United States
Environmental Protection
Agency
Environmental Monitoring
Systems Laboratory
Research Triangle Park NC 27711
Research and Development
EPA/600/S4-86/018 June 1986
Project Summary
Ambient Monitoring for PCB
After Remedial Cleanup of Two
Landfills in the Bloomington,
Indiana Area
D. L. Sgontz and J. E. Howes, Jr.
A monitoring program was conducted
to determine PCB levels in ambient air on
and in the vicinity of two landfills at which
interim remedial cleanup measures have
been performed. The landfill sites are in
the Bloomington, Indiana area. The sampl-
ing locations and methods used were the
same as those used in a June and July,
1983 pre-cleanup monitoring program.
Monitoring data obtained at former hot
spots on the sites (where exposed capac-
itors were visible) were much lower than
the pre-cleanup monitoring levels. How-
ever, PCB concentrations measured at
downwind locations at the site boundaries
during the pre- and post-cleanup monitor-
ing were about the same.
Collocated monitoring conducted during
the study showed that both the low- and
high-volume sampling methods yielded re-
liable, reproducible measurements of air-
borne PCB levels.
This Project Summary was developed
by EPA's Environmental Monitoring Sys-
tems Laboratory, Research Triangle Park,
NC, to announce key findings of the re-
search project that is fully documented in
a separate report of the same title (see
Project Report ordering information at
back).
Introduction
Three landfill sites in the Bloomington,
Indiana, area were used to dispose of
capacitors containing polychlorinated bi-
phenyls (PCBs). The sites were Neal's
Landfill, Neal's Dump and Lemon Lane
Landfill. Visual surveys of these sites show
several areas where capacitors are visible
at or above ground level. In most of the
areas, leakage of the capacitors is sus-
pected because of wet soil and damage to
the surrounding vegetation. Consequently,
PCBs may be emitted, thus creating an air
pollution problem.
During June and July 1983, a field pro-
gram was conducted to monitor PCB lev-
els in the ambient air at selected locations
on and surrounding the three landfill areas.
Airborne PCB measurements on the sites
were performed at localized areas (hot
spots) where leaking capacitors were evi-
dent. Measurements were made at loca-
tions in the vicinity of the sites to deter-
mine upwind background levels and down-
wind emission levels.
During the spring of 1984, interim reme-
dial cleanup measures were conducted at
Neat's Landfill and Neal's Dump to reduce
PCB emissions. Following the cleanup op-
erations, monitoring was performed to
determine the reduction of airborne PCB
levels on and in the vicinity of the two
landfill sites. Monitoring locations and pro-
cedures employed were the same as those
used in the previous study. Battery-oper-
ated, personal-type pump systems were
used to sample during 8-hour daytime
periods at a fixed height above hot spots.
High-volume systems were employed to
sample for 24-hour periods at hot spots,
upwind background locations and down-
wind site perimeter locations. Vertical con-
centration profiles at hot spot areas dur-
ing 8-hour daytime periods were determin-
ed with an array of five battery-operated
sampling systems positioned at different
elevations above ground level. Polyure-
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thane foam (PUF) cartridges were used in
all the sampling systems to collect PCBs
from the ambient air. The quantity of PCBs
collected in the PUF cartridges during
sampling was determined by extracting
and analyzing the extract by electron-
capture gas chromatography using EPA
Method 608. Meteorological conditions
(wind speed and direction, temperature
and relative humidity) were monitored,
during sampling at the sites, to assist in
interpreting PCB measurements.
This study was conducted to provide
EPA Region V with data on airborne PCB
levels following interim remedial cleanup
of the two landfill sites.
Experimental Procedures
PCB Monitoring Procedures
As in the previous study, three different
sampling procedures were used to mea-
sure ambient air PCB concentrations and
emission patterns on and in the vicinity of
the landfill sites. The procedures used
were low-volume, vertical profile, and
high-volume.
Dupont P-4000A battery-operated, low-
volume samplers (flow rate ~3.8 L/min)
were used to sample the ambient air at hot
spots on the landfill sites and at upwind
locations. The samplers were positioned
with inlets of the PUF cartridges at 1.8 m
above ground level. Sampling at hot spots
was performed immediately downwind of
the hot spot area over 8-hour daytime
periods from about 0900 to 1700 hrs CDT.
Measurements of the vertical PCB con-
centration profiles were performed with a
vertical array of five DuPont low-volume
samplers. The array was positioned direct-
ly over a hot spot area with inlets of the
PUF cartridges at 2, 30, 60, 120, and 180
cm above ground level. Sampling was per-
formed for 8-hr periods, starting at ~0900
and terminating at ~1700 hrs CDT.
EPA high-volume systems (flow rate ~8
cfm) were used to collect approximately
24-hr samples upwind of the sites, at hot
spots on the sites, and along the down-
wind perimeter of the sites. The EPA sam-
plers were situated with the inlets about
1.2 m above ground level and were located,
to the extent possible, in areas where air
flow was unrestricted in the windward
direction.
The types and locations of samples col-
lected at each site are summarized in Table
1.
PCB Analysis Procedure
Analysis for PCBs in the PUF cartridges
(and high-volume filters) was performed
according to the procedure described in
Site/Sampling Dates (1984)
Neat's Landfill
July 24, 25, 27, and 28
Samp/ing Location3
HS-A
-C
-E
DW-2
-5
-4
Type of
Sampling Performed11
BhrLV, ShrVP
ShrLV, 24hrHV, ShrVP
8hrLV
24hrHV
24hrHV
24hrHV
Neat's Dump
July 25 and 27
UW
HS-A
DW
UW
24hrHV
ShrLV, 24hrHV
24hrHV
24hrHV
aHS - hot spot, DW - downwind, and UW - upwind.
bLV - DuPont low volume sampler, HV - EPA high volume sampler, and
VP - in-line vertical array of five DuPont low volume samplers.
Table 2. Comparison of Pre- and Post-Cleanup Monitoring Data
Sample Flange of PCB Concentrations (ng/SCM) Found
Sampling Location
Neat's Landfill
HS-A
HS-C
HS-E
UW
DW-2
DW-3
DW-4
Neat's Dump
HS-A
UW
DW
Type
ShrLV
VP-2cm
VP-30cm
VP-60cm
VP- 120cm
VP- 180cm
ShrLV
24hr LV
VP-2cm
VP-30cm
VP-60cm
VP- 120cm
VP-180cm
ShrLV
24hr HV
24hr HV
24hr HV
24hr HV
ShrLV
24hr HV
24hr HV
24hr HV
Pre-Cleanup
5.1-11
552-1053
56-120
30-49
10-23
6.4-13
5.3-12
5.2-14
941-1108
111-157
40-62
15-21
8.6-16
7.3-18
0.08-0.09
0.8-1.8
0.8-1.8
0.3-0.7
7.9-19
23-61
0. 1-0.2
0. 1-0.2
Post-Cleanup
0.4-1.4
2.3-3.2
1.1-1.8
0.9-1.2
0.7-1.4
0.4-0.6
1.7-2.5
3. 1-4.8
11.5-21.3
4. 1-5.8
1. 7-5. 1
1. 7-3. 1
1.5-2.5
NDK0.04)
0.2-0.3
1.1-1.4
0.8-1.2
0.4-0.6
0.8-0.9
2. 7-3. 1
0. 1-0.2
0.1
the EPA Manual of Analytical Methods.
The steps in the analysis procedure includ-
ed: a) Soxhlet extraction of the foam plugs
(and filters in the case of high-volume
samplers) with 5 percent ether in hexane;
b) concentration of the extract to 1 mL;
and c) determination of PCBs in an aliquot
of the extract by electron capture-gas
chromatography using EPA Method 608.
Meteorological Measurements
Measurements of wind speed, wind
direction, and ambient temperature were
performed with Meteorological Research,
Inc. (MRI) portable weather stations. One
unit was located at Neal's Landfill and a
second unit was used to collect meteoro-
logical data at Neal's Dump. Strip chart
data from the meteorological systems
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were manually reduced to obtain hourly
averages. Relative humidity data were ob-
tained from wet/dry bulb temperature
measurements made periodically during
daytime sampling periods.
Results and Discussion
PCB concentrations in ambient air,
measured at locations on Neal's Land-
fill/Dump and in their vicinity after the in-
terim remedial cleanup, are shown in Table
2. As shown in the table, post-cleanup
PCB levels measured at hot spots on the
sites are lower than the pre-cleanup levels.
However, at HS-A and HS-C on Neil's
Landfill and HS-A on Neal's Dump, there
appears to be residual contamination
which gives rise to airborne PCB concen-
trations that are slightly above background
levels.
In general, there is very little difference
in pre- and post-cleanup PCB levels mea-
sured at the downwind locations at the
two landfills. The pre- and post-cleanup
levels measured upwind at Neal's Dump
were approximately the same. PCB levels
observed upwind of Neal's Landfill during
the post-cleanup monitoring program were
higher than those measured during the
pre-cleanup monitoring.
During the post-cleanup monitoring
period, maximum temperatures were in
the range of 25 to 28 °C and there was fre-
quent rainfall. In contrast, maximum tem-
peratures during the pre-cleanup monitor-
ing period were frequently in excess of
38 °C and there was an absence of rainfall.
D. L. Sgontz and J. E. Howes, Jr. are with Battelle Columbus Laboratories,
Columbus, OH 43201.
Barry E. Martin is the EPA Project Officer (see below).
The complete report, entitled "Ambient Monitoring for PCB After Remedial
Cleanup of Two Landfills in the Bloomington, Indiana Area," (Order No. PB
86-177 532/AS; Cost: $11.95. subject to change) will be available only from:
National Technical Information Service
5285 Port Royal Road
Springfield, VA 22161
Telephone: 703-487-4650
The EPA Project Officer can be contacted at:
Environmental Monitoring Systems Laboratory
U.S. Environmental Protection Agency
Research Triangle Park, NC 27711
Conclusions
The results of the monitoring program
show that the interim remedial cleanup
reduced airborne PCB at former hot spots
on the landfill. Airborne PCB levels at the
downwind site boundaries remain about
the same as observed during the pre-
cleanup monitoring.
Modifications of the high-volume samp-
lers by replacing the conventional motor
with a by-pass type significantly improved
the reliability and durability of this unit.
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United States
Environmental Protection
Agency
Center for Environmental Research
Information
Cincinnati OH 45268
Official Business
Penalty for Private Use $300
EPA/600/S4-86/018
0000329 PS
U S ENVIR PROTECTION AGENCY
REGION 5 LIBRARY
230 S DEARBORN STREET
CHICAGO IL 60604
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