&EPA
United States
Environmental Protection
Agency
Office of Pollution
Prevention and Toxics
7408
EPA 745-K-95-004
June 1995
's 33/5O Program
Company Profile
Printed on Recycled Paper
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THE 33/50 PROGRAM
CBBMCALS $M£MPI>-
t SQi
This Company Profile is part of a series of reports being developed by EPA to highlight the accomplishments
of companies participating in the 33/50 Program. The
33/50 Program is an EPA voluntary pollution reduction
initiative that promotes reductions in direct environmen-
tal releases and off site transfers of 17 high-priority toxic
chemicals. The program derives its name from its over-
all goals an interim goal of a 33% reduction by 1992
and an ultimate goal of a 50% reduction by 1995. The
program uses 1988 Toxics, Release Inventory (TRI)
reporting as a baseline. In February, 1991, EPA began
contacting the parent companies of TRI facilities that
reported using 33/50 Program chemicals since 1988 to
request their participation in the 33/50 Program. As of
April, 1994, a total of 1,216 companies had elected to
participate in the Program, pledging to reduce emissions
of the 17 target chemicals by more than 355 million
pounds by 19-95. Companies are encouraged to set their
own reduction targets, which may vary from the
Program's national 33% and 50% reduction goals.
Company commitments-and reduction pledges continue
to be received by EPA on a daily basis.
The 1992 TRI data revealed that releases and
transfers of 33/50 Program chemicals declined by 40%
between 1988 and 1992, surpassing the Program's 1992
interim reduction goal by more than 100 million pounds.
This accomplishment, together with evidence from
s-f ^
as metij^ene cH&jrids .....
'
analysis of facilities' projected releases and transfers of the 17 priority chemicals, reported to TRI under the
Pollution Prevention Act, offers strong encouragement that the 33/50 Program's ultimate goal of a 50% reduction by
1995 will be achieved.
EPA is committed to recognizing companies for their participation in the 33/50 Program and for the emis-
sions reductions they achieve. The Program issues periodic Progress Reports, in which participating companies are
listed and highlighted; In addition, Company Profiles, such as this one, are being prepared to provide more detailed
information about companies that have written to EPA describing significant emissions reduction initiatives.
Information presented in these profiles is drawn from a number of sources, including the company's written com-
munications to the 33/50 Program, extensive interviews with company representatives, the annual TRI reports sub-
mitted by the company's facilities (including Pollution Prevention Act data reported to TRI in Section 8 of Form R),
and, in many cases, site visits to one or more of the company's facilities. All written company communications to
EPA regarding the 33/50 Program are available to the public upon request. ' ,
EPA does not endorse the performance, worker safety, or environmental acceptability of any of the techni-
cal options discussed in this Profile. Mention of any product or procedure in this document is for informational pur-
poses only, and does not constitute a recommendation of any such product or procedure, either expressed or implied
by EPA. ' .-.'.'
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33/50 PROGRAM COMPANY PROFILE: UNISYS CORPORATION
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SUMMARY
0 Replacing a chromic/sulfuric acid.eichant
with an alkaline etchant;
Replacing solvents used for decreasing
with tacky rollers; and
Replacing solvent-based developing and
stripping processes with aqueous-based
processes.
These projects resulted in tremendous
cost savings for Unisys. The first project yielded
an annual, cost savings of about $4.88 per circuit
board, while the second and third projects yielded
total annual cost savings of about $41,000 and
$340,600, respectively. ' '
1988 and 1993, Unisys
Corporation reduced releases and off-site
transfers of targeted 33/50 Program
chemicals from 852,443 pounds to 21,130
pounds, a reduction of approximately 98 percent.
These reductions resulted largely from chemical
substitutions and the elimination of a solvent
cleaning process at the company's manufacturing
operations, including the St. Paul, Minnesota
facility. Reductions also occurred following
.decreased production and facility closures that
occurred over the time period.
This case study highlights three 33/50
Program chemical reduction projects at Unisys:
COMPANY BACKGROUND
Unisys Corporation produces computer hardware, software, and informa-
tion management services for commercial and military customers. The
company also manufactures check sorters, postal sorters, and military
radar units. Unisys provides its services to financial companies, airlines, telecom-
munication companies, and government agencies: Created in 1986 by the merg-
er of Sperry and Burroughs, Unisys presently employs 48,000 people in 100 coun-
tries. The company is headquartered in Blue Bell, Pennsylvania, and has 20 man-
ufacturing facilities across the United States.
Unisys Corporation has annual revenues of $8 billion. About 80 percent
"of this revenue is derived from commercial information systems and services,
while the remainder comes from electronic .systems manufacturing and' services
for the defense industry.
UNISYS
33/50 PROGRAM COMPANY PROFILE: UNISYS CORPORATION
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ENVIRON]MENTAL STRATEGY
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The
in
de
[he Unisys corporate environmental strategy, initiated in 1982, is outlined
a publication entitled Environmental Stewardship Program. As
described in this document, Unisys is committed to a program of environ-
mental stewardship, which entails managing all activities responsibly, with care
and respect for the environment, and not merely complying with government reg-
ulations and requirements. This Profile highlights some of the company's envi-
ronmental achievements and provides an overview of the company's environ-
mental stewardship program.
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In addition to participating in the 33/50 Program, Unisys is involved in
numerous other environmental programs, including the following:
The company has established a program to reduce hazardous waste gen-
erated at their facilities. By re-engineering waste generating processes,
Unisys has achieved its goal of reducing hazardous waste emissions by
85 percent between 1988 and 1994.
Unisys has a program to eliminate the use of chlorofluorocarbons (CFCs)
at its facilities. By the end of 1993, the company eliminated th~e use of
CFCs in precision parts cleaning at their U.S. facilities. Unisys plans to
eliminate CFCs from its refrigeration equipment by the end of 1999
through a phaseout program.
Unisys has a proactive recycling program. The company recycles paper,
plastic, and aluminum cans and promotes the use of environmentally
acceptable packaging materials.
The company participates in many voluntary EPA programs, including the
following: Green Lights, a program that encourages the use of energy-
efficient light fixtures; Energy Star computers, a pro gram that encourages
the computer industry to voluntarily manufacture energy-efficient prod-
ucts; and WasteWi$e, a program that encourages industry to reduce
municipal solid waste.
Unisys was a participant in the Minnesota-50 Project, which is similar to
EPA's 33/50 Program and establishes a state-wide goal of a 50 percent
reduction in releases and transfers of 33/50 Program chemicals by 1995.
"] " "
The company is an active participant in the Council on Office Products
Energy Efficiency and in the International Standards Organization's effort
to develop an international environmental standard to encourage compa-
nies to incorporate environmental management into their business plans.
tJmsyj_ has begun auditing the environmental practices of some of its sup-
f"^= ^jftiersi 'Altnougn t^'^d^e^'lstnformal and conducted on a case-by-case
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PROGRAM COMPANY PROFILE: UNISYS CORPORATION
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basis, Unisys expects to implement a more formal auditing program in the
future. " .-',. , , -. .. V, ' r '
Because of the company's commitment to envii'onmental protection,
Unisys and its facilities have received numerous awards for their efforts in pollu-
tion prevention. Some of the accolades received by Unisys include:
. "Recycler of the Year" finalist, awarded in 1995 by the National Office
Paper Recycling Project;
The 1994 Governor's Award for Pollution Prevention from the Minnesota
Office of Waste Management, awarded to the St. Paul'facility;
The 1994 Governor's Award for Pollution Prevention from the State of
California; " , ,
A Waste Minimization Award conferred to the Salt Lake City facility by
the Department of Public Utilities for Unisys Corporation's efforts in pol-
lution prevention in 1994;
A 1993 Waste Reduction Award'from the California Integrated Waste
Management Board, which recognizes companies in California without
standing programs to reduce, reuse, and recycle waste; and
The Environmental Leadership Award from the Pueblo Area Council of
Governments to the Unisys Corporation's Pueblo Colorado facility in
1993 for their efforts in the areas of waste reduction, recycling, reuse? and
community service/education.
OVERVIEW OF 33/5O PROGRAM AND TRI
CHEMICAL RELEASES AND TRANSFERS
In 1988, Unisys reported total releases and transfers of TRI chemicals of
2,039,899 pounds, of which 42 percent were of 33/50 Program chemicals
Between 1988 and 1993, the following eight facilities reported releases and trans,-
fers of 33/50 Program chemicals to TRI: Roseville, St. Paul, and Eagan,
Minnesota; Waterbury, Connecticut; Great Neck, New York; Salt Lake City, Utah;
and San Diego, .California (two facilities). Exhibit 1 presents company data on
releases and transfers of TRI chemicals for 1988 and 1993. Exhibits 2 and 3 pro-
vide a breakdown of the company's 1988 data by chemical and by-media.
Additional data are provided in Appendices A through D at the end of this Profile.
Unisys reported releases and transfers of the following six 33/50 Program
chemicals since 1988:
Chromium compounds are used primarily in the acidic solutions used to etch
copper and clean metal surfaces in circuit board manufacturing processes, and are
At Unisys, environmen-
tal stewardship means
designing^ manufactur-
ing, and selling envi-
ronmentally acceptable
information manage-
ment solutions.
-Greg Fisher, Vice
President Regulatory
Affairs, Unisys
Corporation.
33/50 PROGRAM COMPANY PROFILE: Utii$xs,CoRPORATiON
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I'",' Exhibit 1*
Releases and Transfers
of TRI Chemicals by
Unisys Corporation (in
Thousands of Pounds)
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33/50 Chemicals (locos ibs.) 1988 1993
Chromium Compounds 48 <1
Dichloromethane 285 NR
Lead & Compounds 5 NR
Methyl Ethyl Ketone 23 NR
1,1,1-Trichloroethane 378 21
Trichloroethylene 114 NR
33/50 Subtotal* 852 21
Other TRI Chemicals 1,187 173
TOTAL* 2.040 194
NR Not reported to TRI; use below reporting threshold
* Columns do not sum to totals due to rounding.
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cuit boards and was released as air emissions.
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loromethane was
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compounds were
ipally used in solder
ig of printed circuit
ds and were trans-
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Unisys pledged a
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tion of releases and
transfers of 33/50
Program chemicals
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1,1,1-Trichloroethane (TCA) is used to develop photoresist prior to etching and
for cleaning circuit board inner layers prior to assembly, and is released primari-
ly as air emissions.
Trichloroethylene (TCE) was used for cleaning circuit board inner layers prior to
assembly, and was released as air emissions. .
The Unisys facility in St. Paul was the largest contributor to releases and
transfers of 33/50 Program chemicals in 1988, and was responsible for 100 per-
cent of MEK and TCE emissions, and 96 percent of dichloromethane emissions
reported by the company. Several facilities (Watefbury, Great Neck, Roseville,
and two in San Diego) reported releases and transfers of only one chemical, TCA.
GOALS AND REDUCTION
PROJECTS
Unisys pledged a 90 percent corporate-wide reduction of releases and
transfers of 33/50 Program chemicals by 1995, using 1988 TRI levels as a base-
line a reduction goal of 767,199 pounds. The company stated that it intended
to rely on source reduction measures to achieve reductions, rather than on recy-
cling or treatment.
To achieve the 90 percent reduction, Unisys, established specific waste-
reduction goals for its facilities that would result in a 90 percent reduction of
35/50 PROGRAM COMPANY PROFILE: UNISYS CORPORATION
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TCE (13.32%)
Chromium Compounds (5.59%)
TCA (44.39%)
Dichloromethane (33.46%)
Lead Compunds (0.53%)
MEK (2.72%)
TCA, a 100 percent reduction of both TCE and dichloromethane, and a 70 per-
cent reduction in -chromium. Releases and transfers of MEK and lead were
expected to remain the same, but opportunities for reducing releases and transfers
of these chemicals would be evaluated. In July, 1993, Unisys revised its goals for
chromium by committing to a 95 percent reduction.
The 33/50 Program at Unisys is administered at the corporate level. The
program is directly implemented at the facility level by the environmental and
production management at each facility, along with staff members who decide
which chemicals to reduce or eliminate and the methods for achieving the reduc-
tions.
This Profile focuses on three-projects undertaken at the company's St.
Paul facility to reduce or eliminate the use of 33/50 Program chemicals. The St.
Paul facility, which employs about 800 workers, manufactures printed circuit
boards for the U.S. military. Because the St. Paul facility accounts for the largest
quantity of 33/50 Program chemical releases and transfers of any Unisys facility,.
the pollution reduction efforts at this facility resulted in the majority of the com-
pany's reductions of 33/50 Program chemicals. Appendix B at the end of this
Profile contains data on releases and transfers of TRI chemicals at the St. Paul
facility.
"All three projects involved modifying the production process, for manu-
facturing printed circuit boards. Generally, circuit boards consist of multiple
Transfers Off-site for Treatment/Disposal/Other (8.26%)
Transfers to POTW (0.58%)
Air Emissions (91..16%)
Exhibit 2
Percentage Breakdown of
33/50 Program Chemical
Releases and Transfers for
1988 (by Chemical)
The pollution reduction
efforts at the St. Paul
facility account fora
majority of the compa-
ny's total reductions.
Exhibit 3
Percentage Breakdown of
33/50 Program Chemical
Releases and Transfers for
1988 (by Media)
33/50 PROGRAM COMPANY PROFILE: UNISYS CORPORATION
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Exhibit 4
^'^Qiagram of Printed Circuit
'?^ri^~ri^.J]:foart Manufacturing
'!""'' "" .' '' ' « . ' Process
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[Potassrum Carbbhate] [Cuprlo Chloride] [Potassium Hydroxide]
TrichiarOBthana}
[Tacky, Rollers]
m$m&Mm%
[Potassium Hydroxide] [Ammonium Hydroxide
KEY /Ammonium Chloride]
ilSfS.'.'.WfiPSSJS'IS lnner Layers O
[New Process ] Multilayer Boards Q
{T,1,1 * THohloraaiftBn&I
[Potassium Carbonate]
inner" layers that are laminated together. "Outer*1 or ''final'* layers are then
placed on the top and bottom of the stack of inner layers to form a printed circuit
board. A schematic of "the process for manufacturing printed circuit boards is
shown in Exhibit 4 and is referred to in the detailed process description that fol-
lows. i,This schematic also indicates the chemicals i used in each of the processes ^
discussed in this Profile.
First, a copper-coated inner layer board is covered with a light-sensitive
polymer and the circuit board pattern is imprinted on the polymer using ultravio-
let light (step 1, apply photoresist). The polymer that is not exposed to light is
then removed (step 2, develop). The bare copper is etched away (step 3, etch) and
the circuit pattern is cleaned of residual resist (step 4, strip). The inner layers are
cleaned and layered on top of each other, final layers of copper-coated board are
placed on the top and bottom, and the package is pressed to produce a board (steps
5-6). Holes are then drilled in the board and a two-step plating process is used to
coat the holes with copper (steps 7-8).
'' The circuit pattern is placed on the final layers using analogous steps
described for the inner layers. The final layer copper board is coated with a light-
sensitive polymer (step 9, apply photoresist) and the area surrounding the circuit
board pattern is imprinted on the board using ultraviolet light. The polymer that
js not exposed to light (i.e., the circuit board pattern) is removed (step 10, devel-
op^ The circuit board pattern and holes are solder-plated (step 11) and excess
jSolymer is removed (step 12, strip). The circuit pattern is then created by etching
away ail copper except the circuit pattern (the solder plating protects the copper
of the final layer circuit pattern from being removed by the stripping process)
(step 13, etch).
The circuit board is cleaned with acid to remove metal oxides, dried in an
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trical connections (step 14, solder brighten and fuse). A permanent, protective
layer of polymer, which acts as an insulator, is then placed on the board using sim-
ilar steps described for the inner and final layers. The polymer is placed on the
final layer board, cured on the board using ultraviolet light, and excess polymer
is removed (step 15, apply and develop solder mask). The final circuit board is
now ready for the assembly .process in which components are attached.
Three projects undertaken at the St. Paul facility that reduced or eliminat-
ed the use of 33/50 Program chemicals are discussed in this Profile:
Replacing a chromic/sulfuric acid etchant for final layer boards with an
alkaline etchant;
Replacing solvents for cleaning inner layers (TCE or TCA) with tacky
rollers; and
Replacing solvents for developing and stripping (TCA and
dichloromethane, respectively) with aqueous processes.
Project #1: Replacing Chromic/Sulfuric Acid Etchant with an Alkaline
Etchant
Chromic/sulfuric acid was used to etch copper from final layers of circuit
boards (step 13 in Exhibit 4) resulting in approximately 25,000 pounds of chromi-
um waste in 1988, which the company transferred off-site. Because of the high
cost of purchasing and disposing of the chemicals used in this process, Unisys
decided to reduce, and if possible, eliminate the use of chromic/sulfuric acid in
the final sulfuric etching process. At the time, the disposal cost for chromic acid
was one of the largest environmental costs at the facility.
As an initial step in reducing the use of chromic acid, the facility invest-
ed about $400,000 in an electrodialytic regeneration system in 1987. This system
was.designed to regenerate the chromic/sulfuric acid etchant for reuse and to
recover the copper etched from the boards for recycling. However, the system
malfunctioned almost immediately after installation and was shut down for
repairs. In late 1992, after repeated problems and attempts to test and repair the
system, Unisys realized the system was unreliable and would not provide the
expected cost savings, and shut the system down. The electrodialytic regenera-
tion system was later dismantled and disposed of.
In 1993, a team of operators, production engineers., maintenance person-
nel, environmental managers, and occupational, safety, and health personnel were
assembled to select an etchant that would be more cost effective and reliable, less
toxic, generate less waste, and use less rinse water than the chromic/sulfuric acid
etchant.
"*
The team considered three alternative etchants: ammonia-based alkaline
etchant, peroxy/sulfuric acid, and cupric chloride. These etching chemistries rep-
Unisys replaced
chromic/sulfric acid
etchant with alkaline
etchant for 90 percent
of its products.
33/50 PROGRAM COMPANY PROFILE: UNISYS CORPORATION
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resent those most widely used in the industry. Peroxy/sulfuric acid was very
expensive and extremely volatile, while cupric chloride could not be used on final
Layer boards since it corrodes the solder coating on the boards (step 11 in Exhibit
4). Thus, these two alternatives were eliminated from further consideration. The
team compared the costs of using the third alternative, an alkaline etchant, with
that of chromic/sulfuric acid, and considered such factors as water use, worker
exposure, purchase and disposal costs, and ease of maintenance. The team deter-
mined that the alkaline etchant was the more cost-effecdye (costs are discussed in
greater detail below).
Implementation of the alkaline etchant also required a change, in the
equipment used. Chromic/sulfuric acid is used in an enclosed conveyorized sys-
tem thirough which the items being etched" pass. However, the equipment used
ljje~chro^c/sulforiciriiaci(d' is ^not, suitable for the ammonia-based alkaline
etchant because the entrance and exit openings are large, and ammonia vapors
escaping through these openings would be too strong for workers to tolerate.
Unisys had to purchase equipment that could transport the items to be etched
through the etchant in a closed and automated system.
The team selected etchant equipment based on information gathered a
year earlier when another etchant system at the facility was replaced, and used the
same manufacturer as had been used before. In July 1993, an alkaline etchant
j^-yg wag purchased. This machine has rinse modules designed to keep virtu-
ally all of the etched copper in the etchant. The copper laden waste etchant is
given to the vendor from whom the etchant is originally purchased. The vendor
removes the ammonia from this etchant, and the copper oxide that is generated is
sold to the wood preservative industry for use as a feed stock in the wood preser-
vative chromated copper arsenate. Because the waste etchant is transferred as a
product, it does not require treatment as a RCRA hazardous waste, thereby reduc-
ing the costs associated with waste disposal.
Although the company wanted to eliminate the use of chromic/sulfuric
acid as an etchant, it determined that the alkaline etchant was not suitable for cer-
tain Unisys products. In particular, the alkaline etchant was not strong enough to
cleanly etch copper layers greater than four ounces per square foot. Unisys man-
ufactures several products that use copper layers greater than this thickness, for
vvhi'ch it continues to use chromic/sulfuric acid as an etchant. In addition, a flex-
iblegable'product"Eat requires etching will not fit through the closed alkaline etch
machines an4, therefore, must be etched in the open system with chromic/sulfu-
rip 'acid"! Approximately10percent of the production at the'St. Paul facility is still
etched with chromic/sulfuric acid.
rrri^r ^k^ne'etch^t'syistem"resulted"lnl'a'cbnsiderable cost
savings forUni's'y's* Exhibit's compares tne'costs of "the two'prbc'esses1':1' The com-"
pany incurred about $95,000 in initial capital costs for the alkaline etchant equip-:
ment and $1,000 for disposal of the old chromic etch equipment. The purchase
and disposal costs for the alkaline etchant, however, are substantially less than
that of the chromic/sulfuric acid etchant. In the first half of 1993, Unisys used
33/50 PROGRAM COMPANY PROFILE: UNISYS CORPORATION
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11,015 gallons of chromic acid etchiant per year at a cost of $2.14 per circuit board
produced. Disposal of spent etchant waste (24,695 gallons generated per year)
cost $4.71 per circuit board. In addition, disposal of waste sludge, consisting of
chromium, copper, lead, nickel, sulfate, and sodium salts, cost $0.29 per board.
In the second half of 1,993, after implementing the alkaline etch system,
the company used 2,020 gallons of chromic/sulfuric acid etch and 4,345 gallons
of alkaline etch per year, which cost about $1.12 per circuit board produced a
50 percent reduction in this cost component. Unisys disposed of 3,355 gallons of
spent chromic/sulfuric acid etch and alkaline etch waste, costing $0.88 per print-
ed circuit board an 81 percent reduction in this cost component. Disposal of
sludge, generated from the chromic/sulfuric acid etch and alkaline etch cost $0.25
per board: a slight decrease from previous sludge disposal costs.
.
COST ELEMENT
100% CHROMIC
ETCH
90% ALKALINE ETCH
10% CHROMIC ETCH
Fixed Costs:.
Purchase new equipment
Dispose of old equipment
Sunk cost
$95,000
$ 1,000
Annual Costs (per circuit board):
Chemical purchase $2.14
Disposal of waste entchant $4.71
Disposal of sludge ' $0.29
$1.12
$0.88
$0.25
Total Annual Cost (per circuit board) $7.13
$2.25
By implementing the alkaline etching system and using chromic sulfuric
acid etchant only for spe'cial applications, the company's annual costs dropped
nearly 70 percent, from $7.13 per board to $2.25 per board. In addition, the com-,
pany's water consumption decreased considerably; however, this cost savings can
not be calculated separately, for this process change. '
Although Unisys had been aware of the technical feasibility of using alka-
line etchant since the 1970s, the decision to convert had been delayed because the
etchant could not be used on all products. However, because of the high cost of
the chromic/sulfuric acid etchant, and the company's wish to eliminate using
33/50 Program chemicals, Unisys decided to split the production line and use the
chromic/sulfuric acid only where it was essential.
Project #2: Replacing Solvents for Degreasing with Tacky Rollers
Chlorinated solvents (TCE and TCA) were used as degreasers to clean the
inner layers of the printed circuit boards prior to assembly (step 5 in Exhibit 4).
In 1988, this cleaning process released approximately 113,000 pounds of TCE to
Exhibit 5
Comparison of Costs for
Project #1 (Etching)
Unisys now uses
chromic/sulfric acid
etchant only where
necessary.
33/50 PROGRAM COMPANY PROFILE: UNISYS CORPORATION
-------
\ .
II II I 111 I 111" III II
Exhibit 6
TJidiy Roller Machine
!" ' ' I
IIIIIH 111 111 I II
IIIIIM^^
Unisys eliminated the
need for solvent clean-
ing by improved mate-
rials handling and use
of tacky rollers.
HI it
Tacky rollers'/produce a
cleanerinner 'tayer"
board tfjian the solvent
degreasing machine.
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the air. TCE
was used for
this purpose
until 1989,
when it was
replaced with
the less toxic
solvent, TCA.
Inner lay-
ers were
cleaned prior
to assembly
to remove
organic mat-
ter like finger
prints and loose debris like dust. These contaminants collected on the inner lay-
ers, between the time the inner layers were produced and the time they were
assembled into circuit boards.
Unisys eliminated the .need for solvent cleaning by changing two process-
es. First, in 1987, Unisys began requiring that employees wear gloves when han-
dling the inner layers. This process change reduced the amount of organic matter
that was deposited on the inner layers. Second, about two years later, the compa-
ny introduced a new process to remove loose debris from the boards.
In 1989, a Unisys employee suggested using tacky rollers instead of sol-
vents to remove loose debris from the inner layers. She had used hand-held
rollers covered with tacky paper to remove loose debris while working at anoth-
er Unisys facility, and had discovered that tacky rollers cleaned the boards better
than did TCA. To test this process change, the St. Paul facility purchased a hand-
held tacky roller from the manufacturer. About six months later, the manufactur-
er of the tacky roller produced a completely automated machine, which the St.
Paul facility purchased. In January 1990, the use of solvents for inner layer board
cleaning was completely eliminated with the implementation of tacky rollers.
The tacky roller machine (Exhibit 6) contains two rollers coated with a
tacky substance. A technician manually inserts the board into the machine
between the rollers. The rollers pull the board through the machine and roll it
back, returning it to the technician. The tacky coating on the rollers removes
debris from both sides of the board The technician then removes the board from
the machine and layers the clean boards on top of each other.
The tacky rollers produce a cleaner inner layer board than the solvent
^agklng^ wnich' "decreases trie" profiaEility of producing a damaged
product. The rollers also reduced the labor required to clean and assemble the
boards. Before using tacky rollers, different workers performed the degreasing
33/50 PROGRAM COMPANY PROFILE: UNISYS CORPORATION
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COST TO CONTINUE SOLVENT CLEANING
\
Fixed Costs: ...
Sunk Costs
Annual Costs:
Purchase solvents $46,000
Dispose of waste solvents $0
Total Annual Cost $46,000
COST TO IMPLEMENT TACKY ROLLERS
Purchase of 8 tacky roller $24,000
machines
Disposal of 3 degreasers $60,000
Roller refills $5,000
Dispose of roller refills $0
$5,000
Exhibit 7
Comparison of Costs for
Project #2
'
and the layering of the boards (steps 5 and 6 in Exhibit 4). Using tacky rollers,
however, the same worker who layers the boards performs the cleaning.
-...' Using tacky roller machines resulted in cost savings for Unisys. Exhibit
7 compares the costs of the two processes. The initial capital cost to purchase
the tacky roller machines was $24,000, while the cost to dispose of the solvent
degreasers was $60,000. The annual cost to use tacky rollers for cleaning is con-
siderably less than the cost of using solvents. The annual cost to purchase sol-
vents was .approximately $46,000 per year (this cost varies depending on the
quantity of solvent used and the price of the solvent). Because Unisys reclaimed
most of the solvent, there were usually no waste solvent disposal costs. The
^annual cost of using the tacky roller machines is about $5,000 per year, the price
of rollerrefills. Each machine has two sets, of rollers: one permanent set and one
replaceable set that can be thrown in the trash. Additionally, converting to tacky
rollers reduced labor and energy costs. Those costs were not quantified by the
company. Even ignoring labor and energy cost savings, Unisys achieved annu-
al savings of $41,000, which provided a payback period of just over two years
on their capital investment for the new solvent-free cleaning system.
Project #3: Replacing-Solyjents for Developing and Stripping with Aqueous
--,... Processes "" '- '
TCA and/or dichloromethane were used in, three distinct processes in the
manufacture of printed circuit boards: to develop and strip inner layer boards
(steps 2 and 4 in Exhibit 4); to~ develop and strip final layer boards (steps 10 and
12); and to develop the solder mask (step 15). In 1988, these develop and strip
processes resulted in air emissions of 139,000 pounds of TCA and 274,000
pounds of dichloromethane. ;
Initially, the decision to replace the developer and the stripper was based
on the need to eliminate the use of dichloromethane. In the early 1980s,
dichloromethane was found to be carcinogenic, which led to public health con-
cerns about the large quantity of dichloromethane emissions to air from the facil-
Using tacky roller
machines resulted in
cost savings for Unisys.
33/50 PROGRAM COMPANY PROFILE: UNISYS CORPORATION
-------
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decided to switch to a
completely aqueous
process to eliminate
the use of all solvents.
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It took f long time to
develop processes
that were acceptable
for military purposes
and compatible with
the company's pro-
duction process.
ity] Because me'developeran3 strippelr had to be compatible with each other,
eliminating the dichloromethane stripper meant that an alternative developer
needed to be found as well.
Replacing the chlorinated solvents used as developers and strippers also
required finding photoresist polymers that were compatible with the alternative
chemicals. As described previously in the circuit board manufacturing process,
the developer is used after the photoresist has been exposed to light to fix the
exposed polymer and to remove the unexposed polymer. The stripper removes
the exposed polymer after the etching process! The primary barrier to switching
develop and strip chemistries was finding a polymer that met the necessary stan-
dards and was compatible with the alternative chemistries.
In the early 1980s, Unisys began a program to replace TCA (in develop-
ing) with potassium carbonate, and replace dichloromethane (used in stripping)
with potassium hydroxide. Substituting these solvents with aqueous solutions
was a three-step process The replacement for inner layer boards occurred in the
early I9&6s, theJ replacement for final layer boards'occurred in the late 1980s, and
the replacement for the solder mask occurred in 1993. The timing of the conver-
sions was determined by the availability of alternative photoresist polymers for
each of the three steps, since each consecutive step had increasingly rigorous
requirements for the polymer.
For the first conversion (steps 2 and 4 in Exhibit 4), the production engi-
neers at the facility had the option of replacing XCA and dicnlpromethane used
for the inner layer boards with either a semi-aqueous or aqueous developer and
siripper. The productionengineers decldec!" to switch to a completely aqueous
process in order to eliminate the use of all solvents. A team of workers was
formed to select the equipment needed to implement the process changes. The
team initially reviewed equipment that was available on the market, sent sample
circuit boards to manufacturers to test the processes, and selected an equipment
While changes were made to the inner layer process, Unisys tried to
replace the developer and stripper used on the final layer boards (steps 10 and 12).
HoweverJ the company was unable to find a polymer compatible with the aque-
ous developer and stripper that met the requirements for outer layers. The poly-
mer coating cured on the final layer board must be more durable than that used on
the inner layers because the final-layer coating must withstand exposure to more
cEemicals ffian th'e inner-layer coating! It wasrft'until me late 1980s, when better
methods became available, that the facility could replace the chlorinated solvent
developer and stripper with aqueous solutions.
In the late 1980s, Unisys began testing aqueous-based systems for the
final solder mask (step 15). However, it took a long time to develop a process that
was both acceptable for military purposes and compatible with the company's
process! Because the solder mask is a permanent coating that remains on the
board, military standards (mil specs) for this process were more rigorous than for
33/50 PROGRAM COMPANY PROFILE: UNISYS CORPORATION
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polymers used in earlier processes. At the time, there were products available that
met the mil, specs, but these-products were hot compatible with the Unisys
process. The company did not want to invest the money to research and develop
a new process. In 1993, the manufacturer of the solvent-compatible solder mask
used by Unisys discontinued production and the facility was forced to find an
alternative solder mask. By this time, products had been .developed that were
compatible with the Unisys process' and with the mil specs. By converting to an
aqueous-compatible solder mask, Unisys replaced TCA with potassium carbonT-
ate, which completely eliminated the use of TCA at,the St. Paul facility.
Replacing the solvents used for developing and stripping with aqueous
processes required a large capital investment for equipment for each process
change (see Exhibit 8). The developer and stripper equipment for the inner layer
boards cost about $330,000., The developer and stripper equipment for the final
layer boards cost about $160,000, and the solder mask developer equipment cost
about $87,000. The annual purchase cost of chemicals, however, has dropped
considerably following the implementation of the aqueous processes. The annu-
al cost of chemicals for developing inner and final layer boards dropped from
$63,000 when using TCA to $4,900 when using potassium carbonate. In addi-
COST ELEMENT
CONTINUE USE OF SOLVENTS
IMPLEMENT AQUEOUS PROCESSES
Fixed costs:
Purchase new equipment Sunk costs
Annual costs:
Chemical purchase
develop and strip inner and final layer boards
$490,000
$329,500 $14,000
Fixed costs:
Purchase new equipment
Anuual costs:
Chemical purchase ,
develop solder mask
Sunk costs $1)7,000
$27,400 $2,300
tion, the annual cost of chemicals for stripping inner and final, layer boards
declined from $266,500 when using dichloromethane to $9,100 when using
potassium hydroxide. With the solder .mask developer, annual chemical costs
dropped from $27,400 when using TCA to $2,300 when using potassium carbon-
ate. . ". ,-.; ' ,',..'
The replacement of solvents for developing and stripping with aqueous
processes resulted in tremendous savings for Unisys. Substituting solvents for
developing inner and final layer boards with aqueous processes resulted in an
annual savings of $316,000, on a capital investment of $490,000. Replacement
of solvents with aqueous processes for solder mask developing resulted in an
annual savings of $25,000 on an $87,000 capital investment.
Exhibit 8
Comparison of Costs for
Project #3
Conversion to aqueous
processes required
large capital invest-
ments but resulted in
lower annual costs.
33/50 PROGRAM COMPANY PROFILE: UNISYS CORPORATION
-------
'"'1 1 1 "
Ill II II rt II II III ul IB 1 ill j i ra III r Ml * JIM J * I . 1 j j
In addition to the costs discussed above, other significant costs included
chemical disposal costs, equipment disposal costs, and changes in wastewater
treatment costs. However, Unisys was not able to provide quantitative estimates
of these costs. The company also incurred significant costs developing new waste
treatment methods for wastes from the aqueous system. The most significant
issue was developing a process for removing the heavy metals from the aqueous
ijya&e. The aqueous chemicals made the wastewater treatment process more dif-
ficult because they cheiate metals, thereby making these metals more difficult to
separate from the cleaning solution in the treatment process. It took Unisys near-
ly a year to develop a waste treatment method that worked consistently and eco-
.gornica
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P3/5O PROGRAM PROGRESS AND TRI DATA
SUMMARY
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Unisys reduced releases and transfers of 33/50 Program chemicals by
over 831,313 pounds between 1988 and 1993 - a 98 percent reduction from
852,443 pounds to 21,130 pounds. As shown in Exhibit 9, the company has sur-
passed its goal of a 90 percent reduction in releases and transfers of 33/50
Program chemicals. Of the six 33/50 Program chemicals used by Unisys, the
largest reductions were from chromium compounds, dichloromethane, TCA, and
TCE. Use of dichloromethane and TCE has been completely eliminated.
Releases and transfers of TCA have decreased by 95 percent since 1988. The use
of chromium compounds dropped below the 10,000 pound reporting threshold.
Exhibits 10 and 11, show the percentage breakdown of 1993 33/50 Program chem-
ical releases and transfers by chemical and by media, respectively.
1 ' . 'i1
The sources for the company-wide reductions of 33/50 Program chemi-
cals are illustrated in Exhibit 12. Of the total reductions, 65 percent were
achieved by process changes made at the St. Paul facility, and one percent result-
ed from process changes made at other facilities. The remaining 34 percent of
reductions resulted from decreases in production and closure of manufacturing
operations. The company has significantly reduced it's size, from 120,000
Exhibit 9
s_ Corporation's
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Chromium Compounds (0.53%)
VGA (99.47%)
employees and $10 billion of revenue in 1988, to 48,000 employees and $8 bil-
lion of revenue in 1993. ,
At the St. Paul facility, the majority of reductions in releases and transfers
of 33/50 Program chemicals resulted from process changes. At this facility, the
use of dichloromethane and TGE decreased by 100 percent since 1988. Releases
and transfers of TCA at this facility decreased 91 percent, while use of chromium
compounds dropped below the reporting threshold.
Transfers .Off-site for Treatment/Disposal/Other (1.00%)
Transfers to POTW (0.52%)
Air Emissions (98.48%)
, Exhibit 13 presents data on the sources of reductions in releases and trans-
fers of 33/50 chemicals at the St. Paul facility. Seventy-one percent of the reduc-
tions were achieved by substituting aqueous processes for TCA as the developer
and dichloromethane as the stripper. Twenty percent of the reductions resulted
from replacing TCE with tacky rollers, and five percent were achieved by replac-
ing chromic acid etchant with an alkaline etchant.
Although not a part of its 33/50 Program goal, Unisys has reduced emis-
sions of TRI chemicals not targeted by the 33/50 Program. Releases and transfers
of non-33/50 TRI chemicals decreased by 85 percent, from 1,187,456 pounds in
1988 to 173,297 pounds in 1993. At the St. Paul facility, releases and transfers of
Exhibit 10
Percentage Breakdown of
33/50 Program Chemical
Releases and Transfers
for 1993 (by Chemical)
Exhibit 11
Percentage Breakdown of
33/50 Program Chemical
Releases and Transfers for
1933 (by Media)
33/50 PROGRAM COMPANY PROFILE: UNISYS CORPORATION
-------
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:,:!!|| [ !""' * Sources of Reductions in
Decreased Production or Plant
Closings (34%)
Implementation of Alkaline Etching Process (St. Paul) (3%)
Implementation of
Aqueous-Based
" leveloping/Stripping
Process (St. Paul)
(48%)
Projects at Other Unisys Facilities (1%)
Implementation of Tacky Rollers
(St. Paul) (14%)
Other Projects (4%)
Implementation of Alkaline
Etching Process (5%)
Implementation of
Tacky Rollers (20%)
Implementation of
Aqueous-Based .
Developing/Stripping
Process (71 %)
Total St. Paul facility reductions in releases and transfers = 562,207 pounds
non-33/50 TRI chemicals have decreased by 86 percent, from 495,589 pounds in
1988 to 70,575 pounds in 1993. The largest reductions in releases and transfers
'at"the St. Paul Facility are for copper, CFC-I15, and sulfuric acid, wfiicE decreased
97, 88, and 85 percent, respectively, since 1988. These reductions may be attrib-
uted to several factors: copper use has declined due to reduced'production, CFC-
113 is being phased out under the Montreal Protocol, and sulfuric acid used in
etchant processes has been replaced.
FUTURE CHALLENGES
Despite the success of Unisys in reducing the use of 33/50 Program chem-
icals, the company continues to investigate methods to eliminate the use of 33/50
Program and other TRI chemicals. Company-wide, Unisys plans to eliminate
CFCs by 1999 and is currently phasing out CFC-refrigerants from its facilities by
converting to non-CFC refrigerants in existing equipment or by replacing outdat-
ed equipment. The company's Roseville facility recently replaced lead used in
soldering with tin and. bismuth in some processes. At its St. Paul facility, several
I I II
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33/50 PROGRAM COMPANY PROFILE: UNISYS CORPORATION
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projects are being planned to further reduce the use of 33/50 Program chemicals.
The need to completely eliminate the use of chromic acid as an etchant is under
discussion, and methods to reduce the use of methyl ethyl ketone needed for the
manufacture of ceramic circuit boards are being researched.
CONTACT FOR FURTHER INFORMATION
For additional information on any of the infor-
mation provided in this case study, please con-
tact the following individual:
Greg Fischer
Vice President Regulatory Affairs
Unisys Corporation
25725 Jeronimo Road
Mission Viejo, CA 92691
Tel: (714)380-5532
Fax: (714) 380-6634
33/50 PROGRAM COMPANY PROFILE: UNISYS CORPORATION
-------
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