
0.075
Length
0.375
0.095
0.08
0.065
0.075
0.1
0.065
0.075
0.215
0.016
FR4
120
Width
0.35
0.085
0.075
0.06
0.055
0.065
0.055
0.055
0.175
Finish (bottom)
61
-------
Appendix E
Cannon FPD - Detailed BOM
Sub No. Entry No.
For SOT on line #19
20.000 MHz
20.000 MHz
Socket type w/large metal bracket
Ni-Zero-Insert-Flex
Ni-Post
Ni-Post
Ni-Post
Ni-Post
Name
1
12
10
2
1
1
8
456
27
232
1
10
1
1
1
1
Bill of Materials for: Hitachi PWB 1.23
PWB:
Board Area in Sq Inches:
Components
Part Number
5B2 HA17339
51CTOOTTL1451A4Y
Wire Type
Wire Type
Wire Type
Wire Type
Wire Type
Wire Type
Can Type
Can Type
Can Type
Trace
VialD
Thick.
39.781
Qty
1
1
2
8
8
8
10
2
7
4
8
8
14
2
4
4
5
Qty.
0
2
2
3
4
2
2
2
2
2
25
12
10
3
4
8
0.01
0.012
0.062
Material
Al heatsink Plate
Electro Cap
Electro Cap
Fuse
Crystal
Crystal
Diode
1206 chip cap
misc. Discrete
0805 chip resistor
Connector
Connector
Connector
Connector
Connector
Connector
Space
ViaOD
#Layers
(total both sides)
#IO
14
16
3
3
2
2
2
2
2
6
4
9
2
2
2
2
2
Weight
(grams)
0.05
0.025
0.07
0.07
0.07
0.07
0.01
0.035
4
Formation Process
Pitch
Material
Weight
All Dimensions in Inches
Type Pkg
SOP
SOP
SOT-23
SOT-23
Capacitor
Capacitor
Capacitor
Capacitor
Capacitor
Transformer
Choke
Transformer
Resistor
Resistor
Capacitor
Capacitor
Capacitor
Pitch
0.1
0.1
0.1
0.1
Length
0.095
0.075
Features
0.02
FR4
205
Width
0.065
0.065
Supplier
Finish (top)
Finish (bottom)
62
-------
Appendix E
Cannon FPD - Detailed BOM
Sub No. Entry No.
Can Type
Open case
Open case
Closed case
Closed case
Name
1
1
1
1
1
1
4
4
4
26
2
14
19
75
Bill of Materials for: Adjustment PWB 1.4
PWB:
Board Area in Sq Inches:
Components
Part Number
Trace
VialD
Thick.
9.2
Qty
3
1
1
1
1
1
Bill of Materials for: Power supply PWB assy 10.3
PWB:
Board Area in Sq Inches:
Components
Part Number
M51995P
upc494C
2903D
PC123
3050C
Trace
ViaTD
Thick.
31.5
Qty
1
1
1
3
8
Qty.
2
2
3
3
3
4
4
3
4
3
5
2
2
2
0.02
0.012
0.048
Material
Capacitor
Fuse
Filter
Variable resistor
Connector
Connector
Connector
Connector
SOT
SOT
SOT
Misc. Discrete
1206 chip capacitor
0805 chip resistor
Space
ViaOD
#Layers
(total both sides)
#IO
4
3
2
2
4
6
0.05
0.03
0.062
Weight
(grams)
0.1
0.1
0.1
0.1
0.1
0.075
0.035
0.01
0.035
2
Formation Process
Pitch
Material
Weight
All Dimensions in Inches
Type Pkg
Variable resistor
Trimmer pot
Axial leaded resistor
Pilot lite LED
Connector
Connector
Space
ViaOD
#Layers
(1 side only)
#IO
16
16
8
4
3
Pitch
0.1
0.1
0.2
0.1
0.1
0.1
0.02
0.06
1
Length
0.95
0.2
Pitch
Material
Weight
All Dimensions in Inches
Type Pkg
DTP
DTP
DTP
DTP
To-220
Pitch
0.1
0.1
0.1
0.1
0.1
Length
0.9
0.9
0.3
0.2
0.75
Features
0.03
FR4
27
Width
0.65
0.2
0.07
Phenolic
240
Width
0.2
0.2
0.2
0.2
0.4
Supplier
Finish (top)
Finish (bottom)
63
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Appendix E
Cannon FPD - Detailed BOM
Sub No. Entry No.
Rectifier
Name
1
4
8
6
20
8
22
45
24
3
1
1
1
1
Bill of Materials for: Row driver input PWB 12.4
PWB:
Board Area in Sq Inches:
Components
Part Number
Trace
VialD
Thick.
24
Qty
9
3
2
Bill of Materials for: Column driver input PWB 12.3
PWB:
Board Area in Sq Inches:
Components
Part Number
Total Product Weight
Trace
ViaTD
Thick.
18
Qty
20
10
2
Qty.
4
2
2
6
2
3
2
2
2
2
8
2
2
8
0.02
0.012
0.032
Material
STP
L.g. electrolytic cap
Med e-lytic cap
Sm e-lytic cap
Radial tant cap
Sm transistor
Axial lead diode
Axial lead resistor
Wire jumper
Lg ferrite core toroid
Lg transformer
Fuse
Connector
Connector
Space
ViaOD
#Layers
(total both sides)
#IO
2
2
36
0.02
0.012
0.032
Weight
(grams)
0.2
0.1
0.1
0.01
0.035
4
Formation Process
1.1
Pitch
Material
Weight
All Dimensions in Inches
Type Pkg
1206 chip capacitor
2515 chip capacitor
Connector
Space
ViaOD
#Layers
(total both sides)
#IO
2
2
36
Pitch
0.1
0.01
0.035
2
Pitch
Material
Weight
All Dimensions in Inches
Type Pkg
1206 chip capacitor
2515 chip capacitor
Connector
Pitch
0.1
5798.6
Stand
Features
0.8
0.03
FR4
30
0.03
FR4
40
3681.4
Supplier
Finish (top)
Finish (bottom)
64
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Glossary
a: Si
Active center
Alignment layer
AMLCD
Amorphous
Amorphous polymers
Amphiphilic
Anisotropic
APCVD
Aquadag
Backbone
Biaxial
Birefringence
Block polymers
BOM
Buffing
CCFT
Chain polymer
Amorphous silicon
Location of the unpaired electron on a free radical, where
reactions take place.
A layer and/or surface treatment applied to the boundary of a
liquid crystal cell to induce a particular director orientation. For
example, a layer of polyimide buffed in one direction induces
alignment parallel to the buffing direction, or a surfactant may be
polymerized on a boundary surface to induce perpendicular
alignment.
Active-matrix liquid crystal display
Irregular; having no discernible order or shape. In the context of
solids, the molecules are randomly arranged, as in glass, rather
than periodically arranged, as in a crystalline material.
A glass-like structure with tangled chains and no long-range
order.
A molecule with a hydrophilic head and a hydrophobic tail (i.e., a
molecule that has one end that attracts water and one end that
repels water).
Having properties that vary depending on the direction of
measurement. In liquid crystals, this is due to the alignment and
the shape of the molecules. Dielectric anisotropy means different
dielectric strengths along different axes, and refractive anisotropy
means different refractive indices along different axes.
Atmospheric pressure chemical vapor deposition
An aqueous conductive coating found on the faceplate.
The main structure of a polymer onto which substituents are
attached.
Possesses two directions along which monochromatic light
vibrating in any plane will travel with the same velocity.
Also called double refraction. The property of uniaxial
anisotropic materials in which light propagates at different
velocities, depending on its direction of polarization relative to the
optic axis.
Polymers composed of two or more connected sequences (blocks)
of homopolymers.
Bill of materials
To give the inner glass surfaces of a liquid crystal cell a texture, in
order to align the liquid crystal molecules in a certain direction
parallel to the surfaces.
Cold cathode fluorescent tube
A polymer in which the repetition of units is linear. The
65
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Chiral Nematic
COB
COF
COG
Convergence
Cross-linking
CRT
Gullet
CVD
DfE Program
Dielectric
Dot pitch
E/S
EOL
FPD
Frit
Gate
Grille dag
1C
IPS
Isotropic
ITO
LCD
Liquid crystal
monomers are linked end to end, forming a single straight
polymer.
Similar to the nematic phase; however, in the cholesteric phase,
molecules in the different layers orient at a slight angle relative to
each other (rather than parallel, as in the nematic). Each
consecutive molecule is rotated slightly relative to the one before
it. Therefore, instead of the constant director of the nematic, the
cholesteric director rotates helically throughout the sample.
Chip-on-board
Chip-on-film
Chip-on-glass
The ability of an electron beam to hit the correct phosphor dot.
A process in which bonds are formed joining adjacent molecules.
At low density, these bonds add to the elasticity of the polymer.
At higher densities, they eventually produce rigidity in the
polymers.
Cathode ray tube. A glass vacuum tube used in televisions and
monitors.
Broken glass from CRT
Chemical vapor deposition
EPA's Design for the Environment Program
A material that is inserted between the plates of a capacitor to
increase its effective capacitance.
The vertical distance between the centers of adjacent pixels. Dot
pitch is an important determinant in the clarity of a color monitor.
Etch stop
End-of-life
Flat panel display
Solder glass made of lead oxide, zinc oxide, and boron oxide,
mixed with nitrocellulose binder and amyl acetate to form a paste.
Control terminal of a thin-film-transistor.
A coating of contrast-enhancing material applied to the faceplate.
Integrated circuit
In-plane switching
Disordered and without any preferred direction.
Indium tin oxide
Liquid crystal display
A thermodynamic stable phase characterized by anisotropy of
properties without the existence of a three-dimensional crystal
lattice, generally lying in the temperature range between the solid
and isotropic liquid phase.
66
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Mesomorphic substance Another term for a liquid crystal material.
MIM
Monochromatic light
Nematic
NMP
OEM
p:Si
Passivation
PECVD
Phosphors
Photoresist
PMLCD
Polyimide
Polymer liquid crystals
PVD
PWB
Slurry
STN
TAB
TFT-LCD
TMAH
Metal-insulator metal
Light composed of only one specific wavelength.
Liquid crystals are characterized by long-range orientational order
and the random disposition of the centers of gravity in individual
molecules. Nematics may be characterized as the simplest
spontaneously anisotropic liquids.
N-methyl pyrrolidinone
Original equipment manufacturer
Polycrystalline silicon
A thin-film protective layer that is applied to a glass substrate prior
to LCD fabrication. It makes the surface "passive" in that no ions
can migrate from the glass to the silicon film.
Plasma-enhanced chemical vapor deposition
Luminescent materials
A photosensitive polyimide resin
Passive matrix liquid crystal display
A cyclopolymerized organic material capable of withstanding high
temperatures (at least 300°C).
Polymers that contain mesogen units and thus have liquid crystal
properties.
Physical vapor deposition
Printed wiring board
A thin paste that has solids suspended in liquids.
Super-twisted nematic, a passive-matrix LCD technology
Tab automated bonding
Thin film transistor liquid crystal display
Trimethylamine hydrochloride
67
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