Electronics Manufacturing Subpart I, Greenhouse Gas Reporting Program SEPA United States Environmental Protection Agency What Must Be Monitored for Manufacturers of Electronics Devices? Measure or estimate these parameters annually ~ ~ ~ ~ Annual manufacturing capacity of each fab (m2). Annual production in terms of substrate surface area (m2) for each fab, including specification of the substrate. Amount of each fluorinated GHG consumed in process sub-types, and process types; and the amount of N2O consumed in CVD and other N20-using processes (kg). Annual fab-level emissions of each fluorinated GHG, including each input gas and each by-product gas, used for the plasma etching/wafer cleaning process type and each of the process sub-types associated with the chamber cleaning process type, including in-situ plasma chamber clean, remote plasma chamber clean, and in-situ thermal chamber clean (metric tons). Inventory of each fluorinated ~ GHG and N2O stored in containers at the end of the reporting year. Acquisitions of each fluorinated ~ GHG and N2O through purchase records or other transactions (kg). ~ Disbursements of each fluorinated GHG and N20. ~ ~ ~ Disbursements under exceptional circumstances of gases through sales or other transactions. Number of containers of gas returned by the facility to gas distributors. Full capacities of gas containers used. Annual emissions of N2O for each ~ N20-using process type, on a fab basis (metric tons). Inventory of each fluorinated GHG ~ and N2O stored in containers at the beginning of the reporting year. Electronics Manufacturing Monitoring Checklist Greenhouse Gas Reporting Program Page 1 of 3 Fab-wide heel factors for each gas and container type used. Process sub-type-specific, and process type-specific fluorinated GHG apportioning factors; and CVD-specific and other N20-using process-specific N2O apportioning factors. 40 CFR 98, subpart I February 2018 ------- If you elect to use the stack test method: ~ For each stack system in the fab for which testing is required, measure the emissions of each fluorinated GHG from the stack system by conducting an emission test. In addition, measure the fab-specific consumption of each fluorinated GHG by the tools that are vented to the stack systems tested. ~ ~ Develop fab-specific emission factors for each fluorinated GHG input gas consumed and each fluorinated GHG formed as a by- product; and calculate fab-level fluorinated GHG emissions. Total annual emissions of fluorinated GHGs from all of the combined stack systems that are not tested in the fab. If you use fluorinated heat transfer fluids (HTFs): Annual emissions of fluorinated ~ HTFs on a fab basis using the mass balance approach, as applicable. ~ ~ ~ The density of each fluorinated HTF used at the facility. Inventory of each fluorinated HTF in containers, other than equipment, at the beginning of the reporting year. Inventory of each fluorinated HTF in containers, other than equipment, at the end of the reporting year. ~ ~ ~ ~ Acquisitions of each fluorinated HTF, including the amounts purchased from chemical suppliers, equipment suppliers with or inside equipment, and returned to the facility after off-site recycling. Total nameplate capacity of equipment that uses a fluorinated HTF and is newly installed during the reporting year. Total nameplate capacity of equipment that uses a fluorinated HTF and is removed from service during the reporting year. Disbursements of each fluorinated HTF, including amounts returned to chemical suppliers, sold with or inside of equipment, and sent off-site for verifiable recycling or destruction. Electronics Manufacturing Monitoring Checklist Greenhouse Gas Reporting Program Page 2 of 3 40 CFR 98, subpart I February 2018 ------- If controlled emissions from the use of abatement systems are reported: Fraction of each fluorinated GHG used in process sub-types, or process ~ types with abatements systems; and ~ the fraction of N2O used in CVD or other N20-using processes. ~ Fraction of each fluorinated GHG destroyed or removed in abatement systems for process sub-types, or process types; Fraction of N2O used ~ in each N20-using process with abatement systems; and the fraction of N2O destroyed or removed in abatement systems for CVD or other |—| N20-using processes. ~ The total time, in minutes, that abatement system p, connected to process tool(s) in the fab using input gas in process sub-type or process type j, is not in operational mode. Properly measured and class average DREs, when the EPA default DRE factor is not used. Uptime of each abatement system used at the facility connected to process tools in the fab. The total time each abatement system is in operational mode and fluorinated GHGs or N2O are flowing through the connected process tools. Amount of each fluorinated GHG consumed for process sub-type, and process type fed into each abatement ~ device used at the facility; the amount of N2O consumed for CVD and other N20-using processes fed into each abatement system used at the facility. ~ The total time fluorinated GHGs or N2O are flowing through process tools connected to each abatement system. For more information, see the information sheet for Electronics Manufacturing at: https: //www .epa. gov/ghgreporting/subpart-i-information-sheet. This document is provided solely for informational purposes. It does not provide legal advice, have legally binding effect, or expressly or implicitly create, expand, or limit any legal rights, obligations, responsibilities, expectations, or bene fits in regard to any person. This in formation is intended to assist reporting facilities/owners in understanding key provisions of the Greenhouse Gas Reporting Program. Electronics Manufacturing Monitoring Checklist Greenhouse Gas Reporting Program Page 3 of 3 40 CFR 98, subpart I February 2018 ------- |